ATE376080T1 - Verfahren zur regeneration von eisenhaltigen ätzlösungen zur verwendung beim ätzen oder beizen von kupfer oder kupferlegierungen und vorrichtung zur durchführung des verfahrens - Google Patents
Verfahren zur regeneration von eisenhaltigen ätzlösungen zur verwendung beim ätzen oder beizen von kupfer oder kupferlegierungen und vorrichtung zur durchführung des verfahrensInfo
- Publication number
- ATE376080T1 ATE376080T1 AT04739653T AT04739653T ATE376080T1 AT E376080 T1 ATE376080 T1 AT E376080T1 AT 04739653 T AT04739653 T AT 04739653T AT 04739653 T AT04739653 T AT 04739653T AT E376080 T1 ATE376080 T1 AT E376080T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- etching
- pickling
- implementing
- electrolysis cell
- Prior art date
Links
- 238000005530 etching Methods 0.000 title abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 5
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 2
- 238000005554 pickling Methods 0.000 title abstract 2
- 230000001172 regenerating effect Effects 0.000 title 1
- 238000005868 electrolysis reaction Methods 0.000 abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 239000003014 ion exchange membrane Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 230000008929 regeneration Effects 0.000 abstract 1
- 238000011069 regeneration method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/36—Regeneration of waste pickling liquors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10326767A DE10326767B4 (de) | 2003-06-13 | 2003-06-13 | Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE376080T1 true ATE376080T1 (de) | 2007-11-15 |
Family
ID=33495031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04739653T ATE376080T1 (de) | 2003-06-13 | 2004-06-07 | Verfahren zur regeneration von eisenhaltigen ätzlösungen zur verwendung beim ätzen oder beizen von kupfer oder kupferlegierungen und vorrichtung zur durchführung des verfahrens |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7520973B2 (de) |
| EP (1) | EP1633906B1 (de) |
| JP (1) | JP4425271B2 (de) |
| KR (1) | KR101052245B1 (de) |
| CN (1) | CN100413999C (de) |
| AT (1) | ATE376080T1 (de) |
| DE (2) | DE10326767B4 (de) |
| MY (1) | MY139968A (de) |
| TW (1) | TWI348502B (de) |
| WO (1) | WO2004111308A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8372757B2 (en) | 2003-10-20 | 2013-02-12 | Novellus Systems, Inc. | Wet etching methods for copper removal and planarization in semiconductor processing |
| KR20120080595A (ko) | 2009-09-02 | 2012-07-17 | 노벨러스 시스템즈, 인코포레이티드 | 감소된 등방성 에칭제 물질 소비 및 폐기물 발생 |
| EP2594662B1 (de) | 2011-11-21 | 2014-04-09 | Atotech Deutschland GmbH | Wässrige Zusammensetzung zur Ätzung von Kupfer und Kupferlegierungen |
| KR20130069419A (ko) * | 2011-12-15 | 2013-06-26 | 미쓰비시 마테리알 가부시키가이샤 | 구리 혹은 구리기 합금 표면의 산화 피막의 제거 방법 및 이 방법을 사용하여 회수한 구리 혹은 구리기 합금 |
| JP2013199702A (ja) * | 2012-02-24 | 2013-10-03 | Mitsubishi Shindoh Co Ltd | 銅或いは銅基合金表面の酸化皮膜の除去方法 |
| EP2754732B1 (de) | 2013-01-15 | 2015-03-11 | ATOTECH Deutschland GmbH | Wässrige Zusammensetzung zur Ätzung von Kupfer und Kupferlegierungen |
| CN103556211B (zh) * | 2013-10-14 | 2016-08-10 | 刘刚 | 一种印制电路板铜表面微蚀粗化方法及其设备 |
| JP2016059855A (ja) | 2014-09-17 | 2016-04-25 | 株式会社東芝 | 処理装置、及び、処理液の再利用方法 |
| CN104562020A (zh) * | 2014-12-24 | 2015-04-29 | 苏州欧美克合金工具有限公司 | 一种刀具增亮池 |
| KR101704748B1 (ko) | 2015-08-28 | 2017-02-08 | 신희찬 | 능동 변속기어 |
| EP3184669B1 (de) | 2015-12-23 | 2018-07-18 | ATOTECH Deutschland GmbH | Lösung zum ätzen von kupfer und kupferlegierungsoberflächen |
| CN106222661A (zh) * | 2016-07-26 | 2016-12-14 | 深圳崇达多层线路板有限公司 | 微蚀废液回收利用的方法及系统 |
| EP3825441A1 (de) * | 2019-11-21 | 2021-05-26 | COVENTYA S.p.A. | Elektrolytische behandlungsvorrichtung zur herstellung von zu metallisierenden kunststoffteilen und verfahren zum ätzen von kunststoffteilen |
| CN117144365A (zh) * | 2023-09-01 | 2023-12-01 | 东莞市百良电子科技有限公司 | 一种微蚀液合成工艺以及循环再生方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3825484A (en) * | 1971-04-29 | 1974-07-23 | N Fronsman | Electrolytic regenerator for chemical etchants including scraper means and rotating cathodes |
| US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
| US3933606A (en) * | 1973-12-03 | 1976-01-20 | Saul Gesler | Water treatment process and apparatus |
| JPS51119632A (en) * | 1975-04-15 | 1976-10-20 | Chiyuuoo Kk | Process for treating etching agents |
| JPS585996B2 (ja) * | 1976-06-01 | 1983-02-02 | スタンレー電気株式会社 | 金属電解回収装置 |
| JPS582272B2 (ja) * | 1978-06-23 | 1983-01-14 | 椿 秀夫 | 塩素化合物腐蝕液の電解方法 |
| DE2850542C2 (de) | 1978-11-22 | 1982-07-01 | Kernforschungsanlage Jülich GmbH, 5170 Jülich | Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen |
| US4604175A (en) * | 1982-12-07 | 1986-08-05 | Naumov Jury I | Process for regeneration of iron-copper chloride etching solution |
| US4880495A (en) | 1987-04-13 | 1989-11-14 | The Harshaw Chemical Company | Regeneration of copper etch bath |
| JP3458036B2 (ja) | 1996-03-05 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
| DE19850530A1 (de) * | 1998-11-03 | 2000-05-25 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
| CN1348020A (zh) * | 2000-10-10 | 2002-05-08 | 同济大学 | 氯化铁刻蚀或酸洗废液中镍与重金属离子的去除方法 |
-
2003
- 2003-06-13 DE DE10326767A patent/DE10326767B4/de not_active Expired - Fee Related
-
2004
- 2004-06-01 TW TW093115701A patent/TWI348502B/zh not_active IP Right Cessation
- 2004-06-04 MY MYPI20042176A patent/MY139968A/en unknown
- 2004-06-07 DE DE602004009572T patent/DE602004009572T2/de not_active Expired - Lifetime
- 2004-06-07 KR KR1020057023701A patent/KR101052245B1/ko not_active Expired - Fee Related
- 2004-06-07 AT AT04739653T patent/ATE376080T1/de active
- 2004-06-07 JP JP2006515835A patent/JP4425271B2/ja not_active Expired - Fee Related
- 2004-06-07 EP EP04739653A patent/EP1633906B1/de not_active Expired - Lifetime
- 2004-06-07 US US10/559,396 patent/US7520973B2/en not_active Expired - Fee Related
- 2004-06-07 WO PCT/EP2004/006115 patent/WO2004111308A1/en not_active Ceased
- 2004-06-07 CN CNB2004800156724A patent/CN100413999C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004009572D1 (de) | 2007-11-29 |
| MY139968A (en) | 2009-11-30 |
| CN1802456A (zh) | 2006-07-12 |
| JP2006527304A (ja) | 2006-11-30 |
| CN100413999C (zh) | 2008-08-27 |
| EP1633906A1 (de) | 2006-03-15 |
| WO2004111308A1 (en) | 2004-12-23 |
| US20060175204A1 (en) | 2006-08-10 |
| KR20060063796A (ko) | 2006-06-12 |
| KR101052245B1 (ko) | 2011-07-27 |
| JP4425271B2 (ja) | 2010-03-03 |
| DE10326767A1 (de) | 2005-01-05 |
| DE602004009572T2 (de) | 2008-07-24 |
| DE10326767B4 (de) | 2006-02-02 |
| TW200506099A (en) | 2005-02-16 |
| TWI348502B (en) | 2011-09-11 |
| US7520973B2 (en) | 2009-04-21 |
| EP1633906B1 (de) | 2007-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
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