CN115230001A

CN115230001A - Silicon wafer production system

Info

Publication number: CN115230001A
Application number: CN202210688081.3A
Authority: CN
Inventors: 丁海军; 邢旭; 兰勇刚
Original assignee: Leshan Gaoce New Energy Technology Co ltd
Current assignee: Leshan Gaoce New Energy Technology Co ltd
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2022-10-25
Also published as: CN114559571B; CN115008621A; CN114559571A

Abstract

An embodiment of the present application provides a silicon wafer production system, including: the slicing machine is used for cutting the silicon rod into silicon wafers, and placing the silicon wafers and the crystal support assembly into the tool basket; the transport trolley is used for transporting the tool basket to the degumming device; the degumming device is internally provided with a staying space for accommodating the transport trolley; the degumming device is used for degumming and slicing the silicon wafer; the inserting and washing device is used for inserting the silicon wafers subjected to the slicing treatment; the frock basket includes: a tooling basket frame and side support assemblies; an accommodating space for accommodating the silicon wafers is formed in the tool basket frame, and an opening for the silicon wafers to enter and exit the accommodating space is formed in the top of the tool basket frame; the side supporting components are used for clamping the silicon wafers from two sides and are respectively connected to two sides of the tooling basket frame; a magnetic attraction piece is arranged in the side supporting component. The silicon wafer production system provided by the embodiment of the application can realize automatic degumming, glue wiping and slicing operation on the silicon wafer, and improves the production efficiency.

Description

Silicon wafer production system

The application is a divisional application of a patent application with an application date of 2022, 4 months and 14 days and an application number of 202210387322.0, and is named as a silicon wafer production system.

Technical Field

The application relates to a silicon wafer production technology, in particular to a silicon wafer production system.

Background

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer.

A slicer is a device for slicing a bar of hard and brittle material, and is usually arranged horizontally with two parallel main rollers, on which a single diamond wire is wound to form at least 2000 wire saws. The silicon rod moves from top to bottom and penetrates through the two main rollers, and the main rollers rotate to drive the diamond wires to move at a high speed so as to slice the silicon rod.

A group of silicon wafers formed by cutting a silicon rod are placed into a tooling basket, the tooling basket is manually conveyed into a degumming device, and the silicon wafers sequentially enter a cleaning tank for pre-cleaning and enter a degumming tank for degumming. After the silicon wafer is degummed from the degumming tank, manually and visually check whether the silicon wafer has residual glue or not, and manually erase the residual glue. Then the silicon wafer is transferred to another type of tool basket and is carried to an inserting and washing device for inserting and washing.

From the above, it can be seen that: in the traditional scheme, more workers participate in the work, and the production efficiency and the product quality are greatly influenced.

Disclosure of Invention

In order to solve one of the technical defects, the embodiment of the application provides a silicon wafer production system.

According to a first aspect of embodiments of the present application, there is provided a silicon wafer production system including:

the slicing machine is used for cutting the silicon rod into silicon wafers, and placing the silicon wafers and the crystal support assembly into the tool basket;

the transportation trolley is used for transporting the tooling basket to the degumming device;

the degumming device is internally provided with a staying space for accommodating the transport trolley; the degumming device is used for degumming and slicing the silicon wafer;

the inserting and washing device is used for inserting the silicon wafers subjected to the slicing treatment;

the tool basket includes:

a tooling basket frame; an accommodating space for accommodating the silicon wafers is formed in the tool basket frame, and an opening for the silicon wafers to enter and exit the accommodating space is formed in the top of the tool basket frame;

the side support assemblies are used for clamping the silicon wafers from two sides, are arranged in the accommodating space and are respectively connected to two sides of the tool basket frame; the side support assembly extends along the length direction of the tool basket frame; a magnetic suction piece is arranged in the side supporting component.

According to the technical scheme, the silicon wafer and the crystal support assembly obtained by cutting the slicing machine are placed in the tool basket, and the tool basket is transferred to the degumming device through the transport trolley. And (4) carrying out degumming treatment in a degumming device to separate the silicon wafer from the crystal support component, and carrying out fragmentation treatment through the magnetic piece in the tooling basket. And then, the silicon wafer enters the inserting and washing device for inserting the silicon wafer, so that the automatic operation of the production process of the silicon wafer is realized, the production efficiency is improved, the manual participation is reduced, the damage to the silicon wafer can be reduced, and the yield is improved.

Drawings

Fig. 1 is a schematic structural diagram of a silicon wafer production system according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a degumming apparatus provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a silicon wafer placed in a tool basket according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a silicon wafer degumming treatment method applied to a degumming device according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a crystal support assembly and a silicon wafer provided in an embodiment of the present application;

FIG. 6 is an enlarged view of area A of FIG. 4;

fig. 7 is a schematic structural diagram of an image acquisition assembly in a degumming apparatus provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a conveying manipulator mechanism in the degumming device provided in the embodiment of the present application;

FIG. 9 is a schematic view of another structure for placing a silicon wafer in a tool basket according to an embodiment of the present disclosure;

FIG. 10 is an enlarged partial schematic view of FIG. 2;

fig. 11 is a schematic structural diagram of a frictioning manipulator mechanism in the degumming device provided in the embodiment of the present application;

fig. 12 is a schematic structural diagram of a glue wiping mechanism in the degumming device provided in the embodiment of the present application;

fig. 13 is a schematic structural diagram of a rubber applying robot mechanism in the degumming device according to the embodiment of the present application;

FIG. 14 is an enlarged partial view of FIG. 2;

fig. 15 is a schematic structural view of a thick plate on a wafer support assembly according to an embodiment of the present disclosure;

FIG. 16 is a schematic structural diagram of a slab removal robot mechanism in a degumming apparatus according to an embodiment of the present application;

fig. 17 is a schematic structural diagram of a thick-plate clamping jaw assembly in the degumming apparatus provided in the embodiment of the present application;

fig. 18 is a structural diagram illustrating a thick sheet clamping assembly clamping a thick sheet in the degumming apparatus provided in the embodiment of the present application;

FIG. 19 is a perspective view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 20 is a side view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 21 is a top view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 22 is an enlarged view of area B of FIG. 21;

fig. 23 is a schematic structural view of a tooling basket entering a slicing station according to an embodiment of the present application;

FIG. 24 is a perspective view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 25 is a perspective view of a silicon wafer mounted on a tool basket according to an embodiment of the present application;

FIG. 26 is a side view of a tool basket provided in accordance with an embodiment of the present application;

fig. 27 is a perspective view of a tool basket and a trigger plate provided in an embodiment of the present disclosure;

FIG. 28 is a top view of a tool basket and trigger plate according to an embodiment of the present disclosure;

FIG. 29 is an enlarged view of area C of FIG. 24;

FIG. 30 is a cross-sectional view taken along line D-D of FIG. 26;

FIG. 31 is an enlarged view of area E of FIG. 30;

FIG. 32 is a schematic view of the structure of the baffle;

fig. 33 is a top view of another tooling basket applied to a slicing station according to an embodiment of the present disclosure.

Reference numerals are as follows:

1-slicing machine;

2-a degumming device; 21-silicon wafer production line; 211-degumming tank; 212-a transit trough; 22-a crystal support recycling line; 23-thick slice collecting basket; 24-a transport robot mechanism; 241-longitudinal guide rails; 242-transverse guide rails; 243-vertical guide rail; 2441-tooling top plate; 2442-tooling basket jaw; 2443-crystal holder jaw; 25-a slab removing manipulator mechanism; 251-removing a thick piece manipulator base; 252-a slab removal robot; 253-thick plate jaw assembly; 2531-jaw holder; 2532-splint; 2533-jaw drive; 254-thick sheet collecting camera; 255-thick sheet light source; 26-a glue wiping manipulator mechanism; 261-a glue spreading manipulator base; 262-a glue wiping mechanical arm; 263-a glue wiping mechanism; 2631-roller holder; 2632-a glue roller; 264-residual glue collecting camera; 265-a light source for applying glue; 271-a slide rail; 272-degumming collecting camera; 273-camera support; 274-a degumming light source;

31-a crystal support assembly; 311-metal plate; 312-a resin plate; 32-thick piece; 33-a silicon wafer;

41-a belt transport mechanism;

5-a tooling basket; 511-frame front panel; 5111-front plate through hole; 512-frame back plate; 513-frame floor; 52-side support assembly; 521-an elastic cord; 522-a magnetic ring; 523-buffer sleeve; 524-a threaded fastener; 525-thread bush; 53-a bottom support assembly; 531-stainless steel rod; 532-rubber sleeve; 54-a tool rack; 541-a bottom frame plate; 542-front frame plate; 5421-shelf through holes; 543-rear shelf board; 55-a side stop assembly; 551-clamp plate stop lever; 552-a first strut; 553-a second strut; 56-a cleat assembly; 561-a baffle; 5611-an intermediate portion; 56111-a collar; 5612-a clamping portion; 5613-a trigger; 562-torsion spring; 563-clamping washer; 57-a bottom take-up assembly;

71-a slicing worktable; 721-a slice conveying mechanism; 722-a magnetic member; 723-slicing nozzle; 73-a trigger plate;

8-inserting and washing device.

Detailed Description

Fig. 1 is a schematic structural diagram of a silicon wafer production system according to an embodiment of the present application. As shown in fig. 1, the silicon wafer production system includes: the device comprises a slicer 1, a degumming device 2 and an insertion washing device 8.

Wherein, slicer 1 is used for cutting into the silicon chip with the silicon rod to place silicon chip and brilliant support subassembly in the frock basket. Before slicing by a slicer, the side of the square bar is glued and stuck on the crystal support component. The crystal support component is clamped by a silicon rod clamping jaw on the slicing machine 1 and moved to a cutting area for cutting. The silicon wafer obtained by cutting is adhered to the lower part of the crystal support component and cannot fall off at once, then the silicon wafer and the crystal support component are integrally arranged in a tooling basket, and the silicon wafer falls off from the crystal support component through a subsequent degumming process.

The tooling basket is conveyed to the degumming device 2 by adopting a transport trolley, the transport trolley can be a trolley running along a rail or a trolley running on the ground, and the tooling basket is placed at the top of the trolley. Through travelling bogie with frock basket 5 from slicer automatic transfer to the mucilage binding that takes off, save artifical transport operation. A stopping space for accommodating a transport trolley is arranged in the degumming device 2, and the transport trolley directly enters the stopping space.

The degumming device 2 is used for degumming the silicon wafer so as to separate the silicon wafer from the crystal support component. The degumming device 2 can also perform the slicing treatment on the silicon wafers, so that each silicon wafer can be separated from the adjacent silicon wafer and can be taken out.

Insert and wash device 8 and be used for carrying out the inserted sheet to each silicon chip and handle, insert and wash device 8 and be provided with and insert the frock basket of washing, the silicon chip inserts and inserts in the frock basket of washing.

In the above-mentioned scheme, silicon chip and the brilliant subassembly that holds in the palm that the slicer cutting obtained are placed in the frock basket, transport the frock basket to the mucilage binding that takes off through travelling bogie. And carrying out degumming treatment in a degumming device to separate the silicon wafer from the crystal support component and carrying out slicing treatment. And then, the silicon wafer enters the inserting and washing device for inserting the silicon wafer, so that the automatic operation of the silicon wafer production process is realized, the production efficiency is improved, the manual participation is reduced, the silicon wafer damage can be reduced, and the yield is improved.

Further, a silicon wafer transferring mechanism is arranged between the degumming device and the inserting and washing device and used for transferring the silicon wafers subjected to the wafer treatment to the inserting and washing device. In this embodiment, the silicon wafer transferring mechanism is specifically a belt conveying mechanism, and is used for transferring each silicon wafer to the inserting and washing device.

The embodiment provides a specific implementation manner of a degumming device, and the degumming device provided by the embodiment is used for degumming a silicon wafer.

Fig. 2 is a schematic structural diagram of a degumming device provided in the embodiment of the present application, and fig. 3 is a schematic structural diagram of a silicon wafer placed in a tool basket provided in the embodiment of the present application. As shown in fig. 2 and fig. 3, the degumming apparatus provided in this embodiment includes: a silicon wafer line 21. The silicon wafer operation line 21 is sequentially provided with a degumming station and a glue wiping station, wherein the degumming station is used for degumming the silicon wafer 33 and the crystal support assembly 31 which are contained in the tool basket 5 so as to separate the silicon wafer from the crystal support assembly. The erasing station is used for wiping the adhesive surface of the degummed silicon wafer so as to remove residual adhesive on the adhesive surface of the silicon wafer.

In addition, the degumming device is also provided with a conveying mechanical arm mechanism 24 which is used for grabbing the tool basket 5 and driving the tool basket 5 to move. Specifically, the silicon wafer 33 and the wafer support assembly 31 cut by the slicing machine are placed in the tool basket 5, and the transportation trolley transports the tool basket 5 into the degumming device. The conveying mechanical arm mechanism 24 grabs the tooling basket 5, conveys the tooling basket 5 to a degumming station for degumming, and conveys the tooling basket 5 to a glue wiping station for glue wiping after degumming is completed.

Preferably, a waiting area is arranged in the degumming device, after the transport trolley enters the degumming device, the conveying mechanical arm mechanism 24 conveys the tool basket 5 provided with the silicon wafer and the crystal support assembly to the waiting area for waiting, then the transport trolley returns to the slicing machine for recycling, and after the degumming station is idle, the conveying mechanical arm mechanism 24 conveys the tool basket 5 provided with the silicon wafer and the crystal support assembly and positioned in the waiting area to the degumming station for degumming the silicon wafer.

Further, the degumming device is also provided with a crystal support recovery line 22, and the crystal support recovery line 22 and the silicon wafer operation line 21 are arranged side by side. And a thick sheet removing station is arranged beside the crystal support recycling line 22 and used for removing the thick sheet adhered to the crystal support assembly. The conveying manipulator mechanism 24 is also used for grabbing the crystal support assembly adhered with the thick plate and driving the crystal support assembly to move to the thick plate removing station after the tooling basket moves to the glue wiping station, so that the thick plate is removed. The transfer robot mechanism 24 then places the susceptor assembly on the susceptor recovery line 22 to return the susceptor assembly to the microtome for recycling.

Further, a tool basket recovery line is arranged in the degumming device and is arranged in parallel with the silicon wafer operation line 21 and the crystal support recovery line 22. The conveying manipulator mechanism 24 is also used for conveying the empty work basket to a work basket recycling line for recycling after the silicon wafers are completely sliced and taken away.

A specific implementation manner is as follows: as shown in fig. 2, the wafer processing line 21, the work basket recovery line, and the wafer carrier recovery line 22 are arranged side by side. The transport trolley loads the tooling basket 5, enters the degumming device 2 from the left side, the conveyor manipulator mechanism 24 grabs the tooling basket to move rightwards, enters a waiting area firstly, and then sequentially enters a degumming station and a degumming station. The wafer carrier recovery line 22 and the tool basket recovery line are both transported from right to left to carry the wafer carrier assembly and the tool basket to the left.

The conveying manipulator mechanism 24 is arranged above and has at least six movement directions, so that the conveying manipulator mechanism 24 can move freely on each conveying line, production is matched, and efficiency is improved.

The degumming station is used for degumming the silicon wafer, and the embodiment provides a specific scheme that:

fig. 4 is a schematic structural diagram of a silicon wafer degumming treatment method applied to a degumming device according to an embodiment of the present application, and fig. 5 is a schematic structural diagram of a crystal support assembly and a silicon wafer according to an embodiment of the present application. As shown in fig. 4 and 5, the degumming station is provided with a degumming tank 211, and an image acquisition assembly is arranged above the degumming tank 211. The conveying mechanical arm mechanism 24 lifts the tool basket 5 to move and downwards enters the degumming tank 211 for degumming. After the initial degumming is completed, the conveying manipulator mechanism 24 lifts the tooling basket 5 to the height of the image acquisition assembly, and acquires the side images of the silicon wafer and the crystal support assembly through the image acquisition assembly. And the image acquisition component performs data interaction with the processor.

Firstly, a processor acquires a side image of a silicon wafer and a crystal support assembly, then determines the distance between the top of the silicon wafer and the bottom surface of the crystal support assembly according to the side image, judges whether the distance meets the degumming finishing condition or not, and finishes degumming if the distance meets the degumming finishing condition. In the degumming process, the silicon wafer is separated from the crystal support assembly and falls into the tool basket, and the distance between the silicon wafer and the crystal support assembly is increased, so that whether the silicon wafer is degummed or not can be determined according to the distance between the silicon wafer and the crystal support assembly, automatic identification is realized, high efficiency is achieved, high accuracy is achieved, and the yield is improved.

A specific implementation manner is as follows: acquiring a side image of the silicon wafer and the crystal support assembly, specifically: the method comprises the steps of firstly controlling an image acquisition assembly to move at a constant speed along the length direction of a crystal support assembly, acquiring a plurality of side images of a silicon wafer and the crystal support assembly in the moving process, and then splicing the acquired side images to obtain a group of side images of the whole silicon wafer.

Specifically, fig. 6 is an enlarged view of an area a in fig. 4, and fig. 7 is a schematic structural diagram of an image capturing assembly in the degumming apparatus according to the embodiment of the present application. As shown in fig. 6 and 7, a slide rail 271 extending in the horizontal direction and a driving mechanism are disposed on the frame of the degumming apparatus, and the image collecting component is specifically a degumming collecting camera 272 disposed on the slide rail 271 through a camera bracket 273.

Furthermore, control the uniform motion of image acquisition subassembly along the length direction of brilliant support subassembly, specifically include: the work of control actuating mechanism drives the image acquisition subassembly and moves at the uniform velocity along slide rail 271, and slide rail 271 is the same with the length direction of brilliant support subassembly, promptly: extending in a horizontal direction. The driving mechanism drives the camera bracket 273 to slide in the horizontal direction relative to the sliding rail 271, and drives the degumming acquisition camera 272 to synchronously move. The length of the slide rail 271 is matched with the length of the crystal support assembly, so that the moving stroke of the degumming acquisition camera 272 can shoot the complete images of the crystal support assembly and the silicon wafer.

Further, a light source is disposed on the top of the camera holder 273, and the light source moves together with the camera holder 273. The light source is called as a degumming light source 274, emits light towards the direction of the silicon wafer, and is used for improving the brightness in the shooting field of the camera and improving the image definition. The brightness of the degumming light source 274 may be constant or adjustable. In the embodiment, in the moving process of the camera, the brightness of the light source is adjusted in real time according to the collected side images, so that the brightness of different environments in the degumming device is adapted to obtain images with uniform brightness, bright-dark contrast exists at the edge of the top of the silicon wafer and the bottom of the crystal support assembly, and subsequent image analysis and feature extraction are facilitated to obtain the edge profile.

Alternatively, the light source 274 is an inductive light source, and an inductor is disposed thereon to sense the brightness of the reflected light and automatically adjust the brightness of the output light.

A specific implementation manner is as follows: adjusting the brightness of the light source according to the collected lateral image comprises: determining the gray value of each pixel in the acquired side image; when the average gray value of each pixel is smaller than the lower gray limit value, controlling the light source to increase the brightness; and when the average gray value of each pixel is larger than the gray upper limit value, controlling the light source to reduce the brightness.

The gray value in the image can represent the brightness of the image, the gray value is 0-255, and the smaller the gray value is, the darker the image is; the larger the grayscale value, the brighter the image. Extracting the gray value of each pixel in the image, calculating the average value of the gray values of all the pixels, and if the average value is smaller than the lower gray limit value, indicating that the image is darker and controlling a light source to increase the brightness; if the average value is larger than the upper gray limit value, the image is brighter, and the light source needs to be controlled to reduce the brightness.

Further, in the above step, the distance between the top of the silicon wafer and the bottom surface of the wafer support assembly is determined according to the side image, which can be specifically realized by the following method:

firstly, identifying silicon slice outlines in the side images by adopting an image processing analysis technology, wherein the silicon slice outlines at least comprise top and side outlines. The top edge profile of each wafer was then fitted to a curve. The silicon wafers fall downwards after being degummed, and the silicon wafers which are not completely degummed are still adhered to the crystal support assembly and are higher in position, so that the silicon wafers are uneven.

And identifying the bottom edge profile of the crystal support assembly, wherein the crystal support assembly comprises a crystal support, a metal plate 311 and a resin plate 312 which are sequentially arranged from top to bottom, and the silicon wafer is adhered to the resin plate 312 before degumming. The bottom edge profile of the lowermost resin plate 312 in the susceptor assembly is fitted to a straight line.

And finally, acquiring the vertical distance between the fitting straight line and the fitting curve to acquire the shortest distance D as the distance between the top of the silicon wafer and the bottom surface of the crystal support assembly.

When the shortest distance is within a preset range, the degumming condition is met, degumming is finished, and the subsequent working procedures can be carried out; and if the content is not in the preset range, the degumming condition is not met, and degumming is needed again. The preset range can be set according to different degumming processes or sizes of silicon wafers. For example: the preset range is 5mm-20mm, and when the shortest distance is 5mm-20mm, the degumming condition is satisfied.

Assuming that the degumming acquisition camera 272 and the degumming light source 274 are at fixed heights, after the preliminary degumming is completed, the conveying manipulator mechanism 24 is controlled to work so as to drive the tool basket 5 containing the silicon wafer 33 to ascend to a preset position, and the degumming acquisition camera 272 can be ensured to completely acquire images of the positions where the silicon wafer 33 and the crystal support assembly are glued in the movement process at the preset position.

After the separation of the silicon wafer and the crystal support assembly is confirmed through the scheme, the conveying manipulator mechanism 24 drives the tool basket 5 to move to the transfer groove of the glue wiping station.

On the basis of the above technical solution, the embodiment further provides an implementation manner of the conveying manipulator mechanism 24:

fig. 8 is a schematic structural diagram of a conveying manipulator mechanism in a degumming apparatus provided in an embodiment of the present application. As shown in fig. 8, the transfer robot mechanism 24 includes: longitudinal guide rail 241, transverse guide rail 242, vertical guide rail 243, jaw assembly, vertical driver, transverse driver, longitudinal driver.

The longitudinal guide rails 241 extend along the crystal support recovery line direction, and the number of the longitudinal guide rails 241 is two and the longitudinal guide rails are arranged side by side. The transverse guide 242 is perpendicular to the tray recovery line direction and is disposed between the two longitudinal guides 241. The longitudinal driver is used to drive the transverse rail 242 and the entire jaw assembly to move along the longitudinal rail 241.

The vertical rail 243 extends in a vertical direction and the vertical driver drives the jaw assembly up and down along the vertical rail 243. The transverse driver is used for driving the clamping jaw assembly and the vertical guide rail 243 to integrally move along the transverse guide rail. So that the clamping jaw assembly can move along the longitudinal direction, the transverse direction and the vertical direction.

The clamping jaw assembly is used for clamping the tool basket. Specifically, the clamping jaw subassembly includes: a tooling top plate 2441 and tooling basket clamping jaws 2442. Wherein, frock roof 2441 links to each other with vertical driver. Tooling basket clamping jaw 2442 sets up in the bottom surface of frock roof, and tooling basket clamping jaw 2442 extends along vertical direction, and its bottom is reverse to be buckled and is formed hook-like structure, and hook-like structure is hung on the tooling basket, can hoist the tooling basket.

In the operation process, the clamping jaw assembly is adjusted to reach the upper part of the tooling basket through the transverse driver and the longitudinal driver, then the clamping jaw assembly is driven to descend through the vertical driver, the hooked structure of the clamping jaw 2442 of the tooling basket is located on the side face of the tooling basket, then the clamping jaw assembly is driven to move transversely through the transverse driver, so that the hooked structure of the clamping jaw 2442 of the tooling basket is inserted into the lower part of a suspender in the tooling basket, and then the clamping jaw assembly is driven to ascend through the vertical driver, so that the tooling basket is lifted and moved.

Further, the clamping jaw assembly still includes: a crystal support clamping jaw 2443 for clamping the crystal support assembly and a driving mechanism for driving the crystal support clamping jaw 2443 to transversely move are arranged on the bottom surface of the tooling top plate 2441. The wafer holder clamping jaw 2443 can be moved or elongated in the transverse direction to accommodate the size requirements of the wafer holder assembly. The structure of the wafer holder clamping jaw 2443 can be set according to the hanging structure of the wafer holder assembly, for example: the top of the crystal support component is provided with a T-shaped groove, and the crystal support clamping jaw 2443 is of a T-shaped structure and is inserted into the T-shaped groove at the top of the crystal support component so as to lift the crystal support component.

The wafer support assembly is lifted away by the conveying manipulator mechanism 24, the rest silicon wafers and the tooling basket are shown in fig. 9, and fig. 9 is another schematic structural diagram of the silicon wafer placing device provided by the embodiment of the application in the tooling basket.

Fig. 10 is a partially enlarged schematic view of fig. 2. As shown in fig. 2 and 10, the transfer slot 212 is provided at the glue station 22, and the image capturing assembly and the glue spreading robot 26 are provided beside the transfer slot 323. The image acquisition assembly is used for identifying the residual glue of the silicon wafer, and the glue wiping manipulator mechanism 26 is used for wiping the residual glue of the silicon wafer. Compared with the traditional manual erasing mode, the scheme provided by the embodiment has higher efficiency, and more operators are not needed, so that on one hand, the manpower input is reduced, and the workload of the operators is lightened; on the other hand, the production rate is also improved.

The embodiment provides an implementation manner of a glue wiping manipulator mechanism: fig. 11 is a schematic structural diagram of a frictioning manipulator mechanism in a degumming device according to an embodiment of the present application. As shown in fig. 11, the adhesive applying mechanism 26 includes: a rubber-wiping mechanical arm 262, a rubber-wiping mechanical arm 263. Wherein, the glue wiping manipulator base 261 is fixed on the workbench. The glue wiping robot 262 is rotatably disposed on the glue wiping robot base 261 and is rotatable with respect to the glue wiping robot base 261. The dispensing robot 262 has at least 2 degrees of freedom, and may have more than 2, 3, 4, 5, 6, or 6 degrees of freedom, for example, to enable the working end of the dispensing robot 262 to move precisely. The glue wiping mechanism 263 is disposed at the working end of the glue wiping mechanical arm 262, and is used for wiping residual glue on the silicon wafer.

A specific implementation manner is as follows: fig. 12 is a schematic structural diagram of a glue wiping mechanism in the degumming device according to the embodiment of the present application. As shown in fig. 12, the glue wiping mechanism 263 includes: a roller mount 2631 and a squeegee 2632. The roller holder 2631 is disposed at the working end of the mechanical arm 262 of the dispensing machine. The rubbing roller 2632 is disposed on the roller holder 2631, and the rubbing roller 2632 is rotatable. The surface of the glue wiping roller 2632 is provided with a glue removing layer capable of adhering glue, and the glue wiping roller 2632 rolls on the side of the silicon wafer 33 to take away residual glue on the silicon wafer 33, so that the glue removing effect is achieved. The adhesive removing layer is made of soft and sticky materials.

Further, the image collecting assembly can be disposed on the roller bracket 2631, and the image collecting assembly can be specifically configured to collect the image for the residual glue 264 and disposed on the roller bracket 2631, and the residual glue 264 collects the image toward the silicon wafer. The scrub robot 262 can move according to the collected image to drive the scrub roller 2632 to contact and roll on the silicon wafer.

Further, a light source (i.e., the light source 265 for wiping in fig. 12) may be disposed on the roller holder 2631. The light emitting direction of the glue wiping light source 265 faces the silicon wafer to be glued so as to improve the brightness of the region and facilitate the collection of clear images. The light source 265 may be a monochromatic light source, and the brightness of the light source may be set according to the brightness of the working environment of the degumming apparatus.

A specific scheme is as follows: as shown in fig. 9, a plurality of silicon chips 33 are accommodated in the tool basket 5, and the side of the silicon chip 33 having the residual glue is upward. The residual glue collecting camera 264 is disposed on the lower surface of the roller holder 2631 to collect residual glue images therebelow. The light emitting direction of the rubbing light source 265 is downward to improve the luminance of the lower region.

Based on the above implementation manner of the frictioning station, this embodiment further provides a frictioning method: firstly, acquiring a silicon wafer image of a silicon wafer adhesive surface through an image acquisition assembly. The image acquisition assembly is in data interaction with the processor, the processor acquires a silicon wafer image of the adhesive surface of the silicon wafer, and then whether residual adhesive exists on the adhesive surface of the silicon wafer is determined according to the silicon wafer image. And when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer.

Further, in the above step, the glue wiping manipulator mechanism is controlled to wipe off the residual glue on the adhesive surface of the silicon wafer, and the following method can be specifically adopted:

firstly, acquiring the current position of a glue wiping manipulator mechanism and the position of a silicon wafer, and then controlling the glue wiping manipulator mechanism to move to the adhesive surface of the silicon wafer according to the current position of the glue wiping manipulator mechanism and the position of the silicon wafer; and controlling a glue wiping mechanical arm mechanism to wipe glue on the silicon wafer adhesive surface according to a preset glue wiping track.

Fig. 13 is a schematic structural diagram of a rubber applying robot mechanism in the degumming device according to the embodiment of the present application. As shown in fig. 13, specifically, controlling the gluing manipulator mechanism to glue on the adhesive surface of the silicon wafer according to a preset gluing track includes: and controlling the glue wiping mechanical arm mechanism to move back and forth on the adhesive surface of the silicon wafer along the width direction of the group of silicon wafers from the end part of the group of silicon wafers for wiping until the other end part of the group of silicon wafers is reached. The group of silicon wafers is a collection of all silicon wafers obtained by slicing one silicon rod.

After finishing the frictioning of a group of silicon wafers, the method further comprises the following steps: controlling the gluing manipulator mechanism to move to a preset initial position, and re-acquiring an image of the adhesive surface of the silicon wafer; determining whether residual glue exists on the viscose surface of the silicon wafer again according to the re-acquired image; and when the residual glue exists, controlling the glue wiping manipulator mechanism to wipe the residual glue on the adhesive surface of the silicon wafer again until the residual glue is completely removed.

The embodiment also provides another glue wiping mode: the gluing manipulator mechanism is controlled to glue on the adhesive surface of the silicon wafer according to a preset gluing track, and the following mode can be adopted: acquiring the length of a group of silicon wafers, and dividing the length into at least two sections; and the at least two sections of silicon wafers are respectively wiped repeatedly at least twice, so that the step of acquiring images again in the scheme is omitted, and the wiping quality is improved.

For example: dividing the length into three segments; and respectively wiping the three sections of silicon wafers twice.

In addition, after at least two sections of silicon wafers are respectively wiped, the viscose surface images of the silicon wafers can be respectively collected; and determining whether residual glue exists in each section of silicon wafer according to the viscose surface image of each section of silicon wafer, and if so, wiping the section of silicon wafer again.

A specific implementation manner is as follows: setting a preset photographing initial position, and when needing to perform frictioning, firstly controlling the frictioning manipulator mechanism to move to the initial position for photographing, and acquiring a silicon wafer adhesive surface image. Dividing the adhesive surface of a group of silicon wafers into three sections, moving the section from the initial position to the first section, wiping the section twice along the width direction of the group of silicon wafers in a reciprocating manner, moving the section to the next section, wiping the section twice in a reciprocating manner, and finally moving the section to the third section, wiping the section twice in a reciprocating manner.

And then, respectively photographing the three sections of silicon wafers, analyzing whether residual glue exists in the image of each section of silicon wafer, and controlling the gluing manipulator mechanism to move to the corresponding position to glue again if the residual glue exists.

Furthermore, a light source is arranged in the degumming device and emits light towards the adhesive surface of the silicon wafer, so that the visual field brightness of the image acquisition assembly is improved. In the process of collecting images by the image collecting assembly, the brightness of the light source is adjusted according to the collected silicon wafer images, and the light source can be arranged on the mechanical hand mechanism of the glue wiping machine and also can be arranged on the frame of the glue removing device.

The conveying manipulator mechanism 24 lifts the wafer support assembly in the transfer tank 212, and conveys the wafer support assembly to a thick sheet removing station to separate the thick sheet from the wafer support assembly. The slab removal station is provided with an image acquisition assembly for identifying the slab and a slab removal manipulator mechanism for clamping the slab and separating the slab from the wafer support assembly, and then the conveying manipulator mechanism 24 places the wafer support assembly into the wafer support recovery line 22 so as to transport the wafer support assembly back to the wafer cutting machine for recycling. Fig. 14 is a partial enlarged view of fig. 2, and fig. 15 is a schematic structural view of a thick plate on a wafer support assembly according to an embodiment of the present disclosure. As shown in fig. 2, 14 and 15, specifically, when the conveying robot mechanism 24 drives the wafer support assembly to move to the vicinity of the slab removing robot mechanism 25, the image capturing assembly acquires the front side image and identifies the slab. When the processor identifies the thick sheet according to the image and determines the position of the thick sheet, the thick sheet removing mechanical arm mechanism 25 is controlled to move to the position to clamp the thick sheet, and the thick sheet is driven to move horizontally, move downwards and/or rotate so as to take the thick sheet off the wafer support assembly, and then the thick sheet is placed in the thick sheet collecting region.

The above-described sheet removal robot mechanism 25 may be fixed to the ground or may be fixed to a table higher than the ground. In this embodiment, a workbench is disposed in the degumming apparatus, the slab removing manipulator mechanism 25 is fixed on the workbench, a slab collecting basket 23 is disposed in the slab collecting region, and the slab removed by the slab removing manipulator mechanism 25 is placed in the slab collecting basket 23.

Further, the embodiment provides an implementation manner of the mechanism of the thick sheet removing manipulator:

fig. 16 is a schematic structural view of a slab removing robot mechanism in a degumming device according to an embodiment of the present application. As shown in fig. 16, the slab removal robot mechanism includes: a de-thicknessing robot base 251, a de-thicknessing robot arm 252, and a thick film gripper assembly 253. Wherein, the manipulator base 251 for removing thick pieces is arranged on the workbench. The tablet removal robot 252 is rotatably disposed on the tablet removal robot base 251 and is rotatable with respect to the tablet removal robot base 251. The de-chuck robot 252 has at least 2 degrees of freedom, for example, 2, 3, 4, 5, 6, or 6 or more degrees of freedom, to enable the working end of the de-chuck robot 252 to move precisely. A slab gripper assembly 253 is provided at the working end of the slab removal robot 252 for gripping a slab.

The embodiment provides an implementation method: the slab jaw assembly 253 includes: a jaw carrier, a jaw, and a jaw driver. Wherein, the clamping jaw support is rotatably arranged at the working end of the slab removing mechanical arm 252, and a containing cavity is arranged in the clamping jaw support. The clamping jaw is arranged in the accommodating cavity. The clamping jaw driver is arranged on the clamping jaw support and used for driving the clamping jaw to perform clamping action.

The structure of the clamping jaw can be various, for example, the following modes can be adopted:

fig. 17 is a schematic structural view of a thick-plate clamping jaw assembly in the degumming device according to the embodiment of the application, and fig. 18 is a schematic structural view of a thick plate clamped by the thick-plate clamping jaw assembly in the degumming device according to the embodiment of the application. As shown in fig. 17 and 18, in the present embodiment, the jaw support 2531 has a rectangular parallelepiped structure, and has a receiving cavity therein, and an opening communicating with the receiving cavity is provided at one end.

The clamping jaw includes: two parallel and oppositely arranged clamping plates 2532 are arranged in the accommodating cavity. The jaw drivers 2533 are respectively connected to the two jaws 2532 for driving the two jaws 2532 toward each other to cause a clamping action, and away from each other.

During application, the slab removal robot 252 moves the slab gripper assembly below the slab 32 and adjusts the distance between the two clamp plates 2532 to be greater than the thickness of the slab 32. The slab removal robot 252 drives the slab gripper assembly to move slowly upward until the two clamp plates 2532 are positioned on either side of the slab 32, driving the two clamp plates 2532 closer to each other to contact the slab 32, and applying a clamping force to the slab 32. Then, the wafer chuck assembly may be rotated horizontally to separate the wafer 32 from the wafer chuck assembly 31, in addition to the wafer chuck assembly moving downward or horizontally by the wafer robot 252.

The jaw driver 2533 may be specifically an air cylinder, a hydraulic cylinder, or a driving motor.

Further, the thick plate jaw assembly 253 further includes: and the clamping jaw telescopic driver is arranged in the accommodating cavity, is connected with the clamping jaw and is used for driving the clamping jaw to extend out of the accommodating cavity so as to execute clamping action. Still taking the clamping plate 2532 as an example, specifically, in the non-working state, the clamping jaw telescopic driver drives the clamping plate 2532 to retract into the accommodating cavity, and the clamping jaw bracket 2531 can protect the clamping plate 2532 from being damaged. In the working state, the clamping plate 2532 is driven to move outwards by the clamping jaw extension driver, and the clamping operation of the thick plate is performed by extending from the opening of the clamping jaw bracket 2531.

The image acquisition assembly can be specifically a thick sheet acquisition camera 254 which is arranged on the outer surface of the clamping jaw support 2531, and the thick sheet acquisition camera 254 acquires images towards the direction of the crystal support assembly. The de-thicknessing robot arm 252 may operate based on the captured images.

Further, a light source (i.e., a thick plate light source 255 in FIG. 17) may be disposed on the jaw support 2531. The light emitting direction of the slab light source 255 faces the wafer support assembly to improve the brightness of the region, facilitating the collection of clear images. The thick light source 255 may be a monochromatic light source, and the brightness thereof may be set according to the brightness of the working environment of the degumming apparatus.

After the slab is broken off, the image acquisition assembly can recognize the state, and then the conveying mechanical arm mechanism 24 is controlled by the controller to place the crystal support assembly into the crystal support recovery line 22 and convey the crystal support assembly back to the slicing station for recycling.

Further, this embodiment also provides an implementation manner of the above-mentioned tool basket 5, and this tool basket 5 is used for containing the silicon wafers produced by cutting with the slicing machine, and conveying the silicon wafers to the degumming device for degumming, gumming and slicing. Silicon wafers are transported between different stations through one tooling basket, eliminating the need to transfer silicon wafers from one tooling basket to another.

Fig. 19 is a perspective view, fig. 20 is a side view, and fig. 21 is a plan view of a tool basket according to an embodiment of the present disclosure. As shown in fig. 19 to 21, the present embodiment provides a tool basket including: a tooling basket frame and side support assemblies 52.

Wherein, the tool basket frame can be a cuboid structure, and the length direction of the tool basket frame is the Y direction in fig. 20; the width direction of the tool basket frame is the X direction in FIG. 21; the height direction of the tool basket frame coincides with the vertical direction, such as the Z direction in fig. 20.

An accommodating space for accommodating the silicon wafer is formed in the silicon wafer accommodating device, and an opening for the silicon wafer to enter and exit the accommodating space is formed in the top of the tooling basket frame. A group of silicon wafers from the slicing machine fall from the opening into the accommodating space. The silicon chip is vertically inserted into the accommodating space, the silicon chip is perpendicular to the length direction of the tooling basket frame, and the silicon chips are arranged side by side and are sequentially arranged along the length direction.

The side supporting components 52 are arranged in the accommodating space, are respectively connected to two sides of the tooling basket frame, and are used for clamping silicon wafers from two sides to prevent the silicon wafers from toppling over. The side support component 52 extends along the length direction of the tooling basket frame, the length of the side support component 52 can be set according to the length of a group of silicon wafers, and also can be set according to the length of a silicon rod before slicing, the length of the side support component 52 is slightly larger than the length of a group of silicon wafers, and all the silicon wafers can be clamped.

Be equipped with in the collateral branch supporting component 52 and inhale the piece, when the side of frock basket was equipped with magnetic part, magnetic part and inhale and produce magnetic attraction between the piece, impel and inhale the collateral branch supporting component 52 near the piece of magnetism and outwards warp to the clamp force that makes to the silicon chip disappears, then the silicon chip that loses the clamp force is in free state. The slicing medium is sprayed towards the side of the silicon wafer through the slicing nozzle on the side face of the tooling basket, so that the distance between the silicon wafer and the adjacent silicon wafer is increased, and the slicing effect is achieved. And subsequently taking out the separated silicon wafer for subsequent production procedures.

The tooling basket provided by the embodiment is used for containing silicon wafers output from a slicing machine and then sending the silicon wafers into a degumming device for degumming and slicing, the tooling basket can adapt to degumming stations, frictioning stations and slicing stations, the silicon wafers do not need to be transferred into another tooling basket among the stations, the operating requirements of the stations can be met by using the same tooling basket, the automation of the process flows of the degumming, frictioning and slicing links is realized, on one hand, the time is saved, and the production efficiency is improved; on the other hand, the condition that the silicon wafer is collided and damaged in the transferring process is reduced, the yield is improved, and the production cost is reduced.

The tooling basket frame can be of a box structure and also can be of a hollow skeleton structure. The embodiment provides a specific implementation manner: as shown in fig. 19 to 21, the tool basket frame includes: a frame front panel 511, a frame back panel 512, and a frame bottom panel 513. The frame bottom plate 513 is a rectangular plate, the frame front plate 511 and the frame back plate 512 are parallel and opposite to each other, and the frame front plate 511 and the frame back plate 512 are respectively and vertically connected to two ends of the frame bottom plate 513 in the length direction.

The side support member 52 is connected between the frame front plate 511 and the frame rear plate 512, and the height of the side support member 52 is set according to the height of the silicon wafer, and the side support member 52 is located at or above the center height of the silicon wafer. The number of the side support assemblies 52 is two and are respectively connected to the X-direction edge positions of the frame front plate 511 and the frame rear plate 512.

Fig. 22 is an enlarged view of region B in fig. 21. As shown in fig. 21 and 22, one implementation: the side support assembly 52 includes: an elastic cord 521, a magnetic ring 522 and a cushion sleeve 523. The elastic string 521 extends along the length direction of the tool basket frame and is connected between the frame front plate 511 and the frame rear plate 512. The elastic strands 521 have a certain stretch deformability.

The magnetic ring 522 is used as a magnetic member and is sleeved on the elastic rope. The number of the magnetic rings 522 is plural, and the plural magnetic rings are arranged at intervals. The buffer sleeve 523 is sleeved outside the magnetic rings 522, and is in press fit with the magnetic rings 522, so that relative sliding cannot occur. The damping sleeve 523 and the magnetic ring 522 may rotate together relative to the elastic cord. The magnetic ring 522 may be a circular ring, and may have a diameter of about 10 mm. The magnetic ring 522 may be made of a material that can generate a magnetic attraction with the magnetic member, for example: electromagnets, permanent magnets or iron. In this embodiment, the magnetic ring 522 is an iron ring.

The damping sleeve 523 may be made of a material having a certain damping capacity, such as: rubber, silica gel, sponge, and the like. In this embodiment, a sponge is taken as an example, and the buffering sleeve 523 is specifically a sponge sleeve, so that the silicon wafer is clamped without being damaged.

The elastic string 521 can be connected to the frame front plate 511 and the frame rear plate 512 in the same manner, for example, as follows:

taking the frame front plate 511 as an example, the frame front plate 511 is provided with a front plate through hole 5111, one end of the threaded sleeve 525 is connected with the elastic rope 521, and the other end thereof is inserted into the front plate through hole 5111. The threaded sleeve 525 is provided with a threaded hole matched with the threaded fastener 524, the threaded fastener 524 is inserted into the threaded hole to be tightly connected with the threaded sleeve 525, and the threaded sleeve 525 is fixed on the frame front plate 511.

One way is as follows: the center line of the threaded hole is perpendicular to the center line of the threaded sleeve 525, and a front plate attachment hole having a center line perpendicular to the front plate through hole is formed in the side surface of the frame front plate 511. The threaded fastener 524 passes through the front plate attachment hole and is then screwed into the threaded hole of the threaded sleeve 525 for attachment. The threaded fastener 524 also serves as a stop to prevent the threaded sleeve 525 from coming out of the front plate through hole. The position of the side support assembly can also be adjusted by adjusting the threaded fastener 524 to accommodate different sized silicon wafers.

The other mode is as follows: the centerline of the threaded hole is parallel to the centerline of the threaded sleeve 525. The opening of one end of the front plate through hole 5111, which is far away from the elastic rope, is set to be smaller than the head of the threaded fastener 524, so that the tail of the threaded fastener 524 enters from the front plate through hole 5111 and is screwed and fixed with the threaded hole of the threaded sleeve 525, and the head of the threaded fastener 524 is located on one side of the frame front plate 511, which is far away from the elastic rope 521, so as to limit the threaded sleeve 525 from coming out of the front plate through hole.

Further, the front plate through hole 5111 is an oblong hole extending in the width direction of the tool basket frame. The width between the two side support assemblies 52 can be adjusted by adjusting the position of the threaded sleeve 525 in the oblong hole, so that the silicon wafers with different width sizes can be adapted.

On the basis of the technical scheme, the tooling basket further comprises a bottom supporting component 53 which is arranged at the bottom of the accommodating space, the silicon wafer enters the accommodating space and then is placed on the bottom supporting component 53, and the bottom supporting component 53 plays a role in supporting the silicon wafer from the bottom. Specifically, the bottom support assembly 53 is coupled between the frame front panel 511 and the frame back panel 512. The number of the bottom support members 53 is two and they are arranged at intervals.

The bottom support assembly 53 includes: a stainless steel rod 531 and a rubber sleeve 532. Wherein, the stainless steel rod 531 is vertically connected between the front frame plate 511 and the back frame plate 512, and the rubber sleeve 532 is sleeved outside the stainless steel rod 531. The stainless steel rod 531 plays a role in rigid support, and the rubber sleeve 532 plays a role in buffer protection, so that the silicon wafer is prevented from being damaged.

A group of wafers 33 from the microtome are adhered to the susceptor assembly 31 and placed into the tool basket 5 integrally with the susceptor assembly 31 as shown in detail in fig. 2. And then, conveying the tooling basket into a degumming device for degumming. After degumming, the silicon wafer 33 is separated from the wafer support component 31, the silicon wafer 33 is left in the tool basket 5, the wafer support component 31 is recycled, as shown in fig. 9, a separating station is further arranged behind the degumming station and the glue wiping station, and the tool basket 5 is sent into the separating station after the glue wiping.

Fig. 23 is a schematic structural diagram of a tooling basket entering a slicing station according to an embodiment of the present application. As shown in fig. 23, the silicon wafer line of the degumming apparatus is further provided with a slicing station, and the slicing station is provided with a slicing table 71, a slicing conveying mechanism 721, a magnetic member 722 and a slicing nozzle 723.

The sheet conveying mechanism 721 is provided on the sheet table 71. The work basket 5 is disposed on the slice conveying mechanism 721, and is moved in the longitudinal direction of the work basket 5, that is, in the Y direction in fig. 7 by the slice conveying mechanism 721. The region in which the tool basket 5 moves serves as a stroke region.

The magnetic member 722 is disposed on two sides of the travel area of the tool basket, for example: magnetic parts 722 are symmetrically arranged on two sides of the stroke area of the tool basket. The magnetic member 722 can generate magnetic attraction with the magnetic attraction member (magnetic ring 522) on the tool basket 5. The slicing nozzle 723 is disposed at two sides of the tool basket stroke area, and is adjacent to the magnetic member 722, and an outlet of the slicing nozzle 723 faces the tool basket stroke area. The slicing nozzle 723 may eject a slicing medium, which may be a gas or a liquid.

Taking fig. 23 as an example, the tool basket 5 moves from left to right, when moving to the position of the magnetic member 722, the magnetic force action between the magnetic member 722 and the magnetic ring 522 causes the side support assembly 52 in the area of the magnetic ring 522 to stretch and deform outwards, the silicon wafer 33 at the position is away from the position, the clamping force on the silicon wafer is lost, the slicing nozzle 723 sprays water towards between two adjacent silicon wafers, so that the adjacent silicon wafers are separated, the distance is increased, and the silicon wafers can be conveniently taken out from the tool basket.

The tool basket 5 continues to move rightwards, the magnetic rings 522 sequentially receive magnetic force from the right to the left direction, the side supporting assemblies 52 sequentially stretch outwards to deform, and the silicon wafers losing the clamping force are separated from the adjacent silicon wafers after being sprayed with water and are taken out. In the above scheme, only a small part of the silicon wafer can be taken out after losing the clamping force through the matching of the magnetic part 722 and the magnetic part, and the rest part of the silicon wafer still is in the clamped state and cannot fall over.

The conveying mechanism 721 may specifically include: conveying screw, conveying sliding table and driving motor. Wherein the conveyor screw extends in the longitudinal direction of the tool basket 5. Transport the slip table and pass through screw-thread fit with transporting the screw rod, transport the slip table and link to each other with the frock basket. The driving motor drives the conveying screw to rotate so as to drive the conveying sliding table and the tooling basket 5 to move along the Y direction.

As shown in fig. 10, a belt transport mechanism 41 is provided at the front end of the conveyor screw, and the belt in the belt transport mechanism 41 includes a vertically moving portion and a horizontally moving portion, wherein the vertically moving portion is adjacent to the work basket 5, and the belt is coated with the glue. The silicon wafers after being sliced in the steps are contacted with the surface of the belt, adhered to the belt, and horizontally moved to the inserting and washing device along the direction of the belt moving upwards and away from the tool basket in sequence. Insert the washing device and be equipped with the inserted sheet frock basket in, each silicon chip is inserted in the inserted sheet frock basket.

This embodiment provides another kind of frock basket 5's implementation, carries out the centre gripping to the silicon chip at burst in-process automation, avoids lodging, and can cooperate the burst station to separate the silicon chip.

Fig. 24 is a perspective view of a tool basket provided in an embodiment of the present application, fig. 25 is a perspective view of a silicon wafer mounted on the tool basket provided in the embodiment of the present application, fig. 26 is a side view of the tool basket provided in the embodiment of the present application, fig. 27 is a perspective view of the tool basket provided in the embodiment of the present application and a trigger plate, and fig. 28 is a top view of the tool basket provided in the embodiment of the present application and the trigger plate.

As shown in fig. 24 to 28, the present embodiment provides a tool basket including: a tool rack 54, a side stop assembly 55 and a clamp plate assembly 56. The fixture 54 is a base structure for supporting the silicon wafer and mounting the components. In the present embodiment, the setting tool rest 54 has a longitudinal direction Y, a width direction X, and a height direction Z.

The side blocking assemblies 55 are disposed on two sides of the tool rack 54, and the side blocking assemblies 55 and the tool rack 54 enclose an accommodating space for accommodating the silicon wafer 33. A set of silicon chips 33 gets into accommodation space from the top, and in silicon chip 33 was vertical to be inserted and was located accommodation space, silicon chip 33 was perpendicular to Y direction, and a plurality of silicon chips 33 arranged side by side, arranged in proper order along Y direction.

The debonding apparatus is provided with a trigger plate 73 that cooperates with the clamping plate assembly 56 to effect clamping or unclamping of the silicon wafer 33. The clamp plate assembly 56 is rotatably disposed on the side stop assembly 55. The clamp plate assembly 56 is initially in a first position for clamping the die 33 and rotates relative to the side stop assembly 55 to a second position for releasing the die 33 when acted upon by the trigger plate 73.

The number of the chucking assembly 56 is plural, and they are arranged in order in the Y direction. The arrangement length of the clamping plate component 56 can be set according to the length of a group of silicon wafers, and can also be set according to the length of the silicon rod before slicing, and the arrangement length of the clamping plate component 56 is slightly greater than the length of a group of silicon wafers, so that all the silicon wafers can be clamped.

After the wafer is placed in the tool basket, the clamping plate assembly 56 is in the first position, clamping the wafer 33. The tooling basket is placed into the slicing station, when the tooling basket is subjected to the acting force exerted by the trigger plate 73, a certain clamping plate assembly 56 rotates to the second position, the silicon wafer 33 is loosened, the clamping force on the silicon wafer disappears, and the silicon wafer losing the clamping force is in a free state. The slicing medium is sprayed towards the side of the silicon wafer through the slicing nozzles on the side face of the tool basket, so that the distance between the silicon wafer and the adjacent silicon wafer is increased, and the slicing effect is achieved. And subsequently taking out the separated silicon wafer for subsequent production procedures. While the remaining clamp plate assemblies 56 still clamp the remaining silicon wafers 33.

The tool frame can be of a box-type structure and also can be of a hollow skeleton-type structure. The embodiment provides a specific implementation manner: the tool rack 54 includes: a chassis plate 541, a front chassis plate 542, and a rear chassis plate 543. The chassis plate 541 is a rectangular plate-shaped structure, and the length direction thereof is the Y direction. The front chassis 542 and the rear chassis 543 are parallel, and the front chassis 542 and the rear chassis 543 are connected to both ends of the chassis 541 in a length direction, respectively, and are perpendicular to the length direction of the chassis 541. The side shield assembly 55 is connected between the front chassis 542 and the rear chassis 543.

A specific implementation manner is as follows: the bottom ends of the rear chassis 543 and the front chassis 542 are connected to the chassis 541, and the top end of the rear chassis 543 is higher than the front chassis 542. The top end of the rear frame plate 543 may be higher than the silicon wafer 33, and the silicon wafer 33 may abut against the rear frame plate 543. The front frame plate 542 is detachably connected with the bottom frame plate 541, so that the front frame plate is convenient to disassemble and assemble, and a silicon wafer is also convenient to place.

This embodiment also provides an implementation of a side stop assembly, fig. 29 is an enlarged view of the area C in fig. 24, fig. 30 is a cross-sectional view taken along the direction D-D in fig. 26, and fig. 31 is an enlarged view of the area E in fig. 30; fig. 32 is a schematic structural view of a baffle plate. As shown in fig. 24 to 32, the side shield assembly 55 includes: a clamp stop post 551, a first post 552, and a second post 553. The clamping plate blocking rod 551, the first supporting rod 552 and the second supporting rod 553 are parallel and are vertically connected between the front frame plate 542 and the rear frame plate 543. The clamping plate stop bar 551, the first support bar 552 and the second support bar 553 are distributed on three different vertical surfaces, the clamping plate stop bar 551 is higher than the first support bar 552, and the first support bar 552 is higher than the second support bar 553.

For example: the clamping plate stop bars 551, the first support bar 552 and the second support bar 553 on two sides of the tool rack are symmetrically arranged. The distance between the two second struts 553 is smaller than the distance between the two first struts 552, and the distance between the two clamp bars 551 is smaller than the distance between the two first struts 552.

Specifically, the front frame plate 542 and the rear frame plate 543 are respectively provided with through holes, called frame plate through holes 5421, through which the cleat stop 551, the first strut 552 and the second strut 553 pass, and the frame plate through holes 5421 are oblong holes extending along the width direction of the underframe plate. The clamping plate stop rod 551, the first support rod 552 and the second support rod 553 can move in the oblong holes, and the positions are adjusted to adapt to silicon wafers with different specifications.

The cleat stop lever 551, the first strut 552 and the second strut 553 fixedly couple with a nut through the end of the cleat through hole 5421 to fix the cleat stop lever 551, the first strut 552 and the second strut 553.

Further, the cleat assembly 56 includes: a flapper 561 and a torsion spring 562. The baffle 561 is rotatably connected to the first rod 522 and is located outside the clamping bar 551 and the second rod 553. The middle part of the torsion spring 562 is sleeved on the first supporting rod 552, the bottom end of the torsion spring 562 penetrates into a connecting hole formed in the second supporting rod 553, and the top end of the torsion spring 562 is clamped on the outer side of the baffle 561. In this embodiment, the inner side is directed to the accommodating space; the outer side and the inner side are opposite to each other.

The torsion spring 562 is rotatable with respect to the first rod 552, but one end of the torsion spring 562 is restricted by the second rod 553, the other end is restricted by the stopper 561, a large rotation angle cannot be generated, and it is restored by an elastic force when the external force disappears.

The trigger plate 73 applies an inward force to the bottom end of the flap 561, causing the top of the flap 561 to rotate outward, releasing the silicon chip 33. When the force applied by the trigger plate disappears, the baffle 561 rotates reversely to restore the original state.

A specific implementation manner is as follows: the flapper 561 has an intermediate portion 5611, a clamping portion 5612, and a trigger portion 5613. The gripping portion 5612 is located at the top end of the intermediate portion 5611, and the trigger portion 5613 is located at the bottom end of the intermediate portion 5611. The middle portion 5611 extends vertically and is provided with a collar 56111 that is fitted over the first leg 522. The inside bending of top from middle part 5611 of clamping part 5612, the internal surface of clamping part 5612 is equipped with clamping pad 563, and clamping pad 563 adopts soft material to make, still can protect the silicon chip when exerting the clamp force to the silicon chip, avoids the silicon chip to take place the damage, for example: rubber, silica gel, felt, sponge, etc.

The trigger 5613 is bent outward from the bottom end of the middle portion and extends forward and inward in the direction of the front shelf 542 to engage with the trigger plate 73.

The trigger portion 5613 has a connecting section, a support section, and a trigger section, wherein the connecting section is connected to a bottom end of the intermediate portion 5611. The supporting section extends along the width direction (i.e., the X direction) of the chassis plate 541, and one end thereof is connected to the connecting section and the other end thereof is connected to the triggering section; the trigger segment extends along the length of the chassis plate (i.e., the Y-direction) to mate with the trigger plate.

Further, a bottom receiving assembly 57 may be further provided, which is connected between the front frame plate 542 and the rear frame plate 543, and is located at the bottom of the accommodating space. The number of the bottom receiving members 57 is two and arranged at intervals. The bottom receiving assembly 57 includes: stainless steel pole and rubber sleeve. Wherein, the stainless steel pole is connected perpendicularly between front frame plate 542 and back frame plate 543, and the outside of stainless steel pole is located to the rubber sleeve cover. The stainless steel rod plays a role in rigid support, and the rubber sleeve plays a role in buffering and protection, so that the silicon wafer is prevented from being damaged. The rubber sleeve can be replaced by a sponge sleeve, and can also be made of other soft materials.

Fig. 33 is a top view of another tooling basket applied to a slicing station according to an embodiment of the present disclosure. As shown in fig. 33, the sheet separation station is provided with a sheet separation table 71, a sheet separation conveyance mechanism 721, a sheet separation nozzle 723, and a trigger plate 73.

The sheet conveying mechanism 721 is provided on the sheet table 71. The work basket 5 is disposed on the slice conveying mechanism 721, and is moved in the longitudinal direction of the work basket 5, i.e., in the Y direction in the drawing, by the slice conveying mechanism 721. The region in which the tool basket 5 moves serves as a stroke region.

Trigger plates 73 are provided on either side of the tool basket travel area for applying force to the clamp plate assembly 56 in the tool basket 5. The left side and the right side of the tool basket 5 are provided with trigger plates 73, and the trigger plates 73 on the two sides are symmetrically arranged to simultaneously loosen the two sides of the silicon wafer.

Slice nozzles 723 are disposed on either side of the tooling basket travel area and adjacent to trigger plate 73. The outlet direction of the slice nozzle 723 is towards the tool basket stroke area. The slicing nozzle 723 may eject a slicing medium, which may be a gas or a liquid.

Taking fig. 32 as an example, the tool basket 5 moves from left to right, and when the tool basket moves to the position of the trigger plate 73, the trigger plate 73 applies a force to the shutter 561 to rotate the shutter 561, thereby releasing the silicon wafer 33 at the position. The slicing nozzle 723 sprays water toward between two adjacent silicon wafers to separate the adjacent silicon wafers, so that the distance between the adjacent silicon wafers is increased, and the silicon wafers can be conveniently taken out of the tool basket.

The tool basket 5 continues to move rightwards, the baffles 561 are sequentially acted by the trigger plate 73 from right to left, and rotate sequentially to loosen the silicon wafers, so that the silicon wafers losing the clamping force are separated from the adjacent silicon wafers after being sprayed with water, and then are adhered to the belt conveying mechanism 41 to be conveyed to the inserting and washing device.

In the above-mentioned scheme, the baffle 561 is matched with the trigger plate 73, so that only a small part of the silicon wafer can be taken out after losing the clamping force, and the rest part of the silicon wafer is still in a clamped state and cannot fall over.

The conveying mechanism 721 may specifically include: conveying screw rod, conveying slip table and driving motor. Wherein the conveyor screw extends in the longitudinal direction of the tool basket 5. Transport the slip table and pass through screw-thread fit with transporting the screw rod, transport the slip table and link to each other with the frock basket. The driving motor drives the conveying screw to rotate so as to drive the conveying sliding table and the tooling basket 5 to move along the Y direction.

Claims

1. A silicon wafer production system, comprising:

the slicing machine is used for cutting the silicon rod into silicon wafers and placing the silicon wafers and the crystal support assembly into the tool basket;

the tool basket includes:

the side supporting components are used for clamping the silicon wafers from two sides, are arranged in the accommodating space and are respectively connected to two sides of the tooling basket frame; the side supporting component extends along the length direction of the tooling basket frame; a magnetic suction piece is arranged in the side supporting component.

2. The silicon wafer production system of claim 1, wherein the tooling basket frame comprises: the frame comprises a frame front plate, a frame rear plate and a frame bottom plate;

the frame front plate and the frame rear plate are parallel and opposite to each other, and are respectively and vertically connected to two ends of the length direction of the frame bottom plate;

the side supporting assembly is connected between the frame front plate and the frame rear plate; the bottom support assembly is connected between the frame front plate and the frame back plate.

3. The silicon wafer production system of claim 2, wherein the side support assembly comprises:

the elastic rope extends along the length direction of the tool basket frame and is connected between the frame front plate and the frame rear plate;

the magnetic ring is used as the magnetic attraction piece and sleeved on the elastic rope; a plurality of magnetic rings are arranged at intervals;

and the buffer sleeve is sleeved outside the magnetic rings and is in press fit with the magnetic rings.

4. The silicon wafer production system of claim 3, wherein the tool basket further comprises: a threaded sleeve;

the frame front plate is provided with a front plate through hole; one end of the threaded sleeve is connected with the elastic rope, and the other end of the threaded sleeve is arranged in the through hole of the front plate in a penetrating manner; and a threaded hole matched with the threaded fastener is formed in the threaded sleeve.

5. The silicon wafer production system according to claim 4, wherein the threaded hole of the threaded sleeve is perpendicular to a center line of the threaded sleeve;

the side surface of the frame front plate is provided with a front plate connecting hole for the threaded fastener to pass through, and the central line of the front plate connecting hole is vertical to the front plate through hole; the threaded fastener penetrates through the front plate connecting hole and then is screwed into the threaded hole of the threaded sleeve for fixation;

the front plate through hole is a long round hole and extends along the width direction of the tool basket frame.

6. The silicon wafer production system of claim 2, wherein the tool basket further comprises:

a bottom support member for supporting the silicon wafer from the bottom, the bottom support member being disposed in the accommodating space; the bottom support assembly extends along the length of the tooling basket frame and is connected to the bottom of the tooling basket frame.

7. The silicon wafer production system of claim 6, wherein the bottom support assembly comprises:

the stainless steel rod is vertically connected between the frame front plate and the frame rear plate;

the rubber sleeve is sleeved on the outer side of the stainless steel rod.

8. The silicon wafer production system according to claim 1, wherein the degumming apparatus is provided with a slicing station;

the burst station is provided with:

a slicing workbench;

the conveying mechanism is arranged on the slicing workbench; the tool basket is arranged on the conveying mechanism and can move along the length direction of the tool basket under the driving of the conveying mechanism;

the magnetic parts are used for generating magnetic attraction with the magnetic parts and are arranged on two sides of the stroke area of the tool basket;

the slicing nozzles are used for spraying slicing media and are arranged on two sides of the stroke area of the tooling basket and close to the magnetic part; the outlet direction of the slicing nozzle faces to the stroke area of the tool basket.

9. The silicon wafer production system according to claim 8, wherein the debonding apparatus comprises:

a silicon wafer production line; the silicon wafer production line is provided with a degumming station and a glue wiping station; the degumming station is used for degumming the silicon wafer and the crystal support assembly contained in the tool basket so as to separate the silicon wafer from the crystal support assembly; the glue wiping station is used for wiping the adhesive surface of the degummed silicon wafer so as to remove residual glue on the adhesive surface of the silicon wafer; the slicing station is positioned at the rear end of the glue wiping station;

and the conveying manipulator mechanism is used for grabbing the tooling basket and driving the tooling basket to sequentially move to the degumming station and the frictioning station.

10. The silicon wafer production system according to claim 9, wherein the degumming apparatus further comprises:

the crystal support recovery line is arranged in parallel with the silicon wafer operating line; a thick sheet dismantling station is arranged beside the crystal support recycling line; the thick sheet removing station is used for removing the thick sheet adhered to the crystal support assembly;

the conveying manipulator mechanism is also used for grabbing the crystal support assembly adhered with the thick sheet after degumming at the degumming station, driving the crystal support assembly to move to the thick sheet dismantling station, and putting the crystal support assembly into a crystal support recovery line after the thick sheet is dismantled.

11. The silicon wafer production system according to claim 10, wherein the debonding apparatus further comprises:

the tool basket recycling line is arranged in parallel with the silicon wafer operating line and the crystal support recycling line; and the conveying mechanical arm mechanism is also used for conveying the tool basket above the silicon wafer operation line to a tool basket recovery line.