GB2372154B - Solder-bearing wafer for use in soldering operations - Google Patents
Solder-bearing wafer for use in soldering operationsInfo
- Publication number
- GB2372154B GB2372154B GB0205160A GB0205160A GB2372154B GB 2372154 B GB2372154 B GB 2372154B GB 0205160 A GB0205160 A GB 0205160A GB 0205160 A GB0205160 A GB 0205160A GB 2372154 B GB2372154 B GB 2372154B
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder
- soldering operations
- bearing wafer
- wafer
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15477199P | 1999-09-20 | 1999-09-20 | |
PCT/US2000/026160 WO2001022785A1 (en) | 1999-09-20 | 2000-09-20 | Solder-bearing wafer for use in soldering operations |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0205160D0 GB0205160D0 (en) | 2002-04-17 |
GB2372154A GB2372154A (en) | 2002-08-14 |
GB2372154B true GB2372154B (en) | 2003-09-24 |
Family
ID=22552709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0205160A Expired - Fee Related GB2372154B (en) | 1999-09-20 | 2000-09-20 | Solder-bearing wafer for use in soldering operations |
Country Status (5)
Country | Link |
---|---|
CN (2) | CN1668168B (en) |
AU (1) | AU7609500A (en) |
DE (2) | DE10084996B8 (en) |
GB (1) | GB2372154B (en) |
WO (1) | WO2001022785A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10084996B8 (en) * | 1999-09-20 | 2009-01-29 | Nas Interplex Industries Inc. | Solder-carrying body for use in soldering operations |
DE10229953A1 (en) * | 2002-07-03 | 2004-01-29 | Hartmann Codier Gmbh & Co.Kg | Component for PCB assembly |
CN101752705B (en) * | 2008-11-28 | 2012-11-28 | 富士康(昆山)电脑接插件有限公司 | Electric coupler |
CN107538094B (en) * | 2017-09-19 | 2018-08-14 | 南昌航空大学 | A kind of precision resistance method for welding of stranded conductor and microfilament |
CN111842015A (en) * | 2019-04-28 | 2020-10-30 | 江苏长电科技股份有限公司 | Printing apparatus and printing method |
CN116851986B (en) * | 2023-09-05 | 2023-11-21 | 微网优联科技(成都)有限公司 | Efficient welding device and method for camera module and PCB |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4684055A (en) * | 1985-09-09 | 1987-08-04 | Harris Corporation | Method of selectively soldering the underside of a substrate having leads |
US4807799A (en) * | 1988-06-01 | 1989-02-28 | Raychem Corporation | Device for applying solder |
JPH0945726A (en) * | 1995-08-03 | 1997-02-14 | Nissan Motor Co Ltd | Structure of semiconductor device and manufacturing method thereof |
US6112001A (en) * | 1997-07-30 | 2000-08-29 | Kyocera Corporation | Optical coupler and a method of producing it |
US6119920A (en) * | 1996-12-20 | 2000-09-19 | Rf Monolithics, Inc. | Method of forming an electronic package with a solder seal |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216350A (en) * | 1978-11-01 | 1980-08-05 | Burroughs Corporation | Multiple solder pre-form with non-fusible web |
US4641426A (en) * | 1985-06-21 | 1987-02-10 | Associated Enterprises, Inc. | Surface mount compatible connector system with mechanical integrity |
US4884335A (en) * | 1985-06-21 | 1989-12-05 | Minnesota Mining And Manufacturing Company | Surface mount compatible connector system with solder strip and mounting connector to PCB |
US5029748A (en) * | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
US4956913A (en) * | 1988-05-11 | 1990-09-18 | E. I. Du Pont De Nemours And Company | Pin alignment method |
US5046957A (en) * | 1990-06-25 | 1991-09-10 | Amp Incorporated | Solder plate assembly and method |
US5875546A (en) * | 1995-11-03 | 1999-03-02 | North American Specialties Corporation | Method of forming solder-holding clips for applying solder to connectors |
US5875102A (en) * | 1995-12-20 | 1999-02-23 | Intel Corporation | Eclipse via in pad structure |
JP3385872B2 (en) * | 1995-12-25 | 2003-03-10 | 三菱電機株式会社 | Solder supply method and solder supply apparatus |
US5796590A (en) * | 1996-11-05 | 1998-08-18 | Micron Electronics, Inc. | Assembly aid for mounting packaged integrated circuit devices to printed circuit boards |
US6063647A (en) * | 1997-12-08 | 2000-05-16 | 3M Innovative Properties Company | Method for making circuit elements for a z-axis interconnect |
DE10084996B8 (en) * | 1999-09-20 | 2009-01-29 | Nas Interplex Industries Inc. | Solder-carrying body for use in soldering operations |
-
2000
- 2000-09-20 DE DE10084996A patent/DE10084996B8/en not_active Expired - Fee Related
- 2000-09-20 WO PCT/US2000/026160 patent/WO2001022785A1/en active Application Filing
- 2000-09-20 CN CN 200510059566 patent/CN1668168B/en not_active Expired - Fee Related
- 2000-09-20 AU AU76095/00A patent/AU7609500A/en not_active Abandoned
- 2000-09-20 GB GB0205160A patent/GB2372154B/en not_active Expired - Fee Related
- 2000-09-20 CN CN 00813018 patent/CN1203733C/en not_active Expired - Fee Related
- 2000-09-20 DE DE10084996T patent/DE10084996T1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4684055A (en) * | 1985-09-09 | 1987-08-04 | Harris Corporation | Method of selectively soldering the underside of a substrate having leads |
US4807799A (en) * | 1988-06-01 | 1989-02-28 | Raychem Corporation | Device for applying solder |
JPH0945726A (en) * | 1995-08-03 | 1997-02-14 | Nissan Motor Co Ltd | Structure of semiconductor device and manufacturing method thereof |
US5986338A (en) * | 1995-08-03 | 1999-11-16 | Nissan Motor Co., Ltd. | Assembly of semiconductor device |
US6119920A (en) * | 1996-12-20 | 2000-09-19 | Rf Monolithics, Inc. | Method of forming an electronic package with a solder seal |
US6112001A (en) * | 1997-07-30 | 2000-08-29 | Kyocera Corporation | Optical coupler and a method of producing it |
Also Published As
Publication number | Publication date |
---|---|
DE10084996B8 (en) | 2009-01-29 |
GB0205160D0 (en) | 2002-04-17 |
CN1668168A (en) | 2005-09-14 |
WO2001022785A1 (en) | 2001-03-29 |
CN1203733C (en) | 2005-05-25 |
DE10084996B4 (en) | 2008-09-18 |
AU7609500A (en) | 2001-04-24 |
DE10084996T1 (en) | 2002-11-07 |
CN1390437A (en) | 2003-01-08 |
GB2372154A (en) | 2002-08-14 |
CN1668168B (en) | 2010-12-01 |
WO2001022785A9 (en) | 2002-11-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090920 |