ATE232015T1 - Verfahren und struktur zur verbesserung der flüssigkeitsströmung für wärmetransport in elektrostatische halter - Google Patents

Verfahren und struktur zur verbesserung der flüssigkeitsströmung für wärmetransport in elektrostatische halter

Info

Publication number
ATE232015T1
ATE232015T1 AT96306457T AT96306457T ATE232015T1 AT E232015 T1 ATE232015 T1 AT E232015T1 AT 96306457 T AT96306457 T AT 96306457T AT 96306457 T AT96306457 T AT 96306457T AT E232015 T1 ATE232015 T1 AT E232015T1
Authority
AT
Austria
Prior art keywords
dielectric
conductive layer
electrostatic chuck
layer
basic structure
Prior art date
Application number
AT96306457T
Other languages
English (en)
Inventor
Rebert J Steger
Brian Lue
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE232015T1 publication Critical patent/ATE232015T1/de

Links

Classifications

    • H10P72/722—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AT96306457T 1995-09-28 1996-09-05 Verfahren und struktur zur verbesserung der flüssigkeitsströmung für wärmetransport in elektrostatische halter ATE232015T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/535,422 US5644467A (en) 1995-09-28 1995-09-28 Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck

Publications (1)

Publication Number Publication Date
ATE232015T1 true ATE232015T1 (de) 2003-02-15

Family

ID=24134142

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96306457T ATE232015T1 (de) 1995-09-28 1996-09-05 Verfahren und struktur zur verbesserung der flüssigkeitsströmung für wärmetransport in elektrostatische halter

Country Status (6)

Country Link
US (2) US5644467A (de)
EP (1) EP0766300B1 (de)
JP (1) JP4145371B2 (de)
KR (1) KR100284832B1 (de)
AT (1) ATE232015T1 (de)
DE (1) DE69625974T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5644467A (en) * 1995-09-28 1997-07-01 Applied Materials, Inc. Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck
JP4236292B2 (ja) 1997-03-06 2009-03-11 日本碍子株式会社 ウエハー吸着装置およびその製造方法
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6080272A (en) * 1998-05-08 2000-06-27 Micron Technology, Inc. Method and apparatus for plasma etching a wafer
US6639783B1 (en) 1998-09-08 2003-10-28 Applied Materials, Inc. Multi-layer ceramic electrostatic chuck with integrated channel
US6572814B2 (en) 1998-09-08 2003-06-03 Applied Materials Inc. Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
US6195246B1 (en) * 1999-03-30 2001-02-27 Electron Vision Corporation Electrostatic chuck having replaceable dielectric cover
US6373679B1 (en) 1999-07-02 2002-04-16 Cypress Semiconductor Corp. Electrostatic or mechanical chuck assembly conferring improved temperature uniformity onto workpieces held thereby, workpiece processing technology and/or apparatus containing the same, and method(s) for holding and/or processing a workpiece with the same
US6839217B1 (en) 1999-10-01 2005-01-04 Varian Semiconductor Equipment Associates, Inc. Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6581275B2 (en) 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
JP4493251B2 (ja) * 2001-12-04 2010-06-30 Ｔｏｔｏ株式会社 静電チャックモジュールおよび基板処理装置
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US7156951B1 (en) 2002-06-21 2007-01-02 Lam Research Corporation Multiple zone gas distribution apparatus for thermal control of semiconductor wafer
KR100505035B1 (ko) * 2003-11-17 2005-07-29 삼성전자주식회사 기판을 지지하기 위한 정전척
US7480974B2 (en) * 2005-02-15 2009-01-27 Lam Research Corporation Methods of making gas distribution members for plasma processing apparatuses
US20060238954A1 (en) * 2005-04-21 2006-10-26 Applied Materials, Inc., A Delaware Corporation Electrostatic chuck for track thermal plates
US7848076B2 (en) * 2007-07-31 2010-12-07 Applied Materials, Inc. Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
KR101125885B1 (ko) * 2007-07-31 2012-03-22 어플라이드 머티어리얼스, 인코포레이티드 감소된 플라즈마 침투 및 아킹을 갖는 정전척을 제공하는 방법 및 장치
US8108981B2 (en) * 2007-07-31 2012-02-07 Applied Materials, Inc. Method of making an electrostatic chuck with reduced plasma penetration and arcing
US9202736B2 (en) * 2007-07-31 2015-12-01 Applied Materials, Inc. Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing
WO2009031566A1 (ja) * 2007-09-06 2009-03-12 Creative Technology Corporation 静電チャック装置におけるガス供給構造の製造方法及び静電チャック装置ガス供給構造並びに静電チャック装置
US8336891B2 (en) * 2008-03-11 2012-12-25 Ngk Insulators, Ltd. Electrostatic chuck
US8064185B2 (en) * 2008-09-05 2011-11-22 Applied Materials, Inc. Electrostatic chuck electrical balancing circuit repair
US9218997B2 (en) * 2008-11-06 2015-12-22 Applied Materials, Inc. Electrostatic chuck having reduced arcing
US8363378B2 (en) * 2009-02-17 2013-01-29 Intevac, Inc. Method for optimized removal of wafer from electrostatic chuck
US20100326602A1 (en) * 2009-06-30 2010-12-30 Intevac, Inc. Electrostatic chuck
US20110024049A1 (en) 2009-07-30 2011-02-03 c/o Lam Research Corporation Light-up prevention in electrostatic chucks
US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US8608852B2 (en) 2010-06-11 2013-12-17 Applied Materials, Inc. Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies
US8906164B2 (en) 2010-08-05 2014-12-09 Lam Research Corporation Methods for stabilizing contact surfaces of electrostatic chucks
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
US9608550B2 (en) * 2015-05-29 2017-03-28 Lam Research Corporation Lightup prevention using multi-layer ceramic fabrication techniques
JP6509139B2 (ja) * 2016-01-29 2019-05-08 日本特殊陶業株式会社 基板支持装置及びその製造方法
JP6820451B1 (ja) 2017-11-21 2021-01-27 ワトロー エレクトリック マニュファクチュアリング カンパニー セラミックペデスタルで使用するための二重目的のビア
KR102715367B1 (ko) 2021-12-02 2024-10-08 세메스 주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
KR102893398B1 (ko) * 2023-11-28 2025-12-02 주식회사 명인이엔지 스퍼터링장치에 구비되는 플라텐 베이스 플레이트에 냉각수로를 형성하는 방법 및 구조

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3238925B2 (ja) * 1990-11-17 2001-12-17 株式会社東芝 静電チャック
EP0506537A1 (de) * 1991-03-28 1992-09-30 Shin-Etsu Chemical Co., Ltd. Elektrostatische Halteplatte
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
JPH05166757A (ja) * 1991-12-13 1993-07-02 Tokyo Electron Ltd 被処理体の温調装置
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method
US5350479A (en) * 1992-12-02 1994-09-27 Applied Materials, Inc. Electrostatic chuck for high power plasma processing
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
US5474614A (en) * 1994-06-10 1995-12-12 Texas Instruments Incorporated Method and apparatus for releasing a semiconductor wafer from an electrostatic clamp
US5515167A (en) * 1994-09-13 1996-05-07 Hughes Aircraft Company Transparent optical chuck incorporating optical monitoring
US5644467A (en) * 1995-09-28 1997-07-01 Applied Materials, Inc. Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck
US5609720A (en) * 1995-09-29 1997-03-11 Lam Research Corporation Thermal control of semiconductor wafer during reactive ion etching

Also Published As

Publication number Publication date
DE69625974D1 (de) 2003-03-06
US5644467A (en) 1997-07-01
DE69625974T2 (de) 2004-01-22
JPH09129717A (ja) 1997-05-16
JP4145371B2 (ja) 2008-09-03
KR100284832B1 (ko) 2001-04-02
EP0766300A1 (de) 1997-04-02
EP0766300B1 (de) 2003-01-29
US5715132A (en) 1998-02-03

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Legal Events

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