ATE373830T1 - Mehrspitzenfühler - Google Patents

Mehrspitzenfühler

Info

Publication number
ATE373830T1
ATE373830T1 AT99932677T AT99932677T ATE373830T1 AT E373830 T1 ATE373830 T1 AT E373830T1 AT 99932677 T AT99932677 T AT 99932677T AT 99932677 T AT99932677 T AT 99932677T AT E373830 T1 ATE373830 T1 AT E373830T1
Authority
AT
Austria
Prior art keywords
probe
probe arms
arms
wafer
conducting
Prior art date
Application number
AT99932677T
Other languages
English (en)
Inventor
Christian Petersen
Francois Grey
Peter Boggild
Original Assignee
Capres Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26063886&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE373830(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from EP98610023A external-priority patent/EP0974845A1/de
Application filed by Capres Aps filed Critical Capres Aps
Application granted granted Critical
Publication of ATE373830T1 publication Critical patent/ATE373830T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14—Measuring resistance by measuring current or voltage obtained from a reference source
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/04—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Mechanical Pencils And Projecting And Retracting Systems Therefor, And Multi-System Writing Instruments (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AT99932677T 1998-07-08 1999-07-08 Mehrspitzenfühler ATE373830T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP98610023A EP0974845A1 (de) 1998-07-08 1998-07-08 Vorrichtung zum Testen elektrischer Eigenschaften mittels eines Mehrspitzenfühlers
DKPA199900378 1999-03-17

Publications (1)

Publication Number Publication Date
ATE373830T1 true ATE373830T1 (de) 2007-10-15

Family

ID=26063886

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99932677T ATE373830T1 (de) 1998-07-08 1999-07-08 Mehrspitzenfühler

Country Status (8)

Country Link
US (2) US20010050565A1 (de)
EP (1) EP1095282B1 (de)
JP (1) JP4685240B2 (de)
AT (1) ATE373830T1 (de)
AU (1) AU4897399A (de)
CA (1) CA2336531A1 (de)
DE (1) DE69937147T2 (de)
WO (1) WO2000003252A2 (de)

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US6955078B2 (en) * 2001-03-30 2005-10-18 Xidex Corporation Caliper method, system, and apparatus
ATE519119T1 (de) 2002-01-07 2011-08-15 Capres As Elektrisches rückkopplungs-detektionssystem für mehrpunktsonden
DE10201491C1 (de) * 2002-01-16 2003-08-28 Gfd Ges Fuer Diamantprodukte M Meßspitzensystem und Verfahren zu dessen Herstellung
EP1782078B2 (de) 2004-06-21 2019-10-16 Capres A/S Verfahren und Vorrichtung zur Ausrichtung einer Sonde bezüglich eines Trägersubstrats
EP2463668A2 (de) 2004-06-21 2012-06-13 Capres A/S Verfahren und Vorrichtung zum Testen elektrischer Eigenschaften
US9423693B1 (en) 2005-05-10 2016-08-23 Victor B. Kley In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate
US7571638B1 (en) * 2005-05-10 2009-08-11 Kley Victor B Tool tips with scanning probe microscopy and/or atomic force microscopy applications
ES2265277B1 (es) * 2005-06-01 2008-01-01 Consejo Superior Investig. Cientificas Dispositivo sensor y equipo para la medicion de resistividad con el metodo de las cuatro puntas, asi como un metodo para la fabricacion del dispositivo.
US7511510B2 (en) * 2005-11-30 2009-03-31 International Business Machines Corporation Nanoscale fault isolation and measurement system
EP2016433A1 (de) 2006-04-24 2009-01-21 Capres A/S Verfahren für blattwiderstands- und leckstromdichtemessungen an seichten halbleiterimplantaten
US8245318B2 (en) * 2006-07-27 2012-08-14 The Regents Of The University Of California Sidewall tracing nanoprobes, method for making the same, and method for use
EP2088420A4 (de) * 2006-11-30 2017-06-28 Japan Science and Technology Agency Metallsonde, verfahren zur ausbildung davon und metallsonde ausbildende vorrichtung
EP1970714A1 (de) * 2007-03-12 2008-09-17 Capres Aps Vorrichtung mit Kontaktdetektor
US8507908B2 (en) 2007-07-03 2013-08-13 Advantest Corporation Probe and probe card
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US20090201038A1 (en) * 2008-02-11 2009-08-13 Knickerbocker John U Test head for functional wafer level testing, system and method therefor
EP2101181A1 (de) 2008-03-12 2009-09-16 Capres A/S Vorrichtung mit Kontaktdetektor
EP2141503A1 (de) * 2008-06-30 2010-01-06 Capres A/S Mehrpunktsonde zum Testen elektrischer Eigenschaften und Verfahren zur Herstellung einer Mehrpunktsonde
US20110285416A1 (en) * 2008-06-30 2011-11-24 Petersen Dirch H Multi-point probe for testing electrical properties and a method of producing a multi-point probe
US7940067B2 (en) * 2008-09-08 2011-05-10 Tektronix, Inc. Probe with printed tip
EP2237052A1 (de) 2009-03-31 2010-10-06 Capres A/S Automatisierte Mehrpunktsondenmanipulation
EP2498081A1 (de) 2011-03-08 2012-09-12 Capres A/S Messung des Hall-Effekts in einer einzigen Position
EP2469271A1 (de) 2010-12-21 2012-06-27 Capres A/S Messung des Hall-Effekts in einer einzigen Position
JP6013361B2 (ja) 2010-12-21 2016-10-25 カプレス・アクティーゼルスカブＣａｐｒｅｓ Ａ／Ｓ 単一位置ホール効果測定
US8633720B2 (en) 2011-06-21 2014-01-21 Avalanche Technology Inc. Method and apparatus for measuring magnetic parameters of magnetic thin film structures
WO2013148204A1 (en) * 2012-03-27 2013-10-03 Syed Amanulla Syed Asif Microscope objective mechanical testing instrument
US8806284B2 (en) 2012-05-02 2014-08-12 Avalanche Technology Inc. Method for bit-error rate testing of resistance-based RAM cells using a reflected signal
EP2677324A1 (de) 2012-06-20 2013-12-25 Capres A/S Tiefgeätzte Mehrpunktsonde
US9252187B2 (en) 2013-03-08 2016-02-02 Avalanche Technology, Inc. Devices and methods for measurement of magnetic characteristics of MRAM wafers using magnetoresistive test strips
US9778572B1 (en) 2013-03-15 2017-10-03 Victor B. Kley In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate
US9844139B2 (en) 2013-03-16 2017-12-12 Indiana Integrated Circuits, LLC Method of interconnecting microchips
KR102080661B1 (ko) * 2013-08-06 2020-02-24 삼성전기주식회사 두께 측정 장치 및 두께 측정 방법
EP2871487A1 (de) 2013-11-11 2015-05-13 Capres A/S Miniaturisierte Messungen von anisotropen Flächenleitfähigkeiten
US9201112B2 (en) 2013-12-09 2015-12-01 International Business Machines Corporation Atom probe tomography sample preparation for three-dimensional (3D) semiconductor devices
US9170273B2 (en) * 2013-12-09 2015-10-27 Globalfoundries U.S. 2 Llc High frequency capacitance-voltage nanoprobing characterization
US10302677B2 (en) 2015-04-29 2019-05-28 Kla-Tencor Corporation Multiple pin probes with support for performing parallel measurements
TWI567846B (zh) * 2015-08-19 2017-01-21 創意電子股份有限公司 測試單元與使用其的測試裝置
US10896803B2 (en) * 2016-08-19 2021-01-19 The Regents Of The University Of California Ion beam mill etch depth monitoring with nanometer-scale resolution
US10514391B2 (en) 2016-08-22 2019-12-24 Kla-Tencor Corporation Resistivity probe having movable needle bodies
US11215638B2 (en) 2017-03-07 2022-01-04 Capres A/S Probe for testing an electrical property of a test sample
TWI645194B (zh) * 2017-07-12 2018-12-21 萬潤科技股份有限公司 探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備
US11693028B2 (en) 2017-11-15 2023-07-04 Kla Corporation Probe for testing an electrical property of a test sample
US10411185B1 (en) 2018-05-30 2019-09-10 Spin Memory, Inc. Process for creating a high density magnetic tunnel junction array test platform
US11125779B2 (en) 2018-11-15 2021-09-21 Rohde & Schwarz Gmbh & Co. Kg Probe with radio frequency power detector, test system and test method
KR102137442B1 (ko) * 2018-12-05 2020-07-27 전북대학교산학협력단 원자력 현미경용 프로브 및 이의 제조 방법
CN110190106B (zh) * 2019-06-13 2022-01-28 京东方科技集团股份有限公司 一种显示面板及其制备方法、检测方法、显示装置
CN112526179B (zh) * 2020-11-30 2022-01-21 强一半导体（苏州）有限公司 一种楔块调幅探针卡及其主体
JP7658168B2 (ja) * 2021-05-21 2025-04-08 富士フイルムビジネスイノベーション株式会社 シート電気抵抗測定器
CN114814314B (zh) * 2022-04-18 2024-02-13 苏州伊欧陆系统集成有限公司 一种多触点高电流高电压测试探针
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Also Published As

Publication number Publication date
WO2000003252A2 (en) 2000-01-20
EP1095282B1 (de) 2007-09-19
EP1095282A2 (de) 2001-05-02
WO2000003252A3 (en) 2000-04-13
US20010050565A1 (en) 2001-12-13
JP2002520596A (ja) 2002-07-09
JP4685240B2 (ja) 2011-05-18
CA2336531A1 (en) 2000-01-20
DE69937147D1 (de) 2007-10-31
DE69937147T2 (de) 2008-06-19
US20040056674A1 (en) 2004-03-25
US7323890B2 (en) 2008-01-29
AU4897399A (en) 2000-02-01

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