ATE445680T1 - Thermisches zwischenmaterial - Google Patents
Thermisches zwischenmaterialInfo
- Publication number
- ATE445680T1 ATE445680T1 AT07001862T AT07001862T ATE445680T1 AT E445680 T1 ATE445680 T1 AT E445680T1 AT 07001862 T AT07001862 T AT 07001862T AT 07001862 T AT07001862 T AT 07001862T AT E445680 T1 ATE445680 T1 AT E445680T1
- Authority
- AT
- Austria
- Prior art keywords
- intermediate material
- thermal intermediate
- composition
- resins
- thermal
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
- C08C19/04—Oxidation
- C08C19/06—Epoxidation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thermal Insulation (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/275,786 US20070179232A1 (en) | 2006-01-30 | 2006-01-30 | Thermal Interface Material |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE445680T1 true ATE445680T1 (de) | 2009-10-15 |
Family
ID=38121448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07001862T ATE445680T1 (de) | 2006-01-30 | 2007-01-29 | Thermisches zwischenmaterial |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070179232A1 (de) |
EP (1) | EP1816175B1 (de) |
JP (1) | JP2007204750A (de) |
KR (1) | KR20070078792A (de) |
CN (1) | CN101012369A (de) |
AT (1) | ATE445680T1 (de) |
DE (1) | DE602007002726D1 (de) |
TW (1) | TW200745307A (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007262348A (ja) * | 2006-03-30 | 2007-10-11 | Achilles Corp | ペースト状のアクリル系グリース |
KR100848837B1 (ko) * | 2007-08-06 | 2008-07-28 | 주식회사 휘닉스아이씨피 | 메모리모듈 방열장치 및 그 제조방법 |
DE102007037621B4 (de) * | 2007-08-09 | 2014-09-18 | Siemens Aktiengesellschaft | Verwendung einer Harz-Formulierung als Folie in einem Verfahren zur planaren Kontaktierung einer elektrischen Kontaktstelle eines elektrischen Bauelements und ein entsprechendes Verfahren |
DE102007037622A1 (de) * | 2007-08-09 | 2009-02-12 | Siemens Ag | Harz-Formulierung auf Bismaleinimid-Basis und Verwendung der Harz-Formulierung |
CN104086929A (zh) * | 2008-10-21 | 2014-10-08 | 日立化成工业株式会社 | 导热片材、其制造方法以及使用了该导热片材的散热装置 |
KR101725336B1 (ko) | 2009-03-16 | 2017-04-10 | 다우 코닝 코포레이션 | 열 전도성 그리스 및 상기 그리스를 사용하는 방법 및 디바이스 |
US20110044004A1 (en) * | 2009-08-18 | 2011-02-24 | Garosshen Thomas J | Heat transfer apparatus having a thermal interface material |
KR20120056885A (ko) | 2009-09-24 | 2012-06-04 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 도금 링크로서 사용하기 위한 중합체 후막 은 전극 조성물 |
JP5740103B2 (ja) * | 2009-10-19 | 2015-06-24 | 日東電工株式会社 | 熱伝導部材、及びそれを用いた組電池装置 |
EP2493998A4 (de) | 2009-10-27 | 2018-01-10 | Henkel IP & Holding GmbH | Wärmeschnittstellenmaterial mit epoxidisiertem nussschalenöl |
KR101734603B1 (ko) * | 2009-11-13 | 2017-05-11 | 헨켈 아이피 앤드 홀딩 게엠베하 | 페닐 에스테르를 가진 열 인터페이스 물질 |
TWI425347B (zh) * | 2009-11-19 | 2014-02-01 | Compal Electronics Inc | 應用於電子裝置的散熱模組 |
TWI475103B (zh) * | 2009-12-15 | 2015-03-01 | Ind Tech Res Inst | 散熱結構 |
TWI466822B (zh) * | 2010-02-18 | 2015-01-01 | Hitachi Chemical Co Ltd | 複合粒子及其製造方法,以及樹脂組成物 |
CN102812099B (zh) * | 2010-03-25 | 2014-12-03 | 株式会社巴川制纸所 | 电子部件用液状粘接剂以及胶带 |
CN101824297A (zh) * | 2010-05-06 | 2010-09-08 | 苏州仙奇化学有限公司 | 一种高导热胶及其制备方法 |
CN102263185A (zh) * | 2010-05-28 | 2011-11-30 | 景德镇正宇奈米科技有限公司 | 热辐射散热发光二极管结构及其制作方法 |
CN201854534U (zh) * | 2010-06-24 | 2011-06-01 | 景德镇正宇奈米科技有限公司 | 陶瓷辐射散热结构 |
KR101043346B1 (ko) * | 2011-01-28 | 2011-06-29 | 주식회사 네원 | 방열특성이 우수한 유무기 하이브리드 조성물 및 이를 이용한 박막 타입의 열방사 시트 |
JP2012224765A (ja) * | 2011-04-20 | 2012-11-15 | Jsr Corp | 熱伝導性シート用組成物 |
JP6173424B2 (ja) * | 2012-03-23 | 2017-08-02 | ダウ グローバル テクノロジーズ エルエルシー | 応力耐久性が高い破壊耐久性接着剤 |
US20150037575A1 (en) | 2012-03-30 | 2015-02-05 | Showa Denko K.K. | Curable heat radiation composition |
US9434870B2 (en) | 2012-09-19 | 2016-09-06 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
US20140080951A1 (en) | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
CN103342976A (zh) * | 2013-06-26 | 2013-10-09 | 苏州天脉导热科技有限公司 | 一种耐短时高温的丙烯酸基组合物及以其制备导热片的方法 |
CN105492563B (zh) * | 2013-07-22 | 2019-04-23 | 爱博斯迪科化学(上海)有限公司 | 可b阶段化且无需固化的晶片背面涂覆粘合剂 |
KR102165264B1 (ko) * | 2013-10-10 | 2020-10-13 | 삼성전자 주식회사 | 아연 입자를 함유하는 비전도성 폴리머 막, 비전도성 폴리머 페이스트, 이들을 포함하는 반도체 패키지, 및 반도체 패키지의 제조 방법 |
US10174433B2 (en) | 2013-12-05 | 2019-01-08 | Honeywell International Inc. | Stannous methanesulfonate solution with adjusted pH |
CN105980512A (zh) | 2014-02-13 | 2016-09-28 | 霍尼韦尔国际公司 | 可压缩热界面材料 |
JP5563175B1 (ja) * | 2014-03-05 | 2014-07-30 | 清二 加川 | 高熱伝導率の放熱シート及びその製造方法 |
CN106536609B (zh) | 2014-07-07 | 2022-04-29 | 霍尼韦尔国际公司 | 具有离子清除剂的热界面材料 |
EP3227399B1 (de) | 2014-12-05 | 2021-07-14 | Honeywell International Inc. | Hochleistungsfähige thermische zwischenmaterialien mit niedrigem wärmewiderstand |
DE102015200425A1 (de) * | 2015-01-14 | 2016-07-14 | Robert Bosch Gmbh | Reaktionsharzsystem mit hoher Wärmeleitfähigkeit |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
CA3013027C (en) | 2016-02-01 | 2020-03-24 | Cabot Corporation | Thermally conductive polymer compositions containing carbon black |
CN109072051B (zh) | 2016-03-08 | 2023-12-26 | 霍尼韦尔国际公司 | 相变材料 |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4690858A (en) * | 1985-02-15 | 1987-09-01 | Hitachi, Ltd. | Thermal transfer sheet |
US5288769A (en) * | 1991-03-27 | 1994-02-22 | Motorola, Inc. | Thermally conducting adhesive containing aluminum nitride |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5569540A (en) * | 1993-06-18 | 1996-10-29 | Dai Nippon Printing Co., Ltd. | Thermal transfer sheet |
US5968606A (en) * | 1997-06-30 | 1999-10-19 | Ferro Corporation | Screen printable UV curable conductive material composition |
US6432497B2 (en) * | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
JP2000129215A (ja) * | 1998-10-21 | 2000-05-09 | Sekisui Chem Co Ltd | 熱伝導性粘接着シート及びその製造方法 |
JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
US6984685B2 (en) * | 2000-04-05 | 2006-01-10 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
JP2004043673A (ja) * | 2002-07-12 | 2004-02-12 | Sekisui Chem Co Ltd | 熱伝導性組成物及びプラズマディスプレイ表示装置 |
US6874573B2 (en) * | 2003-07-31 | 2005-04-05 | National Starch And Chemical Investment Holding Corporation | Thermal interface material |
US7312261B2 (en) * | 2004-05-11 | 2007-12-25 | International Business Machines Corporation | Thermal interface adhesive and rework |
-
2006
- 2006-01-30 US US11/275,786 patent/US20070179232A1/en not_active Abandoned
-
2007
- 2007-01-26 JP JP2007015941A patent/JP2007204750A/ja active Pending
- 2007-01-26 KR KR1020070008544A patent/KR20070078792A/ko not_active Application Discontinuation
- 2007-01-29 AT AT07001862T patent/ATE445680T1/de not_active IP Right Cessation
- 2007-01-29 DE DE602007002726T patent/DE602007002726D1/de not_active Expired - Fee Related
- 2007-01-29 EP EP07001862A patent/EP1816175B1/de active Active
- 2007-01-29 TW TW096103112A patent/TW200745307A/zh unknown
- 2007-01-29 CN CNA2007100082919A patent/CN101012369A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
TW200745307A (en) | 2007-12-16 |
EP1816175A2 (de) | 2007-08-08 |
CN101012369A (zh) | 2007-08-08 |
US20070179232A1 (en) | 2007-08-02 |
EP1816175B1 (de) | 2009-10-14 |
EP1816175A3 (de) | 2007-09-05 |
JP2007204750A (ja) | 2007-08-16 |
KR20070078792A (ko) | 2007-08-02 |
DE602007002726D1 (de) | 2009-11-26 |
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