JPS6481393A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6481393A
JPS6481393A JP23959787A JP23959787A JPS6481393A JP S6481393 A JPS6481393 A JP S6481393A JP 23959787 A JP23959787 A JP 23959787A JP 23959787 A JP23959787 A JP 23959787A JP S6481393 A JPS6481393 A JP S6481393A
Authority
JP
Japan
Prior art keywords
residue
hole
improper
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23959787A
Other languages
Japanese (ja)
Inventor
Akira Maniwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23959787A priority Critical patent/JPS6481393A/en
Publication of JPS6481393A publication Critical patent/JPS6481393A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To prevent improper solder wettability, solder rise, corrosion of copper plating, or improper blow-hole by providing the step of removing a residue adhered to a printed wiring board by a plasma in a finishing step. CONSTITUTION:After a circuit is formed, it is covered with a photosolder resist film 3, fine residue 5 of the film 3 is presented on a conductor circuit 2 of both-side printed wiring board before finishing, and residue 6 of water content is presented in a through hole having 0.3mm of diameter. Such a board is set in a vacuum chamber, the chamber is evacuated in vacuum to 750mbarr or more, maintained under the pressure of 200mTorr with mixture gas of oxygen: fluorocarbon =3:1, high frequency power of 2.5kHz is applied to generate a plasma 7, treated in this state for 20 min, thereby removing the residue 5 on the circuit 2 and the residue 6 in the hole 4. Thus, it can solve improper solder wettability, solder rise, corrosion of Cu, and/or improper blow-hole.
JP23959787A 1987-09-24 1987-09-24 Manufacture of printed wiring board Pending JPS6481393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23959787A JPS6481393A (en) 1987-09-24 1987-09-24 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23959787A JPS6481393A (en) 1987-09-24 1987-09-24 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6481393A true JPS6481393A (en) 1989-03-27

Family

ID=17047130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23959787A Pending JPS6481393A (en) 1987-09-24 1987-09-24 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6481393A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045117A (en) * 1990-09-18 1991-09-03 Rockwell International Corporation System for removing flux residues from printed wiring assemblies
CN102673116A (en) * 2012-05-24 2012-09-19 中国科学院苏州纳米技术与纳米仿生研究所 Method for eliminating satellite points of printed device
CN108811357A (en) * 2018-07-04 2018-11-13 肇庆市创业帮信息技术有限公司 A kind of PCB moves back film alkali cleaning equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045117A (en) * 1990-09-18 1991-09-03 Rockwell International Corporation System for removing flux residues from printed wiring assemblies
CN102673116A (en) * 2012-05-24 2012-09-19 中国科学院苏州纳米技术与纳米仿生研究所 Method for eliminating satellite points of printed device
CN108811357A (en) * 2018-07-04 2018-11-13 肇庆市创业帮信息技术有限公司 A kind of PCB moves back film alkali cleaning equipment

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