ATA903699A - Ofenbeheizter kristallresonator und oszillatoranordnung - Google Patents

Ofenbeheizter kristallresonator und oszillatoranordnung

Info

Publication number
ATA903699A
ATA903699A AT0903699A AT903699A ATA903699A AT A903699 A ATA903699 A AT A903699A AT 0903699 A AT0903699 A AT 0903699A AT 903699 A AT903699 A AT 903699A AT A903699 A ATA903699 A AT A903699A
Authority
AT
Austria
Prior art keywords
crystal resonator
oven heated
oscillator arrangement
heated crystal
oscillator
Prior art date
Application number
AT0903699A
Other languages
English (en)
Other versions
AT410497B (de
Original Assignee
Capital Formation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capital Formation Inc filed Critical Capital Formation Inc
Publication of ATA903699A publication Critical patent/ATA903699A/de
Application granted granted Critical
Publication of AT410497B publication Critical patent/AT410497B/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/08—Holders with means for regulating temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT0903699A 1998-06-11 1999-06-01 Ofenbeheizter kristallresonator und oszillatoranordnung AT410497B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/096,026 US5917272A (en) 1998-06-11 1998-06-11 Oven-heated crystal resonator and oscillator assembly
PCT/US1999/012101 WO1999065087A1 (en) 1998-06-11 1999-06-01 Oven-heated crystal resonator and oscillator assembly

Publications (2)

Publication Number Publication Date
ATA903699A true ATA903699A (de) 2002-09-15
AT410497B AT410497B (de) 2003-05-26

Family

ID=22254774

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0903699A AT410497B (de) 1998-06-11 1999-06-01 Ofenbeheizter kristallresonator und oszillatoranordnung

Country Status (10)

Country Link
US (1) US5917272A (de)
JP (1) JP3284469B2 (de)
AT (1) AT410497B (de)
AU (1) AU4324699A (de)
CH (1) CH691247A5 (de)
DE (1) DE19983298B4 (de)
GB (1) GB2353634B (de)
IL (1) IL139837A (de)
SE (1) SE521729C2 (de)
WO (1) WO1999065087A1 (de)

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US6621361B1 (en) * 2000-10-17 2003-09-16 Cts Corporation Dual oven oscillator using a thermoelectric module
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US20040000844A1 (en) * 2002-06-28 2004-01-01 Morley Peter E. Low profile temperature-compensated low-stress crystal mount structure
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US20080224786A1 (en) * 2007-03-13 2008-09-18 Stolpman James L Apparatus and method for temperature compensating an ovenized oscillator
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US8049326B2 (en) 2007-06-07 2011-11-01 The Regents Of The University Of Michigan Environment-resistant module, micropackage and methods of manufacturing same
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JP5387842B2 (ja) * 2009-05-14 2014-01-15 セイコーエプソン株式会社 圧電デバイス
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CN104040725B (zh) 2011-08-17 2017-08-22 公共服务解决方案公司 用于成像系统的无源检测器
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
EP2568496A3 (de) * 2011-09-09 2017-12-06 Assa Abloy Ab Verfahren und Vorrichtung zur Aufrechterhaltung der Betriebstemperatur einer integrierten Schaltung
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US9667218B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising feedback circuit
US9154103B2 (en) 2012-01-30 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator
US9667220B2 (en) 2012-01-30 2017-05-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Temperature controlled acoustic resonator comprising heater and sense resistors
US9608592B2 (en) 2014-01-21 2017-03-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic wave resonator (FBAR) having stress-relief
JP6118091B2 (ja) * 2012-12-10 2017-04-19 日本電波工業株式会社 発振装置
JP2014197730A (ja) 2013-03-29 2014-10-16 セイコーエプソン株式会社 振動デバイス、電子機器、移動体
JP6191220B2 (ja) * 2013-04-25 2017-09-06 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP2015033065A (ja) * 2013-08-06 2015-02-16 日本電波工業株式会社 水晶振動子及び水晶発振器
JP6349722B2 (ja) * 2013-12-25 2018-07-04 セイコーエプソン株式会社 振動デバイス、電子機器、および移動体
JP6376330B2 (ja) * 2014-03-25 2018-08-22 セイコーエプソン株式会社 電子部品、電子機器および移動体
JP6442899B2 (ja) 2014-07-30 2018-12-26 セイコーエプソン株式会社 振動デバイス、電子機器、および移動体
US10185335B2 (en) 2015-10-27 2019-01-22 Eviga Systems, Inc. System and method for ovenized device temperature control
US10732652B2 (en) * 2015-10-26 2020-08-04 Micro Inertial Llc System and method for ovenized device temperature control
US20180131324A1 (en) * 2016-08-15 2018-05-10 Bliley Technologies, Inc. High-Efficiency Ovenized Oscillator
CN109827570B (zh) * 2019-02-22 2021-08-31 上海戴世智能科技有限公司 惯性测量模块
US11588470B2 (en) * 2020-02-18 2023-02-21 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method of manufacturing the same

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Also Published As

Publication number Publication date
WO1999065087A1 (en) 1999-12-16
SE521729C2 (sv) 2003-12-02
SE0004487D0 (sv) 2000-12-06
CH691247A5 (it) 2001-05-31
IL139837A0 (en) 2002-02-10
AT410497B (de) 2003-05-26
GB2353634A8 (en) 2001-06-04
DE19983298T1 (de) 2001-08-30
JP3284469B2 (ja) 2002-05-20
JP2001500715A (ja) 2001-01-16
IL139837A (en) 2004-02-19
SE0004487L (de) 2001-02-08
GB0029527D0 (en) 2001-01-17
AU4324699A (en) 1999-12-30
DE19983298B4 (de) 2007-12-13
US5917272A (en) 1999-06-29
GB2353634B (en) 2002-08-28
GB2353634A (en) 2001-02-28

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