AU1790001A - Method and apparatus for separating non-metallic materials - Google Patents
Method and apparatus for separating non-metallic materialsInfo
- Publication number
- AU1790001A AU1790001A AU17900/01A AU1790001A AU1790001A AU 1790001 A AU1790001 A AU 1790001A AU 17900/01 A AU17900/01 A AU 17900/01A AU 1790001 A AU1790001 A AU 1790001A AU 1790001 A AU1790001 A AU 1790001A
- Authority
- AU
- Australia
- Prior art keywords
- laser beam
- substrate
- quenching
- housing
- affected zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000007769 metal material Substances 0.000 title 1
- 238000010791 quenching Methods 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 5
- 230000000171 quenching effect Effects 0.000 abstract 4
- 238000005336 cracking Methods 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1423—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16728599P | 1999-11-24 | 1999-11-24 | |
| US60167285 | 1999-11-24 | ||
| PCT/US2000/032076 WO2001038039A1 (en) | 1999-11-24 | 2000-11-22 | Method and apparatus for separating non-metallic materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU1790001A true AU1790001A (en) | 2001-06-04 |
Family
ID=22606723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU17900/01A Abandoned AU1790001A (en) | 1999-11-24 | 2000-11-22 | Method and apparatus for separating non-metallic materials |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6489588B1 (enExample) |
| EP (1) | EP1232038B1 (enExample) |
| JP (1) | JP3895179B2 (enExample) |
| KR (1) | KR100721391B1 (enExample) |
| CN (1) | CN1413136A (enExample) |
| AT (1) | ATE392984T1 (enExample) |
| AU (1) | AU1790001A (enExample) |
| DE (1) | DE60038692T2 (enExample) |
| ES (1) | ES2304987T3 (enExample) |
| TR (1) | TR200201402T2 (enExample) |
| WO (1) | WO2001038039A1 (enExample) |
Families Citing this family (90)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6327875B1 (en) * | 1999-03-09 | 2001-12-11 | Corning Incorporated | Control of median crack depth in laser scoring |
| DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
| DE10041519C1 (de) | 2000-08-24 | 2001-11-22 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US6812430B2 (en) * | 2000-12-01 | 2004-11-02 | Lg Electronics Inc. | Glass cutting method and apparatus with controlled laser beam energy |
| US20020170318A1 (en) * | 2001-04-02 | 2002-11-21 | Andreas Gartner | Brief summary of the invention |
| KR100676249B1 (ko) * | 2001-05-23 | 2007-01-30 | 삼성전자주식회사 | 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치 |
| KR100700997B1 (ko) * | 2001-06-21 | 2007-03-28 | 삼성전자주식회사 | 기판 다중 절단 방법 및 이를 수행하기 위한 기판 다중절단 장치 |
| WO2003004210A1 (en) * | 2001-07-02 | 2003-01-16 | Virtek Laser Systems, Inc. | Method of ablating an opening in a hard, non-metallic substrate |
| TW542763B (en) * | 2001-07-16 | 2003-07-21 | Mitsuboshi Diamond Ind Co Ltd | Scribing device for fragile material substrate |
| TW568809B (en) * | 2001-09-21 | 2004-01-01 | Mitsuboshi Diamond Ind Co Ltd | Method for scribing substrate of brittle material and scriber |
| ES2285634T3 (es) | 2002-03-12 | 2007-11-16 | Hamamatsu Photonics K. K. | Metodo para dividir un siustrato. |
| EP2272618B1 (en) | 2002-03-12 | 2015-10-07 | Hamamatsu Photonics K.K. | Method of cutting object to be processed |
| TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
| US6919531B2 (en) | 2002-03-25 | 2005-07-19 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
| FR2839508B1 (fr) * | 2002-05-07 | 2005-03-04 | Saint Gobain | Vitrage decoupe sans rompage |
| JP4408607B2 (ja) * | 2002-06-11 | 2010-02-03 | 三星ダイヤモンド工業株式会社 | スクライブ方法及びスクライブ装置 |
| CN101602230B (zh) * | 2002-11-06 | 2015-06-10 | 三星钻石工业股份有限公司 | 划线形成方法 |
| TWI520269B (zh) | 2002-12-03 | 2016-02-01 | 濱松赫德尼古斯股份有限公司 | Cutting method of semiconductor substrate |
| KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
| EP1600270A4 (en) * | 2003-01-29 | 2006-09-20 | Mitsuboshi Diamond Ind Co Ltd | DEVICE AND METHOD FOR SUBSTRATE SEPARATION |
| FR2852250B1 (fr) | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
| EP1609559B1 (en) | 2003-03-12 | 2007-08-08 | Hamamatsu Photonics K. K. | Laser beam machining method |
| DE10330179A1 (de) * | 2003-07-02 | 2005-01-20 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zum Trennen flacher Werkstücke aus Keramik |
| EP2324950B1 (en) * | 2003-07-18 | 2013-11-06 | Hamamatsu Photonics K.K. | Semiconductor substrate to be cut with treated and minute cavity region, and method of cutting such substrate |
| US20050029240A1 (en) * | 2003-08-07 | 2005-02-10 | Translume, Inc. | Dual light source machining method and system |
| JP4563097B2 (ja) * | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
| AU2004294430B2 (en) * | 2003-12-05 | 2010-04-01 | Asahi Glass Company, Limited | Method and device for cutting plate glass |
| JP4598407B2 (ja) | 2004-01-09 | 2010-12-15 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
| JP4509578B2 (ja) | 2004-01-09 | 2010-07-21 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
| JP4601965B2 (ja) | 2004-01-09 | 2010-12-22 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
| KR20050100733A (ko) * | 2004-04-14 | 2005-10-20 | 주식회사 탑 엔지니어링 | 비금속재 절단장치 |
| KR20050100734A (ko) * | 2004-04-14 | 2005-10-20 | 주식회사 탑 엔지니어링 | 비금속재 절단방법 |
| KR101043674B1 (ko) * | 2004-05-11 | 2011-06-23 | 엘지디스플레이 주식회사 | 스크라이빙 장치 및 방법 |
| JP2008503355A (ja) * | 2004-06-21 | 2008-02-07 | アプライド フォトニクス,インク. | 基板材料の切断、分断または分割装置、システムおよび方法 |
| US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
| US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
| US20090078370A1 (en) * | 2004-08-31 | 2009-03-26 | Vladislav Sklyarevich | Method of separating non-metallic material using microwave radiation |
| KR100906543B1 (ko) * | 2004-12-08 | 2009-07-07 | 가부시키가이샤 레이져 솔루션즈 | 피분할체에 있어서의 분할 기점 형성 방법, 피분할체의 분할 방법, 및 펄스 레이저광에 의한 피가공물의 가공방법 |
| US20060179722A1 (en) * | 2005-02-02 | 2006-08-17 | Spindler Robert G | Edge treatment for glass panes |
| JPWO2006129504A1 (ja) * | 2005-06-03 | 2008-12-25 | 旭硝子株式会社 | 合わせガラスの切断方法および装置 |
| DE102005027800A1 (de) * | 2005-06-13 | 2006-12-14 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser |
| KR100978259B1 (ko) * | 2005-06-20 | 2010-08-26 | 엘지디스플레이 주식회사 | 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법 |
| US20080236199A1 (en) * | 2005-07-28 | 2008-10-02 | Vladislav Sklyarevich | Method of Separating Non-Metallic Material Using Microwave Radiation |
| WO2007020835A1 (ja) * | 2005-08-12 | 2007-02-22 | Shibaura Mechatronics Corporation | 脆性材料の割断加工システム及びその方法 |
| KR101081613B1 (ko) * | 2005-09-13 | 2011-11-09 | 가부시키가이샤 레미 | 취성재료의 할단방법 및 장치 |
| TW200724276A (en) * | 2005-12-26 | 2007-07-01 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus |
| DE102006012582B4 (de) * | 2006-03-16 | 2010-01-21 | Schott Ag | Vorrichtung und Verfahren zum Abtrennen von Abschnitten von Glasstangen |
| US20090050661A1 (en) * | 2006-03-24 | 2009-02-26 | Youn-Ho Na | Glass Cutting Apparatus With Bending Member and Method Using Thereof |
| JP4977391B2 (ja) * | 2006-03-27 | 2012-07-18 | 日本電気株式会社 | レーザ切断方法、表示装置の製造方法、および表示装置 |
| TWI298280B (en) * | 2006-09-06 | 2008-07-01 | Nat Applied Res Laboratories | Method for cutting non-metal material |
| JP4869002B2 (ja) * | 2006-09-26 | 2012-02-01 | 株式会社東芝 | セラミックス基板の製造方法およびセラミックス回路基板の製造方法 |
| JP2008183599A (ja) * | 2007-01-31 | 2008-08-14 | Japan Steel Works Ltd:The | 高脆性非金属材料製の被加工物の加工方法及びその装置 |
| TWI466836B (zh) * | 2007-02-28 | 2015-01-01 | Ceramtec Ag | 製造構件的方法 |
| US7982162B2 (en) * | 2007-05-15 | 2011-07-19 | Corning Incorporated | Method and apparatus for scoring and separating a brittle material with a single beam of radiation |
| US20090085254A1 (en) * | 2007-09-28 | 2009-04-02 | Anatoli Anatolyevich Abramov | Laser scoring with flat profile beam |
| US8011207B2 (en) * | 2007-11-20 | 2011-09-06 | Corning Incorporated | Laser scoring of glass sheets at high speeds and with low residual stress |
| US8035901B2 (en) * | 2008-04-30 | 2011-10-11 | Corning Incorporated | Laser scoring with curved trajectory |
| US8895892B2 (en) * | 2008-10-23 | 2014-11-25 | Corning Incorporated | Non-contact glass shearing device and method for scribing or cutting a moving glass sheet |
| WO2010048733A1 (en) * | 2008-10-29 | 2010-05-06 | Oerlikon Solar Ip Ag, Trübbach | Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation |
| DE102008058310B3 (de) * | 2008-11-18 | 2010-06-17 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung zum Randentschichten beschichteter Substrate und Trennen in einzelne Module |
| US8347651B2 (en) * | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
| TWI490176B (zh) * | 2009-03-20 | 2015-07-01 | Corning Inc | 分離玻璃板材的製程與設備 |
| TWI517922B (zh) * | 2009-05-13 | 2016-01-21 | 康寧公司 | 切割脆性材料之方法 |
| DE102009023602B4 (de) * | 2009-06-02 | 2012-08-16 | Grenzebach Maschinenbau Gmbh | Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| US8426767B2 (en) * | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
| CN102574232A (zh) * | 2009-09-29 | 2012-07-11 | 皮可钻机公司 | 切割基板的方法和用于切割的设备 |
| US8171753B2 (en) * | 2009-11-18 | 2012-05-08 | Corning Incorporated | Method for cutting a brittle material |
| EP2724993B1 (en) | 2009-11-30 | 2016-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| TWI576320B (zh) | 2010-10-29 | 2017-04-01 | 康寧公司 | 用於裁切玻璃帶之方法與設備 |
| US8461480B2 (en) | 2010-11-30 | 2013-06-11 | Electro Scientific Industries, Inc. | Orthogonal integrated cleaving device |
| CN103313946B (zh) * | 2011-06-08 | 2016-11-23 | 日本电气硝子株式会社 | 板状玻璃的切断方法 |
| US9090383B2 (en) | 2011-12-01 | 2015-07-28 | Sealstrip Corporation | Tape sealed reclosable bag |
| US20130193617A1 (en) * | 2012-02-01 | 2013-08-01 | Electro Scientific Industries, Inc. | Systems and methods for separating non-metallic materials |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| CN102749746B (zh) * | 2012-06-21 | 2015-02-18 | 深圳市华星光电技术有限公司 | 液晶基板切割装置及液晶基板切割方法 |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| US10017411B2 (en) | 2014-11-19 | 2018-07-10 | Corning Incorporated | Methods of separating a glass web |
| US9533813B1 (en) * | 2015-09-27 | 2017-01-03 | Sealstrip Corporation | Re-closable, tamper-resistant, stand-up package |
| CN107520541B (zh) * | 2016-06-20 | 2020-05-15 | 南京魔迪多维数码科技有限公司 | 激光切割脆性材料的方法 |
| CN110678423B (zh) | 2017-03-22 | 2022-05-13 | 康宁股份有限公司 | 分离玻璃板条的方法 |
| CN106938884B (zh) * | 2017-04-19 | 2019-04-26 | 重庆坤秀门窗有限公司 | 一种用于玻璃门切割的玻璃切割机 |
| FR3066488B1 (fr) * | 2017-05-19 | 2022-03-04 | Saint Gobain | Procede de rompage d'une feuille de verre |
| JP7184455B2 (ja) * | 2018-06-27 | 2022-12-06 | 株式会社ディスコ | ウェーハの加工方法 |
| TW202035321A (zh) * | 2019-01-29 | 2020-10-01 | 美商康寧公司 | 用於撓性薄玻璃的自由形式切割的方法及設備 |
| EP4017739A4 (en) * | 2019-08-23 | 2023-10-04 | Tyson II, John | Methods, system and devices for panel marking and formability measurements, including autonomous methods and devices |
| WO2021107168A1 (ko) * | 2019-11-26 | 2021-06-03 | 이석준 | 레이저 절단 장치 및 방법 |
Family Cites Families (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1720883A (en) | 1926-11-27 | 1929-07-16 | Bessie L Gregg | Apparatus for severing glass or the like |
| NL299821A (enExample) | 1962-10-31 | 1900-01-01 | ||
| DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
| US3597578A (en) | 1967-03-16 | 1971-08-03 | Nat Res Dev | Thermal cutting apparatus and method |
| US3629545A (en) | 1967-12-19 | 1971-12-21 | Western Electric Co | Laser substrate parting |
| GB1246481A (en) | 1968-03-29 | 1971-09-15 | Pilkington Brothers Ltd | Improvements in or relating to the cutting of glass |
| US3589883A (en) | 1968-05-28 | 1971-06-29 | Ppg Industries Inc | Method and apparatus for thermally fracturing a ribbon of glass |
| US3604890A (en) | 1969-10-15 | 1971-09-14 | Boeing Co | Multibeam laser-jet cutting apparatus |
| US3610871A (en) * | 1970-02-19 | 1971-10-05 | Western Electric Co | Initiation of a controlled fracture |
| US3695497A (en) | 1970-08-26 | 1972-10-03 | Ppg Industries Inc | Method of severing glass |
| US3790362A (en) | 1970-09-15 | 1974-02-05 | Ppg Industries Inc | Directional control for thermal severing of glass |
| US3800991A (en) | 1972-04-10 | 1974-04-02 | Ppg Industries Inc | Method of and an apparatus for cutting glass |
| US3795502A (en) | 1972-05-26 | 1974-03-05 | Ppg Industries Inc | Method of cutting glass |
| AT342232B (de) | 1972-10-12 | 1978-03-28 | Glaverbel | Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material |
| US4045201A (en) | 1976-07-09 | 1977-08-30 | American Atomics Corporation | Method and apparatus for subdividing a gas filled glass tube |
| DE2813302C2 (de) | 1978-03-28 | 1979-09-13 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen | Verfahren und Vorrichtung zum geradlinigen Schneiden von Flachglas mit Hilfe von thermisch induzierten Spannungen |
| US4467168A (en) | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
| JPS5987996A (ja) | 1982-11-10 | 1984-05-21 | Ishikawajima Harima Heavy Ind Co Ltd | レ−ザ・ガス切断装置 |
| US4546231A (en) | 1983-11-14 | 1985-10-08 | Group Ii Manufacturing Ltd. | Creation of a parting zone in a crystal structure |
| JPS6046892A (ja) | 1984-07-19 | 1985-03-13 | Toshiba Corp | レ−ザ−光照射方法 |
| SU1231813A1 (ru) | 1984-10-02 | 1991-04-23 | Организация П/Я Р-6007 | Установка дл резки листовых материалов, преимущественно стекл нных пластин |
| JPS61229487A (ja) | 1985-04-03 | 1986-10-13 | Sasaki Glass Kk | レ−ザビ−ムによるガラス切断方法 |
| SU1430931A1 (ru) | 1985-11-04 | 1988-10-15 | Институт Машиноведения Им.А.А.Благонравова | Сканатор дл лазерных технологических установок |
| JPS6453794A (en) | 1987-08-20 | 1989-03-01 | Sumitomo Electric Industries | Optical lens for large output laser |
| EP0329787A4 (en) | 1987-08-28 | 1990-09-05 | Tsentralnoe Konstruktorskoe Bjuro Unikalnogo Priborostroenia Akademii Nauk Ssr | Method and device for laser processing of an object |
| JPS6462294A (en) | 1987-09-01 | 1989-03-08 | Sumitomo Electric Industries | Laser beam machining method |
| JP2615093B2 (ja) | 1987-11-30 | 1997-05-28 | 三菱重工業株式会社 | 異軸多焦点式レーザビーム集光装置 |
| JPH0767633B2 (ja) | 1987-11-30 | 1995-07-26 | 三菱重工業株式会社 | 同軸多焦点式レーザビーム集光装置 |
| JPH01306088A (ja) | 1988-06-01 | 1989-12-11 | Nippei Toyama Corp | 可変ビームレーザ加工装置 |
| JP2724192B2 (ja) | 1989-02-17 | 1998-03-09 | 株式会社アマダ | フィルムコーティング材のレーザ加工方法 |
| JPH02263590A (ja) | 1989-04-04 | 1990-10-26 | Matsushita Electric Ind Co Ltd | レーザ加工機 |
| JPH02295688A (ja) | 1989-05-01 | 1990-12-06 | Amada Co Ltd | フィルムコーティング材のレーザ加工方法およびその方法に用いるレーザ加工ヘッド |
| DE69008927T2 (de) | 1989-05-08 | 1994-12-01 | Philips Nv | Verfahren zum Spalten einer Platte aus sprödem Werkstoff. |
| DE69013047T2 (de) | 1989-05-08 | 1995-04-13 | Philips Nv | Verfahren zum Spalten einer Platte aus sprödem Werkstoff. |
| ES2054166T3 (es) | 1989-07-14 | 1994-08-01 | Maho Ag | Procedimiento y maquina herramienta para producir espacios huecos en piezas macizas por medio de rayo laser. |
| JP2712723B2 (ja) | 1990-03-07 | 1998-02-16 | 松下電器産業株式会社 | レーザ切断方法 |
| US5132505A (en) | 1990-03-21 | 1992-07-21 | U.S. Philips Corporation | Method of cleaving a brittle plate and device for carrying out the method |
| DE4016199A1 (de) | 1990-05-19 | 1991-11-21 | Linde Ag | Verfahren und vorrichtung zum laserstrahlschneiden |
| JPH04118190A (ja) | 1990-09-07 | 1992-04-20 | Nagasaki Pref Gov | ウェハの割断方法 |
| JPH0639572A (ja) | 1991-01-11 | 1994-02-15 | Souei Tsusho Kk | ウェハ割断装置 |
| US5223692A (en) | 1991-09-23 | 1993-06-29 | General Electric Company | Method and apparatus for laser trepanning |
| DE4215561C2 (de) | 1991-11-19 | 1995-04-06 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Abtragen von Werkstoff eines relativbewegten metallenen Werkstücks |
| WO1993009909A1 (de) | 1991-11-19 | 1993-05-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum abtragen von werkstoff von relativbewegten metallenen werkstücken |
| RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| US5463200A (en) | 1993-02-11 | 1995-10-31 | Lumonics Inc. | Marking of a workpiece by light energy |
| US5359176A (en) | 1993-04-02 | 1994-10-25 | International Business Machines Corporation | Optics and environmental protection device for laser processing applications |
| US5571429A (en) | 1994-02-25 | 1996-11-05 | Litel Instruments | Apparatus and process for high speed laminate processing with computer generated holograms |
| US5622540A (en) | 1994-09-19 | 1997-04-22 | Corning Incorporated | Method for breaking a glass sheet |
| US5776220A (en) | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| US5871134A (en) * | 1994-12-27 | 1999-02-16 | Asahi Glass Company Ltd. | Method and apparatus for breaking and cutting a glass ribbon |
| US5742026A (en) | 1995-06-26 | 1998-04-21 | Corning Incorporated | Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation |
| JPH0929472A (ja) * | 1995-07-14 | 1997-02-04 | Hitachi Ltd | 割断方法、割断装置及びチップ材料 |
| EP0847317B1 (en) | 1995-08-31 | 2003-08-27 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| DE19609199A1 (de) | 1996-03-09 | 1997-09-11 | Vetter & Co Apotheker | Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens |
| JPH1099978A (ja) | 1996-09-27 | 1998-04-21 | Hitachi Ltd | レーザー加工装置 |
| MY120533A (en) | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
| JP3498895B2 (ja) * | 1997-09-25 | 2004-02-23 | シャープ株式会社 | 基板の切断方法および表示パネルの製造方法 |
| US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| US6259058B1 (en) * | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
-
2000
- 2000-11-22 ES ES00980670T patent/ES2304987T3/es not_active Expired - Lifetime
- 2000-11-22 DE DE2000638692 patent/DE60038692T2/de not_active Expired - Lifetime
- 2000-11-22 US US09/718,453 patent/US6489588B1/en not_active Expired - Lifetime
- 2000-11-22 AT AT00980670T patent/ATE392984T1/de active
- 2000-11-22 WO PCT/US2000/032076 patent/WO2001038039A1/en not_active Ceased
- 2000-11-22 TR TR200201402T patent/TR200201402T2/xx unknown
- 2000-11-22 JP JP2001539634A patent/JP3895179B2/ja not_active Expired - Fee Related
- 2000-11-22 KR KR1020027006462A patent/KR100721391B1/ko not_active Expired - Fee Related
- 2000-11-22 AU AU17900/01A patent/AU1790001A/en not_active Abandoned
- 2000-11-22 EP EP00980670A patent/EP1232038B1/en not_active Expired - Lifetime
- 2000-11-22 CN CN00817725A patent/CN1413136A/zh active Pending
-
2002
- 2002-07-16 US US10/196,658 patent/US6660963B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100721391B1 (ko) | 2007-05-23 |
| DE60038692T2 (de) | 2009-07-02 |
| JP3895179B2 (ja) | 2007-03-22 |
| US6489588B1 (en) | 2002-12-03 |
| DE60038692D1 (de) | 2008-06-05 |
| US20030024909A1 (en) | 2003-02-06 |
| TR200201402T2 (tr) | 2003-03-21 |
| ATE392984T1 (de) | 2008-05-15 |
| JP2003534132A (ja) | 2003-11-18 |
| ES2304987T3 (es) | 2008-11-01 |
| EP1232038A1 (en) | 2002-08-21 |
| KR20020071866A (ko) | 2002-09-13 |
| WO2001038039A1 (en) | 2001-05-31 |
| CN1413136A (zh) | 2003-04-23 |
| US6660963B2 (en) | 2003-12-09 |
| WO2001038039A9 (en) | 2002-11-07 |
| EP1232038B1 (en) | 2008-04-23 |
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