ATE371915T1 - Elektronisches video-aufbau-inspektions-system - Google Patents

Elektronisches video-aufbau-inspektions-system

Info

Publication number
ATE371915T1
ATE371915T1 AT98952209T AT98952209T ATE371915T1 AT E371915 T1 ATE371915 T1 AT E371915T1 AT 98952209 T AT98952209 T AT 98952209T AT 98952209 T AT98952209 T AT 98952209T AT E371915 T1 ATE371915 T1 AT E371915T1
Authority
AT
Austria
Prior art keywords
station
reposition
circuit board
video image
inspection station
Prior art date
Application number
AT98952209T
Other languages
English (en)
Inventor
Joseph L Vilella
Original Assignee
Vectron Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25486709&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE371915(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Vectron Inc filed Critical Vectron Inc
Application granted granted Critical
Publication of ATE371915T1 publication Critical patent/ATE371915T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • H04N7/185—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source from a mobile camera, e.g. for remote control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
  • Image Processing (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
AT98952209T 1997-10-09 1998-10-08 Elektronisches video-aufbau-inspektions-system ATE371915T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94775697A 1997-10-09 1997-10-09

Publications (1)

Publication Number Publication Date
ATE371915T1 true ATE371915T1 (de) 2007-09-15

Family

ID=25486709

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98952209T ATE371915T1 (de) 1997-10-09 1998-10-08 Elektronisches video-aufbau-inspektions-system

Country Status (12)

Country Link
US (3) US6681038B2 (de)
EP (1) EP1032912B8 (de)
JP (1) JP2001520422A (de)
KR (1) KR100628344B1 (de)
CN (1) CN1232924C (de)
AT (1) ATE371915T1 (de)
AU (1) AU9796398A (de)
BR (1) BR9815246A (de)
CA (1) CA2307031C (de)
DE (1) DE69838342T2 (de)
HK (1) HK1033019A1 (de)
WO (1) WO1999019825A1 (de)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7366341B2 (en) * 1996-10-09 2008-04-29 Easton Hunt Capital Partners, L.P. Electronic assembly video inspection system
KR100628344B1 (ko) * 1997-10-09 2006-09-27 벡트론 인코포레이티드 전자 조립체 영상 검사 시스템
US7486813B2 (en) * 1998-10-08 2009-02-03 Easton Hunt Capital Partners, L.P. Electronic assembly video inspection system
KR20000072235A (ko) * 2000-08-21 2000-12-05 여희주 비전 시스템을 이용한 자동차 퓨즈박스 검사장치 및 그 방법
US6958768B1 (en) * 2000-10-20 2005-10-25 Asti Holdings Limited CMOS inspection apparatus
JP4049559B2 (ja) * 2001-08-17 2008-02-20 富士フイルム株式会社 検査装置
US7101508B2 (en) * 2002-07-31 2006-09-05 Agilent Technologies, Inc. Chemical array fabrication errors
US7742071B2 (en) * 2003-01-23 2010-06-22 Oracle America, Inc. Methods and apparatus for inspecting centerplane connectors
NL1022515C2 (nl) * 2003-01-29 2004-08-03 Vitronics Soltec B V Inrichting en werkwijze voor correctief solderen.
US7458055B2 (en) * 2003-02-19 2008-11-25 Diversified Systems, Inc. Apparatus, system, method, and program for facilitating the design of electronic assemblies
US7240319B2 (en) * 2003-02-19 2007-07-03 Diversified Systems, Inc. Apparatus, system, method, and program for facilitating the design of bare circuit boards
GB0307105D0 (en) * 2003-03-27 2003-04-30 Pillarhouse Int Ltd Soldering method and apparatus
DE10344409A1 (de) * 2003-09-25 2005-04-28 Marconi Comm Gmbh Verfahren zum Fertigen einer Hochfrequenzbaugruppe
WO2005096688A1 (en) * 2004-04-02 2005-10-13 Original Solutions Inc. System and method for defect detection and process improvement for printed circuit board assemblies
US7813638B2 (en) * 2004-06-07 2010-10-12 Rudolph Technologies, Inc. System for generating camera triggers
EP1628493A1 (de) * 2004-08-17 2006-02-22 Dialog Semiconductor GmbH Handhabungssystem für Kamera
US7587080B1 (en) * 2004-11-04 2009-09-08 Rockwell Automation Technologies, Inc. Image retention user interface
US20060092274A1 (en) * 2004-11-04 2006-05-04 Rockwell Automation Technologies, Inc. Image sensor annotation method and apparatus
DE102004056698B3 (de) * 2004-11-24 2006-08-17 Stratus Vision Gmbh Inspektionsvorrichtung für ein Substrat, das mindestens eine aufgedruckte Schicht aufweist
GB0616410D0 (en) * 2006-08-21 2006-10-18 Anaglyph Ltd Visual aid for manufacturing assembly/component placement
US7735626B2 (en) * 2006-11-13 2010-06-15 Pioneer Hi-Bred International, Inc. Apparatus, method and system for handling, positioning, and/or automatically orienting objects
BRPI0718911A2 (pt) * 2006-11-13 2014-01-21 Pioneer Hi Bred Int Método de amostragem de semente, aparelho para amostragem de uma ou mais sementes e método de amostragem de tecido de semente a partir de uma semente individual
US7915006B2 (en) * 2006-11-13 2011-03-29 Pioneer Hi-Bred International, Inc. Methodologies, processes and automated devices for the orientation, sampling and collection of seed tissues from individual seed
US20080290885A1 (en) * 2007-05-23 2008-11-27 Texas Instruments Incorporated Probe test system and method for testing a semiconductor package
CN102066896B (zh) 2007-12-17 2014-05-14 先锋国际良种公司 制作、处理、收集以及标引种子和来自植物种子的种子部分的设备、方法以及系统
AU2009202512B2 (en) 2008-06-25 2012-02-02 Aristocrat Technologies Australia Pty Limited A method and system for setting display resolution
US7869645B2 (en) * 2008-07-22 2011-01-11 Seiko Epson Corporation Image capture and calibratiion
US8090184B2 (en) * 2008-07-23 2012-01-03 Seiko Epson Corporation Fault detection of a printed dot-pattern bitmap
US8269836B2 (en) * 2008-07-24 2012-09-18 Seiko Epson Corporation Image capture, alignment, and registration
US9041508B2 (en) * 2008-08-08 2015-05-26 Snap-On Incorporated Image-based inventory control system and method
US7989769B2 (en) * 2008-08-21 2011-08-02 Rockwell Automation Technologies, Inc. In-cabinet thermal monitoring method and system
AR073121A1 (es) 2009-02-18 2010-10-13 Pioneer Hi Bred Int Metodo de preparacion de mazorcas de maiz para la manipulacion, posicionamiento y orientacion automatizada
CN102175309A (zh) * 2011-03-01 2011-09-07 飞迅科技(苏州)有限公司 检测汽车多媒体控制面板指示灯亮度的检测设备
EP2684026A4 (de) * 2011-03-08 2014-09-10 Spectral Instr Imaging Llc Abbildungssystem mit primären und hilfs-kamerasystemen
US9706137B2 (en) 2011-06-10 2017-07-11 Flir Systems, Inc. Electrical cabinet infrared monitor
DE102011112532B4 (de) * 2011-09-05 2019-03-21 Audi Ag Prüfeinrichtung und Verfahren zum Prüfen von Batteriezellen
EP2834968B1 (de) * 2012-04-06 2019-09-11 Flir Systems, Inc. Infrarot-monitor für schaltschrank
DE102013014112A1 (de) * 2013-08-22 2015-02-26 J.G. WEISSER SöHNE GMBH & CO. KG Maschine und Verfahren zur Diagnose einer Maschine
KR101639262B1 (ko) * 2014-09-30 2016-07-13 (주)아세아에프에이 커넥터용 하우징 공급장치
CN104375293B (zh) * 2014-11-20 2017-05-17 武汉精测电子技术股份有限公司 基于机器视觉的lcd屏自动检测机台
CN107408297B (zh) * 2014-11-24 2021-02-02 基托夫系统有限公司 自动检查
CN104390982A (zh) * 2014-11-25 2015-03-04 深圳华普通用自动化设备有限公司 一种用于smt首件检测的测试方法
TWM505131U (zh) * 2015-01-30 2015-07-11 Arima Communication Corp 手機自動化生產系統
US20180157246A1 (en) * 2015-01-30 2018-06-07 Arima Communications Corp. Automated production system for mobile phone
KR102314613B1 (ko) * 2015-02-11 2021-10-20 (주)테크윙 전자부품의 안착상태를 확인하기 위한 장치
CN106153639B (zh) * 2015-04-21 2018-10-19 国际技术开发株式会社 基于人工智能的电路板检测方法及其检测装置
US11167384B2 (en) 2015-07-02 2021-11-09 Serenity Data Security, Llc Hard drive non-destructive dismantling system
WO2017004575A1 (en) 2015-07-02 2017-01-05 Serenity Data Services, Inc. Hard drive dismantling system
US10556240B2 (en) 2015-07-02 2020-02-11 Serenity Data Security, Llc Product verification for hard drive data destroying device
CN105572148A (zh) * 2015-12-14 2016-05-11 天津华迈科技有限公司 一种贴片质检组件
US11330746B2 (en) * 2018-02-28 2022-05-10 Raytheon Company Device and method for reworking flip chip components
DE102018118103B3 (de) 2018-07-26 2019-12-05 Ersa Gmbh Reworksystem zum Aus- und/oder Einlöten von elektronischen Komponenten auf einer Leiterplatte
CN111832324B (zh) * 2019-04-17 2024-01-30 深圳长城开发科技股份有限公司 用于smt生产线的在线自动扫描条码方法和系统
CN110426400B (zh) * 2019-07-18 2021-03-05 成都新西旺自动化科技有限公司 针对触摸屏可操作区的自动打光方法
US11551349B2 (en) 2020-05-22 2023-01-10 Future Dial, Inc. Defect detection and image comparison of components in an assembly
US11538148B2 (en) 2020-05-22 2022-12-27 Future Dial, Inc. Defect detection of a component in an assembly
CN114324343A (zh) * 2020-10-09 2022-04-12 泰连服务有限公司 具有视觉检查系统的零件制造机器
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
US20230153986A1 (en) * 2021-11-12 2023-05-18 Future Dial, Inc. Grading cosmetic appearance of a test object
CN116322014B (zh) * 2023-03-02 2024-07-16 惠州市天睿电子有限公司 电路板自动贴片装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61293657A (ja) * 1985-06-21 1986-12-24 Matsushita Electric Works Ltd 半田付け外観検査方法
US4729062A (en) * 1986-06-16 1988-03-01 Hughes Aircraft Company Reworkable encapsulated electronic assembly
DE68929062T2 (de) * 1988-05-09 2000-03-16 Omron Corp. Vorrichtung zum Prüfen von Leiterplatten
EP0651937A4 (de) * 1992-06-19 1995-08-30 Motorola Inc Selbstausrichtende elektrische kontaktleiste.
TW331599B (en) * 1995-09-26 1998-05-11 Toshiba Co Ltd Array substrate for LCD and method of making same
US5754678A (en) * 1996-01-17 1998-05-19 Photon Dynamics, Inc. Substrate inspection apparatus and method
US5917332A (en) * 1996-05-09 1999-06-29 Advanced Micro Devices, Inc. Arrangement for improving defect scanner sensitivity and scanning defects on die of a semiconductor wafer
KR100628344B1 (ko) * 1997-10-09 2006-09-27 벡트론 인코포레이티드 전자 조립체 영상 검사 시스템

Also Published As

Publication number Publication date
CN1232924C (zh) 2005-12-21
US20040071335A1 (en) 2004-04-15
DE69838342T2 (de) 2008-05-29
US20020186877A1 (en) 2002-12-12
US7043070B2 (en) 2006-05-09
CA2307031A1 (en) 1999-04-22
WO1999019825A1 (en) 1999-04-22
DE69838342D1 (de) 2007-10-11
KR20010024424A (ko) 2001-03-26
EP1032912B8 (de) 2008-01-09
CN1280691A (zh) 2001-01-17
BR9815246A (pt) 2000-11-21
EP1032912A4 (de) 2001-04-04
JP2001520422A (ja) 2001-10-30
KR100628344B1 (ko) 2006-09-27
CA2307031C (en) 2007-03-27
US20040208354A1 (en) 2004-10-21
EP1032912A1 (de) 2000-09-06
US6681038B2 (en) 2004-01-20
EP1032912B1 (de) 2007-08-29
AU9796398A (en) 1999-05-03
HK1033019A1 (en) 2001-08-10

Similar Documents

Publication Publication Date Title
ATE371915T1 (de) Elektronisches video-aufbau-inspektions-system
CA2108915A1 (en) A system and method for automatic optical inspection
AU6935296A (en) Method and apparatus for automatic electronic replacement of billboards in a video image
EP1042559A4 (de) Inspektionssystem für strassenschäden
CA2181479A1 (en) Method and Apparatus for Positioning an Ultrasonic Transducer and a Display Screen
DE19727471C1 (de) Verfahren zur automatischen Intensitätseinstellung einer Beleuchtung für Einrichtungen zur Lageerkennung und/oder Qualitätskontrolle bei der automatischen Bestückung von Bauelementen
EP0871027A3 (de) Prüfung gedruckter Leiterplatten
JPS54143290A (en) Soldered part inspecting device
CN211785807U (zh) 闪电通道双摄自动观测系统
US20040148128A1 (en) Methods and apparatus for inspecting centerplane connectors
GB9906765D0 (en) Colour Monitoring
KR930003300B1 (en) Apparatus for the inspection of printed circuit boards on which components have been mounted
EP0336114A2 (de) Vorrichtung zur Lageerfassung der Anschlusskontakte elektrischer oder elektronischer Bauelemente
EP0730146A2 (de) Verfahren zur Bestimmung der Qualitätseigenschaften von individuellen Skeletten, Lampe zur Beleuchtung eines Skelettes und Anwendung des Verfahrens und der Lampe
CN215263162U (zh) 一种可偏移报警的多级视觉分类检测装置
KR910019488A (ko) 전자부품 자동설치장치 및 방법
EP0407685A3 (en) Method for inspection of solder joints by x-ray fluoroscopic image, apparatus therefor and mounting construction of electronic parts on board
CN215554239U (zh) 一种无人机的旋转摄像头安装组件
EP0783157A3 (de) Vereinfachte Montage und automatischer Bauteiletest in elektro-optischen Systemen zum Lesen von kodierten Zeichen
KR100218397B1 (ko) 표면실장부품 검사방법
Miller AOI systems for yield improvement
JPS57206802A (en) Alignment device
WO1996010325A3 (en) A device for capturing images from a component and a mounting machine with such a device
JPS6223200A (ja) 部品取付検査装置
JPS6488686A (en) Deficient parts inspecting device for packaged parts

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties