ES2084400T3 - Procedimiento para soldar con estaño placas de circuitos impresos. - Google Patents
Procedimiento para soldar con estaño placas de circuitos impresos.Info
- Publication number
- ES2084400T3 ES2084400T3 ES93101734T ES93101734T ES2084400T3 ES 2084400 T3 ES2084400 T3 ES 2084400T3 ES 93101734 T ES93101734 T ES 93101734T ES 93101734 T ES93101734 T ES 93101734T ES 2084400 T3 ES2084400 T3 ES 2084400T3
- Authority
- ES
- Spain
- Prior art keywords
- printed circuit
- circuit boards
- soldering
- procedure
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
LA INVENCION SE REFIERE A UN PROCESO PARA SOLDADURA CON ESTAÑO DE PLACAS DE CIRCUITO IMPRESO EQUIPADAS EN DONDE SE REALIZA UNA PRIMERA ETAPA DE PURIFICACION PREVIA. LAS PLACAS DE CIRCUITO IMPRESO SON MANEJADAS CON UN PLASMA GENERADO A PARTIR DE UN GAS DE PROCESO. COMO GAS DE PROCESO, QUE HACE SUPERFLUO LA UTILIZACION DE FUNDENTE EN LA ETAPA DE SOLDADURA CENTRAL Y CON ELLO LA REALIZACION DE UNA ETAPA DE PURIFICACION DISPUESTA A CONTINUACION, SE PROPONE UNA MEZCLA DE GAS COMPUESTA DE 0,5 HASTA 10 % EN VOLUMEN DE OXIGENO 20 HASTA 80 % EN VOLUMEN DE HIDROGENO 80 HASTA 20 % EN VOLUMEN DE CF4.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4206103A DE4206103A1 (de) | 1992-02-27 | 1992-02-27 | Verfahren zum verloeten von leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2084400T3 true ES2084400T3 (es) | 1996-05-01 |
Family
ID=6452763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES93101734T Expired - Lifetime ES2084400T3 (es) | 1992-02-27 | 1993-02-04 | Procedimiento para soldar con estaño placas de circuitos impresos. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0557756B1 (es) |
AT (1) | ATE132065T1 (es) |
DE (2) | DE4206103A1 (es) |
ES (1) | ES2084400T3 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4228551C2 (de) * | 1992-08-27 | 1996-02-22 | Linde Ag | Verfahren und Anwendung des Verfahrens zur reinigenden Behandlung von Oberflächen mit einem Niederdruckplasma |
JP3206142B2 (ja) * | 1992-10-15 | 2001-09-04 | 松下電器産業株式会社 | ワイヤボンディング装置及びワイヤボンディング方法 |
GB2274286B (en) * | 1993-01-13 | 1996-11-06 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Method of and apparatus for preparing an electric circuit board for a flow or wave soldering process |
JP3365511B2 (ja) * | 1993-04-05 | 2003-01-14 | セイコーエプソン株式会社 | ろう材による接合方法及び装置 |
DE4338225A1 (de) * | 1993-11-09 | 1995-05-11 | Linde Ag | Verfahren zum Wellenlöten mit bleifreien Lotmaterialien |
FR2735054B1 (fr) * | 1995-06-09 | 1997-07-25 | Air Liquide | Procede de fluxage par voie seche de surfaces metalliques avant brasage ou etamage utilisant une atmosphere comportant de la vapeur d'eau |
DE19521750A1 (de) * | 1995-06-14 | 1996-12-19 | Smt Maschinengesellschaft Mbh | Verfahren zur Oberflächenbehandlung oxidierbarer Metalle |
DE19545676A1 (de) * | 1995-12-07 | 1997-06-12 | Wack O K Chemie Gmbh | Verfahren zum Aktivieren von Leiterplatinen |
US5941448A (en) * | 1996-06-07 | 1999-08-24 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor |
US6468833B2 (en) * | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
WO2002028586A1 (de) * | 2000-10-06 | 2002-04-11 | Pac Tech - Packaging Technologies Gmbh | Verfahren zum flussmittelfreien aufbringen eines lötmittels auf ein substrat oder einen chip |
DE10210216A1 (de) * | 2002-03-08 | 2003-10-16 | Behr Gmbh & Co | Verfahren zum Löten von Aluminium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5751265A (en) * | 1980-09-10 | 1982-03-26 | Hitachi Ltd | Microwave plasma etching device |
US4699689A (en) * | 1985-05-17 | 1987-10-13 | Emergent Technologies Corporation | Method and apparatus for dry processing of substrates |
GB8827933D0 (en) * | 1988-11-30 | 1989-01-05 | Plessey Co Plc | Improvements relating to soldering processes |
DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
-
1992
- 1992-02-27 DE DE4206103A patent/DE4206103A1/de not_active Withdrawn
-
1993
- 1993-02-04 DE DE59301226T patent/DE59301226D1/de not_active Expired - Fee Related
- 1993-02-04 EP EP93101734A patent/EP0557756B1/de not_active Expired - Lifetime
- 1993-02-04 AT AT93101734T patent/ATE132065T1/de not_active IP Right Cessation
- 1993-02-04 ES ES93101734T patent/ES2084400T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0557756A1 (de) | 1993-09-01 |
ATE132065T1 (de) | 1996-01-15 |
DE4206103A1 (de) | 1993-09-02 |
DE59301226D1 (de) | 1996-02-08 |
EP0557756B1 (de) | 1995-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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