ATE331759T1 - Polyamidharzzusammensetzugen zur abschirmung gegen elektromagnetische interferenzen, sowie daraus geformte gegenstände - Google Patents

Polyamidharzzusammensetzugen zur abschirmung gegen elektromagnetische interferenzen, sowie daraus geformte gegenstände

Info

Publication number
ATE331759T1
ATE331759T1 AT02792466T AT02792466T ATE331759T1 AT E331759 T1 ATE331759 T1 AT E331759T1 AT 02792466 T AT02792466 T AT 02792466T AT 02792466 T AT02792466 T AT 02792466T AT E331759 T1 ATE331759 T1 AT E331759T1
Authority
AT
Austria
Prior art keywords
polyamide resin
resin compositions
electromagnetic interference
against electromagnetic
shielding against
Prior art date
Application number
AT02792466T
Other languages
English (en)
Inventor
Paul P Cheng
Yuji Saga
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Application granted granted Critical
Publication of ATE331759T1 publication Critical patent/ATE331759T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Textile Engineering (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AT02792466T 2001-12-19 2002-12-19 Polyamidharzzusammensetzugen zur abschirmung gegen elektromagnetische interferenzen, sowie daraus geformte gegenstände ATE331759T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34193901P 2001-12-19 2001-12-19

Publications (1)

Publication Number Publication Date
ATE331759T1 true ATE331759T1 (de) 2006-07-15

Family

ID=23339645

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02792466T ATE331759T1 (de) 2001-12-19 2002-12-19 Polyamidharzzusammensetzugen zur abschirmung gegen elektromagnetische interferenzen, sowie daraus geformte gegenstände

Country Status (9)

Country Link
US (1) US7022265B2 (de)
EP (1) EP1458814B1 (de)
JP (1) JP2005532417A (de)
CN (1) CN1701097A (de)
AT (1) ATE331759T1 (de)
AU (1) AU2002357920A1 (de)
CA (1) CA2470623C (de)
DE (1) DE60212878T2 (de)
WO (1) WO2003054087A2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10259498A1 (de) * 2002-12-19 2004-07-01 Bayer Ag Leitfähige Thermoplaste mit Ruß und Kohlenstoff-Nanofibrillen
JP2005051129A (ja) * 2003-07-30 2005-02-24 Sony Corp 電子機器
US20050272855A1 (en) * 2004-03-30 2005-12-08 Andreas Renken Process for coating vehicle exterior parts made from electrically conductive polyamide resin compositions
US20080132636A1 (en) * 2004-06-03 2008-06-05 Gilbert Ross Nylon monofilaments and process for preparing nylon monofilaments for the production of spiral fabrics and seam wires
JP2006206672A (ja) * 2005-01-26 2006-08-10 Mitsubishi Engineering Plastics Corp ポリアミド樹脂組成物および導電性軸状成形品
FR2899236B1 (fr) * 2006-04-04 2008-05-16 Rhodia Recherches & Tech Composition electriquement conductrice a base de matrice polyamide.
DE102006060339A1 (de) * 2006-12-13 2008-06-19 Leibniz-Institut Für Polymerforschung Dresden E.V. Flammfestes Polyamid und Verfahren zu seiner Herstellung
US8679371B2 (en) * 2007-04-11 2014-03-25 Sabic Innovative Plastics Ip B.V. Electrically conducting polymeric compositions, methods of manufacture thereof and articles comprising the same
US7999018B2 (en) * 2007-04-24 2011-08-16 E. I. Du Pont De Nemours And Company Thermoplastic resin composition having electromagnetic interference shielding properties
JP2011506642A (ja) * 2007-12-05 2011-03-03 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 弾性率増加ゴムの製造に有用なエラストマー材料
KR101212671B1 (ko) 2008-12-10 2012-12-14 제일모직주식회사 Ｅｍｉ/ｒｆｉ 차폐용 수지 복합재
FR2958652B1 (fr) * 2010-04-13 2013-09-06 Rhodia Operations Composition thermoplastique a base de polyamide et de polycetone.
KR20120034538A (ko) * 2010-08-26 2012-04-12 제일모직주식회사 고강성 전자파 차폐 조성물 및 그 성형품
WO2012026652A1 (ko) * 2010-08-26 2012-03-01 제일모직 주식회사 고강성 전자파 차폐 조성물 및 그 성형품
WO2013071474A1 (en) 2011-11-14 2013-05-23 Honeywell International Inc. Polyamide composition for low temperature applications
CN103946311B (zh) * 2011-11-25 2016-04-06 东丽株式会社 树脂组合物、该组合物的粒料和成型品
CN102412705A (zh) * 2011-11-28 2012-04-11 黄柱联 一种ac-dc驱动电源装置
KR102206305B1 (ko) * 2013-11-14 2021-01-22 이엠에스-패턴트 에이지 큰 성형 부품용 폴리아미드 몰딩 컴파운드
CN103804897A (zh) * 2014-02-14 2014-05-21 张家港大塚化学有限公司 工程塑料
CN105131588B (zh) * 2015-08-28 2018-02-27 古道尔工程塑胶（深圳）有限公司 一种低翘曲高耐热导电阻燃复合材料及其制备方法
KR102575899B1 (ko) * 2015-12-25 2023-09-06 니폰 제온 가부시키가이샤 전자파 흡수 재료 및 전자파 흡수체
JP6757163B2 (ja) * 2016-03-31 2020-09-16 タツタ電線株式会社 電磁波シールドフィルム
DE102017112603A1 (de) * 2017-06-08 2018-12-13 Lisa Dräxlmaier GmbH EMV und ESD Schutzgehäuse aus elektrisch leitfähigem Polyamid

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399295A (en) * 1984-06-11 1995-03-21 The Dow Chemical Company EMI shielding composites
US4849474A (en) * 1986-01-06 1989-07-18 General Electric Company Moisture reduction in polyamide compositions
DE3700178A1 (de) * 1986-03-31 1987-10-01 Mitsubishi Gas Chemical Co Elektromagnetische wellen abschirmende thermoplastische harzmasse
DE3641497A1 (de) * 1986-12-04 1988-06-16 Basf Ag Thermoplastische formmassen auf der basis von polyamiden und polyaryletherketonen
DE3914048A1 (de) * 1988-09-13 1990-03-22 Bayer Ag Leichtfliessende polyamid-formmassen und -legierungen
EP0374795B1 (de) * 1988-12-19 1995-10-18 Matsushita Electric Industrial Co., Ltd. Funkwellen absorbierendes Material
DE4002605A1 (de) * 1990-01-30 1991-09-26 Bayer Ag Polyamidformmassen
JPH03289004A (ja) * 1990-04-04 1991-12-19 Matsushita Electric Ind Co Ltd 導電性樹脂組成物
JP2598829B2 (ja) * 1990-04-12 1997-04-09 松下電器産業株式会社 電波吸収材
DE4300260A1 (de) * 1993-01-07 1994-07-14 Bayer Ag Schwerentflammbare Polyamidformmassen
JP3456301B2 (ja) * 1995-03-30 2003-10-14 チッソ株式会社 繊維および特定のカーボンブラックを均一に含有する繊維強化熱可塑性複合体
JPH0987417A (ja) * 1995-09-22 1997-03-31 Kobe Steel Ltd 導電性薄肉樹脂成形品
US5872187A (en) * 1996-03-11 1999-02-16 General Electric Company Polyamide resin composition
JPH10120798A (ja) * 1996-10-18 1998-05-12 Kobe Steel Ltd 電子機器用導電性ケーシング
JP2001067933A (ja) * 1999-08-24 2001-03-16 Toray Ind Inc 導電性樹脂組成物およびその成形品
JP2001131418A (ja) * 1999-11-01 2001-05-15 Toray Ind Inc 熱可塑性樹脂組成物、成形材料、射出成形用ペレットおよび成形品
JP2001220517A (ja) * 1999-11-29 2001-08-14 Toyo Ink Mfg Co Ltd 有機繊維樹脂組成物及びその利用
US6384128B1 (en) * 2000-07-19 2002-05-07 Toray Industries, Inc. Thermoplastic resin composition, molding material, and molded article thereof

Also Published As

Publication number Publication date
AU2002357920A1 (en) 2003-07-09
DE60212878D1 (de) 2006-08-10
WO2003054087A2 (en) 2003-07-03
CA2470623A1 (en) 2003-07-03
EP1458814A2 (de) 2004-09-22
DE60212878T2 (de) 2007-02-08
AU2002357920A8 (en) 2003-07-09
EP1458814B1 (de) 2006-06-28
US7022265B2 (en) 2006-04-04
CA2470623C (en) 2009-09-15
US20030199607A1 (en) 2003-10-23
WO2003054087A3 (en) 2003-11-20
CN1701097A (zh) 2005-11-23
JP2005532417A (ja) 2005-10-27

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