ATE101414T1 - Loetverfahren. - Google Patents

Loetverfahren.

Info

Publication number
ATE101414T1
ATE101414T1 AT89312159T AT89312159T ATE101414T1 AT E101414 T1 ATE101414 T1 AT E101414T1 AT 89312159 T AT89312159 T AT 89312159T AT 89312159 T AT89312159 T AT 89312159T AT E101414 T1 ATE101414 T1 AT E101414T1
Authority
AT
Austria
Prior art keywords
soldering process
atomic hydrogen
hydrogen
abstraction
solder
Prior art date
Application number
AT89312159T
Other languages
English (en)
Inventor
Christopher John Wort
Kim Louise Pickering
David John Pedder
Original Assignee
Marconi Gec Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Gec Ltd filed Critical Marconi Gec Ltd
Application granted granted Critical
Publication of ATE101414T1 publication Critical patent/ATE101414T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Plasma Technology (AREA)
AT89312159T 1988-11-30 1989-11-22 Loetverfahren. ATE101414T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB888827933A GB8827933D0 (en) 1988-11-30 1988-11-30 Improvements relating to soldering processes
EP89312159A EP0371693B1 (de) 1988-11-30 1989-11-22 Lötverfahren

Publications (1)

Publication Number Publication Date
ATE101414T1 true ATE101414T1 (de) 1994-02-15

Family

ID=10647701

Family Applications (1)

Application Number Title Priority Date Filing Date
AT89312159T ATE101414T1 (de) 1988-11-30 1989-11-22 Loetverfahren.

Country Status (6)

Country Link
US (1) US5000819A (de)
EP (1) EP0371693B1 (de)
JP (1) JPH02190489A (de)
AT (1) ATE101414T1 (de)
DE (1) DE68913013D1 (de)
GB (2) GB8827933D0 (de)

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US6742701B2 (en) * 1998-09-17 2004-06-01 Kabushiki Kaisha Tamura Seisakusho Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
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Also Published As

Publication number Publication date
GB8827933D0 (en) 1989-01-05
DE68913013D1 (de) 1994-03-24
US5000819A (en) 1991-03-19
EP0371693B1 (de) 1994-02-09
GB8928259D0 (en) 1990-02-21
JPH02190489A (ja) 1990-07-26
EP0371693A1 (de) 1990-06-06

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties