ATE113225T1 - Überwachung von bondparametern während des bondvorganges. - Google Patents

Überwachung von bondparametern während des bondvorganges.

Info

Publication number
ATE113225T1
ATE113225T1 AT88100121T AT88100121T ATE113225T1 AT E113225 T1 ATE113225 T1 AT E113225T1 AT 88100121 T AT88100121 T AT 88100121T AT 88100121 T AT88100121 T AT 88100121T AT E113225 T1 ATE113225 T1 AT E113225T1
Authority
AT
Austria
Prior art keywords
bonding
monitoring
parameters during
measured
machines
Prior art date
Application number
AT88100121T
Other languages
German (de)
English (en)
Inventor
Raben Klaus-Ulrich V Ph D
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6319221&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE113225(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of ATE113225T1 publication Critical patent/ATE113225T1/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/922—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9221—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power
    • B29C66/92211—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power with special measurement means or methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
    • B29C66/9515—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools by measuring their vibration amplitude
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
    • B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
    • H—ELECTRICITY
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    • B29C66/944—Measuring or controlling the joining process by measuring or controlling the time by controlling or regulating the time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/9513—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools characterised by specific vibration frequency values or ranges
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Die Bonding (AREA)
  • Pretreatment Of Seeds And Plants (AREA)
AT88100121T 1987-01-21 1988-01-07 Überwachung von bondparametern während des bondvorganges. ATE113225T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873701652 DE3701652A1 (de) 1987-01-21 1987-01-21 Ueberwachung von bondparametern waehrend des bondvorganges

Publications (1)

Publication Number Publication Date
ATE113225T1 true ATE113225T1 (de) 1994-11-15

Family

ID=6319221

Family Applications (1)

Application Number Title Priority Date Filing Date
AT88100121T ATE113225T1 (de) 1987-01-21 1988-01-07 Überwachung von bondparametern während des bondvorganges.

Country Status (5)

Country Link
US (1) US4854494A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0275877B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS63191927A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE113225T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (2) DE3701652A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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JPH088271B2 (ja) * 1988-11-01 1996-01-29 株式会社新川 ワイヤボンデイング装置
JP2708222B2 (ja) * 1989-03-31 1998-02-04 株式会社東芝 ボンディング装置
JPH0353137A (ja) * 1989-07-20 1991-03-07 Yakichi Higo 応力測定法
US5065933A (en) * 1990-09-19 1991-11-19 At&T Bell Laboratories Electronic device manipulating apparatus and method
ATE117611T1 (de) * 1991-02-15 1995-02-15 Esec Sa Verfahren und einrichtung zur messung der schwingungsamplitude an einem energietransducer.
JP2665080B2 (ja) * 1991-08-02 1997-10-22 山形日本電気株式会社 半導体製造装置
JPH0547860A (ja) * 1991-08-08 1993-02-26 Shinkawa Ltd ワイヤボンデイング方法
JP3128702B2 (ja) * 1991-09-11 2001-01-29 株式会社新川 ボンデイング装置のデータ設定モード変更方法及び装置
DE4131565C2 (de) * 1991-09-18 2002-04-25 Bleich Karl Heinz Verfahren zur Optimierung des Schweißprozesses bei Bondverfahren
US5201453A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Linear, direct-drive microelectronic bonding apparatus and method
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
US5186378A (en) * 1991-09-30 1993-02-16 Texas Instruments Incorporated Method and apparatus for transducer heating in low temperature bonding
DE69216761T2 (de) * 1991-10-30 1997-07-03 F & K Delvotev Bondtechgmbh Steuerungssystem
JP2981948B2 (ja) * 1992-03-12 1999-11-22 株式会社新川 ワイヤクランパ
US5170929A (en) * 1992-05-29 1992-12-15 International Business Machines Corporation Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JPH06331678A (ja) * 1993-05-13 1994-12-02 Internatl Business Mach Corp <Ibm> 電子部品のリード接続を検査する方法および装置
DE4335108C1 (de) * 1993-10-14 1995-01-05 Schunk Ultraschalltechnik Gmbh Verfahren und Vorrichtung zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern
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DE3851900D1 (de) 1994-12-01
EP0275877A2 (de) 1988-07-27
JPS63191927A (ja) 1988-08-09
DE3701652C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-06-17
JPH0552064B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-08-04
EP0275877B1 (de) 1994-10-26
US4854494A (en) 1989-08-08
EP0275877A3 (de) 1991-03-06
DE3701652A1 (de) 1988-08-04

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