ATE535936T1 - Scheibchenbehälter mit radial schwenkenden verriegelungselementen - Google Patents

Scheibchenbehälter mit radial schwenkenden verriegelungselementen

Info

Publication number
ATE535936T1
ATE535936T1 AT04751855T AT04751855T ATE535936T1 AT E535936 T1 ATE535936 T1 AT E535936T1 AT 04751855 T AT04751855 T AT 04751855T AT 04751855 T AT04751855 T AT 04751855T AT E535936 T1 ATE535936 T1 AT E535936T1
Authority
AT
Austria
Prior art keywords
latch elements
elements
pivot
inward
wafer
Prior art date
Application number
AT04751855T
Other languages
English (en)
Inventor
Valoris Forsyth
Jim Gardiner
Berry Brown
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works filed Critical Illinois Tool Works
Application granted granted Critical
Publication of ATE535936T1 publication Critical patent/ATE535936T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT04751855T 2003-06-17 2004-05-11 Scheibchenbehälter mit radial schwenkenden verriegelungselementen ATE535936T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US47908603P 2003-06-17 2003-06-17
US10/787,489 US6988621B2 (en) 2003-06-17 2004-02-25 Reduced movement wafer box
PCT/US2004/014659 WO2005001890A2 (en) 2003-06-17 2004-05-11 Wafer box with radially pivoting latch elements

Publications (1)

Publication Number Publication Date
ATE535936T1 true ATE535936T1 (de) 2011-12-15

Family

ID=33519329

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04751855T ATE535936T1 (de) 2003-06-17 2004-05-11 Scheibchenbehälter mit radial schwenkenden verriegelungselementen

Country Status (6)

Country Link
US (2) US6988621B2 (de)
EP (1) EP1638864B1 (de)
JP (1) JP4564004B2 (de)
KR (1) KR20060026423A (de)
AT (1) ATE535936T1 (de)
WO (1) WO2005001890A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7578392B2 (en) * 2003-06-06 2009-08-25 Convey Incorporated Integrated circuit wafer packaging system and method
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
US7431162B2 (en) * 2005-07-15 2008-10-07 Illinois Tool Works Inc. Shock absorbing horizontal transport wafer box
FR2896912B1 (fr) * 2005-12-09 2008-11-28 Alcatel Sa Enceinte etanche pour le transport et le stockage de substrats semi-conducteurs
WO2009048456A1 (en) * 2007-10-12 2009-04-16 Peak Plastic & Metal Products (International) Limited Wafer container with staggered wall structure
US8109390B2 (en) * 2009-08-26 2012-02-07 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with overlapping wall structure
US8556079B2 (en) * 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
US8813964B2 (en) * 2009-08-26 2014-08-26 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with recessed latch
WO2012135863A2 (en) * 2011-04-01 2012-10-04 Entegris, Inc. Substrate shipper with locking device
CN103074610A (zh) * 2012-08-28 2013-05-01 光达光电设备科技（嘉兴）有限公司 衬底支撑结构、含有上述衬底支撑结构的反应腔室
WO2014062956A1 (en) * 2012-10-19 2014-04-24 Entegris, Inc. Reticle pod with cover to baseplate alignment system
JP6258069B2 (ja) * 2014-02-26 2018-01-10 信越ポリマー株式会社 基板収納容器
US10153187B2 (en) * 2014-11-11 2018-12-11 Applied Materials, Inc. Methods and apparatus for transferring a substrate
JP6767297B2 (ja) * 2017-03-31 2020-10-14 アキレス株式会社 ウェーハ収容容器
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
EP4503107A1 (de) * 2022-03-30 2025-02-05 Achilles Corporation Halbleiter-wafer-transferbehälter

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691294A (en) * 1970-10-05 1972-09-12 Coil Sales Inc Package for encapsulated electrical components
US3997072A (en) * 1975-02-24 1976-12-14 General Electric Company Compactor container with removable bottom
JP2941125B2 (ja) * 1992-08-15 1999-08-25 アキレス株式会社 半導体ウェーハ収納容器
US5366079A (en) * 1993-08-19 1994-11-22 Taiwan Semiconductor Manufacturing Company Integrated circuit wafer and retainer element combination
JPH08236605A (ja) * 1995-02-28 1996-09-13 Komatsu Electron Metals Co Ltd 半導体ウェハ収納ケース
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
JPH0986588A (ja) * 1995-09-21 1997-03-31 Komatsu Kasei Kk 積層型包装容器
US5611448A (en) * 1995-09-25 1997-03-18 United Microelectronics Corporation Wafer container
US6003674A (en) 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
US5724748A (en) * 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6193090B1 (en) * 1999-04-06 2001-02-27 3M Innovative Properties Company Reusable container
DE60044028D1 (de) * 1999-07-23 2010-04-29 Ray G Brooks Sicherungssystem für wafer mit integriertem schaltkreis (ic)
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
JP4480296B2 (ja) * 2001-05-09 2010-06-16 アキレス株式会社 電子部材用収納容器
US6988620B2 (en) * 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
JP2004266181A (ja) * 2003-03-04 2004-09-24 Nec Electronics Corp 半導体基板収納容器
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
CN100363243C (zh) * 2003-06-17 2008-01-23 伊利诺斯器械工程公司 减少移动的晶片盒
US6915906B2 (en) * 2003-07-14 2005-07-12 Peak Plastic & Metal Products (International) Limited Wafer storage container with wafer positioning posts
US7225929B2 (en) * 2004-12-30 2007-06-05 Illinois Tool Works Inc. Adjustable height wafer box

Also Published As

Publication number Publication date
WO2005001890A2 (en) 2005-01-06
JP2006527921A (ja) 2006-12-07
EP1638864B1 (de) 2011-11-30
KR20060026423A (ko) 2006-03-23
US7565980B2 (en) 2009-07-28
US6988621B2 (en) 2006-01-24
JP4564004B2 (ja) 2010-10-20
EP1638864A2 (de) 2006-03-29
US20040256285A1 (en) 2004-12-23
US20060180499A1 (en) 2006-08-17
EP1638864A4 (de) 2008-07-30
WO2005001890A3 (en) 2005-03-24

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