ATE365375T1 - Verfahren und apparat zum trocknen von halbleiterscheibenoberflächen mittels einer vielzahl von ein- und auslässen in der nähe der scheibenoberfläche - Google Patents

Verfahren und apparat zum trocknen von halbleiterscheibenoberflächen mittels einer vielzahl von ein- und auslässen in der nähe der scheibenoberfläche

Info

Publication number
ATE365375T1
ATE365375T1 AT03798815T AT03798815T ATE365375T1 AT E365375 T1 ATE365375 T1 AT E365375T1 AT 03798815 T AT03798815 T AT 03798815T AT 03798815 T AT03798815 T AT 03798815T AT E365375 T1 ATE365375 T1 AT E365375T1
Authority
AT
Austria
Prior art keywords
substrate
fluid
conduit
head
disc
Prior art date
Application number
AT03798815T
Other languages
English (en)
Inventor
Larios John De
James Garcia
Carl Woods
Mike Ravkin
Fritz Redeker
John Boyd
Afshin Nickhou
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/261,839 external-priority patent/US7234477B2/en
Priority claimed from US10/611,140 external-priority patent/US7264007B2/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE365375T1 publication Critical patent/ATE365375T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
AT03798815T 2002-09-30 2003-09-30 Verfahren und apparat zum trocknen von halbleiterscheibenoberflächen mittels einer vielzahl von ein- und auslässen in der nähe der scheibenoberfläche ATE365375T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/261,839 US7234477B2 (en) 2000-06-30 2002-09-30 Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
US10/611,140 US7264007B2 (en) 2002-09-30 2003-06-30 Method and apparatus for cleaning a substrate using megasonic power

Publications (1)

Publication Number Publication Date
ATE365375T1 true ATE365375T1 (de) 2007-07-15

Family

ID=32044980

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03798815T ATE365375T1 (de) 2002-09-30 2003-09-30 Verfahren und apparat zum trocknen von halbleiterscheibenoberflächen mittels einer vielzahl von ein- und auslässen in der nähe der scheibenoberfläche

Country Status (12)

Country Link
EP (1) EP1500128B1 (de)
JP (1) JP4559226B2 (de)
KR (1) KR101055997B1 (de)
CN (1) CN100431092C (de)
AT (1) ATE365375T1 (de)
AU (1) AU2003277212A1 (de)
DE (1) DE60314508T2 (de)
IL (1) IL161550A0 (de)
PL (1) PL208012B1 (de)
RU (1) RU2338296C2 (de)
TW (1) TWI230397B (de)
WO (1) WO2004030052A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6988326B2 (en) * 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7520285B2 (en) * 2002-09-30 2009-04-21 Lam Research Corporation Apparatus and method for processing a substrate
US7093375B2 (en) * 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
JP5043021B2 (ja) 2005-10-04 2012-10-10 アプライド マテリアルズ インコーポレイテッド 基板を乾燥するための方法及び装置
KR100687504B1 (ko) * 2005-10-27 2007-02-27 세메스 주식회사 매엽식 기판 세정 방법
DE102013220252A1 (de) * 2013-10-08 2015-04-09 Rudolph Technologies Germany Gmbh Halte- und Drehvorrichtung für flache Objekte
DE102017111618B4 (de) * 2017-05-29 2021-03-11 CURO GmbH Vorrichtung, System und Verfahren zur Trocknung einer Halbleiterscheibe
US11352711B2 (en) 2019-07-16 2022-06-07 Applied Materials, Inc. Fluid recovery in semiconductor processing
CN111312581B (zh) * 2020-02-27 2022-07-15 至微半导体(上海)有限公司 一种可提升晶圆干燥效率的排气方法
CN111312580B (zh) * 2020-02-27 2022-07-15 至微半导体(上海)有限公司 一种用于高深宽比图形晶圆的微幅震动方法
CN111211043B (zh) * 2020-02-27 2022-10-18 至微半导体(上海)有限公司 一种用于提升晶圆干燥效率的干燥方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264626A (ja) * 1994-04-28 1996-10-11 Hitachi Ltd 試料保持方法及び試料表面の流体処理方法並びにそれらの装置
US5975098A (en) * 1995-12-21 1999-11-02 Dainippon Screen Mfg. Co., Ltd. Apparatus for and method of cleaning substrate
JPH1092784A (ja) * 1996-09-10 1998-04-10 Toshiba Microelectron Corp ウェーハ処理装置およびウェーハ処理方法
US6039059A (en) 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
JP4616948B2 (ja) * 1997-09-24 2011-01-19 アイメック 回転基材の表面から液体を除去する方法および装置
WO1999016109A1 (en) * 1997-09-24 1999-04-01 Interuniversitair Micro-Elektronica Centrum Vereniging Zonder Winstbejag Method and apparatus for removing a liquid from a surface
EP0905746A1 (de) * 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
US6398975B1 (en) * 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
US6261377B1 (en) * 1997-09-24 2001-07-17 Interuniversitair Microelektronica Centrum (Imec) Method of removing particles and a liquid from a surface of substrate
JP2000015159A (ja) * 1998-07-02 2000-01-18 Dainippon Screen Mfg Co Ltd 処理液供給装置
JP3873099B2 (ja) * 2000-01-13 2007-01-24 アルプス電気株式会社 基板ガイド装置ならびにこれを用いた洗浄装置
JP2004515053A (ja) * 2000-06-26 2004-05-20 アプライド　マテリアルズ　インコーポレイテッド ウェーハ洗浄方法及び装置
US6555017B1 (en) * 2000-10-13 2003-04-29 The Regents Of The University Of Caliofornia Surface contouring by controlled application of processing fluid using Marangoni effect

Also Published As

Publication number Publication date
AU2003277212A1 (en) 2004-04-19
TWI230397B (en) 2005-04-01
DE60314508D1 (de) 2007-08-02
PL208012B1 (pl) 2011-03-31
RU2338296C2 (ru) 2008-11-10
KR20050063748A (ko) 2005-06-28
RU2004113416A (ru) 2006-07-20
CN1579005A (zh) 2005-02-09
WO2004030052A3 (en) 2004-07-29
EP1500128A2 (de) 2005-01-26
JP4559226B2 (ja) 2010-10-06
KR101055997B1 (ko) 2011-08-11
PL374502A1 (en) 2005-10-31
WO2004030052A2 (en) 2004-04-08
TW200411722A (en) 2004-07-01
CN100431092C (zh) 2008-11-05
IL161550A0 (en) 2004-09-27
EP1500128B1 (de) 2007-06-20
DE60314508T2 (de) 2008-02-21
JP2006501655A (ja) 2006-01-12

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