ATE445297T1 - Silizium kondensatormikrofon und verfahren zum einbringen eines mikrofons in ein gehäuse - Google Patents

Silizium kondensatormikrofon und verfahren zum einbringen eines mikrofons in ein gehäuse

Info

Publication number
ATE445297T1
ATE445297T1 AT06254378T AT06254378T ATE445297T1 AT E445297 T1 ATE445297 T1 AT E445297T1 AT 06254378 T AT06254378 T AT 06254378T AT 06254378 T AT06254378 T AT 06254378T AT E445297 T1 ATE445297 T1 AT E445297T1
Authority
AT
Austria
Prior art keywords
metal case
microphone
board
condenser microphone
connecting pattern
Prior art date
Application number
AT06254378T
Other languages
English (en)
Inventor
Chung-Dam Song
Original Assignee
Bse Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050076521A external-priority patent/KR100675025B1/ko
Priority claimed from KR1020050076522A external-priority patent/KR100644730B1/ko
Application filed by Bse Co Ltd filed Critical Bse Co Ltd
Application granted granted Critical
Publication of ATE445297T1 publication Critical patent/ATE445297T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
AT06254378T 2005-08-20 2006-08-21 Silizium kondensatormikrofon und verfahren zum einbringen eines mikrofons in ein gehäuse ATE445297T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050076521A KR100675025B1 (ko) 2005-08-20 2005-08-20 실리콘 콘덴서 마이크로폰
KR1020050076522A KR100644730B1 (ko) 2005-08-20 2005-08-20 실리콘 콘덴서 마이크로폰

Publications (1)

Publication Number Publication Date
ATE445297T1 true ATE445297T1 (de) 2009-10-15

Family

ID=37441885

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06254378T ATE445297T1 (de) 2005-08-20 2006-08-21 Silizium kondensatormikrofon und verfahren zum einbringen eines mikrofons in ein gehäuse

Country Status (9)

Country Link
US (1) US7903831B2 (de)
EP (1) EP1755360B1 (de)
JP (1) JP2007060661A (de)
AT (1) ATE445297T1 (de)
DE (1) DE602006009592D1 (de)
DK (1) DK1755360T3 (de)
ES (1) ES2334056T3 (de)
SG (1) SG130158A1 (de)
TW (1) TWI330881B (de)

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* Cited by examiner, † Cited by third party
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TW200725819A (en) 2007-07-01
ES2334056T3 (es) 2010-03-04
DK1755360T3 (da) 2010-01-18
JP2007060661A (ja) 2007-03-08
US7903831B2 (en) 2011-03-08
DE602006009592D1 (de) 2009-11-19
TWI330881B (en) 2010-09-21
US20070041597A1 (en) 2007-02-22
EP1755360A1 (de) 2007-02-21
EP1755360B1 (de) 2009-10-07
SG130158A1 (en) 2007-03-20

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