JP2005051129A - 電子機器 - Google Patents
電子機器 Download PDFInfo
- Publication number
- JP2005051129A JP2005051129A JP2003283228A JP2003283228A JP2005051129A JP 2005051129 A JP2005051129 A JP 2005051129A JP 2003283228 A JP2003283228 A JP 2003283228A JP 2003283228 A JP2003283228 A JP 2003283228A JP 2005051129 A JP2005051129 A JP 2005051129A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- conductive layer
- carbon fiber
- casing
- screw hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 46
- 239000004917 carbon fiber Substances 0.000 claims abstract description 46
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 27
- 238000003384 imaging method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229910000861 Mg alloy Inorganic materials 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 230000036039 immunity Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Textile Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
【解決手段】 少なくとも電子部品を内部に収納する筐体20を備え、この筐体20は、炭素繊維21aと熱可塑性樹脂21bとの混合体からなる導電層22と、導電層22の表面に熱可塑性樹脂21bのみが表出する絶縁層23とを有する炭素繊維強化樹脂からなる。
【選択図】 図4
Description
Claims (7)
- 少なくとも電子部品を内部に収納する筐体を備え、
上記筐体は、炭素繊維と熱可塑性樹脂との混合体からなる導電層と、前記導電層の表面に前記熱可塑性樹脂のみが表出する絶縁層とを有する炭素繊維強化樹脂からなることを特徴とする電子機器。 - 上記電子部品が実装されたプリント回路基板を備え、
上記筐体は、上記絶縁層から上記導電層に臨む深さで形成されたネジ孔を有し、
上記プリント配線基板は、上記筐体のネジ孔にネジ止めされることによって、上記導線層とネジを介して電気的に導通されていることを特徴とする請求項1記載の電子機器。 - 上記電子部品と電気的に接続されたフレキシブル配線基板を備え、
上記筐体は、上記絶縁層から上記導電層に臨む深さで形成されたネジ孔を有し、
上記フレキシブル配線基板は、上記筐体のネジ孔にネジ止めされることによって、上記導電層とネジを介して電気的に導通されていることを特徴とする請求項1記載の電子機器。 - 上記筐体は、上記絶縁層から上記導電層に臨む深さで形成されたネジ孔を有し、当該ネジ孔にネジ止めされた金属部品がネジを介して上記導電層と電気的に導通されていることを特徴とする請求項1記載の電子機器。
- 上記筐体の表面が塗装されていることを特徴とする請求項1記載の電子機器。
- 上記筐体は、上記炭素繊維強化樹脂を、表面に上記炭素繊維が露出しないように金型のキャビティ表面の温度を高温としながら、射出成形することで形成されることを特徴とする請求項1記載の電子機器。
- 上記炭素繊維強化樹脂は、全重量に対して上記炭素繊維が10〜30重量%の割合で含有されていることを特徴とする請求項1記載の電子機器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003283228A JP2005051129A (ja) | 2003-07-30 | 2003-07-30 | 電子機器 |
US10/888,290 US7310236B2 (en) | 2003-07-30 | 2004-07-09 | Electronic device |
KR1020040053573A KR20050014660A (ko) | 2003-07-30 | 2004-07-09 | 전자기기 |
EP04254499A EP1503618A3 (en) | 2003-07-30 | 2004-07-28 | Electronic device |
CNB2004100702123A CN100342767C (zh) | 2003-07-30 | 2004-07-30 | 电子装置 |
HK05105413A HK1072678A1 (en) | 2003-07-30 | 2005-06-29 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003283228A JP2005051129A (ja) | 2003-07-30 | 2003-07-30 | 電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005051129A true JP2005051129A (ja) | 2005-02-24 |
Family
ID=33535694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003283228A Pending JP2005051129A (ja) | 2003-07-30 | 2003-07-30 | 電子機器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7310236B2 (ja) |
EP (1) | EP1503618A3 (ja) |
JP (1) | JP2005051129A (ja) |
KR (1) | KR20050014660A (ja) |
CN (1) | CN100342767C (ja) |
HK (1) | HK1072678A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006278568A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | 電磁波シールド筐体 |
WO2015004919A1 (ja) * | 2013-07-11 | 2015-01-15 | パナソニックIpマネジメント株式会社 | 電子機器、電子機器を搭載した自動車、表示装置、表示装置を搭載した移動装置 |
JP2017211641A (ja) * | 2016-05-24 | 2017-11-30 | 株式会社リコー | 電子装置および筐体構造体 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1219401A3 (en) * | 2000-12-29 | 2004-02-04 | Nokia Corporation | Resin injection molded article with reinforcing or decorative core |
JP2008104037A (ja) * | 2006-10-20 | 2008-05-01 | Fujifilm Corp | 撮像装置 |
CN101214918B (zh) * | 2007-01-04 | 2012-04-18 | 菱生精密工业股份有限公司 | 用于微机电封盖制程的封装结构 |
JP2008191433A (ja) * | 2007-02-06 | 2008-08-21 | Fujifilm Corp | タップネジの導電構造、及び電子機器 |
US8574696B2 (en) * | 2007-07-31 | 2013-11-05 | Hewlett-Packard Development Company, L.P. | Electronic device housing assembly |
JP5163340B2 (ja) * | 2008-07-25 | 2013-03-13 | 富士通株式会社 | コネクタ構造、プラグコネクタ及び電子機器 |
JP4489133B2 (ja) * | 2008-09-10 | 2010-06-23 | 株式会社東芝 | プリント配線板、電子機器 |
JP4421663B1 (ja) * | 2008-09-10 | 2010-02-24 | 株式会社東芝 | プリント配線板、電子機器 |
TWM361848U (en) * | 2008-12-24 | 2009-07-21 | Micro Star Int Co Ltd | Fixing mechanism capable of reducing electromagnetic radiation interference and related electronic device |
US7845956B1 (en) * | 2009-05-26 | 2010-12-07 | Thomas Baycura | Electrical component interface |
JP2011014239A (ja) * | 2009-06-30 | 2011-01-20 | Sanyo Electric Co Ltd | 電子機器 |
KR101032252B1 (ko) * | 2009-10-23 | 2011-05-02 | 삼성전기주식회사 | 동화상 카메라 및 이를 포함하는 전자장치 |
US20150222311A1 (en) * | 2012-08-27 | 2015-08-06 | Motorola Solutions ,Inc. | Housing for electrostatic discharge protection of a portable communication device |
JP6322951B2 (ja) * | 2013-10-18 | 2018-05-16 | 株式会社デンソー | 車両電子装置 |
US9575560B2 (en) | 2014-06-03 | 2017-02-21 | Google Inc. | Radar-based gesture-recognition through a wearable device |
US9921660B2 (en) | 2014-08-07 | 2018-03-20 | Google Llc | Radar-based gesture recognition |
US9811164B2 (en) | 2014-08-07 | 2017-11-07 | Google Inc. | Radar-based gesture sensing and data transmission |
US10268321B2 (en) | 2014-08-15 | 2019-04-23 | Google Llc | Interactive textiles within hard objects |
US9588625B2 (en) | 2014-08-15 | 2017-03-07 | Google Inc. | Interactive textiles |
US9778749B2 (en) | 2014-08-22 | 2017-10-03 | Google Inc. | Occluded gesture recognition |
US11169988B2 (en) | 2014-08-22 | 2021-11-09 | Google Llc | Radar recognition-aided search |
US9600080B2 (en) | 2014-10-02 | 2017-03-21 | Google Inc. | Non-line-of-sight radar-based gesture recognition |
US10016162B1 (en) | 2015-03-23 | 2018-07-10 | Google Llc | In-ear health monitoring |
US9983747B2 (en) | 2015-03-26 | 2018-05-29 | Google Llc | Two-layer interactive textiles |
KR102002112B1 (ko) | 2015-04-30 | 2019-07-19 | 구글 엘엘씨 | 제스처 추적 및 인식을 위한 rf―기반 마이크로―모션 추적 |
KR102327044B1 (ko) | 2015-04-30 | 2021-11-15 | 구글 엘엘씨 | 타입-애그노스틱 rf 신호 표현들 |
WO2016176574A1 (en) | 2015-04-30 | 2016-11-03 | Google Inc. | Wide-field radar-based gesture recognition |
US9693592B2 (en) | 2015-05-27 | 2017-07-04 | Google Inc. | Attaching electronic components to interactive textiles |
US10088908B1 (en) | 2015-05-27 | 2018-10-02 | Google Llc | Gesture detection and interactions |
US10817065B1 (en) | 2015-10-06 | 2020-10-27 | Google Llc | Gesture recognition using multiple antenna |
WO2017079484A1 (en) * | 2015-11-04 | 2017-05-11 | Google Inc. | Connectors for connecting electronics embedded in garments to external devices |
US10492302B2 (en) | 2016-05-03 | 2019-11-26 | Google Llc | Connecting an electronic component to an interactive textile |
US10175781B2 (en) | 2016-05-16 | 2019-01-08 | Google Llc | Interactive object with multiple electronics modules |
US10579150B2 (en) | 2016-12-05 | 2020-03-03 | Google Llc | Concurrent detection of absolute distance and relative movement for sensing action gestures |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4602051A (en) * | 1983-09-07 | 1986-07-22 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition having electromagnetic wave shielding effort |
US4657325A (en) * | 1986-02-27 | 1987-04-14 | Amp Incorporated | Electrical connector |
US4851614A (en) * | 1987-05-22 | 1989-07-25 | Compaq Computer Corporation | Non-occluding mounting hole with solder pad for printed circuit boards |
DE69329501T2 (de) * | 1992-07-17 | 2001-05-03 | Vlt Corp., San Antonio | Verpackung für elektronische Komponenten |
JPH06240049A (ja) | 1993-02-22 | 1994-08-30 | Mitsubishi Gas Chem Co Inc | 炭素繊維強化熱可塑性樹脂組成物 |
US5369494A (en) * | 1993-04-12 | 1994-11-29 | X-Rite, Incorporated | Portable scanning colorimeter |
US5805402A (en) * | 1993-06-09 | 1998-09-08 | Ut Automotive Dearborn, Inc. | Integrated interior trim and electrical assembly for an automotive vehicle |
JP3528255B2 (ja) | 1994-08-16 | 2004-05-17 | Necトーキン株式会社 | 混成集積回路素子及びその製造方法 |
US5414223A (en) * | 1994-08-10 | 1995-05-09 | Ast Research, Inc. | Solder pad for printed circuit boards |
US5644103A (en) * | 1994-11-10 | 1997-07-01 | Vlt Corporation | Packaging electrical components having a scallop formed in an edge of a circuit board |
JPH10120798A (ja) * | 1996-10-18 | 1998-05-12 | Kobe Steel Ltd | 電子機器用導電性ケーシング |
US5833903A (en) * | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
DE69716483T2 (de) * | 1997-03-12 | 2003-06-26 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno, Delft | Verfahren zur herstellung einer bipolaren platte |
JPH10256772A (ja) | 1997-03-14 | 1998-09-25 | Daido Steel Co Ltd | 電磁波シールド用シートおよびそれを用いた電磁波シールド方法 |
US6282352B1 (en) * | 1997-04-08 | 2001-08-28 | Hitachi, Ltd. | Optical module, method for manufacturing optical module and optical communication apparatus |
US6028775A (en) * | 1997-12-12 | 2000-02-22 | Nortel Networks Corporation | Assemblies of electronic devices and flexible containers thereof |
US6090728A (en) * | 1998-05-01 | 2000-07-18 | 3M Innovative Properties Company | EMI shielding enclosures |
JP2000207060A (ja) | 1999-01-20 | 2000-07-28 | Toshiba Corp | 電子機器 |
EP2161735A3 (en) * | 1999-03-05 | 2010-12-08 | Canon Kabushiki Kaisha | Image formation apparatus |
US6230610B1 (en) * | 1999-06-11 | 2001-05-15 | Utex Industries, Inc. | Pump liner |
US6195267B1 (en) * | 1999-06-23 | 2001-02-27 | Ericsson Inc. | Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
US6440593B2 (en) * | 2000-02-16 | 2002-08-27 | The University Of Massachusetts | Molded article |
JP2001225371A (ja) | 2000-02-18 | 2001-08-21 | Ono Sangyo Kk | 強化プラスチック成形物の塗装・印刷品及びその製造方法 |
US6410847B1 (en) * | 2000-07-25 | 2002-06-25 | Trw Inc. | Packaged electronic system having selectively plated microwave absorbing cover |
CN1338760A (zh) * | 2000-08-10 | 2002-03-06 | 陈国梁 | 介电性电磁波吸收材料及其制造方法和应用 |
JP2002118371A (ja) | 2000-10-11 | 2002-04-19 | Toray Ind Inc | 繊維強化プラスチック製成形品の締結構造 |
US6548895B1 (en) * | 2001-02-21 | 2003-04-15 | Sandia Corporation | Packaging of electro-microfluidic devices |
JP2002262438A (ja) * | 2001-03-05 | 2002-09-13 | Yazaki Corp | 補機モジュール用中継部品および補機モジュール |
JP2002298940A (ja) * | 2001-03-30 | 2002-10-11 | Jst Mfg Co Ltd | 樹脂ハンダを用いた電気接触子、電気コネクタ及びこれらのプリント配線板への接続方法 |
US6651659B2 (en) * | 2001-05-23 | 2003-11-25 | John I. Izuchukwu | Ambulatory storage system for pressurized gases |
CN1165210C (zh) * | 2001-07-19 | 2004-09-01 | 博大科技股份有限公司 | 用以阻隔电磁波的电路板封胶制程 |
ATE331759T1 (de) * | 2001-12-19 | 2006-07-15 | Du Pont | Polyamidharzzusammensetzugen zur abschirmung gegen elektromagnetische interferenzen, sowie daraus geformte gegenstände |
US6846184B2 (en) * | 2003-01-24 | 2005-01-25 | High Connection Density Inc. | Low inductance electrical contacts and LGA connector system |
-
2003
- 2003-07-30 JP JP2003283228A patent/JP2005051129A/ja active Pending
-
2004
- 2004-07-09 US US10/888,290 patent/US7310236B2/en not_active Expired - Fee Related
- 2004-07-09 KR KR1020040053573A patent/KR20050014660A/ko not_active Application Discontinuation
- 2004-07-28 EP EP04254499A patent/EP1503618A3/en not_active Withdrawn
- 2004-07-30 CN CNB2004100702123A patent/CN100342767C/zh not_active Expired - Fee Related
-
2005
- 2005-06-29 HK HK05105413A patent/HK1072678A1/xx not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006278568A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | 電磁波シールド筐体 |
JP4635679B2 (ja) * | 2005-03-28 | 2011-02-23 | パナソニック電工株式会社 | 電磁波シールド筐体の製造方法 |
WO2015004919A1 (ja) * | 2013-07-11 | 2015-01-15 | パナソニックIpマネジメント株式会社 | 電子機器、電子機器を搭載した自動車、表示装置、表示装置を搭載した移動装置 |
JP2015018936A (ja) * | 2013-07-11 | 2015-01-29 | パナソニックIpマネジメント株式会社 | 電子機器と、それを搭載した自動車 |
JP2017211641A (ja) * | 2016-05-24 | 2017-11-30 | 株式会社リコー | 電子装置および筐体構造体 |
Also Published As
Publication number | Publication date |
---|---|
KR20050014660A (ko) | 2005-02-07 |
US20050024835A1 (en) | 2005-02-03 |
EP1503618A3 (en) | 2007-08-15 |
EP1503618A2 (en) | 2005-02-02 |
US7310236B2 (en) | 2007-12-18 |
HK1072678A1 (en) | 2005-09-02 |
CN100342767C (zh) | 2007-10-10 |
CN1585597A (zh) | 2005-02-23 |
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