GB2372154A - Solder-bearing wafer for use in soldering operations - Google Patents

Solder-bearing wafer for use in soldering operations Download PDF

Info

Publication number
GB2372154A
GB2372154A GB0205160A GB0205160A GB2372154A GB 2372154 A GB2372154 A GB 2372154A GB 0205160 A GB0205160 A GB 0205160A GB 0205160 A GB0205160 A GB 0205160A GB 2372154 A GB2372154 A GB 2372154A
Authority
GB
Grant status
Application
Patent type
Prior art keywords
solder
wafer
surface
use
soldering operations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0205160A
Other versions
GB2372154B (en )
GB0205160D0 (en )
Inventor
Joseph S Cachina
James R Zanolli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nas Interplex Industries Inc
NAS INTERPLEX IND Inc
Original Assignee
Nas Interplex Industries Inc
NAS INTERPLEX IND Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current connectors or for joining electric conductors for soldered or welded connections for applying solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions ; Methods of application thereof
    • H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10378Interposers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10424Frame holders
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0338Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0415Small preforms other than balls, e.g. discs, cylinders or pillars
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals

Abstract

A solder-bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and a second surface opposing the first surface. The first surface has grooves (115, 117) formed therein and includes lengths of solder (130) disposed within the grooves. Upon heating of the solder and placement of the wafer between the first and second devices, the two devices are connected.

Description

AUK Patent Application 1g,GB.,, 2 372 154.3,A (43) Date of Printing by UK

Office 14.08.2002 (21) Application No 0205160.5 (51) INTCL7 H05K 1/16

(22) Date of Filing 20.09.2000 (52) UK CL (Edition T) (30) Priority Data H1R RAA1 (31) 60154771 (32) 20.09.1999 (33) US

(56) Documents Cited by ISA (86) International Application Data US 6119920 A US 6112001 A PCT/US2000/026160 En 20.09.2000 US 5986338 A US 4807799 A US 4684055 A

187) International Publication Data WO2001/022785 En 29.03.2001 (58) Field of Search by ISA

INTCL7 H05K1/16

US CL: 174/260; 228/56.3 4381598, 106, 612

(71) Applicant(s) NAS Interplex Industries Inc. llacorPorated in USA - New York) (74) Agent and/or Address for Service 120-12 28th Avenue, Flushing, NY 11354, Elkington and Fife United States of America Prospect House, 8 Pembroke Road, SE-vENOAKS, Kent, TN13 1XR, United Kingdom (72) Inventor(s) Joseph S Cachina James R Zanolli {54) Abstract Title Solder- beariny wafer for use in soldering operations (57) A solder-bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and a second surface opposing the first surface. The first surface has grooves (115, 117) formed therein and includes lengths of solder (130) disposed within the grooves. Upon heating of the solder and placement of the wafer between the first and second devices, the two devices are connected.

ALL: G)

con D

GB0205160A 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations Expired - Fee Related GB2372154B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15477199 true 1999-09-20 1999-09-20
PCT/US2000/026160 WO2001022785A9 (en) 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations

Publications (3)

Publication Number Publication Date
GB0205160D0 GB0205160D0 (en) 2002-04-17
GB2372154A true true GB2372154A (en) 2002-08-14
GB2372154B GB2372154B (en) 2003-09-24

Family

ID=22552709

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0205160A Expired - Fee Related GB2372154B (en) 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations

Country Status (4)

Country Link
CN (2) CN1668168B (en)
DE (2) DE10084996T1 (en)
GB (1) GB2372154B (en)
WO (1) WO2001022785A9 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1668168B (en) 1999-09-20 2010-12-01 纳斯因特普拉克斯工业公司 Electric connector and solder-bearing wafer and method for firmly mounting a device
DE10229953A1 (en) * 2002-07-03 2004-01-29 Hartmann Codier Gmbh & Co.Kg Component for PCB mounting
CN101752705B (en) 2008-11-28 2012-11-28 富士康(昆山)电脑接插件有限公司 Electric coupler
CN107538094B (en) * 2017-09-19 2018-08-14 南昌航空大学 Precision resistance brazing method kinds of the fine stranded wire

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684055A (en) * 1985-09-09 1987-08-04 Harris Corporation Method of selectively soldering the underside of a substrate having leads
US4807799A (en) * 1988-06-01 1989-02-28 Raychem Corporation Device for applying solder
US5986338A (en) * 1995-08-03 1999-11-16 Nissan Motor Co., Ltd. Assembly of semiconductor device
US6112001A (en) * 1997-07-30 2000-08-29 Kyocera Corporation Optical coupler and a method of producing it
US6119920A (en) * 1996-12-20 2000-09-19 Rf Monolithics, Inc. Method of forming an electronic package with a solder seal

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US4956913A (en) 1988-05-11 1990-09-18 E. I. Du Pont De Nemours And Company Pin alignment method
US5046957A (en) * 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
US5875546A (en) * 1995-11-03 1999-03-02 North American Specialties Corporation Method of forming solder-holding clips for applying solder to connectors
US5875102A (en) 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
JP3385872B2 (en) * 1995-12-25 2003-03-10 三菱電機株式会社 Solder supply method and the solder supply apparatus
US5796590A (en) 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US6063647A (en) * 1997-12-08 2000-05-16 3M Innovative Properties Company Method for making circuit elements for a z-axis interconnect
CN1668168B (en) 1999-09-20 2010-12-01 纳斯因特普拉克斯工业公司 Electric connector and solder-bearing wafer and method for firmly mounting a device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684055A (en) * 1985-09-09 1987-08-04 Harris Corporation Method of selectively soldering the underside of a substrate having leads
US4807799A (en) * 1988-06-01 1989-02-28 Raychem Corporation Device for applying solder
US5986338A (en) * 1995-08-03 1999-11-16 Nissan Motor Co., Ltd. Assembly of semiconductor device
US6119920A (en) * 1996-12-20 2000-09-19 Rf Monolithics, Inc. Method of forming an electronic package with a solder seal
US6112001A (en) * 1997-07-30 2000-08-29 Kyocera Corporation Optical coupler and a method of producing it

Also Published As

Publication number Publication date Type
WO2001022785A9 (en) 2002-11-28 application
DE10084996T0 (en) grant
GB2372154B (en) 2003-09-24 grant
DE10084996B8 (en) 2009-01-29 grant
GB0205160D0 (en) 2002-04-17 grant
DE10084996T1 (en) 2002-11-07 grant
CN1203733C (en) 2005-05-25 grant
WO2001022785A1 (en) 2001-03-29 application
CN1668168B (en) 2010-12-01 grant
CN1668168A (en) 2005-09-14 application
CN1390437A (en) 2003-01-08 application
DE10084996B4 (en) 2008-09-18 grant

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090920