AT410497B - Ofenbeheizter kristallresonator und oszillatoranordnung - Google Patents

Ofenbeheizter kristallresonator und oszillatoranordnung Download PDF

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Publication number
AT410497B
AT410497B AT0903699A AT903699A AT410497B AT 410497 B AT410497 B AT 410497B AT 0903699 A AT0903699 A AT 0903699A AT 903699 A AT903699 A AT 903699A AT 410497 B AT410497 B AT 410497B
Authority
AT
Austria
Prior art keywords
substrate
crystal resonator
oven
base
resonator
Prior art date
Application number
AT0903699A
Other languages
German (de)
English (en)
Other versions
ATA903699A (de
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Publication of ATA903699A publication Critical patent/ATA903699A/de
Application granted granted Critical
Publication of AT410497B publication Critical patent/AT410497B/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT0903699A 1998-06-11 1999-06-01 Ofenbeheizter kristallresonator und oszillatoranordnung AT410497B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/096,026 US5917272A (en) 1998-06-11 1998-06-11 Oven-heated crystal resonator and oscillator assembly
PCT/US1999/012101 WO1999065087A1 (en) 1998-06-11 1999-06-01 Oven-heated crystal resonator and oscillator assembly

Publications (2)

Publication Number Publication Date
ATA903699A ATA903699A (de) 2002-09-15
AT410497B true AT410497B (de) 2003-05-26

Family

ID=22254774

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0903699A AT410497B (de) 1998-06-11 1999-06-01 Ofenbeheizter kristallresonator und oszillatoranordnung

Country Status (10)

Country Link
US (1) US5917272A (en:Method)
JP (1) JP3284469B2 (en:Method)
AT (1) AT410497B (en:Method)
AU (1) AU4324699A (en:Method)
CH (1) CH691247A5 (en:Method)
DE (1) DE19983298B4 (en:Method)
GB (1) GB2353634B (en:Method)
IL (1) IL139837A (en:Method)
SE (1) SE521729C2 (en:Method)
WO (1) WO1999065087A1 (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008839B2 (en) 2007-06-27 2011-08-30 Fluke Corporation System and method of providing a thermally stabilized fixed frequency piezoelectric optical modulator

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US6236145B1 (en) * 2000-02-29 2001-05-22 Cts Corporation High thermal resistivity crystal resonator support structure and oscillator package
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US6731180B1 (en) 2000-10-20 2004-05-04 Deleware Capital Formation Inc. Evacuated hybrid ovenized oscillator
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US6486440B1 (en) * 2001-07-09 2002-11-26 Jds Uniphase Corporation Redundant package for optical components
US6664511B2 (en) 2001-07-09 2003-12-16 Jds Uniphase Corporation Package for optical components
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
US6559728B1 (en) 2001-12-19 2003-05-06 Cts Corporation Miniature ovenized crystal oscillator
US6784756B2 (en) * 2001-12-21 2004-08-31 Corning Incorporated On-board processor compensated oven controlled crystal oscillator
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JP2003287631A (ja) * 2002-01-24 2003-10-10 Ibiden Co Ltd 導波路型光モジュールおよびその温調部品ならびに温調素子
US6697553B2 (en) 2002-02-15 2004-02-24 Jds Uniphase Corporation Compact, low insertion loss, high yield arrayed waveguide grating
WO2004004117A2 (en) * 2002-06-28 2004-01-08 Vectron International Low profile temperature-compensated low-stress crystal mount structure
US7116182B2 (en) * 2003-06-03 2006-10-03 Halliburton Energy Services, Inc. Method and system for downhole clock having compensation
EP1665374A4 (en) * 2003-08-19 2010-03-03 Capital Formation Inc CAVITY HOUSING / MULTIPLE COMPARTMENTS
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US7113051B2 (en) * 2004-01-07 2006-09-26 Schlumberger Technology Corporation Frequency characterization of quartz crystals
JP4499478B2 (ja) * 2004-05-27 2010-07-07 日本電波工業株式会社 表面実装用の水晶振動子を用いた恒温型の水晶発振器
US7345552B2 (en) 2004-05-19 2008-03-18 Nihon Dempa Kogyo Co., Ltd. Constant temperature type crystal oscillator
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JP4354347B2 (ja) 2004-06-29 2009-10-28 日本電波工業株式会社 水晶発振器
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US20060022556A1 (en) * 2004-07-29 2006-02-02 Bail David L Quartz resonator package having a housing with thermally coupled internal heating element
JP2006093893A (ja) 2004-09-21 2006-04-06 Nippon Dempa Kogyo Co Ltd 水晶発振器及び水晶発振器に於ける保温方法
EP1883956A4 (en) * 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
US7612635B2 (en) * 2005-08-03 2009-11-03 Kolo Technologies, Inc. MEMS acoustic filter and fabrication of the same
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US7649426B2 (en) * 2006-09-12 2010-01-19 Cts Corporation Apparatus and method for temperature compensation of crystal oscillators
WO2008112265A1 (en) * 2007-03-13 2008-09-18 Cts Corporation Apparatus and method for temperature compensating an ovenized oscillator
US8049326B2 (en) 2007-06-07 2011-11-01 The Regents Of The University Of Michigan Environment-resistant module, micropackage and methods of manufacturing same
US10266392B2 (en) 2007-06-07 2019-04-23 E-Pack, Inc. Environment-resistant module, micropackage and methods of manufacturing same
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US8035454B2 (en) * 2009-03-09 2011-10-11 Micro Crystal Ag Oscillator device comprising a thermally-controlled piezoelectric resonator
ATE534191T1 (de) 2009-03-09 2011-12-15 Micro Crystal Ag Oszillatorvorrichtung, die einen wärmegesteuerten piezoeletrischen quarz umfasst
JP5387842B2 (ja) * 2009-05-14 2014-01-15 セイコーエプソン株式会社 圧電デバイス
KR101655302B1 (ko) * 2009-09-22 2016-09-07 삼성전자주식회사 표면 탄성파 센서 시스템
JP5020340B2 (ja) * 2010-02-05 2012-09-05 日本電波工業株式会社 表面実装用とした恒温型の水晶発振器
US9431375B2 (en) * 2011-04-01 2016-08-30 Schlumberger Technology Corporation High density microelectronics packaging
CN104040725B (zh) 2011-08-17 2017-08-22 公共服务解决方案公司 用于成像系统的无源检测器
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
EP2568496A3 (en) * 2011-09-09 2017-12-06 Assa Abloy Ab Method and apparatus for maintaining operational temperature of an integrated circuit
ITTO20111100A1 (it) * 2011-11-30 2013-05-31 St Microelectronics Srl Dispositivo oscillatore e procedimento di fabbricazione dello stesso
US9608592B2 (en) 2014-01-21 2017-03-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic wave resonator (FBAR) having stress-relief
US9667218B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising feedback circuit
US9667220B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising heater and sense resistors
US9154103B2 (en) 2012-01-30 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator
JP6118091B2 (ja) * 2012-12-10 2017-04-19 日本電波工業株式会社 発振装置
JP2014197730A (ja) 2013-03-29 2014-10-16 セイコーエプソン株式会社 振動デバイス、電子機器、移動体
JP6191220B2 (ja) * 2013-04-25 2017-09-06 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP2015033065A (ja) * 2013-08-06 2015-02-16 日本電波工業株式会社 水晶振動子及び水晶発振器
JP6349722B2 (ja) * 2013-12-25 2018-07-04 セイコーエプソン株式会社 振動デバイス、電子機器、および移動体
JP6376330B2 (ja) * 2014-03-25 2018-08-22 セイコーエプソン株式会社 電子部品、電子機器および移動体
JP6442899B2 (ja) 2014-07-30 2018-12-26 セイコーエプソン株式会社 振動デバイス、電子機器、および移動体
US10732652B2 (en) * 2015-10-26 2020-08-04 Micro Inertial Llc System and method for ovenized device temperature control
US10185335B2 (en) 2015-10-27 2019-01-22 Eviga Systems, Inc. System and method for ovenized device temperature control
US20180131324A1 (en) * 2016-08-15 2018-05-10 Bliley Technologies, Inc. High-Efficiency Ovenized Oscillator
CN109827570B (zh) * 2019-02-22 2021-08-31 上海戴世智能科技有限公司 惯性测量模块
US11588470B2 (en) * 2020-02-18 2023-02-21 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same

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Publication number Priority date Publication date Assignee Title
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US4259606A (en) * 1979-05-25 1981-03-31 The United States Of America As Represented By The Secretary Of The Army Fast warm-up oven controlled piezoelectric oscillator
US4334168A (en) * 1979-07-18 1982-06-08 Etat Francais High frequency, thermostatically self controlled oscillator
US4627533A (en) * 1984-10-29 1986-12-09 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
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US5438219A (en) * 1993-11-30 1995-08-01 Motorola, Inc. Double-sided oscillator package and method of coupling components thereto
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US4259606A (en) * 1979-05-25 1981-03-31 The United States Of America As Represented By The Secretary Of The Army Fast warm-up oven controlled piezoelectric oscillator
US4334168A (en) * 1979-07-18 1982-06-08 Etat Francais High frequency, thermostatically self controlled oscillator
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008839B2 (en) 2007-06-27 2011-08-30 Fluke Corporation System and method of providing a thermally stabilized fixed frequency piezoelectric optical modulator

Also Published As

Publication number Publication date
IL139837A0 (en) 2002-02-10
US5917272A (en) 1999-06-29
JP3284469B2 (ja) 2002-05-20
GB2353634B (en) 2002-08-28
AU4324699A (en) 1999-12-30
DE19983298T1 (de) 2001-08-30
SE0004487L (en:Method) 2001-02-08
IL139837A (en) 2004-02-19
GB2353634A8 (en) 2001-06-04
ATA903699A (de) 2002-09-15
CH691247A5 (it) 2001-05-31
WO1999065087A1 (en) 1999-12-16
JP2001500715A (ja) 2001-01-16
SE0004487D0 (sv) 2000-12-06
DE19983298B4 (de) 2007-12-13
GB2353634A (en) 2001-02-28
SE521729C2 (sv) 2003-12-02
GB0029527D0 (en) 2001-01-17

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