ATE184419T1 - Chip-induktivität anordnung - Google Patents

Chip-induktivität anordnung

Info

Publication number
ATE184419T1
ATE184419T1 AT95303410T AT95303410T ATE184419T1 AT E184419 T1 ATE184419 T1 AT E184419T1 AT 95303410 T AT95303410 T AT 95303410T AT 95303410 T AT95303410 T AT 95303410T AT E184419 T1 ATE184419 T1 AT E184419T1
Authority
AT
Austria
Prior art keywords
chip
substrate
multilayer
solder bumps
major surface
Prior art date
Application number
AT95303410T
Other languages
English (en)
Inventor
David John Pedder
Original Assignee
Mitel Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitel Semiconductor Ltd filed Critical Mitel Semiconductor Ltd
Application granted granted Critical
Publication of ATE184419T1 publication Critical patent/ATE184419T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
AT95303410T 1994-06-03 1995-05-22 Chip-induktivität anordnung ATE184419T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9411107A GB2290171B (en) 1994-06-03 1994-06-03 Inductor chip device

Publications (1)

Publication Number Publication Date
ATE184419T1 true ATE184419T1 (de) 1999-09-15

Family

ID=10756121

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95303410T ATE184419T1 (de) 1994-06-03 1995-05-22 Chip-induktivität anordnung

Country Status (6)

Country Link
EP (1) EP0685857B1 (de)
JP (1) JPH07335439A (de)
AT (1) ATE184419T1 (de)
DE (1) DE69511940T2 (de)
ES (1) ES2139841T3 (de)
GB (1) GB2290171B (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
WO1999033108A1 (en) * 1997-12-22 1999-07-01 Conexant Systems, Inc. Wireless inter-chip communication system and method
US6303423B1 (en) 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
JP2001358551A (ja) 2000-06-15 2001-12-26 Matsushita Electric Ind Co Ltd フィルタ
DE10144464C2 (de) * 2001-09-10 2003-07-17 Infineon Technologies Ag Elektronisches Bauteil mit Induktionsspule für Hochfrequenzanwendungen und Verfahren zur Herstellung desselben
FR2830683A1 (fr) * 2001-10-10 2003-04-11 St Microelectronics Sa Realisation d'inductance et de via dans un circuit monolithique
KR20030048691A (ko) * 2001-12-12 2003-06-25 삼성전자주식회사 작은 값의 적은 변화를 가지는 고주파 인덕터 및 그 제조방법
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
DE102006057332B4 (de) 2006-12-05 2018-01-25 Infineon Technologies Ag Zusammenbau aufweisend ein Substrat und einen auf dem Substrat montierten Chip
NL1036092C (nl) * 2008-10-21 2010-04-22 Tetradon B V Werkwijze en inrichting voor een modulair opgebouwde transformator.
US10665377B2 (en) 2014-05-05 2020-05-26 3D Glass Solutions, Inc. 2D and 3D inductors antenna and transformers fabricating photoactive substrates
CA3015525C (en) 2016-02-25 2022-04-26 3D Glass Solutions, Inc. 3d capacitor and capacitor array fabricating photoactive substrates
US11161773B2 (en) 2016-04-08 2021-11-02 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
WO2018159457A1 (ja) 2017-03-01 2018-09-07 株式会社村田製作所 実装用基板
KR102386799B1 (ko) 2017-07-07 2022-04-18 3디 글래스 솔루션즈 인코포레이티드 패키지 광활성 유리 기판들에서 ｒｆ 시스템을 위한 2ｄ 및 3ｄ 집중 소자 디바이스들
AU2018383659B2 (en) 2017-12-15 2021-09-23 3D Glass Solutions, Inc. Coupled transmission line resonate RF filter
JP7226832B2 (ja) 2018-01-04 2023-02-21 スリーディー グラス ソリューションズ，インク 高効率ｒｆ回路のためのインピーダンス整合伝導構造
AU2019344542B2 (en) 2018-09-17 2022-02-24 3D Glass Solutions, Inc. High efficiency compact slotted antenna with a ground plane
WO2020139955A1 (en) 2018-12-28 2020-07-02 3D Glass Solutions, Inc. Annular capacitor rf, microwave and mm wave systems
CA3107810C (en) 2018-12-28 2024-05-14 3D Glass Solutions, Inc. Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates
KR20210147040A (ko) 2019-04-05 2021-12-06 3디 글래스 솔루션즈 인코포레이티드 유리 기반의 빈 기판 집적 도파관 디바이스
KR102601781B1 (ko) 2019-04-18 2023-11-14 3디 글래스 솔루션즈 인코포레이티드 고효율 다이 다이싱 및 릴리스
US11908617B2 (en) 2020-04-17 2024-02-20 3D Glass Solutions, Inc. Broadband induction

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873127A (ja) * 1981-10-28 1983-05-02 Hitachi Ltd Ｉｃチツプのはんだ溶融接続方法
DE3502770A1 (de) * 1985-01-28 1986-07-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung einer flachspule sowie flachspule fuer ein stosswellenrohr
JPS6215850A (ja) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd マルチチツプパツケ−ジ基板
JP2615151B2 (ja) * 1988-08-19 1997-05-28 株式会社村田製作所 チップ型コイル及びその製造方法
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
DE69021438T2 (de) * 1989-05-16 1996-01-25 Marconi Gec Ltd Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.
JPH04245410A (ja) * 1991-01-30 1992-09-02 Sharp Corp 複同調回路用プリントコイル
US5349743A (en) * 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
GB2263582B (en) * 1992-01-21 1995-11-01 Dale Electronics Laser-formed electrical component and method for making same

Also Published As

Publication number Publication date
JPH07335439A (ja) 1995-12-22
GB2290171B (en) 1998-01-21
GB2290171A (en) 1995-12-13
DE69511940T2 (de) 2000-05-04
DE69511940D1 (de) 1999-10-14
EP0685857B1 (de) 1999-09-08
ES2139841T3 (es) 2000-02-16
GB9411107D0 (en) 1994-07-27
EP0685857A1 (de) 1995-12-06

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Legal Events

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