ATE82460T1 - Methode zur behandlung der substratoberflaechen mit hilfe von plasma und reaktor fuer die durchfuehrung dieser methode. - Google Patents

Methode zur behandlung der substratoberflaechen mit hilfe von plasma und reaktor fuer die durchfuehrung dieser methode.

Info

Publication number
ATE82460T1
ATE82460T1 AT88201112T AT88201112T ATE82460T1 AT E82460 T1 ATE82460 T1 AT E82460T1 AT 88201112 T AT88201112 T AT 88201112T AT 88201112 T AT88201112 T AT 88201112T AT E82460 T1 ATE82460 T1 AT E82460T1
Authority
AT
Austria
Prior art keywords
plasma
reactor
substrato
implementing
treatment
Prior art date
Application number
AT88201112T
Other languages
German (de)
English (en)
Inventor
Daniel Cornelis Schram
Gerardus Maria Wilhelm Kroesen
Original Assignee
Univ Eindhoven Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Eindhoven Tech filed Critical Univ Eindhoven Tech
Application granted granted Critical
Publication of ATE82460T1 publication Critical patent/ATE82460T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder or liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
AT88201112T 1987-06-30 1988-06-02 Methode zur behandlung der substratoberflaechen mit hilfe von plasma und reaktor fuer die durchfuehrung dieser methode. ATE82460T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8701530A NL8701530A (nl) 1987-06-30 1987-06-30 Werkwijze voor het behandelen van oppervlakken van substraten met behulp van een plasma en reactor voor het uitvoeren van die werkwijze.
EP88201112A EP0297637B1 (en) 1987-06-30 1988-06-02 Method of treating surfaces of substrates with the aid of a plasma and a reactor for carrying out the method

Publications (1)

Publication Number Publication Date
ATE82460T1 true ATE82460T1 (de) 1992-11-15

Family

ID=19850226

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88201112T ATE82460T1 (de) 1987-06-30 1988-06-02 Methode zur behandlung der substratoberflaechen mit hilfe von plasma und reaktor fuer die durchfuehrung dieser methode.

Country Status (10)

Country Link
US (1) US4871580A (OSRAM)
EP (1) EP0297637B1 (OSRAM)
JP (1) JP2705029B2 (OSRAM)
AT (1) ATE82460T1 (OSRAM)
AU (1) AU596935B2 (OSRAM)
CA (1) CA1324979C (OSRAM)
DE (1) DE3875815T2 (OSRAM)
ES (1) ES2036253T3 (OSRAM)
GR (1) GR3007016T3 (OSRAM)
NL (1) NL8701530A (OSRAM)

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US5565247A (en) * 1991-08-30 1996-10-15 Canon Kabushiki Kaisha Process for forming a functional deposited film
US5525392A (en) * 1992-12-10 1996-06-11 International Business Machines Corporation Magnetic recording medium having a fluorinated polymeric protective layer formed by an ion beam
JPH0822945A (ja) * 1994-07-07 1996-01-23 Fujitsu Ltd 半導体装置の製造方法
SE9403988L (sv) * 1994-11-18 1996-04-01 Ladislav Bardos Apparat för alstring av linjär ljusbågsurladdning för plasmabearbetning
US5571332A (en) * 1995-02-10 1996-11-05 Jet Process Corporation Electron jet vapor deposition system
US6258287B1 (en) * 1996-08-28 2001-07-10 Georgia Tech Research Corporation Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment
DE19648999C2 (de) * 1996-11-27 2000-08-03 Afs Entwicklungs & Vertriebs G Vorrichtung zur Reinigung, Beschichtung und/oder Aktivierung von Kunststoffoberflächen
US6213049B1 (en) 1997-06-26 2001-04-10 General Electric Company Nozzle-injector for arc plasma deposition apparatus
US6110544A (en) * 1997-06-26 2000-08-29 General Electric Company Protective coating by high rate arc plasma deposition
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US6122050A (en) * 1998-02-26 2000-09-19 Cornell Research Foundation, Inc. Optical interface for a radially viewed inductively coupled argon plasma-Optical emission spectrometer
US6420032B1 (en) 1999-03-17 2002-07-16 General Electric Company Adhesion layer for metal oxide UV filters
US6517687B1 (en) 1999-03-17 2003-02-11 General Electric Company Ultraviolet filters with enhanced weatherability and method of making
US6426125B1 (en) 1999-03-17 2002-07-30 General Electric Company Multilayer article and method of making by ARC plasma deposition
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US6261694B1 (en) 1999-03-17 2001-07-17 General Electric Company Infrared reflecting coatings
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NL1017849C2 (nl) * 2001-04-16 2002-10-30 Univ Eindhoven Tech Werkwijze en inrichting voor het deponeren van een althans ten dele kristallijne siliciumlaag op een substraat.
WO2003017737A2 (en) * 2001-08-16 2003-02-27 Dow Global Technologies Inc. Cascade arc plasma and abrasion resistant coatings made therefrom
US6948448B2 (en) 2001-11-27 2005-09-27 General Electric Company Apparatus and method for depositing large area coatings on planar surfaces
US6681716B2 (en) * 2001-11-27 2004-01-27 General Electric Company Apparatus and method for depositing large area coatings on non-planar surfaces
ATE402277T1 (de) * 2002-02-05 2008-08-15 Dow Global Technologies Inc Chemische dampfphasenabscheidung auf einem substrat mittels eines korona-plasmas
RU2200058C1 (ru) * 2002-02-12 2003-03-10 Открытое акционерное общество "ТВЭЛ" Способ проведения гомогенных и гетерогенных химических реакций с использованием плазмы
US6743524B2 (en) 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
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NL1021185C2 (nl) * 2002-07-30 2004-02-03 Fom Inst Voor Plasmafysica Inrichting voor het behandelen van een oppervlak van een substraat en een plasmabron.
US20040229051A1 (en) 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
JP2006508346A (ja) * 2002-11-28 2006-03-09 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 光学検査システム及び当該検査システムに用いられる放射源
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US6969953B2 (en) * 2003-06-30 2005-11-29 General Electric Company System and method for inductive coupling of an expanding thermal plasma
US7282244B2 (en) * 2003-09-05 2007-10-16 General Electric Company Replaceable plate expanded thermal plasma apparatus and method
NL1025096C2 (nl) * 2003-12-21 2005-06-23 Otb Group Bv Werkwijze alsmede inrichting voor het vervaardigen van een functionele laag bestaande uit ten minste twee componenten.
US20050139256A1 (en) * 2003-12-31 2005-06-30 Korman Charles S. Solar cell assembly for use in an outer space environment or a non-earth environment
US20050139253A1 (en) * 2003-12-31 2005-06-30 Korman Charles S. Solar cell assembly for use in an outer space environment or a non-earth environment
US20050139255A1 (en) * 2003-12-31 2005-06-30 Korman Charles S. Solar cell assembly for use in an outer space environment or a non-earth environment
EP2261392B1 (en) * 2004-03-09 2018-10-03 Exatec, LLC. Expanding thermal plasma deposition system
US7354845B2 (en) 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
US7703413B2 (en) * 2004-06-28 2010-04-27 Sabic Innovative Plastics Ip B.V. Expanded thermal plasma apparatus
WO2006126133A2 (en) * 2005-05-26 2006-11-30 Koninklijke Philips Electronics N.V. Cascade arc radiation source with oxygen scavenging means
WO2008007944A1 (en) * 2006-07-12 2008-01-17 Technische Universiteit Eindhoven Method and device for treating a substrate by means of a plasma
EP1895818B1 (en) * 2006-08-30 2015-03-11 Sulzer Metco AG Plasma spraying device and a method for introducing a liquid precursor into a plasma gas system
ES2534215T3 (es) 2006-08-30 2015-04-20 Oerlikon Metco Ag, Wohlen Dispositivo de pulverización de plasma y un método para la introducción de un precursor líquido en un sistema de gas de plasma
DE102006042501B4 (de) * 2006-09-07 2010-11-25 Eisenmann Anlagenbau Gmbh & Co. Kg Verfahren und Anlage zum Trocknen von Gegenständen
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Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2245779B1 (OSRAM) * 1973-09-28 1978-02-10 Cit Alcatel

Also Published As

Publication number Publication date
NL8701530A (nl) 1989-01-16
AU1822288A (en) 1989-01-05
DE3875815T2 (de) 1993-04-29
EP0297637A1 (en) 1989-01-04
CA1324979C (en) 1993-12-07
US4871580A (en) 1989-10-03
AU596935B2 (en) 1990-05-17
EP0297637B1 (en) 1992-11-11
JP2705029B2 (ja) 1998-01-26
JPH01208450A (ja) 1989-08-22
ES2036253T3 (es) 1993-05-16
DE3875815D1 (de) 1992-12-17
GR3007016T3 (OSRAM) 1993-07-30

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Legal Events

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UEP Publication of translation of european patent specification
EELA Cancelled due to lapse of time