ATE517957T1 - Verfahren zur herstellung eines silikonschichtverbunds - Google Patents

Verfahren zur herstellung eines silikonschichtverbunds

Info

Publication number
ATE517957T1
ATE517957T1 AT04799889T AT04799889T ATE517957T1 AT E517957 T1 ATE517957 T1 AT E517957T1 AT 04799889 T AT04799889 T AT 04799889T AT 04799889 T AT04799889 T AT 04799889T AT E517957 T1 ATE517957 T1 AT E517957T1
Authority
AT
Austria
Prior art keywords
silicone layer
producing
layer composite
addition
organopolysiloxane composition
Prior art date
Application number
AT04799889T
Other languages
English (en)
Inventor
Yoshitsugu Morita
Tomoko Kato
Hiroji Enami
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE517957T1 publication Critical patent/ATE517957T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
AT04799889T 2003-11-28 2004-11-24 Verfahren zur herstellung eines silikonschichtverbunds ATE517957T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003400426A JP4503271B2 (ja) 2003-11-28 2003-11-28 シリコーン積層体の製造方法
PCT/JP2004/017829 WO2005052078A1 (en) 2003-11-28 2004-11-24 A method of manufacturing a layered silicone composite material

Publications (1)

Publication Number Publication Date
ATE517957T1 true ATE517957T1 (de) 2011-08-15

Family

ID=34631645

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04799889T ATE517957T1 (de) 2003-11-28 2004-11-24 Verfahren zur herstellung eines silikonschichtverbunds

Country Status (7)

Country Link
US (2) US7919150B2 (de)
EP (1) EP1697473B1 (de)
JP (1) JP4503271B2 (de)
KR (1) KR101109503B1 (de)
CN (1) CN1886476A (de)
AT (1) ATE517957T1 (de)
WO (1) WO2005052078A1 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4503271B2 (ja) * 2003-11-28 2010-07-14 東レ・ダウコーニング株式会社 シリコーン積層体の製造方法
US7438952B2 (en) 2004-06-30 2008-10-21 Ppg Industries Ohio, Inc. Methods and systems for coating articles having a plastic substrate
US7192795B2 (en) * 2004-11-18 2007-03-20 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US7625625B2 (en) * 2005-08-02 2009-12-01 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
JP5481613B2 (ja) * 2005-09-14 2014-04-23 Ｅ＆Ｃエンジニアリング株式会社 共振型電波吸収体とその製造方法
JP4684835B2 (ja) * 2005-09-30 2011-05-18 信越化学工業株式会社 シリコーンゴム硬化物の表面タック性を低減する方法、半導体封止用液状シリコーンゴム組成物、シリコーンゴム封止型半導体装置、及び該半導体装置の製造方法
JP4872296B2 (ja) * 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
US20070092737A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092636A1 (en) * 2005-10-24 2007-04-26 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
JP4816951B2 (ja) * 2005-12-06 2011-11-16 信越化学工業株式会社 シリコーン組成物及びその硬化物
WO2007100445A2 (en) * 2006-02-24 2007-09-07 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP4933610B2 (ja) * 2006-04-18 2012-05-16 ダウ・コーニング・コーポレイション 銅インジウム二セレン化物をベースとする光起電デバイス及びその光起電デバイスを作製する方法
CN101421100B (zh) * 2006-04-18 2013-03-27 陶氏康宁公司 用缩合固化的有机硅树脂组合物涂布的金属箔基底
KR20090005184A (ko) 2006-04-18 2009-01-12 다우 코닝 코포레이션 구리 인듐 디셀레나이드-기재 광전지 장치 및 그의 제조 방법
US8207442B2 (en) 2006-04-18 2012-06-26 Itn Energy Systems, Inc. Reinforcing structures for thin-film photovoltaic device substrates, and associated methods
KR20080112381A (ko) * 2006-04-18 2008-12-24 다우 코닝 코포레이션 카드뮴 텔루라이드 기재 광전지 장치 및 그 제조 방법
JP5202819B2 (ja) * 2006-04-26 2013-06-05 富士フイルム株式会社 反射防止フィルムの製造方法
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
JP2007329182A (ja) * 2006-06-06 2007-12-20 Shin Etsu Polymer Co Ltd キャリア治具及びその製造方法
US8092735B2 (en) 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
WO2008036769A2 (en) 2006-09-19 2008-03-27 Itn Energy Systems, Inc. Semi-transparent dual layer back contact for bifacial and tandem junction thin-film photovolataic devices
WO2008100991A1 (en) 2007-02-13 2008-08-21 3M Innovative Properties Company Led devices having lenses and methods of making same
US9944031B2 (en) * 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
DE102007025749A1 (de) * 2007-06-01 2008-12-11 Wacker Chemie Ag Leuchtkörper-Silicon-Formteil
TWI458780B (zh) 2007-07-31 2014-11-01 Dow Corning Toray Co Ltd 提供高透明矽酮硬化物之硬化性矽酮組合物
US20090065792A1 (en) * 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
US7960192B2 (en) * 2007-09-14 2011-06-14 3M Innovative Properties Company Light emitting device having silicon-containing composition and method of making same
JP2009152099A (ja) * 2007-12-21 2009-07-09 Shin Etsu Polymer Co Ltd 携帯電話の照明構造
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5571295B2 (ja) * 2008-07-14 2014-08-13 東レ・ダウコーニング株式会社 ヒドロシリル化反応により硬化してなるシリコーン層を備えた基材の製造方法および回収された有機溶媒を使用するシリコーン組成物
CN102112556B (zh) 2008-07-31 2014-01-01 道康宁东丽株式会社 多成分型海绵形成性液体硅橡胶组合物和硅橡胶海绵的制造方法
JP5475296B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5568240B2 (ja) * 2009-02-02 2014-08-06 東レ・ダウコーニング株式会社 硬化性シリコーンゴム組成物
JP5475295B2 (ja) 2009-02-02 2014-04-16 東レ・ダウコーニング株式会社 高透明のシリコーン硬化物を与える硬化性シリコーン組成物
JP5434954B2 (ja) * 2010-05-07 2014-03-05 信越化学工業株式会社 剥離紙又は剥離フィルム用下塗りシリコーン組成物、並びに処理紙又は処理フィルム
JP5626097B2 (ja) * 2010-05-07 2014-11-19 信越化学工業株式会社 剥離紙又は剥離フィルム用シリコーン組成物、並びに剥離紙又は剥離フィルムとその製造方法
KR101213028B1 (ko) 2011-02-09 2012-12-18 주식회사 케이씨씨 오르가노폴리실록산, 그 제조방법 및 이를 포함하는 실리콘 조성물
TWI480335B (zh) * 2011-11-25 2015-04-11 Ｌｇ化學股份有限公司 可固化組成物
JP5660145B2 (ja) * 2012-04-03 2015-01-28 Jsr株式会社 硬化性組成物、硬化物および光半導体装置
US9475258B2 (en) 2012-06-15 2016-10-25 The Boeing Company Multiple-resin composite structures and methods of producing the same
JP6306982B2 (ja) * 2013-08-28 2018-04-04 丸榮日産株式会社 蓄光シリコーンゲルシート
CN105705583B (zh) * 2013-10-11 2018-11-09 道康宁东丽株式会社 硬化性硅组合物和光半导体装置
KR101457900B1 (ko) * 2014-03-26 2014-11-04 실리콘밸리(주) 실리콘 적층을 이용한 디스플레이용 필름 및 그 제조방법
JP2016084419A (ja) * 2014-10-27 2016-05-19 信越化学工業株式会社 集光型太陽電池用シリコーンゴム組成物及び集光型太陽電池用フレネルレンズ及びプリズムレンズ
JPWO2017119363A1 (ja) * 2016-01-08 2018-11-01 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物、並びに光半導体装置
GB201603107D0 (en) * 2016-02-23 2016-04-06 Dow Corning Low temperature cure silicone elastomer
JP6575429B2 (ja) * 2016-05-02 2019-09-18 横浜ゴム株式会社 密着付与剤及び硬化性樹脂組成物
GB201709852D0 (en) * 2017-06-20 2017-08-02 Advanced Insulation Plc Thermal insulation structure
JP6915527B2 (ja) * 2017-12-27 2021-08-04 信越化学工業株式会社 有機ｅｌ用透明乾燥剤及びその使用方法
JP6965840B2 (ja) * 2018-07-13 2021-11-10 信越化学工業株式会社 含フッ素ポリシロキサン硬化性組成物、該組成物の硬化物で被覆されたゴム硬化物又はゲル硬化物、該被覆されたゴム硬化物又はゲル硬化物を有する電気・電子部品及び光半導体装置、並びにゴム硬化物又はゲル硬化物の表面粘着性を低減する方法
CN112654687B (zh) 2018-08-10 2023-08-25 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7088880B2 (ja) * 2019-05-30 2022-06-21 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物、該組成物の製造方法、及び光半導体装置
CN114341294B (zh) * 2019-08-13 2024-05-28 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
CN114269876B (zh) 2019-08-13 2024-05-14 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
CN114269875B (zh) 2019-08-13 2024-05-14 陶氏东丽株式会社 压敏粘接层形成性聚有机硅氧烷组合物及其使用
JP7401247B2 (ja) * 2019-10-08 2023-12-19 信越化学工業株式会社 硬化性組成物、その硬化物、及び半導体装置
EP4041530B1 (de) 2019-10-11 2025-11-26 Peridot Print LLC Dreidimensionales drucken mit hydrophobierungs- und hydrophilierungsmitteln

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Also Published As

Publication number Publication date
US8153202B2 (en) 2012-04-10
KR20060123401A (ko) 2006-12-01
EP1697473A1 (de) 2006-09-06
EP1697473B1 (de) 2011-07-27
WO2005052078A1 (en) 2005-06-09
JP4503271B2 (ja) 2010-07-14
JP2005161132A (ja) 2005-06-23
US20110143025A1 (en) 2011-06-16
CN1886476A (zh) 2006-12-27
KR101109503B1 (ko) 2012-01-31
US7919150B2 (en) 2011-04-05
US20070134425A1 (en) 2007-06-14

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