ATE385857T1 - Verfahren und vorichtung zur kontrolle der schichtdicke - Google Patents

Verfahren und vorichtung zur kontrolle der schichtdicke

Info

Publication number
ATE385857T1
ATE385857T1 AT03773410T AT03773410T ATE385857T1 AT E385857 T1 ATE385857 T1 AT E385857T1 AT 03773410 T AT03773410 T AT 03773410T AT 03773410 T AT03773410 T AT 03773410T AT E385857 T1 ATE385857 T1 AT E385857T1
Authority
AT
Austria
Prior art keywords
control
layer thickness
substrate
datastorage
distributing
Prior art date
Application number
AT03773410T
Other languages
English (en)
Inventor
Chieh Ou-Yang
Original Assignee
Oc Oerlikon Balzers Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oc Oerlikon Balzers Ag filed Critical Oc Oerlikon Balzers Ag
Application granted granted Critical
Publication of ATE385857T1 publication Critical patent/ATE385857T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AT03773410T 2002-12-05 2003-12-02 Verfahren und vorichtung zur kontrolle der schichtdicke ATE385857T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43134602P 2002-12-05 2002-12-05

Publications (1)

Publication Number Publication Date
ATE385857T1 true ATE385857T1 (de) 2008-03-15

Family

ID=32469606

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03773410T ATE385857T1 (de) 2002-12-05 2003-12-02 Verfahren und vorichtung zur kontrolle der schichtdicke

Country Status (9)

Country Link
US (1) US8062705B2 (de)
EP (1) EP1569759B1 (de)
JP (1) JP5199531B2 (de)
CN (1) CN100553794C (de)
AT (1) ATE385857T1 (de)
AU (1) AU2003281895A1 (de)
DE (1) DE60319129T2 (de)
TW (1) TWI306784B (de)
WO (1) WO2004050261A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100971442B1 (ko) * 2003-01-14 2010-07-21 코닌클리케 필립스 일렉트로닉스 엔.브이. 광 데이터 저장매체의 제조방법, 광 데이터 저장매체와,상기 방법을 수행하기 위한 장치
JP3988834B2 (ja) * 2004-06-03 2007-10-10 芝浦メカトロニクス株式会社 樹脂層形成方法及び樹脂層形成装置、ディスク及びディスク製造方法
DE102005017178A1 (de) * 2005-04-13 2006-10-19 Bühler AG Verfahren zur Herstellung eines gefüllten Verzehrproduktes
US20070105400A1 (en) * 2005-11-08 2007-05-10 Unaxis Balzers Ag Method and apparatus for control of layer thicknesses
DE102006061585B4 (de) * 2006-08-23 2013-11-28 Singulus Technologies Ag Verfahren und Vorrichtung zur Rotationsbeschichtung von Substraten
JP5262117B2 (ja) * 2007-04-11 2013-08-14 株式会社リコー スピンコート装置及びその温度制御方法、並びに光ディスク製造装置及び光ディスク製造方法
US20120301998A1 (en) * 2009-12-28 2012-11-29 Takahiro Hashimoto Method for manufacturing solar cell
CN103295936B (zh) * 2012-02-29 2016-01-13 斯克林集团公司 基板处理装置及基板处理方法
US9991141B2 (en) * 2012-03-23 2018-06-05 SCREEN Holdings Co., Ltd. Substrate processing apparatus and heater cleaning method
JP5946401B2 (ja) * 2012-12-07 2016-07-06 株式会社ディスコ 保護膜の被覆方法
JP6242057B2 (ja) * 2013-02-15 2017-12-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US9360755B2 (en) * 2013-03-14 2016-06-07 Taiwan Semiconductor Manufacturing Company Limited Thickening phase for spin coating process
JP6271304B2 (ja) 2013-03-29 2018-01-31 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
US9248466B2 (en) * 2013-05-10 2016-02-02 Infineon Technologies Ag Application of fluids to substrates
JP6319705B2 (ja) * 2013-12-14 2018-05-09 木村　光照 スピンコータ
JP6440111B2 (ja) * 2014-08-14 2018-12-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US10421867B2 (en) * 2015-03-16 2019-09-24 Taiwan Semiconductor Manufacturing Company, Ltd. Priming material for substrate coating

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155336A (en) * 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5580607A (en) * 1991-07-26 1996-12-03 Tokyo Electron Limited Coating apparatus and method
JPH05259061A (ja) * 1992-03-10 1993-10-08 Kawasaki Steel Corp 半導体基板のスピンコーティング方法および装置
JPH05259062A (ja) * 1992-03-10 1993-10-08 Kawasaki Steel Corp 半導体基板のスピンコーティング方法
KR100370728B1 (ko) * 1994-10-27 2003-04-07 실리콘 밸리 그룹, 인크. 기판을균일하게코팅하는방법및장치
JPH1012536A (ja) * 1996-06-27 1998-01-16 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP3405439B2 (ja) * 1996-11-05 2003-05-12 株式会社荏原製作所 固体表面の清浄化方法
KR100246964B1 (ko) * 1996-11-28 2000-03-15 윤종용 반도체 스피너장비
US5916368A (en) * 1997-02-27 1999-06-29 The Fairchild Corporation Method and apparatus for temperature controlled spin-coating systems
JPH10261579A (ja) * 1997-03-21 1998-09-29 Matsushita Electron Corp レジスト塗布装置及びレジスト塗布方法
DE19742126A1 (de) * 1997-09-24 1999-03-25 Siemens Ag Tragbarer Datenträger mit Aktivierungsschalter
US6300600B1 (en) 1998-08-12 2001-10-09 Silicon Valley Group, Inc. Hot wall rapid thermal processor
US6254936B1 (en) * 1998-09-14 2001-07-03 Silicon Valley Group, Inc. Environment exchange control for material on a wafer surface
US6174651B1 (en) * 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
US6322626B1 (en) * 1999-06-08 2001-11-27 Micron Technology, Inc. Apparatus for controlling a temperature of a microelectronics substrate
JP2001068490A (ja) * 1999-08-27 2001-03-16 Sony Corp 回転塗布装置および回転塗布方法

Also Published As

Publication number Publication date
TW200420355A (en) 2004-10-16
AU2003281895A1 (en) 2004-06-23
EP1569759A1 (de) 2005-09-07
JP2006508787A (ja) 2006-03-16
CN1720106A (zh) 2006-01-11
DE60319129D1 (de) 2008-03-27
WO2004050261A1 (en) 2004-06-17
EP1569759B1 (de) 2008-02-13
CN100553794C (zh) 2009-10-28
TWI306784B (en) 2009-03-01
US8062705B2 (en) 2011-11-22
JP5199531B2 (ja) 2013-05-15
DE60319129T2 (de) 2009-03-05
US20040137751A1 (en) 2004-07-15

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Legal Events

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