ATE475195T1 - Tic als thermisch stabiles p-metall-carbid auf sio2-gatestapeln mit hohem k - Google Patents

Tic als thermisch stabiles p-metall-carbid auf sio2-gatestapeln mit hohem k

Info

Publication number
ATE475195T1
ATE475195T1 AT05826022T AT05826022T ATE475195T1 AT E475195 T1 ATE475195 T1 AT E475195T1 AT 05826022 T AT05826022 T AT 05826022T AT 05826022 T AT05826022 T AT 05826022T AT E475195 T1 ATE475195 T1 AT E475195T1
Authority
AT
Austria
Prior art keywords
tic
metal
thermally stable
metal carbide
gate stacks
Prior art date
Application number
AT05826022T
Other languages
German (de)
English (en)
Inventor
Alessandro C Callegari
Michael A Gribelyuk
Dianne L Lacey
Fenton R Mcfeely
Katherine L Saenger
Sufi Zafar
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE475195T1 publication Critical patent/ATE475195T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0212—Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
    • H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
AT05826022T 2005-01-13 2005-12-02 Tic als thermisch stabiles p-metall-carbid auf sio2-gatestapeln mit hohem k ATE475195T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/034,597 US7667277B2 (en) 2005-01-13 2005-01-13 TiC as a thermally stable p-metal carbide on high k SiO2 gate stacks
PCT/US2005/043552 WO2006076086A2 (en) 2005-01-13 2005-12-02 Tic mos devices on high-k-dielectric gate stacks

Publications (1)

Publication Number Publication Date
ATE475195T1 true ATE475195T1 (de) 2010-08-15

Family

ID=36678065

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05826022T ATE475195T1 (de) 2005-01-13 2005-12-02 Tic als thermisch stabiles p-metall-carbid auf sio2-gatestapeln mit hohem k

Country Status (8)

Country Link
US (2) US7667277B2 (enExample)
EP (1) EP1842240B1 (enExample)
JP (2) JP5241237B2 (enExample)
CN (1) CN101443918B (enExample)
AT (1) ATE475195T1 (enExample)
DE (1) DE602005022493D1 (enExample)
TW (1) TWI374540B (enExample)
WO (1) WO2006076086A2 (enExample)

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US8318550B2 (en) 2011-04-08 2012-11-27 Micron Technology, Inc. Multilayer select devices and methods related thereto
US9269580B2 (en) * 2011-06-27 2016-02-23 Cree, Inc. Semiconductor device with increased channel mobility and dry chemistry processes for fabrication thereof
JP2013175593A (ja) * 2012-02-24 2013-09-05 Rohm Co Ltd 半導体装置およびその製造方法
CN103594343A (zh) * 2012-08-13 2014-02-19 中芯国际集成电路制造(上海)有限公司 高k膜的制作方法及晶体管的形成方法
US9679984B2 (en) * 2012-11-07 2017-06-13 Taiwan Semiconductor Manufacturing Company, Ltd. Metal gate structure with multi-layer composition
US9312136B2 (en) 2014-03-06 2016-04-12 International Business Machines Corporation Replacement metal gate stack for diffusion prevention
US9449887B2 (en) 2014-12-08 2016-09-20 Globalfoundries Inc. Method of forming replacement gate PFET having TiALCO layer for improved NBTI performance
WO2016105402A1 (en) 2014-12-23 2016-06-30 Intel Corporation Via blocking layer
CN110349915B (zh) * 2019-07-12 2021-07-30 中国科学院微电子研究所 一种半导体器件制备方法及制备得到的半导体器件
CN113025032B (zh) * 2021-03-09 2022-04-15 电子科技大学 一种高介电性能自愈合聚氨酯复合材料及其制备的方法和制动应用
US20230028460A1 (en) * 2021-07-23 2023-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Forming Silicon-Containing Material Over Metal Gate To Reduce Loading Between Long Channel And Short Channel Transistors

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Also Published As

Publication number Publication date
WO2006076086A3 (en) 2009-04-16
JP2008530769A (ja) 2008-08-07
JP5511889B2 (ja) 2014-06-04
TWI374540B (en) 2012-10-11
CN101443918A (zh) 2009-05-27
EP1842240B1 (en) 2010-07-21
US8288237B2 (en) 2012-10-16
DE602005022493D1 (de) 2010-09-02
US20100015790A1 (en) 2010-01-21
TW200629539A (en) 2006-08-16
JP5241237B2 (ja) 2013-07-17
JP2012191220A (ja) 2012-10-04
WO2006076086A2 (en) 2006-07-20
CN101443918B (zh) 2011-07-06
EP1842240A2 (en) 2007-10-10
EP1842240A4 (en) 2009-10-14
US7667277B2 (en) 2010-02-23
US20060163630A1 (en) 2006-07-27

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