ATE447837T1 - Verbessertes verfahren zur mikroaufrauhungsbehandlung von kupfer- und mischmetallschaltkreisen - Google Patents
Verbessertes verfahren zur mikroaufrauhungsbehandlung von kupfer- und mischmetallschaltkreisenInfo
- Publication number
- ATE447837T1 ATE447837T1 AT04789106T AT04789106T ATE447837T1 AT E447837 T1 ATE447837 T1 AT E447837T1 AT 04789106 T AT04789106 T AT 04789106T AT 04789106 T AT04789106 T AT 04789106T AT E447837 T1 ATE447837 T1 AT E447837T1
- Authority
- AT
- Austria
- Prior art keywords
- micro
- copper
- improved method
- mixed metal
- metal layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/675,019 US20050067378A1 (en) | 2003-09-30 | 2003-09-30 | Method for micro-roughening treatment of copper and mixed-metal circuitry |
PCT/US2004/031697 WO2005034596A2 (en) | 2003-09-30 | 2004-09-27 | Improved method for micro-roughening treatment of copper and mixed-metal circuitry |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE447837T1 true ATE447837T1 (de) | 2009-11-15 |
Family
ID=34377021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04789106T ATE447837T1 (de) | 2003-09-30 | 2004-09-27 | Verbessertes verfahren zur mikroaufrauhungsbehandlung von kupfer- und mischmetallschaltkreisen |
Country Status (12)
Country | Link |
---|---|
US (1) | US20050067378A1 (de) |
EP (1) | EP1668967B1 (de) |
JP (1) | JP4629048B2 (de) |
KR (1) | KR101177145B1 (de) |
CN (1) | CN100594763C (de) |
AT (1) | ATE447837T1 (de) |
BR (1) | BRPI0414904A (de) |
CA (1) | CA2536836A1 (de) |
DE (1) | DE602004023958D1 (de) |
MY (1) | MY147004A (de) |
TW (1) | TWI347232B (de) |
WO (1) | WO2005034596A2 (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7063800B2 (en) * | 2003-11-10 | 2006-06-20 | Ying Ding | Methods of cleaning copper surfaces in the manufacture of printed circuit boards |
DE102004050269A1 (de) * | 2004-10-14 | 2006-04-20 | Institut Für Solarenergieforschung Gmbh | Verfahren zur Kontakttrennung elektrisch leitfähiger Schichten auf rückkontaktierten Solarzellen und Solarzelle |
US7307022B2 (en) * | 2004-11-19 | 2007-12-11 | Endicott Interconnect Technologies, Inc. | Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof |
US7383629B2 (en) * | 2004-11-19 | 2008-06-10 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
US7476620B2 (en) * | 2005-03-25 | 2009-01-13 | Dupont Air Products Nanomaterials Llc | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
US7591955B2 (en) * | 2005-07-14 | 2009-09-22 | Interplex Nas, Inc. | Method for forming an etched soft edge metal foil and the product thereof |
DE602006009614D1 (de) * | 2006-02-17 | 2009-11-19 | Atotech Deutschland Gmbh | Zusammensetzung und Verfahren zur Behandlung der Oberflächen von Kupferlegierungen, um die Haftfähigkeit zwischen der Metalloberfläche und dem gebundenen polymerischen Material zu verbessern |
US7704562B2 (en) * | 2006-08-14 | 2010-04-27 | Cordani Jr John L | Process for improving the adhesion of polymeric materials to metal surfaces |
EP2135736B1 (de) * | 2007-04-06 | 2013-02-27 | Taisei Plas Co., Ltd. | Kupferlegierungsverbund und herstellungsverfahren dafür |
JP2009016818A (ja) * | 2007-07-04 | 2009-01-22 | Samsung Electro-Mechanics Co Ltd | 多層印刷回路基板及びその製造方法 |
EP2255601B1 (de) * | 2008-04-30 | 2012-05-16 | Panasonic Corporation | Verfahren zur herstellung einer leiterplatte mittels additivverfahren |
US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
JP5203108B2 (ja) * | 2008-09-12 | 2013-06-05 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
DE102008056086A1 (de) * | 2008-11-06 | 2010-05-12 | Gp Solar Gmbh | Additiv für alkalische Ätzlösungen, insbesondere für Texturätzlösungen sowie Verfahren zu dessen Herstellung |
CN103333662A (zh) | 2008-12-11 | 2013-10-02 | 日立化成工业株式会社 | Cmp用研磨液以及使用该研磨液的研磨方法 |
CN102598883A (zh) | 2009-10-30 | 2012-07-18 | 松下电器产业株式会社 | 电路板以及在电路板上安装有元件的半导体装置 |
US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
JP5603600B2 (ja) * | 2010-01-13 | 2014-10-08 | 新光電気工業株式会社 | 配線基板及びその製造方法、並びに半導体パッケージ |
JP5482285B2 (ja) * | 2010-02-23 | 2014-05-07 | 大日本印刷株式会社 | 配線回路基板用基材、配線回路基板用基材の製造方法、配線回路基板、配線回路基板の製造方法、hdd用サスペンション基板、hdd用サスペンションおよびハードディスクドライブ |
JP5648567B2 (ja) * | 2010-05-07 | 2015-01-07 | 日立化成株式会社 | Cmp用研磨液及びこれを用いた研磨方法 |
WO2011147448A1 (en) * | 2010-05-26 | 2011-12-01 | Atotech Deutschland Gmbh | Composition and method for micro etching of copper and copper alloys |
KR101857248B1 (ko) | 2011-03-21 | 2018-05-14 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102128954B1 (ko) * | 2012-06-06 | 2020-07-01 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 프린트 배선판용 동박, 그 제조방법, 및 그 동박을 사용한 프린트 배선판 |
JP6225467B2 (ja) * | 2012-06-06 | 2017-11-08 | 三菱瓦斯化学株式会社 | プリント配線板用銅箔およびその製造方法ならびにその銅箔を用いたプリント配線板 |
JP5219008B1 (ja) * | 2012-07-24 | 2013-06-26 | メック株式会社 | 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法 |
TW201404936A (zh) * | 2012-07-24 | 2014-02-01 | Au Optronics Corp | 蝕刻液與形成圖案化多層金屬層的方法 |
US9338896B2 (en) | 2012-07-25 | 2016-05-10 | Enthone, Inc. | Adhesion promotion in printed circuit boards |
CN105453711A (zh) * | 2013-08-16 | 2016-03-30 | 乐思股份有限公司 | 在印刷电路板内的粘合促进 |
US8999194B1 (en) * | 2014-02-24 | 2015-04-07 | E-Chem Enterprise Corp. | Etching solution capable of effectively reducing galvanic effect |
JP2016015432A (ja) | 2014-07-03 | 2016-01-28 | イビデン株式会社 | 回路基板及びその製造方法 |
CN104302124A (zh) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | 一种双面挠性印制板的制造工艺 |
JP6159904B2 (ja) * | 2015-05-01 | 2017-07-05 | 株式会社フジクラ | 配線体、配線基板、及びタッチセンサ |
US9673341B2 (en) * | 2015-05-08 | 2017-06-06 | Tetrasun, Inc. | Photovoltaic devices with fine-line metallization and methods for manufacture |
CN113597123A (zh) | 2015-06-04 | 2021-11-02 | 科迪华公司 | 用于在金属表面上产生抗蚀刻图案的方法及其组合物组 |
KR102508824B1 (ko) * | 2015-08-13 | 2023-03-09 | 카티바, 인크. | 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법 |
FR3040516B1 (fr) * | 2015-08-27 | 2017-09-15 | Linxens Holding | Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique |
FR3051313B1 (fr) * | 2016-05-10 | 2019-08-02 | Linxens Holding | Procede de fabrication d’un circuit imprime, circuit imprime obtenu par ce procede et module de carte a puce comportant un tel circuit imprime |
KR20210099192A (ko) * | 2016-05-18 | 2021-08-11 | 아이솔라 유에스에이 코프 | 회로 기판들을 제조하는 방법 |
JP7127861B2 (ja) | 2017-11-10 | 2022-08-30 | ナミックス株式会社 | 複合銅箔 |
CN109788653B (zh) * | 2017-11-15 | 2022-05-27 | 奥特斯奥地利科技与系统技术有限公司 | 具有不同表面精饰的部件承载件及其制造方法 |
TWI776168B (zh) * | 2019-06-19 | 2022-09-01 | 金居開發股份有限公司 | 進階反轉電解銅箔及應用其的銅箔基板 |
JP2021021137A (ja) | 2019-06-19 | 2021-02-18 | 金居開發股▲分▼有限公司 | 長尺島状の微細構造を有するアドバンスト電解銅箔及びそれを適用した銅張積層板 |
KR20220166335A (ko) * | 2020-07-22 | 2022-12-16 | 미쯔이가가꾸가부시끼가이샤 | 금속 부재, 금속 수지 복합체 및 금속 부재의 제조 방법 |
CN114196994B (zh) * | 2021-12-30 | 2023-03-31 | 山东金宝电子有限公司 | 一种用于铜箔表面的粗化处理溶液及粗化处理工艺 |
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DE2850542C2 (de) * | 1978-11-22 | 1982-07-01 | Kernforschungsanlage Jülich GmbH, 5170 Jülich | Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen |
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JPH02111095A (ja) * | 1988-10-20 | 1990-04-24 | Hitachi Cable Ltd | 表面実装用基板 |
JPH02292890A (ja) * | 1989-05-02 | 1990-12-04 | Hitachi Cable Ltd | 表面実装用基板 |
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US6261466B1 (en) * | 1997-12-11 | 2001-07-17 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
US6284309B1 (en) * | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
TW470785B (en) * | 1998-02-03 | 2002-01-01 | Atotech Deutschland Gmbh | Process for preliminary treatment of copper surfaces |
TW460622B (en) * | 1998-02-03 | 2001-10-21 | Atotech Deutschland Gmbh | Solution and process to pretreat copper surfaces |
US6294220B1 (en) * | 1999-06-30 | 2001-09-25 | Alpha Metals, Inc. | Post-treatment for copper on printed circuit boards |
US6036758A (en) * | 1998-08-10 | 2000-03-14 | Pmd (U.K.) Limited | Surface treatment of copper |
JP3037662B2 (ja) * | 1998-08-31 | 2000-04-24 | 京セラ株式会社 | 多層配線基板およびその製造方法 |
JP2001284797A (ja) * | 2000-03-28 | 2001-10-12 | Kyocera Corp | 多層配線基板及びその製造方法 |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
DE10066028C2 (de) * | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
US6506314B1 (en) * | 2000-07-27 | 2003-01-14 | Atotech Deutschland Gmbh | Adhesion of polymeric materials to metal surfaces |
US6500349B2 (en) * | 2000-12-26 | 2002-12-31 | Oak-Mitsui, Inc. | Manufacture of printed circuits using single layer processing techniques |
JP2002205356A (ja) * | 2001-01-09 | 2002-07-23 | Hitachi Cable Ltd | 樹脂付銅箔の製造方法 |
US6589413B2 (en) * | 2001-08-09 | 2003-07-08 | Gould Electronics Inc. | Method of making a copper on INVAR® composite |
US6459047B1 (en) * | 2001-09-05 | 2002-10-01 | International Business Machines Corporation | Laminate circuit structure and method of fabricating |
-
2003
- 2003-09-30 US US10/675,019 patent/US20050067378A1/en not_active Abandoned
-
2004
- 2004-09-24 TW TW093128979A patent/TWI347232B/zh not_active IP Right Cessation
- 2004-09-27 EP EP04789106A patent/EP1668967B1/de not_active Not-in-force
- 2004-09-27 CA CA002536836A patent/CA2536836A1/en not_active Abandoned
- 2004-09-27 KR KR1020067006122A patent/KR101177145B1/ko active IP Right Grant
- 2004-09-27 JP JP2006534003A patent/JP4629048B2/ja not_active Expired - Fee Related
- 2004-09-27 AT AT04789106T patent/ATE447837T1/de not_active IP Right Cessation
- 2004-09-27 DE DE602004023958T patent/DE602004023958D1/de active Active
- 2004-09-27 CN CN200480028366A patent/CN100594763C/zh not_active Expired - Fee Related
- 2004-09-27 WO PCT/US2004/031697 patent/WO2005034596A2/en active Application Filing
- 2004-09-27 BR BRPI0414904-1A patent/BRPI0414904A/pt not_active IP Right Cessation
- 2004-09-28 MY MYPI20043971A patent/MY147004A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE602004023958D1 (de) | 2009-12-17 |
WO2005034596A2 (en) | 2005-04-14 |
EP1668967B1 (de) | 2009-11-04 |
KR101177145B1 (ko) | 2012-09-07 |
CA2536836A1 (en) | 2005-04-14 |
CN1860832A (zh) | 2006-11-08 |
WO2005034596B1 (en) | 2005-09-15 |
WO2005034596A3 (en) | 2005-06-16 |
BRPI0414904A (pt) | 2006-11-07 |
US20050067378A1 (en) | 2005-03-31 |
CN100594763C (zh) | 2010-03-17 |
TW200514627A (en) | 2005-05-01 |
EP1668967A2 (de) | 2006-06-14 |
JP4629048B2 (ja) | 2011-02-09 |
MY147004A (en) | 2012-10-15 |
TWI347232B (en) | 2011-08-21 |
KR20060092225A (ko) | 2006-08-22 |
JP2007507616A (ja) | 2007-03-29 |
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