CN114570684A - Silicon wafer degumming treatment method, treatment system and degumming device - Google Patents
Silicon wafer degumming treatment method, treatment system and degumming device Download PDFInfo
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- CN114570684A CN114570684A CN202210387247.8A CN202210387247A CN114570684A CN 114570684 A CN114570684 A CN 114570684A CN 202210387247 A CN202210387247 A CN 202210387247A CN 114570684 A CN114570684 A CN 114570684A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 210
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 210
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- 239000003292 glue Substances 0.000 claims abstract description 107
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application provides a silicon wafer degumming treatment method, a treatment system and a degumming device, wherein the method comprises the following steps: acquiring a silicon wafer image of a silicon wafer adhesive surface; determining whether residual glue exists on the adhesive surface of the silicon wafer according to the silicon wafer image; and when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer. The silicon wafer degumming treatment method, the silicon wafer degumming treatment system and the silicon wafer degumming device can further perform degumming on the viscose surface of the silicon wafer after primary degumming so as to remove residual gum.
Description
Technical Field
The present disclosure relates to silicon wafer manufacturing technologies, and in particular, to a silicon wafer degumming method, a silicon wafer degumming system, and a silicon wafer degumming apparatus.
Background
The process of manufacturing a sheet-like single crystal silicon cell generally includes: the method comprises the following steps of cutting a cylindrical single crystal silicon rod into square rods, cutting the square rods into square silicon wafers by utilizing diamond wires wound on a cutting roller, and sequentially carrying out cleaning, degumming, inserting and the like.
Before slicing through a slicing machine, glue is coated on the side face of the square rod, so that a silicon wafer obtained through cutting is stuck below the wafer support component and cannot fall off immediately. The silicon wafers fall off one by one through the subsequent degumming process. In the actual process, the side surfaces of the silicon wafers have residual glue under the influence of degumming time, glue layer thickness, degumming temperature and the like, so that each silicon wafer needs to be manually and independently rubbed to remove the residual glue. However, the manual glue wiping mode has low efficiency and easily damages the silicon wafer.
Disclosure of Invention
In order to solve one of the above technical defects, embodiments of the present application provide a silicon wafer degumming processing method, a processing system and a degumming apparatus.
According to a first aspect of the embodiments of the present application, there is provided a silicon wafer degumming treatment method, including:
acquiring a silicon wafer image of a silicon wafer adhesive surface;
determining whether residual glue exists on the adhesive surface of the silicon wafer according to the silicon wafer image;
and when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer.
According to a second aspect of the embodiments of the present application, there is provided a silicon wafer degumming processing system, including:
the image acquisition assembly is used for acquiring a silicon wafer image of the silicon wafer adhesive surface;
the glue wiping manipulator mechanism is used for wiping residual glue on the adhesive surface of the silicon wafer;
and the processor is used for executing the silicon wafer degumming processing method.
According to a third aspect of the embodiments of the present application, there is provided a degumming apparatus comprising: the silicon wafer degumming treatment system as described above;
a silicon wafer operation line is arranged in the degumming device, the silicon wafer operation line is provided with a degumming station and a degumming station, and the silicon wafers positioned in the tooling basket are degummed at the degumming station;
the image acquisition assembly and the gluing manipulator mechanism for identifying the residual glue of the silicon wafer are arranged at the gluing station.
According to the technical scheme provided by the embodiment of the application, the silicon wafer image of the silicon wafer adhesive surface is obtained, and whether residual adhesive exists on the adhesive surface of the silicon wafer is determined according to the silicon wafer image; when the residual glue exists, the glue wiping mechanical arm mechanism is controlled to wipe the residual glue on the adhesive surface of the silicon wafer, so that the automatic identification and automatic wiping of the residual glue on the silicon wafer are realized. Compared with the traditional manual glue wiping mode, the scheme provided by the embodiment can improve the production efficiency of the silicon wafer in response, does not damage the silicon wafer easily, and improves the yield.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a flow chart of a silicon wafer degumming treatment method according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a degumming apparatus provided in an embodiment of the present application;
FIG. 3 is an enlarged partial schematic view of FIG. 2;
fig. 4 is a schematic structural diagram of a frictioning manipulator mechanism in the degumming device provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of a glue wiping mechanism in the degumming device provided in the embodiment of the present application;
fig. 6 is a schematic structural diagram of a rubber applying robot mechanism in the degumming device according to the embodiment of the present application;
FIG. 7 is a schematic structural diagram of a silicon wafer accommodated in a tool basket according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a conveying manipulator mechanism in the degumming device provided by the embodiment of the present application;
fig. 9 is a schematic structural diagram of a silicon wafer degumming treatment method applied to a degumming device according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of a wafer support assembly and a silicon wafer according to an embodiment of the present disclosure;
FIG. 11 is an enlarged view of area A of FIG. 9;
fig. 12 is a schematic structural diagram of an image capturing assembly in a degumming apparatus provided in an embodiment of the present application;
fig. 13 is a schematic structural view of a thick plate on a wafer support assembly according to an embodiment of the present disclosure;
fig. 14 is a schematic structural diagram of a slab removing robot mechanism in a degumming device according to an embodiment of the present application;
fig. 15 is a schematic structural diagram of a thick-plate clamping jaw assembly in the degumming apparatus provided in the embodiment of the present application;
fig. 16 is a schematic structural diagram of a thick sheet clamping component in the degumming apparatus according to the embodiment of the present application for clamping a thick sheet.
Reference numerals:
2-a degumming device; 21-silicon wafer production line; 211-degumming tank; 212-a transit trough; 22-a crystal support recovery line; 23-thick sheet collection basket; 24-a transport robot mechanism; 241-longitudinal guide rails; 242-transverse guide rails; 243-vertical guide rail; 2441-tooling top plate; 2442-tooling basket jaws; 2443-Crystal holder jaw; 25-a slab removing manipulator mechanism; 251-removing a thick sheet mechanical arm base; 252-a de-thicknessing robot arm; 253-thick plate jaw assembly; 2531-jaw holder; 2532-splint; 2533-jaw drive; 254-thick sheet collecting camera; 255-thick light source; 26-a glue wiping manipulator mechanism; 261-a glue spreading manipulator base; 262-a glue wiping mechanical arm; 263-glue wiping mechanism; 2631-roller holder; 2632-a glue roller; 264-residual glue collecting camera; 265-a light source for applying glue; 271-a slide rail; 272-degumming collecting camera; 273-camera support; 274-a degumming light source;
31-a crystal support assembly; 311-metal plate; 312-resin plate; 32-thick piece; 33-a silicon wafer;
5-tooling basket.
Detailed Description
In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The embodiment provides a silicon wafer degumming treatment method, which is used for further erasing residual gum on a silicon wafer after primary degumming.
In practical application, the silicon wafer degumming treatment method can be realized by a computer program, such as application software; alternatively, the method may also be implemented as a medium storing a related computer program, for example, a usb disk, a cloud disk, or the like; still alternatively, the method may be implemented by a physical device, such as a chip, a removable smart device, etc., into which the associated computer program is integrated or installed.
Fig. 1 is a flowchart of a silicon wafer degumming treatment method provided in an embodiment of the present application. As shown in fig. 1, the method for degumming a silicon wafer provided in this embodiment includes:
and step 10, obtaining a silicon wafer image of the silicon wafer adhesive surface.
An image acquisition component and a gluing manipulator mechanism are arranged in the degumming device, wherein the image acquisition component is used for acquiring the silicon wafer image of the adhesive surface of the silicon wafer.
And 20, determining whether residual glue exists on the adhesive surface of the silicon wafer according to the silicon wafer image.
And step 30, when the residual glue exists, controlling a glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer.
The processor can acquire the silicon wafer image acquired by the image acquisition assembly, and then process and analyze the silicon wafer image to determine whether the adhesive surface of the silicon wafer has adhesive. When the adhesive exists, the processor controls the adhesive wiping manipulator mechanism to wipe the adhesive surface of the silicon wafer so as to wipe off the residual adhesive.
According to the technical scheme provided by the embodiment, the silicon wafer image of the silicon wafer adhesive surface is obtained, and whether residual adhesive exists on the adhesive surface of the silicon wafer is determined according to the silicon wafer image; when the residual glue exists, the glue wiping mechanical arm mechanism is controlled to wipe the residual glue on the adhesive surface of the silicon wafer, so that the automatic identification and automatic wiping of the residual glue on the silicon wafer are realized. Compared with the traditional manual glue wiping mode, the scheme provided by the embodiment can improve the production efficiency of the silicon wafer in response, does not damage the silicon wafer easily, and improves the yield.
Further, in the step 30, the glue wiping manipulator mechanism is controlled to wipe off the residual glue on the adhesive surface of the silicon wafer, which may specifically adopt the following mode:
firstly, acquiring the current position of a glue wiping manipulator mechanism and the position of a silicon wafer, and then controlling the glue wiping manipulator mechanism to move to the adhesive surface of the silicon wafer according to the current position of the glue wiping manipulator mechanism and the position of the silicon wafer; and controlling the frictioning manipulator mechanism to perform frictioning on the adhesive surface of the silicon wafer according to a preset frictioning track.
Specifically, according to predetermineeing the frictioning orbit control frictioning manipulator mechanism and carry out the frictioning on silicon chip viscose face, include: and controlling the glue wiping mechanical arm mechanism to move back and forth on the adhesive surface of the silicon wafer along the width direction of the group of silicon wafers from the end part of the group of silicon wafers for wiping until the other end part of the group of silicon wafers is reached. The group of silicon wafers is a collection of all silicon wafers obtained by slicing one silicon rod.
After finishing the frictioning of a group of silicon wafers, the method further comprises the following steps: controlling the gluing manipulator mechanism to move to a preset initial position, and acquiring an image of the adhesive surface of the silicon wafer again; determining whether residual glue exists on the adhesive surface of the silicon wafer again according to the re-acquired image; and when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer again until the residual glue is completely removed.
The embodiment also provides another glue wiping mode: controlling the frictioning manipulator mechanism to frictioning on the silicon wafer adhesive surface according to a preset frictioning track, and adopting the following mode: acquiring the length of a group of silicon wafers, and dividing the length into at least two sections; and the at least two sections of silicon wafers are respectively wiped repeatedly at least twice, so that the step of acquiring images again in the scheme is omitted, and the wiping quality is improved.
For example: dividing the length into three sections; and respectively wiping the three sections of silicon wafers twice. In addition, after at least two sections of silicon wafers are respectively wiped, the adhesive surface images of the silicon wafers can be respectively collected; and determining whether residual glue exists in each section of silicon wafer according to the viscose surface image of each section of silicon wafer, and if so, wiping the section of silicon wafer again.
A specific implementation manner is as follows: setting a preset photographing initial position, and when needing to perform frictioning, firstly controlling the frictioning manipulator mechanism to move to the initial position for photographing, and acquiring a silicon wafer adhesive surface image. Dividing the viscose surfaces of a group of silicon wafers into three sections, moving the section from the initial position to the first section, wiping the section twice along the width direction of the group of silicon wafers in a reciprocating manner, moving the section to the next section, wiping the section twice in a reciprocating manner, and finally moving the section to the third section, wiping the section twice in a reciprocating manner.
And then respectively photographing the three sections of silicon wafers, analyzing whether residual glue exists in the image of each section of silicon wafer, and controlling the glue wiping mechanical arm mechanism to move to the corresponding position for glue wiping again if the residual glue exists.
Furthermore, a light source is arranged in the degumming device, and the light source emits light towards the silicon wafer adhesive surface and is used for improving the visual field brightness of the image acquisition assembly. In the process of collecting images by the image collecting assembly, the brightness of a light source is adjusted according to the collected images of the silicon wafer, and the light source can be arranged on the mechanical hand mechanism of the glue wiping machine and also can be arranged on a frame of the glue removing device.
Based on the foregoing scheme, this embodiment provides a silicon wafer degumming processing system, including: the device comprises an image acquisition component for acquiring a silicon wafer image of a silicon wafer adhesive surface, a glue wiping manipulator mechanism for wiping residual glue on the silicon wafer adhesive surface, and a processor for executing the silicon wafer degumming processing method provided by any content.
This embodiment also provides a degumming apparatus, including: the silicon wafer degumming treatment system.
Fig. 2 is a schematic structural diagram of a degumming apparatus provided in an embodiment of the present application, and fig. 3 is a partially enlarged schematic diagram in fig. 2. As shown in fig. 2 and fig. 3, the degumming apparatus 2 provided in this embodiment includes: the silicon wafer production line 21 is provided with a degumming station, a glue wiping station and the like, and the glue wiping station is used for placing the silicon wafers obtained after degumming through the degumming station. Specifically, the degumming station is provided with a degumming tank 211, and the frictioning station is provided with a transfer tank 212. The silicon wafer and the crystal support assembly cut by the slicing machine are firstly degummed in the degummed groove 211, and then the silicon wafer 33 enters the transfer groove 212 to erase the residual glue on the side edge of the silicon wafer.
An image acquisition assembly is arranged beside the glue wiping station and used for identifying residual glue on the silicon wafer 33. And a frictioning manipulator mechanism 26 is arranged beside the frictioning station and used for erasing the silicon wafer 33 according to the residual gum position identified by the image acquisition assembly so as to remove the residual gum.
On the basis of the technical scheme, the conveying manipulator mechanism 24 is adopted to drive the silicon wafer 33 to move on the silicon wafer production line and move from the degumming tank 211 to the transfer tank 212. In a specific implementation mode, the silicon wafer 33 is placed in the tool basket 5, and the conveying manipulator mechanism 24 grabs the tool basket 5 containing the silicon wafer to be degummed and drives the tool basket 5 to descend into the degummed groove for degummed. After degumming, the conveying manipulator mechanism 24 drives the tooling basket 5 to ascend, and the silicon wafers 33 fall into the tooling basket 5. Then the conveying manipulator mechanism 24 drives the tooling basket 5 to move to the frictioning station, the tooling basket 5 is placed into the transfer groove, and then the silicon wafer 33 is automatically frictionized through the frictioning manipulator mechanism 26.
The frictioning robot mechanism 26 may be fixed to the ground or to a table above the ground. In this embodiment, a work table is provided in the degumming apparatus, and the rubber applying manipulator mechanism 26 is fixed to the work table.
The embodiment provides an implementation manner of a gluing manipulator mechanism: fig. 4 is a schematic structural diagram of a frictioning manipulator mechanism in the degumming device provided by the embodiment of the application. As shown in fig. 4, the squeegee robot mechanism 26 includes: a rubber wiping mechanical arm 262, a rubber wiping mechanical arm 261 and a rubber wiping mechanism 263. Wherein, the glue wiping manipulator base 261 is fixed on the work table. The glue wiping mechanical arm 262 is rotatably disposed on the glue wiping mechanical arm base 261 and can rotate relative to the glue wiping mechanical arm base 261. The dispensing robot 262 has at least 2 degrees of freedom, and may have more than 2, 3, 4, 5, 6, or 6 degrees of freedom, for example, to enable the working end of the dispensing robot 262 to move precisely. The glue wiping mechanism 263 is disposed at the working end of the glue wiping mechanical arm 262, and is used for wiping residual glue on the silicon wafer.
A specific implementation manner is as follows: fig. 5 is a schematic structural diagram of a glue wiping mechanism in the degumming device according to the embodiment of the application. As shown in fig. 5, the glue wiping mechanism 263 includes: a roller mount 2631 and a squeegee 2632. The roller holder 2631 is disposed at the working end of the mechanical arm 262 of the dispensing machine. The rubbing roller 2632 is disposed on the roller holder 2631, and the rubbing roller 2632 is rotatable. The surface of the glue wiping roller 2632 is provided with a glue removing layer capable of adhering glue, and the glue wiping roller 2632 rolls on the side of the silicon wafer 33 to take away residual glue on the silicon wafer 33, so that the glue removing effect is achieved.
Further, the image collecting assembly can be arranged on the roller bracket 2631, the image collecting assembly can specifically collect the camera 264 for the residual glue, and is arranged on the roller bracket 2631, and the residual glue collects the image of the camera 264 towards the direction of the silicon chip. The scrub robot 262 can move according to the collected image to drive the scrub roller 2632 to contact and roll on the silicon wafer.
Further, a light source (i.e., the light source 265 for frictioning in FIG. 5) may be disposed on the roller bracket 2631. The light emitting direction of the glue wiping light source 265 faces the silicon wafer to be glued so as to improve the brightness of the region and facilitate the collection of clear images. The light source 265 may be a monochromatic light source, and the brightness of the light source may be set according to the brightness of the working environment of the degumming apparatus.
Fig. 6 is a schematic structural diagram of a rubber applying robot mechanism in a degumming device according to an embodiment of the present application. Fig. 6 shows the glue-wiping robot 26 for wiping the adhesive surfaces of the silicon wafers and reciprocating the same along the width direction of the group of silicon wafers.
A specific scheme is as follows: fig. 7 is a schematic structural diagram of a silicon wafer accommodated in a tool basket according to an embodiment of the present application. As shown in fig. 7, a plurality of silicon chips 33 are accommodated in the tool basket 5, and the side of the silicon chip 33 having the residual glue is upward. The residual glue collecting camera 264 is disposed on the lower surface of the roller bracket 2631 to collect residual glue images therebelow. The light emitting direction of the rubbing light source 265 is downward to improve the luminance of the lower region.
On the basis of the technical scheme, the degumming device further comprises a crystal support recycling line 22 which is arranged side by side with the silicon wafer operating line 21. The conveying manipulator mechanism 24 can grab the crystal support assembly from the transfer tank and drive the crystal support assembly to move above the crystal support recovery line 22, and then the crystal support assembly is placed into the crystal support recovery line 22 and conveyed back to the slicing machine station for recycling besides grabbing the tool basket to move in the silicon wafer operation line 21.
On the basis of the above technical solution, the present embodiment further provides an implementation manner of the conveying manipulator mechanism 24: fig. 8 is a schematic structural diagram of a conveying manipulator mechanism in a degumming apparatus provided in an embodiment of the present application. As shown in fig. 8, the transfer robot mechanism 24 includes: longitudinal rail 241, transverse rail 242, vertical rail 243, jaw assembly, vertical drive, transverse drive, longitudinal drive.
The longitudinal rails 241 extend in the direction of the tray collecting line 22, and the number of the longitudinal rails 241 is two and the longitudinal rails are arranged side by side. The transverse guide 242 is perpendicular to the direction of the wafer carrier recovery line and is disposed between the two longitudinal guides 241. The longitudinal driver is used to drive the transverse rail 242 and the jaw assembly to move along the longitudinal rail 241 as a whole.
The vertical rail 243 extends in a vertical direction and the vertical driver drives the jaw assembly up and down along the vertical rail 243. The lateral driver is used to drive the jaw assembly and the vertical rail 243 to move integrally along the lateral rail. So that the clamping jaw assembly can move along the longitudinal direction, the transverse direction and the vertical direction.
The jaw assembly is used for gripping the tool basket 5. Specifically, the jaw assembly 244 includes: a tooling top plate 2441 and tooling basket clamping jaws 2442. Wherein, frock roof 2441 links to each other with vertical driver. Tooling basket clamping jaw 2442 sets up in the bottom surface of frock roof, and tooling basket clamping jaw 2442 extends along vertical direction, and its bottom is reverse to be buckled and is formed hook-like structure, and hook-like structure is hooked on tooling basket 5, can hoist tooling basket 5.
In the operation process, the clamping jaw assembly is adjusted to reach the upper side of the tool basket through the transverse driver and the longitudinal driver, then the clamping jaw assembly is driven to descend through the vertical driver, the hooked structure of the clamping jaw 2442 of the tool basket is located on the side face of the tool basket, then the clamping jaw assembly is driven to move transversely through the transverse driver, so that the hooked structure of the clamping jaw 2442 of the tool basket is inserted into the lower portion of a hanging rod in the tool basket, then the clamping jaw assembly is driven to ascend through the vertical driver, and the tool basket is lifted and moved.
On the basis of the above technical solution, the conveying manipulator mechanism 24 is further provided with a crystal support clamping jaw 2443 for clamping the crystal support assembly, and the crystal support clamping jaw is used for grabbing the crystal support assembly located at the glue wiping station and conveying the crystal support assembly to the crystal support recovery line 22. The wafer holding clamp 2443 includes: the clamping jaw comprises a clamping jaw body and a clamping jaw driver for driving the clamping jaw body to move along the transverse direction so as to adapt to crystal support assemblies with different sizes.
The end part of the crystal support recycling line 22 is provided with a thick sheet collecting area, and the side of the thick sheet collecting area is provided with an image collecting component and a thick sheet removing mechanical arm mechanism 25. The image acquisition assembly is used for acquiring images and identifying the thick plate. The thick sheet removing mechanical arm mechanism 25 is used for clamping a thick sheet, separating the thick sheet from the crystal support component, equivalently breaking off the thick sheet, then putting the broken thick sheet into a thick sheet collecting region, realizing automatic identification after degumming and directly breaking off the thick sheet, reducing the participation of personnel, improving the production efficiency on the one hand, and ensuring the life safety of the personnel on the other hand.
In the above scheme, the conveying manipulator mechanism 24 first grabs the tooling basket and enters the degumming tank to perform degumming, and then drives the tooling basket to enter the transfer tank. And then the conveying manipulator mechanism 24 grabs the wafer support assembly separated from the silicon wafer after degumming and moves to the position near the wafer removing manipulator mechanism 25, and the image acquisition assembly acquires an image and identifies the wafer. After the image acquisition assembly identifies the slab and determines the position of the slab, the slab on the wafer carrier assembly is broken off by the slab removal manipulator mechanism 25. Finally, the transfer robot mechanism 24 places the remaining wafer boat assemblies in the wafer boat recovery line 22. And an image of the residual silicon wafer in the transfer tank is acquired through an image acquisition assembly beside the frictioning station, so that the frictioning mechanical arm mechanism 26 rubs the silicon wafer.
The above-described tablet removing robot mechanism 25 may be fixed to the floor surface or may be fixed to a table higher than the floor surface. In this embodiment, a workbench is disposed in the degumming apparatus, the slab removing manipulator mechanism 25 is fixed on the workbench, a slab collecting basket 23 is disposed in the slab collecting region, and the slab removed by the slab removing manipulator mechanism 25 is placed in the slab collecting basket 23.
On the basis of the technical scheme, the conveying mechanical arm mechanism 24 grabs the tooling basket and enters the degumming tank for degumming. In the degumming process, the silicon wafer is separated from the crystal support assembly and falls into the tool basket, and the distance between the silicon wafer and the crystal support assembly is increased, so that whether the silicon wafer is degummed or not can be determined according to the distance between the silicon wafer and the crystal support assembly.
After the degumming step is primarily completed, side images of the silicon wafer and the crystal support assembly are obtained, the distance between the top of the silicon wafer and the bottom of the crystal support assembly is determined according to the side images, whether the distance meets degumming finishing conditions or not is judged, degumming is finished if the distance meets the degumming finishing conditions, and the degumming condition is automatically identified. Compare in the mode that relies on human eye identification in traditional scheme, the technical scheme that this embodiment provided has realized automatic identification, has higher efficiency, and has higher degree of accuracy, is favorable to improving the yield.
Fig. 9 is a schematic structural diagram of a silicon wafer degumming treatment method applied to a degumming device according to an embodiment of the present application, and fig. 10 is a schematic structural diagram of a crystal support assembly and a silicon wafer according to an embodiment of the present application. As shown in fig. 9 and 10, the present embodiment provides a degumming apparatus, in which a conveying robot mechanism 24 is disposed at the top, a degumming tank 221 is disposed at the lower part, and an image acquisition assembly for identifying the degumming state is disposed above the degumming tank 221. A group of silicon wafers cut by the slicing machine and the crystal support assembly are loaded into the tool basket 5, and the tool basket 5 is conveyed into the degumming device through the transport trolley. The conveying manipulator mechanism 24 lifts the tool basket 5 to move and downwards enters the degumming tank 221 for degumming. After the degumming is primarily completed, the conveying manipulator mechanism 24 lifts the tooling basket 5 to the height of the image acquisition assembly, and acquires the side images of the silicon wafer and the crystal support assembly through the image acquisition assembly.
A specific implementation manner is as follows: the above-mentioned side image of obtaining silicon chip and brilliant support subassembly can be specifically: the method comprises the steps of firstly controlling an image acquisition assembly to move at a constant speed along the length direction of a crystal support assembly, acquiring a plurality of side images of a silicon wafer and the crystal support assembly in the moving process, and then splicing the acquired side images to obtain a group of side images of the whole silicon wafer.
Specifically, fig. 11 is an enlarged view of an area a in fig. 9, and fig. 12 is a schematic structural diagram of an image capturing assembly in the degumming apparatus according to the embodiment of the present application. As shown in fig. 11 and 12, a slide rail 271 extending in the horizontal direction and a driving mechanism are disposed on the frame of the degumming apparatus, and the image collecting component, specifically, the degumming collecting camera 272, is disposed on the slide rail 271 through a camera bracket 273.
Further, control the image acquisition subassembly and hold in the palm the length direction uniform velocity of subassembly along the crystalline substance and move, specifically include: the work of control actuating mechanism drives the image acquisition subassembly and moves at the uniform velocity along slide rail 271, and slide rail 271 is the same with the length direction of brilliant support subassembly, promptly: extending in a horizontal direction. The driving mechanism drives the camera bracket 273 to slide along the horizontal direction relative to the sliding rail 271, and drives the degumming acquisition camera 272 to synchronously move. The length of the slide rail 271 is matched with the length of the crystal support assembly, so that the moving stroke of the degumming acquisition camera 272 can shoot the complete images of the crystal support assembly and the silicon wafer.
Further, a light source is provided on the top of the camera holder 273, and the light source moves together with the camera holder 273. The light source is called as a degumming light source 274, emits light towards the direction of the silicon wafer, and is used for improving the brightness in the shooting visual field of the camera and improving the image definition. The brightness of the degumming light source 274 may be constant or adjustable. In the embodiment, in the moving process of the camera, the brightness of the light source is adjusted in real time according to the collected side images, so that the brightness of different environments in the degumming device is adapted to obtain images with uniform brightness, bright-dark contrast exists at the edge of the top of the silicon wafer and the bottom of the crystal support assembly, and subsequent image analysis and feature extraction are facilitated to obtain the edge profile.
Alternatively, the light source 274 is an inductive light source, and a sensor is disposed thereon to sense the brightness of the reflected light and automatically adjust the brightness of the output light.
A specific implementation manner is as follows: adjusting the brightness of the light source according to the collected lateral image comprises: determining the gray value of each pixel in the acquired side image; when the average gray value of each pixel is smaller than the lower gray limit value, controlling the light source to increase the brightness; and when the average gray value of each pixel is larger than the gray upper limit value, controlling the light source to reduce the brightness.
The gray value in the image can represent the brightness of the image, the gray value is 0-255, and the smaller the gray value is, the darker the image is; the larger the grayscale value, the brighter the image. Extracting the gray value of each pixel in the image, calculating the average value of the gray values of all the pixels, and if the average value is smaller than the lower gray limit value, indicating that the image is darker and needing to control a light source to increase the brightness; if the average value is larger than the upper gray limit value, the image is brighter, and the light source needs to be controlled to reduce the brightness.
Further, the distance between the top of the silicon wafer and the bottom surface of the wafer support assembly is determined according to the side image, which can be specifically realized by adopting the following mode:
firstly, identifying silicon slice outlines in the side images by adopting an image processing and analyzing technology, wherein the silicon slice outlines at least comprise top and side outlines. The top edge profile of each wafer was then fit to a curve. The silicon wafers fall downwards after being degummed, and part of the silicon wafers which are not degummed are still stuck on the crystal support assembly and are higher in position, so that the silicon wafers are uneven.
And identifying the bottom edge profile of the crystal support assembly, wherein the crystal support assembly comprises a crystal support, a metal plate 311 and a resin plate 312 which are sequentially arranged from top to bottom, and the silicon wafer is adhered to the resin plate 312 before degumming. The bottom edge profile of the lowermost resin plate 412 in the tray assembly is fitted to a straight line.
And finally, acquiring the vertical distance between the fitting straight line and the fitting curve to obtain the shortest distance D as the distance between the top of the silicon wafer and the bottom surface of the crystal support assembly.
When the shortest distance is within a preset range, the degumming condition is met, degumming is finished, and the subsequent working procedures can be carried out; if the content is not within the preset range, the degumming condition is not met, and degumming needs to be carried out again. The preset range can be set according to different degumming processes or sizes of silicon wafers. For example: the preset range is 5mm-20mm, and when the shortest distance is 5mm-20mm, the degumming condition is satisfied.
Assuming that the degumming acquisition camera 272 and the degumming light source 274 are at a fixed height, after the preliminary degumming is completed, the conveying manipulator mechanism 24 is controlled to work so as to drive the tool basket 5 containing the silicon wafer 33 to ascend, and the degumming acquisition camera 272 can completely acquire images at the positions where the silicon wafer 33 and the crystal support assembly are glued in the movement process.
According to the technical scheme provided by the embodiment, manual operation is reduced, degumming detection is automatically completed in the degumming device, the crystal support component is automatically taken away after degumming, the production efficiency and the yield are improved, and important technical support is provided for the following steps of slicing, inserting and the like.
Further, the embodiment provides an implementation manner of the mechanism of the thick sheet removing manipulator:
fig. 13 is a schematic structural view of a slab on a wafer support assembly according to an embodiment of the present disclosure, and fig. 14 is a schematic structural view of a slab removing robot mechanism in a degumming apparatus according to an embodiment of the present disclosure. As shown in fig. 13, the slab 32 is located below the susceptor assembly.
As shown in fig. 14, the slab removal robot mechanism includes: a de-thicknessing robot base 251, a de-thicknessing robot arm 252, and a thick film gripper assembly 253. Wherein, the robot base 251 is disposed on the worktable. The tablet removal robot 252 is rotatably disposed on the tablet removal robot base 251 and is rotatable with respect to the tablet removal robot base 251. The de-chuck robot 252 has at least 2 degrees of freedom, for example, 2, 3, 4, 5, 6, or 6 or more degrees of freedom, to enable the working end of the de-chuck robot 252 to move precisely. A slab gripper assembly 253 is provided at the working end of the slab removal robot 252 for gripping the slab.
The embodiment provides an implementation manner: the slab jaw assembly 253 includes: a jaw support, a jaw, and a jaw driver. Wherein the gripper bracket is rotatably disposed at the working end of the de-thicknessing robot arm 252, and an accommodating cavity is disposed in the gripper bracket. The clamping jaw is arranged in the accommodating cavity. The clamping jaw driver is arranged on the clamping jaw support and used for driving the clamping jaw to perform clamping action.
The structure of the clamping jaw can be various, for example, the following modes can be adopted:
fig. 15 is a schematic structural diagram of a thick sheet clamping jaw assembly in the degumming apparatus provided in the embodiment of the present application, and fig. 16 is a schematic structural diagram of a thick sheet clamping jaw assembly in the degumming apparatus provided in the embodiment of the present application. As shown in fig. 15 and 16, in the present embodiment, the jaw housing 2531 has a rectangular parallelepiped structure, and is provided with a housing cavity therein, and an opening communicating with the housing cavity is provided at one end.
The clamping jaw includes: two parallel and oppositely arranged clamping plates 2532 are arranged in the accommodating cavity. The jaw drivers 2533 are respectively connected to the two clamp plates 2532 for driving the two clamp plates 2532 toward each other to generate a clamping action, and away from each other.
During application, the slab removal robot 252 moves the slab gripper assembly below the slab 32 and adjusts the distance between the two clamp plates 2532 to be greater than the thickness of the slab 32. The slab removal robot 252 drives the slab gripper assembly to move slowly upward until the two clamp plates 2532 are positioned on either side of the slab 32, driving the two clamp plates 2532 closer to each other to contact the slab 32, and applying a clamping force to the slab 32. Thereafter, the wafer removal robot 252 may move the wafer chuck assembly downward or horizontally, or may rotate horizontally to separate the wafer 32 from the wafer support assembly 31.
The clamping jaw driver can be an air cylinder, a hydraulic cylinder or a driving motor.
Further, the thick plate jaw assembly 253 further includes: and the clamping jaw telescopic driver is arranged in the accommodating cavity, is connected with the clamping jaw and is used for driving the clamping jaw to extend out of the accommodating cavity so as to execute clamping action. Still taking the clamping plate 2532 as an example, specifically, in the non-working state, the clamping jaw telescopic driver drives the clamping plate 2532 to retract into the accommodating cavity, and the clamping jaw bracket 2531 can protect the clamping plate 2532 from being damaged. In the working state, the clamping plate 2532 is driven to move outwards by the clamping jaw telescopic driver, and extends out of the opening of the clamping jaw bracket 2531 to perform the operation of clamping the thick sheet.
The image acquisition assembly can be specifically a thick sheet acquisition camera 254 which is arranged on the outer surface of the clamping jaw support 2531, and the thick sheet acquisition camera 254 acquires images towards the direction of the crystal support assembly. The de-thicknessing robot arm 252 may operate based on the captured images.
Furthermore, a light source (i.e., a thick light source 255 in the figure) can be disposed on the jaw support 2531. The light exiting direction of the thick sheet light source 255 faces the crystal support assembly to improve the brightness of the area, so that a clear image can be conveniently collected. The thick sheet light source 255 may be a monochromatic light source, and the brightness thereof may be set according to the brightness of the working environment of the degumming apparatus.
After the slab is broken off, the image acquisition assembly can recognize the state, and then the conveying mechanical arm mechanism 24 is controlled by the controller to drive the crystal support assembly to move, and the crystal support recovery line 22 is placed in the crystal support assembly, so that the crystal support assembly is conveyed back to the slicing station for recycling.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein. The scheme in the embodiment of the application can be implemented by adopting various computer languages, such as object-oriented programming language Java and transliterated scripting language JavaScript.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A silicon wafer degumming treatment method is characterized by comprising the following steps:
acquiring a silicon wafer image of a silicon wafer adhesive surface;
determining whether residual glue exists on the adhesive surface of the silicon wafer according to the silicon wafer image;
and when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer.
2. The method of claim 1, wherein controlling the frictioning robot mechanism to scrub the residual glue on the adhesive surface of the silicon wafer comprises:
acquiring the current position of a frictioning manipulator mechanism and the position of a silicon wafer;
controlling the gluing manipulator mechanism to move to the adhesive surface of the silicon wafer according to the current position of the gluing manipulator mechanism and the position of the silicon wafer;
and controlling a glue wiping mechanical arm mechanism to wipe glue on the silicon wafer adhesive surface according to a preset glue wiping track.
3. The method of claim 2, wherein the step of controlling the glue wiping manipulator mechanism to wipe the silicon wafer adhesive surface according to the preset glue wiping track comprises the following steps:
and controlling the frictioning manipulator mechanism to reciprocate on the adhesive surface of the silicon wafer along the width direction of the group of silicon wafers from the end part of the group of silicon wafers for frictioning until the silicon wafers reach the other end part of the group of silicon wafers.
4. The method of claim 3, further comprising, after the step of rubbing the set of silicon wafers, the step of:
controlling the gluing manipulator mechanism to move to a preset initial position, and re-acquiring an image of the adhesive surface of the silicon wafer;
determining whether residual glue exists on the adhesive surface of the silicon wafer again according to the re-acquired image;
and when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer again.
5. The method of claim 2, wherein the step of controlling the glue wiping manipulator mechanism to wipe the silicon wafer adhesive surface according to the preset glue wiping track comprises the following steps:
acquiring the length of a group of silicon wafers, and dividing the length into at least two sections;
and respectively wiping at least two sections of silicon wafers repeatedly for at least two times.
6. The method of claim 5, further comprising, after the wiping of at least two segments of the wafer, respectively:
respectively collecting adhesive surface images of at least two sections of silicon wafers;
and determining whether residual glue exists in each section of silicon wafer according to the glue surface images of at least two sections of silicon wafers, and if so, wiping the section of silicon wafer again.
7. The method of claim 2, further comprising:
and adjusting the brightness of a light source according to the acquired silicon wafer image, wherein the light source is arranged on the frictioning manipulator mechanism.
8. A silicon wafer degumming treatment system is characterized by comprising:
the image acquisition assembly is used for acquiring a silicon wafer image of the silicon wafer adhesive surface;
the glue wiping manipulator mechanism is used for wiping residual glue on the adhesive surface of the silicon wafer;
a processor for performing the silicon wafer degumming process according to any of the claims 1-7.
9. A degumming apparatus, characterized by comprising: the silicon wafer degumming processing system as defined in claim 8;
a silicon wafer operation line is arranged in the degumming device, the silicon wafer operation line is provided with a degumming station and a degumming station, and the silicon wafers positioned in the tooling basket are degummed at the degumming station;
the image acquisition assembly and the gluing manipulator mechanism for identifying the residual glue of the silicon wafer are arranged at the gluing station.
10. The degumming apparatus according to claim 9, wherein a crystal support recovery line is further arranged in the degumming apparatus; the side of brilliant support recovery line is equipped with and removes thick piece manipulator mechanism and is used for discerning the image acquisition subassembly that the brilliant holds in the palm the thick piece on the subassembly, remove thick piece manipulator mechanism and be used for breaking off the thick piece from the brilliant support subassembly and put into brilliant support recovery line and retrieve with the fingers and thumb.
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Application publication date: 20220603 |