TW201739524A - Wafer adhesive residue cleaning method and device capable of cleaning adhesive residue on individual die - Google Patents

Abstract

The present invention provides a wafer adhesive residue cleaning method and device, which comprises: a machine platform configured with a transfer section; a gantry rail rack separating a first working area and a second working area for the machine platform; an inspection mechanism disposed on one side of the gantry rail rack; a pick-and-place mechanism disposed in the first working area of the machine platform and including two clamping bases disposed with an interval; a carrier, which may be driven to move between the first working area and the second working area for carrying the workpiece to be processed from the pick-and-place mechanism or delivering the workpiece to be processed to the pick-and-place mechanism; and a wiping mechanism disposed on the other side of the gantry rail rack and configured with a pressing base rack and a wiping material member; in which, the pressing base rack is configured with a first pressing member and the wiping material member is provided with a wiping material to be wound thereon, and the first pressing member may be driven for pressing the wiping material on the workpiece to be processed on the carrier for adhesive residue cleaning.

Description

Wafer residual glue cleaning method and device

The invention relates to a cleaning method and device, in particular to a method and a device for cleaning a residual adhesive of a wafer for removing residual glue on a wafer.

According to the general wafer processing process, the adhesive is often sprayed or spotted on the die or its periphery. These adhesives usually remain on the die after the process is completed, and some must be removed or the next process will be affected. The adhesive is difficult to completely remove whether it is cleaned with any solvent. In the prior art, the entire wafer is wiped to clean the surface of the wafer. The glue is removed.

The prior art method of wiping the entire wafer can only be applied to the condition that the wafer surface has a large residual residue, and is only applicable to the 2D wafer; since the current wafer process has been developed to the 3D process, it is often in the crystal After the circle has finished cutting the grains, it is still necessary to apply the glue between the grains. Therefore, many times the residual glue will not occur in a large piece, but only will remain in some individual grains, and then the whole crystal will be used. Round cleaning is difficult to effectively clean individual dies.

Accordingly, it is an object of the present invention to provide a wafer residual cleaning method that can perform residue cleaning for individual dies.

Another object of the present invention is to provide a wafer residual cleaning device that can perform residue cleaning for individual dies.

It is still another object of the present invention to provide an apparatus using the wafer residual glue cleaning method.

The method for cleaning a residual adhesive of a wafer according to the object of the present invention comprises: performing a residue inspection step on a wafer on which a workpiece to be applied is subjected to a detection mechanism on a wafer by a detection mechanism. The die is inspected for the residual rubber condition; a die wiping step causes a wiping mechanism to wipe the individual die from which the residual glue is detected by the wiper.

A wafer residual glue cleaning device according to another object of the present invention comprises: a machine table having a machine table, a transfer section on the machine table; and a gantry rail frame separating the machine table into a first work And a second working area; a detecting mechanism is disposed on a side of the gantry rail facing the first working area, and inspects a workpiece to be applied in the first working area; a pick-and-place mechanism is set in the machine The first working area of the station comprises two clamping seats arranged at intervals; a loading platform is arranged on the machine table, the second working area can be driven to be displaced in the first working area, the second working area, and the self-picking mechanism Receiving a workpiece or delivering a workpiece to be delivered to the pick-and-place mechanism; a wiping mechanism disposed on a side of the gantry rail facing the second working area, provided with a pressing frame and a wiper assembly; The seat frame is provided with a first pressing component, the wiping material assembly is provided with a wiping material wound thereon; the first pressing component can be driven to press against the wiping material to perform residual glue cleaning on the workpiece to be applied on the loading platform.

A wafer residual glue cleaning device according to still another object of the present invention includes: a device using the wafer residual glue cleaning method.

The method and device for cleaning the residual adhesive of the wafer in the embodiment of the present invention can be separately cleaned for the die to be detected with the residual glue, in addition to the better cleaning effect, The cleaning of the residual glue on the whole wafer can be performed efficiently; and the workpiece to be applied has been heated by the heating element on the stage, so that the residual glue is subjected to warm heating, and the whole piece is to be applied as a workpiece for the first time. In the case of a pyrolysis process, the wiping mechanism H is further executed by a first pressing assembly having a heat source, and a second pyrolysis process for the individual crystal grains from top to bottom, and the residual glue on the die that has been rubbed has been Melt into a liquid diluted form, and then wiped by a second pressure-free component without heat source, the residual glue can be cleaned more easily, and the linear laser beam projected by the line laser height detector is used to check the rubbing effect. The cleaning of the die is completed without any omission; and the wiper assembly of the wiping mechanism releases the wipe to the hollow reel of the reeling zone by the reel in the release zone, so that the wipe can be self-interrupted The roller on the cleaning liquid container is stained with cleaning liquid and is counterweighted. The wheel counterweight wheel adjusts the tightness of the brush to be pulled in the entire flow path, so that the cleaning operation of the glue can be automatically performed in an uninterrupted manner, so that the cleaning performance is greatly improved; and the second rail seat is pressed against the module. The elastic members on the upper and lower sides have an elastic buffer when the Z-axis is displaced up and down, so that the first pressing member or the second pressing member on the pressing module is pressed against the surface of the die, except The pressure of the lower pressure is buffered by the measurement of the weight measuring component on the stage, and the pressure of the pressing pressure itself is reduced, which can reduce the damage of the crystal to be applied to the workpiece.

Referring to FIG. 1 and FIG. 2, the embodiment of the present invention can be illustrated by the wafer residual glue cleaning device, including: a machine table A having a machine table A1, and a machine table A1 on both sides of the machine A side. Each of the protrusions is formed with a height corresponding to the pedestal A2, so that a recessed transfer section A3 is formed between the two pedestals A2, and the upper surface A21 of the two pedestals A2 is formed with the other end table A1 of the machine A without the pedestal A2. a height drop; a gantry rail B, with two columns B1 spanning the two seats A2 of the machine A, a beam B2 is arranged between the two columns B1, the gantry rail B separates and plans the machine A The first working area A4 of the other machine table A1 of the machine A not provided with the pedestal A2, and the second working area A5 of the second pedestal A2 side, wherein the first working area A4 is used for performing pick and place The workpiece W to be applied and the workpiece W to be treated are detected; the second working area A5 is used for performing the rubbing operation on the workpiece W; the workpiece W to be applied is adhered to a ring steel frame W1. The wafer W3 on the adhesive film W2 is disposed, and the wafer W3 maintains an annular pitch with the annular steel frame W1, and the wafer W3 has been cut and granulated. The die W4 has a residual glue on the die W4 due to the related process; a detecting mechanism C is formed by a CCD lens disposed on the side of the gantry rail B facing the first working area A4, The X-axis slide rail B4 of the beam B2 of the gantry rail B can be reciprocally displaced in the X-axis by the first driving member B3 on the gantry rail B. The CCD lens of the detecting mechanism C is oriented in the Z-axis direction. In the lower direction, the workpiece W to be applied in the first working area A4 is inspected; a pick-and-place mechanism D is disposed on the machine table A1 of the first working area A4, and includes two clips disposed at intervals of X-axis spacing The seat D1 and the two clamps D1 are respectively provided with the inserting members D3 of the opposite recessed latching portions D2, and the respective inserting members D3 are respectively disposed at the fixed positions supported by the plurality of pivots D4 arranged in the Y-axis interval. On the seat D5, the two insert members D3 are respectively driven by a driving member D6 on the lower fixing seat D5, and can be used as an annular steel frame W1 to be applied as a workpiece W in the X-axis direction. The workpiece W is horizontally spanned between the two insert members D3; the fixed seat D5 and the interlocking clip member D3 are driven to be lifted and lowered with the pivot D4, and the workpiece W to be applied is interlocked. Up and down lifting; when the clamping member D3 is engaged with the workpiece W, the height of the workpiece W to be applied is lower than the height of the lower beam B2 of the gantry rail B and the lower end of the detecting mechanism C; The machine table A1 is disposed in the Y-axis direction, and one end thereof extends in the first working area A4, the two-clamp D1 of the pick-and-place mechanism D is below the workpiece W to be applied, and the other end passes under the gantry rail B. Extending into the concave transfer section A3 between the two seats A2 of the second working area A5, one end of which is provided with a rail seat driving member E1; a liquid supply mechanism F, the machine set in the first working area A4 On the table A1, the content is provided with a cleaning liquid, and a pipeline can be provided for conveying the cleaning liquid; a loading table G is disposed in the middle of the concave transfer section A3 between the two seats A2 of the second working area A5. On the seat E, and driven by the rail seat E upper rail drive member E1, the Y axis can be displaced through the gantry rail B and displaced between the first working area A4 and the second working area A5; 3 and 4, when the gantry rail B is displaced in the first working area A4, it is moved into the lower position of the second holder D1 of the pick-and-place mechanism D to be applied under the workpiece W, and is taken and placed. The mechanism D receives the workpiece W, and moves to the inspection mechanism C to receive the test after receiving the workpiece W, and then carries the workpiece to be moved to the second working area A5 to perform the rubbing operation, and finishes wiping. After the glue operation and then back to the first working area A4, the workpiece W to be applied for the rubbing operation is delivered to the pick-and-place mechanism D; a wiping mechanism H is disposed at the gantry rail facing the second working area A5. On the slide B6 of the X-axis slide B5 on the side of the beam B2 of the B, which is driven by a second drive member B7 on the gantry rail B, the X-axis can be reciprocally displaced on the slide rail B5. The mechanism H performs a rubbing operation on the workpiece W to be transferred to the second working area A5 in the Z-axis downward direction.

Referring to FIG. 5, the stage G includes: a fixing base G1 disposed on the rail base E, and capable of being displaced by the Y axis by the driving of the rail seat driving member E1 of the rail seat E, and a loading plate G2. The fixing seat G1 can be rotated by the driving member (not shown) of the fixing base G1, and the carrier G2 has a disk shape and is convexly arranged on the circumference and slightly raised above the carrier G2. a plurality of support frames G22 (four in the present embodiment) of the upper surface G21, a load weight measuring element G23 is disposed in the center of the upper surface G21 of the loading plate G2, and the upper surface G21 of the loading plate G2 is on the outer peripheral side of the load measuring element G23. Two positioning members G24 are respectively disposed at an angle of 90 degrees; a fixing frame G3 is disposed above the load measuring component G23 on the carrier G2 and is measured by the load measuring component G23, and is attached by a surface G31. The frame G32 which is disposed on the load weight measuring component G23 and extends outwardly from the four corners is respectively disposed on the support frame G22 of the carrier G2, and the fixed frame G3 can be rotated by the carrier G2. The four legs G32 on the fixed frame G3 are arranged at ninety degrees with each other, and the side G311 of the seat surface G31 adjacent to each of the two legs G32 is formed into a straight edge shape. A positioning section G33 is formed between the two legs G32 and the side G31 of the seat G31 adjacent thereto, and the fixing frame G3 is disposed on the load measuring component G23 with the seating surface G31, and the two adjacent positioning sections G33 are just The two positioning members G24 disposed at an outer circumferential side of the load weight measuring element G23 at an angle of ninety degrees are embedded and positioned; a heating element G4 is composed of a plurality of heating rods G41, and the heating rods G41 are parallel and horizontally spaced apart The positioning plate G5 is disposed on the fixing frame G3, and the four corners thereof are respectively supported by the four legs G32 of the fixing frame G3. The heating element G4 is located on the positioning plate G5 and the fixing frame G3. The positioning plate G5 can be heated while being placed on the lower surface of the positioning plate G5; the upper surface of the positioning plate G5 is provided with a ring-shaped concentric groove G51 with a plurality of spaced intervals, and a straight concave groove which is arranged at ninety degrees. In the groove G52, a groove G53 is provided in a groove intersecting the groove G51 and the groove G52 (please refer to FIG. 6), and a negative pressure is applied to the hole G53 to adsorb the carrier on the positioning plate G5.

Referring to FIGS. 2, 7, and 8, the wiping mechanism H is provided with: a pressing frame H1, and a fixing seat H11 having a rectangular shape and a Z-axis standing, which is fixed in the second working area A5. The sliding block B6 of the X-axis slide rail B5 on the side of the beam B2 of the gantry rail B can be driven by the second driving member B7 to perform X-axis sliding on the sliding rail B5; the back side of the fixing seat H11 A line of laser height detector H2 is disposed below, and is coupled with the fixed seat H11 and can project a linear laser beam H21 downward; the front side of the fixing seat H11 is provided with a pressing module H3, which is composed of a first pressing component. The H31 and the second pressing component H32 are configured, wherein the first pressing component H31 is provided with a heat source; the pressing module H3 is driven by the driving member H12 above the fixing seat H11 of the frame H1 to be vertically displaced. A wiper assembly H4 is provided with a slightly ㄇ-shaped fixing frame H41, and a hollow first opening section H411 is arranged below the fixing frame H41, and the upper part of the fixing frame H41 is also hollowed over the first section H411. There is a hollow hollow second interval H412, and a rib-shaped fixing portion H413 is arranged between the first interval H411 and the second interval H412, and the material is wiped. The assembly H4 is fixed to and interlocked with the pressing portion H1 by the fixing portion H413 of the fixing frame H41.

Referring to FIGS. 7 and 9, the pressing seat frame H1 is provided with a Z-axis first rail seat H13 on the front side of the fixing base H11, and the rail seat H13 is provided with a Z-axis slide rail (not shown), and A sliding seat H131 is disposed on the sliding rail, and a connecting seat H14 is disposed on the sliding seat H131 and is driven by the driving member H12 to be Z-axis sliding. The connecting seat H14 is provided for the fixing frame H41 of the cleaning material assembly H4. The fixing portion H413 is fixed thereon, so that the wiper assembly H4 is driven by the driving member H12 to be Z-axis sliding and interlocked with the pressing frame H1; the sliding seat H131 below the connecting seat H14 is provided with an X-axis. To the second rail seat H15, the second rail seat H15 can be vertically displaced in the Z-axis on the first rail seat H13, and the second rail seat H15 is provided with an X-axis slide rail H151, which is provided with A slide H152 for X-axis displacement on the slide rail H151; an X-axis rail H153 is arranged in parallel below the slide rail H151, and the rail rod H152 is provided with an X-axis slip on the rail H153. The driving member H154, the upper and lower sides of the second rail seat H15 are respectively provided with a spring element H155 composed of a spring with a Z-axis elastic force at a distance from the X-axis, and the elastic member H155 makes the entire second rail seat H15 at Z. Axial The lower displacement has an elastic buffer; the pressing module H3 is mounted on the driving member H154 at the bottom of the frame H33 and is driven to be X-axis displacement, and the back side of the frame H33 is fixedly attached thereto. The slider H152 obtains a stable slip when being driven, so that the pressing module H3 has an elastic cushioning when the elastic member H155 on the upper and lower sides of the second rail seat H15 is displaced up and down in the Z-axis direction.

Referring to FIG. 10 , the pressing module H3 is configured by the frame H33 for the first pressing component H31 and the second pressing component H32 to be respectively disposed in the Z axis and in parallel; wherein the first pressing component The H31 includes: a driving member H311 fixed to the frame H33 by a fixing base H3111 and interlocked by the frame H33. The driving member H311 drives a connecting seat H3112 below thereof to be displaced in the Z-axis direction, and the connecting seat One side of the H3112 is fixed with a side seat H3113 connected thereto; an adjusting component H312, the upper end of which is fixed by a bottom surface of the first adjusting seat H3121 and the bottom of the connecting seat H3112 of the driving member H311, and is fixed by the first adjusting seat H3121 The front side is fixed to the front side of the lower end of the side seat H3113; a connecting seat H313 has an upper end and a second adjusting seat H3122 at the lower end of the adjusting component H312. The connecting seat H313 is provided with a heating hole H3131, and the connecting seat H313 is provided with a temperature. The switch H3135 can stop heating when the detecting temperature is higher than a predetermined value; the temperature measuring holes H3132 communicating with the heating hole H3131 are respectively disposed at the two oblique surfaces of the front side of the joint H313; and a loading and unloading portion is convex at the lower end of the connecting seat H313 H3133, which is provided with loading and unloading holes H3134; The heating element H314 is a long rod-like body and is inserted into the heating hole H3131 of the coupling seat H313, which is monitored by the temperature switch H3135. A pressing seat H315 is disposed under the adjusting component H312 and is connected by the connecting seat. The H3112 linkage can be used for the Z-axis up and down displacement, and is provided with a U-shaped loading and unloading head H3151 and a moving head H3152 at the lower end of the loading and unloading portion H3151. The loading and unloading head H3151 can be nested and positioned at the lower end of the coupling seat H313. H3133, and the pin-shaped coupling member H3154 linked by the H3153 is inserted into the loading and unloading hole H3134 of the loading and unloading portion H3133 to be coupled; the wiping head H3152 has a one-piece shape, and the lower end has a square-shaped sliding portion H3155. The bottom end of the heating element H314 is in contact with the wiping head H3152 and the heat source is transmitted to the rubbing portion H3155 of the rubbing head H3152; a magnet H3156 is disposed on the side of the pusher H3153, and the loading portion H3154 can be inserted into the loading and unloading portion H3133. The loading and unloading hole H3134 is adsorbed to the coupling seat H313, so that the pusher H3153 is not easily slipped; the heating member H314 heats the coupling seat H313 to conduct the heat to the moving portion H3155 of the moving head H3152 pressed against the seat H315, The loading and unloading head H3151 and the moving head H3152 are The adjusting component H312 is used for fine-tuning and interlocking the lower part of the X-axis and the Y-axis at the level of the sliding portion H3155 of the head H3152 below the H315, so as to conform to and correspond to the wiped below. The second pressing member H32 has the same structure as the first pressing member H31, and only the heating member H314 and the temperature switch H3135 are not provided, and other members are not described herein.

Referring to FIG. 11 , a third adjustment seat H3123 is disposed between the first adjustment seat H3121 and the second adjustment seat H3122 of the adjustment component H312. The first adjustment seat H3121 located above and the third adjustment seat H3123 located below Forming a set of X-axis horizontal adjustment components, wherein the X-axis sides are respectively fixed by the sheet-shaped fixing members H3124; the upper third adjustment seat H3123 and the lower second adjustment seat H3122 form a set of Y-axis To the horizontal adjustment component, the two sides of the Y-axis are respectively fixed by the sheet-shaped fixing member H3125; the first adjusting seat H3121 located above and the third adjusting seat H3123 located below form a set of X-axis horizontal adjusting components For example, the first adjusting seat H3121 located above and the third adjusting seat H3123 located below are screwed by a set of screwing members H316, and the set of screwing members H316 includes: X of the first adjusting seat H3121 located above One side of the axially offset side is used for a fine adjustment screw H3161 between the first adjustment seat H3121 which is disposed above and below and the third adjustment seat H3123 which is located below, and is used separately from the two side fixing members H3124 Put the upper end of the two side fixtures H3124 with the bit The fourth fixing screw H318, which is fixed by the upper first mounting seat H3121, and the four adjustable screwing member H3163, which are fixed from the lower end of the fixing member H3124 and the third adjusting seat H3123 located below; The hole H3164 at the lower end of the fixing member H3124 through which the adjustable screw member H3163 is threaded has a larger outer diameter than the thread portion of the adjustable screw member H3163, so that there is a margin for displacement, but the group located on one side The second adjustable screw H3163 is normally screwed with the third adjusting seat H3123 located below, and the other two adjustable screw members H3163 on the same side of the fine adjusting screw H3161 are taken with the third adjusting seat located below. H3123 can be randomly loosened or screwed; outside the fixing member H3124 on the same side of the fine adjustment screw H3161, is provided with a second pin H3171 inserted through the lower end of the fixing member H3124 and the third adjusting seat H3123 located below; Between the first adjusting seat H3121 located above the trimming screw H3161 and the third adjusting seat H3123 located below, a second elastic member H3172 composed of a spring spaced apart in the Y-axis direction is provided; the two pin members The H3171 plug-in state is a standard setting under normal conditions. When the tilting state needs to be adjusted, since the two fixing members H3124 are arranged on both sides of the X-axis, the two pin members H3171 can be pulled out first, and the two adjustable screws can be loosened on the same side as the fine-tuning screw member H3161. The joint H3163 has a displacement margin between the hole diameter of the perforation H3164 and the outer diameter of the threaded portion of the adjustable screw H3163, so the second elastic element H3172 on the same side as the fine adjustment screw H3161 will be at the first position above. When the adjusting seat H3121 is fixed, a driving force is pushed against the third adjusting seat H3123 located below, and the driving force is moved downward on the same side as the fine adjusting screw H3161, and the elastic component H3172 is supported by fine-tuning the fine adjusting screw H3161. The pushing force of the pushing push pushes down the side of the third adjusting seat H3123 and the fine adjusting screw H3161 on the lower side to obtain the horizontal height adjustment of the third adjusting seat H3123X located below. After the positioning is adjusted, the two adjustable screw members H3163 on the same side of the fine adjustment screw H3161 are screwed and locked; the set of the third adjusting seat H3123 located above and the second adjusting seat H3122 located below Y axial level adjustment component between the two Y axes The method of adjusting the height adjustment and the horizontal sides of the axial direction X Similarly the level of which members are also the same, but the orientation of the Y axis disposed symmetrically disposed, this can be understood from FIG. 11, hereby not described herein.

Referring to FIGS. 8 and 12, a side of the first section H411 of the open recessed hollow portion of the wiper assembly H4 is provided with a release zone H414, and the first section of the hollow section H411 is provided with a side. The winding area H415 is provided with a liquid immersion area H416 below the same side of the material release area H414, and a drawing area H417 is disposed below the same side of the winding area H412, and forms between the immersion area H416 and the drawing area H417. A wiping zone H418; a temperature sensor H419 is fixed on a sliding seat H4193 by a fixing seat H4192 at the upper end of an extension rod H4191, and the sliding seat H4193 is arranged on the bottom edge of the hollow hollow second section H412 above the fixing frame H41. On the X-axis slide rail H4194, the temperature sensor H419 can be embedded in the temperature-measuring hole H3132 of the coupling seat H313 (please refer to FIG. 7 and 10) and communicate with the heating hole H3131 at the two oblique surfaces on the front side. The temperature of the heating element H314 is synchronously shifted by the X-axis with the first pressing component H31; wherein the releasing material zone H414 is provided with a winding wiper whose axle is disposed in the Y-axis direction and driven by a driving member H4141 on the back side of the fixing frame H41. The reel H4142 of the material, under the reel H4142, is provided with a first steering in which the X-axis spaced apart axles are arranged in the Y-axis direction. H4143, second steering wheel H4144, below the first steering wheel H4143, the second steering wheel H4144 is provided with a weight wheel H4145 whose axle is arranged in the Y axis, and the weight wheel H4145 is located in the fixing frame H41 of the releasing material zone H414. At a Z-axis long slot H4146, the axle of the weight wheel H4145 extends through the slot H4146 and is coupled to a counterweight H4147 on the back side of the bracket H41. The counterweight H4147 is disposed in a slot H4146. The side is parallel to the long slot H4146 on the Z-axis slide H4148, and the weight wheel H4145 can be interlocked for the Z-axis up and down displacement, and the stroke distance of the up-and-down displacement is sensed by a set of upper and lower positions. The H45 is monitored and controlled; the winding area H415 is provided with an empty reel H4152 with a winding shaft in the Y-axis and driven by a driving member H4151 on the back side of the fixing frame H41, and an X under the reel H4152. The third steered wheel H4153 and the fourth steered wheel H4154 are disposed in the Y-axis direction, and the counterweight wheel H4155 is disposed in the Y-axis direction below the third steered wheel H4153 and the fourth steered wheel H4154. The weight wheel H4155 is located at a Z-axis long slot H4156 on the mounting frame H41 in the retracting area H415. The axle of the weight wheel H4155 extends through the long slot H4156 and is interlocked with a counterweight H4157 on the back side of the fixed frame H41. The weight H4157 is disposed on the side of a long slot H4156 and parallel to the long slot H4156. On the slide rail H4158, the weight wheel H4155 can be interlocked for the Z-axis up and down displacement, and the stroke distance of the up-and-down displacement is monitored and controlled by a component of the upper and lower positions of the sensing member H4159; the dip area H416 A cleaning liquid container H4161 is disposed on the mounting frame H42 fixed at the lower end of the fixing frame H41, and is provided with a pipeline (not shown) between the liquid supply mechanism F in FIG. The mechanism F obtains the supply of the cleaning liquid; the cleaning liquid container H4161 is provided with a roller H4162, the wheel shaft of the roller H4162 is disposed on the cleaning liquid container H4161 in the Y-axis direction, and a part of the circumference of the roller H4162 is immersed in the cleaning liquid container H4161. A portion is exposed outside the cleaning liquid container H4161, and its circumferential surface is arranged in an equidistant ring arrangement in the form of a Y-axis groove; the dip area H416 is provided with a proximal wheel H4163 with an axle disposed in the Y-axis, which is near Relying between the cleaning liquid container H4161 and between the proximal wheel H4163 and the roller H4162 of the cleaning liquid container H4161 The first movable wheel H4165 and the second movable wheel H4166 are disposed in a plurality of sets and spaced apart from each other by a swing frame H4164. The first movable wheel H4165 and the second movable wheel H4166 are located in the liquid immersion area H416. A Z-axis long slot H4167 on the mounting frame H41, the shaft H4168 disposed on the rear side of the swing frame H4164 extends through the long slot H4167 and is driven by a rotary driving member H4169 on the back side of the mounting frame H41 to make the pendulum The H4164 can be pivoted so that the first movable wheel H4165 can be moved down against the upper circumference of the roller H4162 on the cleaning liquid container H4161; the pulling portion H417 is provided with a driving member H4171 driven by the back side of the fixing frame H41, and The wheel axle is a rotatable pulling wheel H4172 disposed in the Y-axis direction, and the circumferential surface of the pulling wheel H4172 is arranged in an equidistant ring arrangement in the form of a Y-axis groove; the adjacent side of the pulling wheel H4172 is provided with an axle disposed in the Y-axis direction. The yoke H4173 has a circumferential surface which is also arranged in a Y-axis groove. The rivet wheel H4173 is disposed on the swing arm H4175 of the fixed frame H41 with the pivot H4174 as a fulcrum. The swing arm H4174 The adjacent pinion wheel H4173 is provided with a pivot pin H4176 which is pivoted to the fixing frame H41 on the adjacent side, and the opposite pivot pin H The other side swing arm H4174 of the 4176 is pulled by the elastic member H4177 (Fig. 13) formed by a spring on the fixing frame H41, and after swinging the pivot pin H4176 of the fixing frame H41, the swing arm H4175 The elastic member H4177 is pulled to fit the circumference of the pulling wheel H4172; the wiping area H418 is provided with a first guiding arm H4181 which is fixed by the fixing frame H41 of the liquid absorbing area H416 and extends obliquely downward, and is pulled by The second guiding arm H4182 of the lead frame H417 is fixed and inclined downwardly, and the lower ends of the first guiding arm H4181 and the second guiding arm H4182 are close to each other to maintain an operation interval H4183, and each end is The first support wheel H4184 and the second support wheel H4185 having the axle disposed in the Y-axis are disposed; the bottom edges of the first support wheel H4184 and the second support wheel H4185 maintain a same X-axis horizontal height; wherein, the second guide A guide wheel H4186 having an axle disposed in the Y-axis is disposed at the pull-up wheel H4172 of the lead-arm H4182 adjacent to the pull-out zone H417.

Referring to FIGS. 12 and 13, in the wiping cleaning of the residual glue, the rolled strip-shaped wipe L is sequentially passed from the reel H4142 of the release material zone H414 to the first steering wheel H4143, the weight wheel H4145, After the second steering wheel H4144 enters the dip zone H416 and passes around the near revolving wheel H4163, the first movable wheel H4165, the second movable wheel H4166, and the roller H4162, and then passes through the first supporting wheel H4184 of the wiping area H418. The second support wheel H4185 and the guide wheel H4186 enter the pulling area H417 and pass through the pulling wheel H4172, enter the winding area H415 and pass through the third steering wheel H4153, the weight wheel H4155, and the fourth steering wheel. H4154 is taken up by the empty reel H4152; wherein, when the wipe L is wound around the second movable wheel H4166, the second movable wheel H4166 can be driven to press against the wipe L at the second movable wheel H4166. The roller H4162, which has been adhered to the cleaning liquid container H4161, is adhered to the cleaning liquid; the cleaning material L is clamped by the inset wheel H4173 when it is wound around the pulling wheel H4172, so that the pulling wheel H4172 can be driven by the driving member H4171. Pulling the wipe L in the wiping area H418 to be displaced, when the wipe L in the wiping area H418 is pulled to the release area When the weight wheel H4145 in the H414 is forced to move up to the sensing member H4149 where the counterweight H4147 touches the upper position, the driving member H4141 is caused to drive the reel H4142 to release the wipe material L until the counterweight H4147 touches the lower position. As in the case of the winding portion H415, when the wiper L is pulled by the pulling wheel H4172, the weight L4 in the winding portion H415 is relaxed until the weight H4157 of the weighting wheel H4155 is linked to the lower position. When the workpiece H4159 is tested, the driving member H4151 will drive the empty reel H4152 to wind the receiving material L until the weight H4157 touches the sensing member H4159 at the upper position, thereby adjusting the wipe L to be pulled in the entire flow path. The pressing module H3 is selectively operable by the first pressing member H31 or the second pressing member H32, and is respectively pressed by the sliding portion H3155 of the lower end of the holder H3152 by pressing against the lower end of the holder H315. The wrap is wound over the wiper L between the first support wheel H4184 and the second support wheel H4185 in the wiping area H418.

In the embodiment of the present invention, the method for cleaning the residual adhesive of the wafer is performed by the following steps: a feeding step of loading the workpiece W into the pick-and-place mechanism D by the two clamping members D3 on the two clamping seats D1 to be in a horizontal state Clamping; the loading operation can be taken out and executed by a robot (not shown) from a loading/unloading device (not shown); a reclaiming step, the loading station G is operated by the second The area A5 is displaced by the y-axis linear displacement flow path through the gantry rail B in the first working area A4, and is moved into the lower part of the pick-and-place mechanism D between the two holders D1 to be applied under the workpiece W, and the self-picking mechanism The two inserting members D3 on the D are received by the workpiece W; when the workpiece W is to be taken up by the loading platform G, the carrier G2 is adsorbed by the negative pressure in the air hole G53 and positioned on the carrier G2. And being heated by the heating element G4; a residual glue inspection step, the stage G is linearly displaced along the Y-axis, and moved to the workpiece in the first working area A4 when the pick-and-place mechanism D is removed. W is inspected by the detecting mechanism C on the gantry rail B to check the residual rubber condition of each of the upper crystal grains W4; The workpiece to be applied in the glue condition is displaced by the stage G along the original Y-axis linear displacement flow path through the gantry rail B to the second working area A5; a die wiping step, the pressing mechanism of the wiping mechanism H is pressed The holder H1 is linked to the wiper assembly H4, and the wiper L is pressed against the wiper portion H3155 of the transfer head H3152 of the first pressing member H31 provided with the heat source (refer to FIG. 14), and the wiper L is pulled by the guide wheel. H4172 pulls the wheel H4172, and wipes the bottom surface of the rubbing portion H3155 of the rubbing head H3152 and the upper surface of the die W4, and wipes the individual die W4 with the residual glue detected; because of the moving head H3152 side The area of the square-shaped moving portion H3155 at the lower end of the body is approximately the same as the surface area of the crystal grain W4, so the wiping range can cover the entire crystal grain; the grain W4 of each workpiece to be detected on the workpiece W is wiped. Then, the wiper L is pressed against the wiper H by the rubbing portion H3155 of the transfer head H3152 of the second press-fitting component H32 of the heat-free source, and the die W4 is wiped; the transfer head H3152 is moved. When the wiper portion H3155 presses the wiper material L against the die W4 applied to the workpiece W, the biasing force of the wiper head H3152 is pressed by the load G of the stage G. G23 measurement, once the set load value is reached, the moving head H3152 will stop pressing to avoid damage to the grain W4; a cleaning inspection step, so that the workpiece W to be applied is linearly displaced by the stage G along the Y axis The flow path is displaced toward the pick-and-place mechanism D, and the linear laser beam H21 projected by the line laser height detector H2 under the back side of the mount H11 is pressed against the second working area A5 below the gantry rail B. The grain W4 from which the residual glue was originally detected is inspected (please refer to FIG. 15); when it is detected that the grain is not cleaned to the expected extent, the workpiece W to be applied is straight along the Y axis by the stage G. The displacement flow path re-executes the foregoing step of wiping the grain W4; when all the grains W4 which have been detected to have the residual glue are inspected to have reached the expected level, it is determined that the cleaning has been completed; The workpiece W is displaced by the linear displacement flow path of the stage G along the Y axis through the lower side of the gantry rail B to the pick-and-place mechanism D in the first working area A4, and is moved into the pick-and-place mechanism D between the two holders D1. The two inserting members D3 on the pick-and-place mechanism D receive the workpiece W for the robot to take off and transfer into the receiving and receiving materials. It is set, and performs the next cycle of the load to be applied for the workpiece W.

In the embodiment of the present invention, the method and device for cleaning the residual adhesive of the wafer are performed by cleaning the die W4 one by one, so that the die W4 which is detected by the residual glue can be separately cleaned, in addition to the better cleaning effect. The cleaning of the residual glue on the whole wafer can be performed efficiently; and the workpiece W to be applied has been heated by the heating element G4 on the stage G, so that the residual glue is subjected to warm heating, and the whole piece is to be applied. In the case of the first pyrolysis process of the workpiece W, the wiping mechanism H is further subjected to a second pyrolysis process for the individual crystal grains W4 from top to bottom by the first pressing member H31 having the heat source, and is subjected to the rubbing process. The residual glue on the grain W4 has been melted into a liquid dilution state, and then wiped by the second pressure-free component H32 without the heat source, the residual glue can be cleaned more easily, and the linear lightning detector H2 is projected with the line laser height detector H2. The beam H21 checks the rubbing effect, and the die cleaning can be completed without any omission; and the wiper assembly H4 of the wiping mechanism H releases the wipe L to the winding area H415 by the reel H4142 in the release zone H414. Roller H4152 rolls the receiving material, during which the wipe L can be self-cleaning liquid without interruption The H4162 on the H4161 is attached with the cleaning liquid, and the weight of the wiper L is pulled through the entire flow path by the weight wheel H4145 and H4155, so that the cleaning operation can be automated without interruption. The cleaning performance is greatly improved; at the same time, the elastic member H155 of the upper and lower sides of the second rail seat H15 is elastically buffered when being displaced up and down in the Z-axis, so as to press the first on the module H3. When the pressing member H31 or the second pressing member H32 is pressed against the surface of the die, the pressure of the pressing pressure itself is buffered except for the measurement of the lower pressure channel by the measurement of the load measuring member G23 on the loading table G. The damage of the grain W4 on the workpiece W to be applied can be reduced.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

A‧‧‧ machine
A1‧‧‧ machine table
A2‧‧‧ pedestal
A21‧‧‧ upper surface
A3‧‧‧Transfer interval
A4‧‧‧First Work Area
A5‧‧‧Second Work Area
B‧‧‧Longmen rail
B1‧‧‧ column
B2‧‧‧ beams
B3‧‧‧First drive
B4‧‧‧rails
B5‧‧‧rails
B6‧‧‧ slide
B7‧‧‧second drive
C‧‧‧Testing agency
D‧‧‧ pick-and-place mechanism
D1‧‧‧Clip seat
D2‧‧‧Card Department
D3‧‧‧Inlay clips
D4‧‧‧ pivot
D5‧‧‧ fixed seat
D6‧‧‧ drive parts
E‧‧‧ rail seat
E1‧‧‧ rail seat drive
F‧‧‧liquid supply mechanism
G‧‧‧ stage
G1‧‧‧ fixed seat
G2‧‧‧ Carrier
G21‧‧‧ upper surface
G22‧‧‧Support frame
G23‧‧‧Load weight measuring component
G24‧‧‧ positioning parts
G3‧‧‧ fixed frame
G31‧‧‧Seat
G311‧‧‧ side
G32‧‧‧ feet
G33‧‧‧ Positioning interval
G4‧‧‧ heating element
G41‧‧‧heating rod
G5‧‧‧ positioning plate
G51‧‧‧ Groove
G52‧‧‧ Groove
G53‧‧‧ stomata
H‧‧‧wiping mechanism
H1‧‧‧ against the frame
H11‧‧‧ fixed seat
H12‧‧‧ drive parts
H13‧‧‧First rail seat
H131‧‧ ‧ slide
H14‧‧‧ linkage seat
H15‧‧‧Second rail seat
H151‧‧‧rails
H152‧‧‧ slide
H153‧‧‧ rails
H154‧‧‧ drive parts
H155‧‧‧Flexible components
H2‧‧‧Laser altimeter
H21‧‧‧ line laser beam
H3‧‧‧Pressure module
H31‧‧‧First pressure component
H311‧‧‧ drive parts
H3111‧‧‧ Fixed seat
H3112‧‧‧ link
H3113‧‧‧ side seat
H312‧‧‧Adjustment components
H3121‧‧‧First adjustment seat
H3122‧‧‧Second adjustment seat
H3123‧‧‧ third adjustment seat
H3124‧‧‧Fixed parts
H3125‧‧‧Fixed parts
H313‧‧‧Connection
H3131‧‧‧heating hole
H3132‧‧‧Measurement hole
H3133‧‧‧Loading and Unloading Department
H3134‧‧‧ loading and unloading hole
H3135‧‧‧Temperature switch
H314‧‧‧heating parts
H315‧‧‧ pressed to the seat
H3151‧‧‧ loading and unloading head
H3152‧‧‧Missing head
H3153‧‧‧ push handle
H3154‧‧‧Connecting parts
H3155‧‧‧Missing Department
H3156‧‧‧ magnetic parts
H316‧‧‧ screw joint
H3161‧‧‧Micro-adjustment screw
H3162‧‧‧ fixing screw
H3163‧‧‧Adjustable screw
H3164‧‧‧Perforation
H3171‧‧ ‧ sales
H3172‧‧‧Flexible components
H32‧‧‧Second pressure component
H33‧‧‧Rack
H4‧‧‧Wash component
H41‧‧‧ Fixing frame
H411‧‧‧First interval
H412‧‧‧Second interval
H413‧‧‧Fixed Department
H414‧‧‧ release area
H4141‧‧‧ drive parts
H4142‧‧‧Reel
H4143‧‧‧First steering wheel
H4144‧‧‧Second steering wheel
H4145‧‧‧weight wheel
H4146‧‧‧Long slot
H4147‧‧‧weight
H4148‧‧‧rails
H4149‧‧‧Sensor
H415‧‧‧Retraction area
H4151‧‧‧ drive parts
H4152‧‧‧Reel
H4153‧‧‧First steering wheel
H4154‧‧‧Second steering wheel
H4155‧‧‧weight wheel
H4156‧‧‧ long slot
H4157‧‧‧weight
H4158‧‧‧rails
H4159‧‧‧Sensor
H416‧‧‧Dip area
H4161‧‧‧cleaning liquid container
H4162‧‧‧Roller
H4163‧‧‧near wheel
H4164‧‧‧Swing
H4165‧‧‧First activity round
H4166‧‧‧Second activity round
H4167‧‧‧Long slot
H4168‧‧‧ shaft
H4169‧‧‧Rotary drive
H417‧‧‧ Pulling area
H4171‧‧‧ drive parts
H4172‧‧‧ Pulling wheel
H4173‧‧‧Inclusion round
H4174‧‧‧ pivot
H4175‧‧‧ swing arm
H4176‧‧‧ pivot
H4177‧‧‧Flexible components
H418‧‧ Wipe area
H4181‧‧‧First guiding arm
H4182‧‧‧Second guiding arm
H4183‧‧‧ operation spacing
H4184‧‧‧First support wheel
H4185‧‧‧Second support wheel
H4186‧‧‧ Guide wheel
H419‧‧‧Temperature rod detector
H4191‧‧‧Extension rod
H4192‧‧‧ Fixed seat
H4193‧‧‧ slide
H4194‧‧‧rails
W‧‧‧ to be applied as a workpiece
W1‧‧‧ steel frame
W2‧‧‧ film
W3‧‧‧ wafer
W4‧‧‧ grain

1 is a perspective view showing the mechanism of the first working area side of the wafer residual glue cleaning device in the embodiment of the present invention. 2 is a perspective view showing the mechanism of the second working area side of the wafer residual glue cleaning device in the embodiment of the present invention. 3 is a front elevational view of FIG. 1 in an embodiment of the present invention. 4 is a schematic diagram of the left side of FIG. 1 in the embodiment of the present invention. FIG. 5 is a perspective exploded view of the stage in the embodiment of the present invention. Fig. 6 is a schematic view showing the air holes on the positioning plate of the stage in the embodiment of the present invention. Figure 7 is a perspective view of the wiping mechanism in the embodiment of the present invention. Figure 8 is a perspective view showing the back side of the wiping mechanism in the embodiment of the present invention. FIG. 9 is a perspective exploded view of the seat frame and the pressing module in the embodiment of the present invention. FIG. 10 is a perspective exploded view of the pressing module and the first pressing component in the embodiment of the present invention. Figure 11 is a perspective exploded view of the adjustment assembly in the embodiment of the present invention. Figure 12 is a perspective view of a wiper assembly in accordance with an embodiment of the present invention. Figure 13 is a front elevational view of the wiper assembly of the embodiment of the present invention. FIG. 14 is a perspective view showing the wiping head of the first pressing component in the embodiment of the present invention for wiping on the die of the wafer. FIG. 15 is a schematic diagram of residual glue detection by a line laser beam of a laser height detector according to an embodiment of the present invention.

A‧‧‧ machine

A2‧‧‧ pedestal

A3‧‧‧Transfer interval

A4‧‧‧First Work Area

A5‧‧‧Second Work Area

B3‧‧‧First drive

B7‧‧‧second drive

G‧‧‧ stage

H‧‧‧wiping mechanism

W‧‧‧ to be applied as a workpiece

W1‧‧‧ steel frame

W2‧‧‧ film

W3‧‧‧ wafer

W4‧‧‧ grain

Claims (13)

A method for cleaning a residual adhesive of a wafer, comprising: performing on a machine: a residual glue inspection step, wherein the wafer to be applied as a workpiece is inspected by a detecting mechanism on a wafer on a stage Residual rubber condition; a grain wiping step, such that a wiping mechanism wipes the individual individual crystal grains from which the residual glue is detected by the wiping material one by one. The method for cleaning a residual adhesive of a wafer according to claim 1, wherein the workpiece to be applied is received by a loading platform and is vacuum-adsorbed on one of the loading trays to be positioned on the carrier. The method for cleaning a residual adhesive of a wafer according to claim 1, wherein the workpiece to be applied is heated by the heating element on the stage, and the residual glue is heated to perform a heat of the whole workpiece to be applied to the workpiece. Solve the program. The method for cleaning a residual adhesive of a wafer according to claim 1, wherein the workpiece to be applied is subjected to a pyrolysis process for a single die from a top to bottom by a first pressing member having a heat source by a wiping mechanism. . The method for cleaning a residual adhesive of a wafer according to claim 1, wherein the first pressing component of the workpiece to be applied by the wiping mechanism is pressed against the workpiece to be applied to the workpiece. In the case of granules, the urging force of the squeezing head is measured by a load weight measuring element. The method for cleaning a residual adhesive of a wafer according to claim 1, wherein after the step of performing the die wiping of the workpiece is performed, performing a linear laser beam projected by the line laser height detector to inspect the die Whether the cleaning has reached the expected level of cleaning inspection steps. The method for cleaning a residual adhesive of a wafer according to claim 1, wherein the first pressing component of the workpiece to be applied by the wiping mechanism is pressed against the workpiece to be applied to the workpiece. In the case of granules, the pressure of the pressing is buffered by the action of the elastic member. A wafer residual glue cleaning device comprises: a machine table having a machine table, a transfer section on the machine table; a gantry rail frame separating the machine table into a first work area, and a second a working area; a detecting mechanism is disposed on a side of the gantry rail facing the first working area, and inspects a workpiece to be applied in the first working area; a pick-and-place mechanism is disposed in the first working area of the machine , comprising two clamping seats arranged at intervals; a loading platform disposed on the machine table, the second working area is driven to be displaced in the first working area and the second working area, and is received by the pick-and-place mechanism for receiving the workpiece or a workpiece to be applied to the pick-and-place mechanism; a wiping mechanism disposed on a side of the gantry rail facing the second working area, provided with a pressing frame and a wiper assembly; the pressing frame is provided with a first pressure And the wiper assembly provides a wipe material to be wound thereon; the first press-fit component can be driven to press against the wiper to perform residual glue cleaning on the workpiece to be applied on the stage. The wafer residual glue cleaning device according to claim 8 , wherein the machine is provided with a liquid supply mechanism, the content is provided with a cleaning liquid, and a pipeline is provided for conveying the cleaning liquid to the cleaning mechanism and the cleaning liquid container. The cleaning fluid container is bypassed by the wipe of the wipe assembly. The wafer residual glue cleaning device according to claim 8, wherein the pressing frame is provided with a second pressing component, wherein the first pressing component is provided with a heat source, and the two can be switched to press against the material. Residual cleaning of the workpiece to be applied to the stage. The wafer residual glue cleaning device according to claim 8, wherein the first pressing component is provided with fine adjustment and interlocking one of the first pressing components, and the moving head is on both sides of the X-axis and the Y-axis. Level adjustment component. The wafer residual glue cleaning device according to claim 8, wherein the wiper assembly is provided with a weight for adjusting the tightness of the wipe. A wafer residual glue cleaning device comprising: a device using the wafer residual glue cleaning method according to any one of claims 1 to 7.