ATE377099T1 - Verfahren zur metallisierung von nichtleitenden substraten, bei welchen das aufrauhen bzw. das anätzen des substrates anhand von glanzmessungen gesteuert wird - Google Patents

Verfahren zur metallisierung von nichtleitenden substraten, bei welchen das aufrauhen bzw. das anätzen des substrates anhand von glanzmessungen gesteuert wird

Info

Publication number
ATE377099T1
ATE377099T1 AT04026653T AT04026653T ATE377099T1 AT E377099 T1 ATE377099 T1 AT E377099T1 AT 04026653 T AT04026653 T AT 04026653T AT 04026653 T AT04026653 T AT 04026653T AT E377099 T1 ATE377099 T1 AT E377099T1
Authority
AT
Austria
Prior art keywords
etching
roughing
substrate
controlled
conductive substrates
Prior art date
Application number
AT04026653T
Other languages
English (en)
Inventor
Merten Piel
Lutz Stamp
Christiane Moepert
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE377099T1 publication Critical patent/ATE377099T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT04026653T 2004-11-10 2004-11-10 Verfahren zur metallisierung von nichtleitenden substraten, bei welchen das aufrauhen bzw. das anätzen des substrates anhand von glanzmessungen gesteuert wird ATE377099T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04026653A EP1657324B1 (de) 2004-11-10 2004-11-10 Verfahren zur Metallisierung von nichtleitenden Substraten, bei welchen das Aufrauhen bzw. das Anätzen des Substrates anhand von Glanzmessungen gesteuert wird

Publications (1)

Publication Number Publication Date
ATE377099T1 true ATE377099T1 (de) 2007-11-15

Family

ID=34927313

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04026653T ATE377099T1 (de) 2004-11-10 2004-11-10 Verfahren zur metallisierung von nichtleitenden substraten, bei welchen das aufrauhen bzw. das anätzen des substrates anhand von glanzmessungen gesteuert wird

Country Status (9)

Country Link
US (1) US8137575B2 (de)
EP (1) EP1657324B1 (de)
JP (1) JP4657302B2 (de)
KR (1) KR101211116B1 (de)
CN (1) CN100510173C (de)
AT (1) ATE377099T1 (de)
DE (1) DE602004009805T2 (de)
TW (1) TWI381066B (de)
WO (1) WO2006050792A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5474566B2 (ja) 2007-01-23 2014-04-16 サンーゴバン アブレイシブズ，インコーポレイティド 凝集塊を含む研磨布紙製品
JP4912985B2 (ja) * 2007-08-27 2012-04-11 新光電気工業株式会社 エッチング処理方法
MX2011000753A (es) * 2008-07-22 2011-03-29 Saint Gobain Abrasives Inc Productos abrasivos recubiertos que contienen agregados.
EP2658944A4 (de) 2010-12-30 2017-08-02 Saint-Gobain Abrasives, Inc. Beschichtete schleifmittelaggregate und diese enthaltende produkte
DE102011111294B4 (de) 2011-08-26 2018-12-20 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung
JP5330474B2 (ja) * 2011-09-22 2013-10-30 上村工業株式会社 デスミア液及びデスミア処理方法
US9168638B2 (en) 2011-09-29 2015-10-27 Saint-Gobain Abrasives, Inc. Abrasive products and methods for finishing hard surfaces
WO2013106575A1 (en) 2012-01-10 2013-07-18 Saint-Gobain Abrasives, Inc. Abrasive products and methods for finishing coated surfaces
RU2595788C2 (ru) 2012-03-16 2016-08-27 Сэнт-Гобэн Эбрейзивс, Инк. Абразивные продукты и способы чистовой обработки поверхностей
US8968435B2 (en) 2012-03-30 2015-03-03 Saint-Gobain Abrasives, Inc. Abrasive products and methods for fine polishing of ophthalmic lenses
CN104244602A (zh) * 2014-09-26 2014-12-24 无锡长辉机电科技有限公司 一种印制板镀铜除去环氧钻污的方法
CN113165960A (zh) * 2019-05-07 2021-07-23 爱发科成膜株式会社 石英蚀刻方法及蚀刻基板
WO2021134205A1 (zh) * 2019-12-30 2021-07-08 瑞声声学科技(深圳)有限公司 一种lcp薄膜的表面处理方法
TWI772066B (zh) 2021-06-16 2022-07-21 達運精密工業股份有限公司 金屬遮罩基材的製備方法
CN113529087B (zh) * 2021-07-13 2022-11-22 长鑫存储技术有限公司 金属工件表面光泽度的控制方法及金属薄膜的制备方法
DE102024001171A1 (de) 2024-04-11 2024-06-20 Mercedes-Benz Group AG Verfahren zur Herstellung eines Bauteils

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2702253A (en) 1950-11-01 1955-02-15 Gasaccumulator Svenska Ab Surface metallizing method
US3647699A (en) 1967-12-22 1972-03-07 Gen Motors Corp Surface conditioner composition for abs resin
US3598630A (en) 1967-12-22 1971-08-10 Gen Motors Corp Method of conditioning the surface of acrylonitrile-butadiene-styrene
US3506397A (en) 1967-12-22 1970-04-14 Gen Motors Corp Phosphoric acid recovery from spent plastic conditioner solution
JPS6014677A (ja) 1983-07-07 1985-01-25 Matsushita Electric Ind Co Ltd 音声認識機能付混合栓
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
JPS61131869A (ja) * 1984-11-28 1986-06-19 Hitachi Ltd ピ−ニング加工結果判定方法
JPS61173104A (ja) * 1985-01-29 1986-08-04 Toshiba Corp プリント配線板の表面処理検査方法
JPS63128389A (ja) 1986-11-19 1988-05-31 三菱電機株式会社 訓練用シミュレータの時定数処理方法
DE3823137C2 (de) * 1988-07-05 1993-12-02 Schering Ag Verfahren zur Ätzung von Epoxid-Harz
US6139930A (en) * 1993-06-15 2000-10-31 Comer; Annette Marie Films
TW488200B (en) * 1999-01-13 2002-05-21 Ngk Spark Plug Co Method of making a multilayer circuit board
JP2001144432A (ja) * 1999-11-02 2001-05-25 Internatl Business Mach Corp <Ibm> 絶縁層上の導体層の製造方法およびビルドアップ回路基板の製造方法
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板

Also Published As

Publication number Publication date
DE602004009805D1 (de) 2007-12-13
CN100510173C (zh) 2009-07-08
WO2006050792A1 (en) 2006-05-18
US20090200263A1 (en) 2009-08-13
TWI381066B (zh) 2013-01-01
DE602004009805T2 (de) 2008-08-21
KR101211116B1 (ko) 2012-12-11
CN101057006A (zh) 2007-10-17
EP1657324A1 (de) 2006-05-17
JP4657302B2 (ja) 2011-03-23
TW200628634A (en) 2006-08-16
KR20070089927A (ko) 2007-09-04
US8137575B2 (en) 2012-03-20
EP1657324B1 (de) 2007-10-31
JP2008520085A (ja) 2008-06-12
WO2006050792A8 (en) 2006-07-27

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