CN107369609A - Wafer residual glue cleaning method and device - Google Patents
Wafer residual glue cleaning method and device Download PDFInfo
- Publication number
- CN107369609A CN107369609A CN201710059923.8A CN201710059923A CN107369609A CN 107369609 A CN107369609 A CN 107369609A CN 201710059923 A CN201710059923 A CN 201710059923A CN 107369609 A CN107369609 A CN 107369609A
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- Prior art keywords
- cull
- workpiece
- wafer
- component
- workspace
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- 238000004140 cleaning Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000003292 glue Substances 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 66
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- 238000012546 transfer Methods 0.000 claims abstract description 7
- 238000006073 displacement reaction Methods 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000012360 testing method Methods 0.000 claims description 10
- 230000003139 buffering effect Effects 0.000 claims description 7
- 238000000197 pyrolysis Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 abstract description 8
- 238000001514 detection method Methods 0.000 abstract description 6
- 125000003003 spiro group Chemical group 0.000 description 22
- 238000009826 distribution Methods 0.000 description 17
- 238000005096 rolling process Methods 0.000 description 13
- 235000004443 Ricinus communis Nutrition 0.000 description 12
- 230000008878 coupling Effects 0.000 description 11
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000037237 body shape Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000644035 Clava Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 240000000528 Ricinus communis Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides a method and a device for cleaning wafer residual glue, comprising the following steps: a transfer area is arranged on one machine; the gantry rail frame divides the machine station into a first working area and a second working area; the detection mechanism is arranged on one side of the gantry rail frame; the pick-and-place mechanism is arranged in the first working area of the machine table and comprises two clamping seats arranged at intervals; the carrying platform can be driven to move between the first working area and the second working area, and carry the workpiece to be worked from the taking and placing mechanism or deliver the workpiece to be worked to the taking and placing mechanism; the wiping mechanism is arranged on the other side of the gantry rail frame and is provided with a pressing seat frame and a wiping material component; the pressing seat frame is provided with a first pressing component, and the wiping material component provides a wiping material to wind on the first pressing component; the first pressing and pushing assembly can be driven to press and push the material to clean the residual glue of the workpiece to be processed on the carrying platform.
Description
【Technical field】
The invention relates to a kind of clean method and device, espespecially a kind of crystalline substance cull on wafer to be removed
Circle cull clean method and device.
【Background technology】
Press, often sprayed or be stained with a little on tube core or its periphery using viscose glue in general wafer procedure for processing, these are viscous
Glue can be generally stayed on tube core after processing procedure is completed, some must then remove otherwise can under the influence of a processing procedure progress, and nothing
Cleaned by with any solvent, viscose glue is all difficult to be eliminated completely；Prior art can be all taken to full wafer when being cleaned
Wafer makees the operation wiped, so that the cull on the surface of full wafer wafer is eliminated.
【The content of the invention】
The operation for making to wipe to full wafer wafer in prior art, which only can be suitably used for crystal column surface, has the situation of large stretch of cull,
And it is only applicable to 2D wafer；Because silicon wafer process has been developed to 3D processing procedure now, often complete to cut outlet pipe in wafer
After core, still have to make the gluing between tube core, thus it is many when after the generation of cull will not be a sheet of, but can only remain in certain
A little individual dies, the then cleaning for making full wafer wafer are difficult to make effectively cleaning for individual die.
Whence is the purpose of the present invention, and it is clear to be to provide a kind of wafer cull that cull cleaning is carried out for individual die
Clean method.
It is another object of the present invention to provide a kind of wafer cull cleaning that cull cleaning is carried out for individual die
Device.
It is still a further object of the present invention is to provide a kind of device using the wafer cull clean method.
According to the wafer cull clean method of the object of the invention, including：Performed on a board：One cull checking step,
The wafer of workpiece to be applied is set to be inspected its cull situation to each tube core on wafer one by one by a testing agency on a microscope carrier；One pipe
Core wipes step, makes a Wiping mechanism and the independent individual die for being detected cull is wiped one by one with wiping material.
According to the wafer cull cleaning device of another object of the present invention, including：One board, there is a board table top, board
Table top is provided with a transfer section；One gantry rail gantry, board is separated out one first workspace, and one second workspace；One
Testing agency, located at gantry rail gantry side towards the first workspace, the workpiece to be applied in the first workspace is inspected；
One fetching device, located at board first workspace, including it is separated by two holders of spacing setting；One microscope carrier, located at board this
Two workspaces can driven and displacement in the first workspace, the second operation interval, and from fetching device accept workpiece to be applied or
Workpiece to be applied is delivered into fetching device；One Wiping mechanism, located at gantry rail gantry side towards the second workspace, provided with a pressure
Rivet holder frame and one wipe material component；This compresses mounting and compresses component provided with one first, and this is wiped material component offer one and wipes material pile warp thereon；
This first compress component driven can compress wipe material on microscope carrier workpiece to be applied carry out cull cleaning.
According to the wafer cull cleaning device of another object of the present invention, including：Use such as described wafer cull clean method
Device.
The wafer cull clean method and device of the embodiment of the present invention, due to adopting tube core, rubber cleaning mode is carried out one by one,
Therefore the tube core separate cleaning for being detected cull can be directed to, in addition to up to preferable cleaning effect, for cull on full wafer wafer
Cleaning can be with efficient execution；And cull has been set to be performed one by warm by heating element heats on microscope carrier in workpiece to be applied
In the case of by lower workpiece first time pyrolysis procedure to be applied to full wafer, Wiping mechanism H compresses component by first with thermal source
One is performed again on to lower second of pyrolysis procedure for single tube core, and liquid is melted into by cull on the tube core of carry out rubber
State dilutes shape, then is compressed through apyrogenic second under component wiping, can be easier to make for cull cleaning, and coordinate line laser
Height finder projects linear laser beam and rubber effect is checked, can more exhaustively complete each tube core cleaning；And wipe
The material component of wiping for wiping mechanism by rolling wheel release in Shi Cai areas is wiped material and furled to the hollow rolling wheel in retracting area and wipes material, makes to wipe material therebetween
Cleaning solution can be attached by automatically cleaning liquid container upper roller without interruption, and material is wiped in whole stream through weighting distribution wheel weighting distribution wheel, adjustment
The middle elastic appropriateness pulled, the operation for cleaning rubber circulate continual automation and carried out, and make cleaning performance significantly
Improve；Flexible member of the module by means of the upper and lower side of the second rail chair flexible buffering in the up and down displacement of Z axis is compressed simultaneously,
Make to compress first in module to compress component or second compress component and compress when wiping material and being butted on die surfaces, except by loading on microscope carrier
The measurement of measuring element and monitor and push outside power, the pressure pushed inherently have buffering, can reduce on workpiece to be applied
Tube core is damaged.
【Brief description of the drawings】
Fig. 1 is the mechanism schematic perspective view of the first workspace of wafer cull cleaning device board side in the embodiment of the present invention.
Fig. 2 is the mechanism schematic perspective view of the second workspace of wafer cull cleaning device board side in the embodiment of the present invention.
Fig. 3 is the front schematic view of Fig. 1 in the embodiment of the present invention.
Fig. 4 is the leftschematic diagram of Fig. 1 in the embodiment of the present invention.
Fig. 5 is the perspective exploded view of microscope carrier in the embodiment of the present invention.
Fig. 6 is the schematic diagram of stomata on the positioning disk of microscope carrier in the embodiment of the present invention.
Fig. 7 is the schematic perspective view of Wiping mechanism in the embodiment of the present invention.
Fig. 8 is the dorsal part schematic perspective view of Wiping mechanism in the embodiment of the present invention.
Fig. 9 is that mounting is compressed in the embodiment of the present invention and compresses the perspective exploded view of module.
Figure 10 is that module is compressed in the embodiment of the present invention and first compresses the perspective exploded view of component.
Figure 11 is the perspective exploded view that component is adjusted in the embodiment of the present invention.
Figure 12 is the schematic perspective view that material component is wiped in the embodiment of the present invention.
Figure 13 is that the front schematic view that material is wiped in material component winding is wiped in the embodiment of the present invention.
Figure 14 is that the first shifting rubbing head for compressing component is made to move the schematic perspective view wiped on the tube core of wafer in the embodiment of the present invention.
Figure 15 is the schematic diagram for carrying out cull detection in the embodiment of the present invention with the line laser light beam of laser altimeter.
【Embodiment】
Referring to Fig. 1,2, wafer cull cleaning device that the embodiment of the present invention can be in figure illustrates, including：
One board A, have each projection formation in both sides on the board table top A1 of board table top A1, a board A one end highly corresponding
Pedestal A2, make the transfer section A3 that a recessed shape is formed between two pedestal A2, the two pedestals A2 upper surface A21 and do not set pedestal A2
Board A other end board table tops A1 formed a height fall；
One gantry rail gantry B, with two column B1 across frame on board A two pedestal A2, a crossbeam B2 is located between two column B1,
Board A is separated and cooks up the first work positioned at the board A other end board table tops A1 for not setting pedestal A2 by gantry rail gantry B
Area A4, and the second workspace A5 positioned at two pedestal A2 sides, wherein, the first workspace A4 waits to apply to perform to pick and place
Workpiece W and treat and apply workpiece W and detected；The second workspace A5 applies workpiece W progress rubber operations to treat；This is treated
Workpiece W is applied by the wafer W3, wafer W3 and ring-type steel framework W1 on a viscous glued membrane W2 being sticked located at a ring-type steel framework W1
A ring-type spacing is kept, wafer W3 simultaneously has completed to cut out the tube core W4 by grain, and is left because of related process on tube core W4
Cull；
One testing agency C, it is made up of a CCD camera lenses, located at gantry rail gantry B sides towards the first workspace A4, it is by dragon
The upper one first actuator B3 of door track frame B drive and can to make X axis in gantry rail gantry B entablatures B2 X axis slide rail B4 reciprocal
Displacement, testing agency C CCD camera lenses are examined with Z axis to direction down to the workpiece W to be applied in the first workspace A4
Depending on；
One fetching device D, on the first workspace A4 board table top A1, it is included in two that X axis is separated by spacing setting
Holder D1, two holder D1 are respectively provided with opposite recessed blocking part D2 embedding folder D3 respectively, and each embedding folder D3 is respectively located at respectively to be located at
On the fixed seat D5 that the multiple pivot D4 set in Y-axis interval row are supported, the two embedding folder D3 is respectively fixed below respectively
An actuator D6 on seat D5 is driven, and can be made the opposite clip of X axis workpiece W to be applied ring-type steel framework W1, be made work to be applied
Part W is horizontal across frame between two embedding folder D3；Fixed seat D5 simultaneously can interlock embedding folder D3 with pivot D4 liftings driven,
And interlock clamped workpiece W to be applied and make oscilaltion；Two embedding folder D3 clampings are detained when workpiece W is applied, workpiece W to be applied
Height be less than gantry rail gantry B entablatures B2 and testing agency C lower ends height；
One rail chair E, on board table top A1, set in Y-axis, its one end stretches in fetching device D in the first workspace A4
In two holder D1 workpiece W to be applied below, the other end passes below the rail gantry B of gantry and stretches be placed in the second workspace A5 two
Between seat A2 in the transfer section A3 of recessed shape, its one end is simultaneously provided with rail chair actuator E1；
One liquid supplying device F, on the board table top A1 in the first workspace A4, cleaning solution is inside equipped with, can be provided with pipeline will
Cleaning solution is conveyed；
One microscope carrier G, between second workspace A5 two pedestal A2 in the transfer section A3 of recessed shape on rail chair E, and by this
On rail chair E rail chair actuator E1 driving can be passed as Y-axis below the rail gantry B of gantry and displacement in the first workspace A4, second
Between the A5 of workspace；Please coordinate simultaneously refering to Fig. 3,4, microscope carrier G can when passing gantry rail gantry B displacements in the first workspace A4,
Move into fetching device D below two holder D1 workpiece W to be applied, and workpiece W to be applied is accepted from fetching device D, and in holding
Reception, which applies to move to after workpiece W below testing agency C, receives detection, then carries and move workpiece W to be applied and move to the second workspace A5
Middle progress rubber operation, again completion rubber operation is waited to apply to when moving back in the first workspace A4 after completion rubber operation
Workpiece W delivers fetching device D；
One Wiping mechanism H, located at the X axis slide rail B5 of the crossbeam B2 sides of the gantry rail gantry B towards the second workspace A5 cunning
On seat B6, it is driven by the upper one second actuator B7 of gantry rail gantry B and can make X axis shift reciprocately on slide rail B5, the wiping
Wipe mechanism H and rubber operation is carried out to the workpiece W to be applied being transferred in the second workspace A5 to direction down with Z axis.
Referring to Fig. 5, microscope carrier G includes：
One fixed seat G1, on rail chair E, Y-axis displacement can be made by the driving of rail chair actuator E1 on rail chair E, one carries
Disk G2, on fixed seat G1, actuator (not shown) it can drive and rotate in by fixed seat G1, load plate G2 is in a disk
Shape is simultaneously arranged with evagination and micro- multiple support Gs 22 for raising up higher than load plate G2 upper surface G21 (are in the present embodiment in periphery etc.
Four), load plate G2 upper surface G21 of the G21 centers in upper surface provided with loading a measuring element G23, load plate G2 measures in loading
Element G23 outer circumferential sides are respectively provided with two keeper G24 respectively with the orientation that is at right angles；
Above one fixed mount G3, the loading measuring element G23 on load plate G2 and load-bearing weight measuring element G23 is measured, its with
One seat surface G31 reclines on loading measuring element G23, and stretches out with four corners that each seat is set respectively by the frame pin G32 of projection
In in load plate G2 support G 22, simultaneously loadable disk G2 gearings are rotated fixed mount G3；The upper four framves pin G32 of fixed mount G3
Mutually set in 90 degree of bifurcateds, and the seat surface G31 side G311 abutted between every two framves pin G32 is formed straight flange shape, two frame pin G32
With forming recessed positioning section G33 between the seat surface G31 side G311 that abut therebetween, fixed mount G3 is reclined with seat surface G31 and is located at
During loading measuring element G23, two adjacent positioning section G33 are just by the loading measuring element G23 outer circumferential sides side of being at right angles
The two keeper G24 that position is set are embedded by positioning；
One heating element heater G4, it is made up of multiple heating rod G41, each heating rod G41 is parallel and be horizontally placed in spacing is separated by
Above fixed mount G3；
One positioning disk G5, on fixed mount G3, its four corner is simultaneously respectively supported by fixed mount G3 four frame pin G32, should be added
Thermal element G4 can add then between positioning disk G5 and fixed mount G3, and be posted by positioning disk G5 lower surfaces to positioning disk G5
Heat；Multiple rings that positioning disk G5 upper surfaces are provided with annular are separated by the concentric chase G51 of spacing, and are in mutually 90 degree arranged in a crossed manner
Straight line chase G52, be provided with stomata G53 (please refer to Fig. 6), the gas in the chase of chase G51 and chase G52 infalls
Negative pressure is connected with the G53 of hole to be adsorbed to carrier on positioning disk G5.
Fig. 2,7,8 are referred to, Wiping mechanism H is provided with：
One compresses mounting H1, is in fixed seat H11 of the Z axis to vertically-arranged provided with rectangular one, it is fixedly arranged on the second workspace A5's
On the X axis slide rail B5 of gantry rail gantry B crossbeam B2 sides slide B6, and can be by the second actuator B7 drivings and in slide rail
Make X axis sliding on B5；A line laser height finder H2 is installed with below fixed seat H11 dorsal parts, it is interlocked simultaneously with fixed seat H11
Linear laser beam H21 can be projected downwards；It is provided with front side of fixed seat H11 and compresses module H3, it compresses component H31 by one first
And second compress component H32 and formed, wherein, this first compresses component H31 and is provided with thermal source；Compress module H3 compression rivet holder framves H1
Fixed seat H11 above an actuator H12 driving and upper and lower displacement can be made；
One wipes material component H4, provided with one is slightly in the fixed mount H41 of ㄇ shapes, and is provided with a lower section openning shape below fixed mount H41
Hollow out first interval H411, fixed mount H41 above simultaneously and hollow out first interval H411 above be provided with a hollow hollow out
Second interval H412, a ribbed fixed part H413 is provided between first interval H411 and second interval H412, wipes material component H4 with this
It is fixed and interlocked by it that fixed mount H41 fixed part H413 and this compresses mounting H1.
Fig. 7,9 are referred to, this compresses mounting H1 and a Z axis is provided with front side of fixed seat H11 to the first rail chair H13, the rail chair
H13 is located at the slide to slide rail (not shown), and in slide rail provided with Z axis provided with slide a H131, a continuous action base H14
H131 is upper and driven moving part H12 drives and can make Z axis to sliding, and continuous action base H14 wipes material component H4 fixed mount H41 for this
Fixed part H413 is fixed thereon, and Z axis can be made to sliding and with compressing mounting H1 by this is wiped material component H4 driven members H12 and is driven
Interlock；Slide H131 below continuous action base H14 is provided with the second rail chair H15 of an X axis, and second rail chair H15 can be the
Make Z axis on one rail chair H13 and be provided with the slide rail H151 of X axis to upper and lower displacement, the second rail chair H15, which is provided with can be in slide rail
Make the slide H152 of X axis displacement on H151；It is separated by that spacing is parallel to be provided with X axis rail bar H153, rail bar below slide rail H151
H152, which is provided with, to make the actuator H154 that X axis slides on in-orbit bar H153, and the upper and lower sides of second rail chair H15 are respectively in X axis
It is separated by the flexible member H155 that spacing is formed provided with Z axis to the spring of elastic acting force, flexible member H155 makes whole second
Rail chair H15 flexible bufferings in the up and down displacement of Z axis；This compresses module H3 and is located at the drive with a mounting H33 base part seats
X axis displacement can be made by being driven by it on moving part H154, and mounting H33 dorsal parts simultaneously recline and are fixedly arranged on slide H152 to obtain quilt simultaneously
Firm sliding during driving, thus compress module H3 will be up and down in Z axis by means of the flexible member H155 of the second upper and lower sides of rail chair H15
Flexible buffering during displacement.
Referring to Fig. 10, this compresses module H3 and compresses component H31 and second for first with mounting H33 and compresses component H32 points
Not respectively with Z axis to and abreast mutually and set；Wherein, this first compresses component H31 and included：
One actuator H311, it is fixedly arranged on mounting H33 and is interlocked by mounting H33, actuator H311 with a fixed seat H3111
A joint seat H3112 can make the up and down displacement of Z axis, the side seat that joint seat H3112 sides fixed one interlock with it below for driving
H3113；
One adjustment component H312, its upper end is with one first adjusting seat H3121 upper surfaces and actuator H311 joint seat H3112
Bottom is fixed, and with fixed on front side of the first adjusting seat H3121 side and side seat H3113 lower ends；
One coupling seat H313, the one second adjusting seat H3122 of its upper end and adjustment component H312 lower ends is fixed, coupling seat H313
In be provided with a bottoming hole H3131, coupling seat H313 sides are provided with temperature switch H3135, can be higher than a predetermined value in detection temperature
When stop heating；On front side of coupling seat H313 the thermometer hole H3132 communicated with bottoming hole H3131 is respectively respectively equipped with two oblique angle faces；
Coupling seat H313 lower ends are convexly equipped with a handling part H3133, which is provided with handling hole H3134；
One heating member H314, for a strip clava and it is placed through in coupling seat H313 bottoming hole H3131, it is opened by temperature
H3135 is closed to be monitored；
One compresses a H315, can make the up and down displacement of Z axis below adjustment component H312, and by joint seat H3112 gearings,
It is provided with U-shaped a handling head H3151 and the shifting rubbing head H3152 positioned at handling part H3151 lower ends, and handling head H3151 can
Nesting is positioned at the handling part H3133 of coupling seat H313 lower ends, and the latch shape connector interlocked with a handle H3153
H3154 inserts handling part H3133 handling hole H3134 and is coupled；It is a square body shape to move rubbing head H3152, and its lower end has
The shifting wiping portion H3155 of one square planar shape；Heating member H314 bottoms contacted with shifting rubbing head H3152 and by heat source to move wipe
Head H3152 shifting wiping portion H3155；Handle H3153 sides are provided with a magnetic absorption member H3156, can insert the handling in connector H3154
Adsorbed during portion H3133 handling hole H3134 with coupling seat H313, make handle H3153 be not easy to slip；
Heating member H314 is to heat coupling seat H313 and wipe hot temperature conduction to the shifting for the shifting rubbing head H3152 for compressing a H315
Portion H3155, the handling head H3151 and shifting rubbing head H3152 are made up of copper material；
The adjustment component H312 moves rubbing head H3152 shifting wiping portion H3155 in X-axis to finely tune and interlock to compress below a H315
To the both sides level height of, Y-axis, with the surface met and corresponding lower section is wiped；
This second compresses component H32 constructions with first to compress component H31 identical, does not only set heating member H314 and temperature switch
H3135, other components are not repeated hereby.
Figure 11 is referred to, one the is provided between adjustment component H312 the first adjusting seat H3121 and the second adjusting seat H3122
Three adjusting seat H3123；Wherein, the first adjusting seat H3121 above and underlying 3rd adjusting seat H3123 is formed
One group of X axis horizontal adjustment component, X axis both sides therebetween are respectively fixed with sheet fixture H3124；This above 3rd
Adjusting seat H3123 and underlying second adjusting seat H3122 forms one group of Y-axis horizontal adjustment component, Y-axis two therebetween
Side is respectively fixed with sheet fixture H3125；
It is horizontal that one group of X axis is formed with the first adjusting seat H3121 above and underlying 3rd adjusting seat H3123
Exemplified by adjusting component, with one group of spiral shell between the first adjusting seat H3121 above and underlying 3rd adjusting seat H3123
Fitting H316 spiral shells are set, and this group of spiro connecting piece H316 includes：First adjusting seat H3121 above X axis set partially side to
From top to bottom spiral shell is set in the fine setting spiral shell between the first adjusting seat H3121 and underlying 3rd adjusting seat H3123 of top
Fitting H3161, from outside the fixture H3124 of both sides to each by two side fixture H3124 upper ends and above first respectively
Adjusting seat H3121 fix four fix spiro connecting piece H3182, from outside the fixture H3124 of side to by fixture H3124 lower ends with
The four adjustable spiro connecting piece H3163 that underlying 3rd adjusting seat H3123 is fixed；
Wherein, the fixture H3124 lower ends perforation H3164 more adjustable spiro connecting piece H3163 in aperture of the adjustable spiro connecting piece H3163 spiral shells warp
Threaded portion external diameter it is bigger, make to leave displaceable enough and to spare therebetween, but should adopt positioned at adjustable spiro connecting piece H3163 of the group two of side
Consolidate with underlying 3rd adjusting seat H3123 normality spiral shells, another group adjustable is spirally connected with finely tuning the two of spiro connecting piece H3161 homonymies
Part H3163 adopts can be according to need unclasp or spiral shell is consolidated with underlying 3rd adjusting seat H3123 at random；
Outside the fixture H3124 with finely tuning spiro connecting piece H3161 homonymies, provided with inserting through fixture H3124 lower ends and being located at lower section
The 3rd adjusting seat H3123 two pin member H3171；In the first adjusting seat above with finely tuning spiro connecting piece H3161 homonymies
Between H3121 and underlying 3rd adjusting seat H3123, two flexible members provided with the spring composition for being separated by spacing in Y-axis
H3172；
Two pin member H3171 plugs state as the standard setting under a normality, when occurring that heeling condition must be adjusted, due to two
Fixture H3124 is separated by setting in X axis both sides, therefore can first extract two pin member H3171, and unclasps and fine setting spiro connecting piece
H3161 homonymies two adjustable spiro connecting piece H3163, due between perforation H3164 apertures and adjustable spiro connecting piece H3163 threaded portion external diameter
Displaceable enough and to spare is left, therefore the two flexible member H3172 with finely tuning spiro connecting piece H3161 homonymies will adjust above first
Under bed rearrangement H3121 is fixed, carry out one support the underlying 3rd adjusting seat H3123 of pushing and pressing should be same with fine setting spiro connecting piece H3161
The drive that side moves down, via fine setting fine setting spiro connecting piece H3161, flexible member H3172 is supported the drive of pushing and pressing will be located at
3rd adjusting seat H3123 of lower section and fine setting spiro connecting piece H3161 homonymies lateral lower pushing and pressing, to obtain the underlying 3rd
The adjustment of adjusting seat H3123X axial directions both sides level height, adjustment positioning after again by with fine setting spiro connecting piece H3161 homonymies this two
Adjustable spiro connecting piece H3163 screws tight locking；
This group of Y-axis water that the 3rd adjusting seat H3123 above and underlying second adjusting seat H3122 is formed
The Y-axis both sides level height of Heibei provincial opera whole group part therebetween is adjusted with the method for adjustment of foregoing X axis both sides level height similarly,
Its component is also identical, only sets orientation to be symmetrical arranged with Y-axis, and this is not repeated hereby by being appreciated that in Figure 11.
Fig. 8,12 are referred to, this wipes the firstth area of the recessed hollow out of material component H4 ㄇ shape fixed mount H41 lower opening shapes
Between H411 sides be provided with a Shi Cai areas H414, the first interval H411 opposite sides of hollow out are provided with a retracting area H415, should be with releasing material
Liquid zone H416 is stained with the lower section of area's H414 homonymies provided with one, and the lower section with furling area's H412 homonymies is provided with a pull area H417, is being stained with
One, which is formed, between liquid zone H416 and pull area H417 wipes area H418；One temperature sensor H419 is with an extension rod H4191 upper ends
One fixed seat H4192 is fixedly arranged on a slide H4193, the area of hollow out second hollow above fixed mount H41 slide H4193
Between H412 root edges X axis slide rail H4194 on, temperature sensor H419 can be embedded at coupling seat H313 (please refer to figure
7th, heating member H314 temperature is detected and with first in the thermometer hole H3132 10) communicated at two oblique angle faces of front side with bottoming hole H3131
Compress component H31 and synchronously make X axis displacement；Wherein,
Shi Cai areas H414 is provided with wheel shaft and sets in Y-axis and wiped by the actuator H4141 of fixed mount H41 dorsal parts one windings driven
Be provided with below the rolling wheel H4142 of material, rolling wheel H4142 X axis be separated by the first deflecting roller H4143 that spacing wheel shaft sets in Y-axis,
Second deflecting roller H4144, the lower section between the first deflecting roller H4143, the second deflecting roller H4144 are provided with a wheel shaft and set in Y-axis
Weighting distribution wheel H4145, weighting distribution wheel H4145 is located at the Z axis in Shi Cai areas H414 on fixed mount H41 at long slot bore H4146, should
Weighting distribution wheel H4145 wheel shaft extension interlocks through long slot bore H4146 and in fixed mount H41 dorsal parts and a counterweight H4147, the counterweight
H4147 on slide rail H4148, and can interlock the counterweight located at a long slot bore H4146 sides and the Z axis parallel with long slot bore H4146
Wheel H4145 makees Z axis to upper and lower displacement, and the stroke spacing of its upper and lower displacement is put the sensing member H4149 institutes of upper and lower position by a component
Monitoring and control；
Retracting area H415 is provided with wheel shaft and sets in Y-axis and wiped by the actuator H4151 of fixed mount H41 dorsal parts one windings driven
It is in the 3rd deflecting roller that Y-axis is set to be provided with X axis below blank coil the wheel H4152, rolling wheel H4152 of material to be separated by spacing wheel shaft
H4153, the 4th deflecting roller H4154, lower section between the 3rd deflecting roller H4153, the 4th deflecting roller H4154 are in Y-axis provided with a wheel shaft
To the weighting distribution wheel H4155 of setting, a Z axis of the weighting distribution wheel H4155 on fixed mount H41 in retracting area H415 is to long slot bore
At H4156, weighting distribution wheel H4155 wheel shaft extension connects through long slot bore H4156 in fixed mount H41 dorsal parts and a counterweight H4157
Dynamic, counterweight H4157 on slide rail H4158, and can connect located at a long slot bore H4156 sides and the Z axis parallel with long slot bore H4156
Dynamic weighting distribution wheel H4155 makees Z axis and is put upper and lower position to upper and lower displacement, the stroke spacing of its upper and lower displacement by a component and sensed
Part H4159 is monitored and controlled；
This is stained with liquid zone H416 and is provided with a cleaning liquid receptacle H4161, and it is arranged in, and fixed mount H41 lower ends are fixed to put on frame H42, and
It is coupled between liquid supplying device F in Fig. 1 provided with pipeline (not shown), the supply of cleaning solution can be obtained from liquid supplying device F；Cleaning
A roller H4162 is provided with liquid container H4161, roller H4162 wheel shaft is located at cleaning liquid receptacle H4161, roller in Y-axis
A H4162 circumference part, which is stained with, to be dipped in cleaning liquid receptacle H4161, and a part is revealed in outside cleaning liquid receptacle H4161, its circumference
Surface and equally circular row cloth are set as the embedding trench of Y-axis；It is stained with the nearly runner for being provided with that a wheel shaft is in Y-axis setting in liquid zone H416
H4163, it closely depends on cleaning liquid receptacle H4161, and between nearly runner H4163 and cleaning liquid receptacle H4161 roller H4162 on
Side is one group by two provided with one and is separated by the first castor H4165, the second castor that spacing is located at a rocker H4164
H4166, first castor H4165, the second castor H4166, which are located at, is stained with liquid zone H416 a Z axis on fixed mount H41 to length
At slotted eye H4167, the axostylus axostyle H4168 on rear side of rocker H4164 stretch through long slot bore H4167 and in fixed mount H41 dorsal parts by
One rotary drive H4169 drives, and rocker H4164 is made swing and is made the first castor H4165 to move down against the cleaning
Liquid container H4161 upper roller H4162 upper peripheral edges；
Pull area H417 is provided with one and driven by the actuator H4171 of fixed mount H41 dorsal parts one, and its wheel shaft is in Y-axis setting
Equally circular row cloth is set as the embedding trench of Y-axis to rotatable pull wheel H4172, the pull wheel H4172 circumferential surface；Pull wheel
H4172 neighbour side is provided with embedding support that a wheel shaft is set in Y-axis and takes turns H4173, and equally equally circular row cloth is set as Y to its circumferential surface
Axially embedding trench, the embedding wheel H4173 that supports are hubbed on fixed mount H41 swing arm H4175 by fulcrum of pivot H4174 located at one, put
Embedding wheel H4173 neighbour side of supporting on arm H4174 is additionally provided with slotting pivot in fixed mount H41 trunnion H4176, and opposed pivot pins H4176's is embedding
Pulled to wheel H4173 opposite side swing arm H4174 by the flexible member H4177 (Figure 13) that the upper springs of fixed mount H41 are formed,
Slotting pivot is pulled up after fixed mount H41 trunnion H4176, swing arm H4175 embedding by flexible member H4177 pulls will support the pull wheel
H4172 circumference；
Wiping area H418 is provided with that liquid zone H416 fixed mount H41 is fixed and oblique the first guid arm extended down by being stained with
H4181, and fixed by pull area H417 fixed mount H41 and oblique the second guid arm H4182 extended down, the first guiding
Arm H4181, the second guid arm H4182 lower ends are mutually close and keep an operation room away from H4183, and provided with wheel shaft are in respectively Y in end
Axially arranged the first support wheel H4184, the second support wheel H4185；First support wheel H4184, the second support wheel H4185 root edges
It is common to maintain an identical X axis level height；Wherein, pull area H417 drawing is abutted above the second guid arm H4182
It is in the propelling sheave H4186 that Y-axis is set that a wheel shaft is provided with running wheel H4172.
Figure 12,13 are referred to, in the wiped clean for carrying out cull, coiled banding is wiped material L from Shi Cai areas H414
Rolling wheel H4142 sequentially after the first deflecting roller of pile warp H4143, weighting distribution wheel H4145, the second deflecting roller H4144；Liquid zone is stained with into this
After H416 and the nearly runner H4163 of pile warp, the first castor H4165, the second castor H4166, roller H4162, further around through the wiping
Area H418 the first support wheel H4184, the second support wheel H4185, propelling sheave H4186 is wiped, and enters the pull area H417 pile warps
After pull wheel H4172, into the retracting area H415 and the deflecting roller H4153 of pile warp the 3rd, weighting distribution wheel H4155, the 4th deflecting roller
H4154, and furled by the rolling wheel H4152 of sky；Wherein, material L is wiped in pile warp the second castor H4166, the second castor
H4166 can be compressed by driving wiped at pile warp second castor H4166 material L support and cleaning liquid receptacle H4161 on attached cleaning
The roller H4162 of liquid is to attach cleaning solution；Wipe material L to be clipped by the embedding wheel H4173 that supports when pile warp pulls wheel H4172, take turns pull
H4172 driven moving part H4171 can pull pile warp to wipe the material L that wipes in area H418 and carry out displacement when driving, as wiping area H418
In wipe material L pulled to the weighting distribution wheel H4145 in Shi Cai areas H414 be forced on move to counterweight H4147 and touch top position
After sensing member H4149, actuator H4141 driving rolling wheel H4142 releases will be promoted to wipe material L, until counterweight H4147 touches lower section
Untill the sensing member H4149 of position；And it is the same at retracting area H415 places, pulled when wiping material L and taking turns H4172 by pull to making retracting area
Wiped in H415 material L relax to weighting distribution wheel H4155 interlock counterweight H4157 touch the sensing member H4159 of lower position when, driving
Part H4151 will drive empty rolling wheel H4152 retractings to wipe material L and touch until counterweight H4157 the sensing member H4159 of top position
Only, the elastic appropriateness that material L pulled in whole stream is wiped with adjustment whereby；
This, which compresses module H3 and optionally compresses component H31 or second with first, compresses component H32 and is operated, and each respectively
A rubbing head H3152 shifting wiping portion H3155 is moved to compress H315 lower ends and overlays this around across the first support wheel in wiping area H418
Wiping above material L between H4184, the second support wheel H4185.
It is to perform following steps that the embodiment of the present invention, which carries out wafer cull clean method,：
One feeding step, workpiece W to be applied is loaded into fetching device D by upper two embedding folder D3 of two holder D1 with horizontal
State clamps；The loading operation can be by a robot (not shown) from a material supply device (Load/Unload) (not shown)
Take out and perform；
One material step, microscope carrier G is set to pass gantry rail gantry B displacements in by the second workspace A5 with Y-axis straight-line displacement stream
In one workspace A4, and move into fetching device D below the workpiece W to be applied between two holder D1, and from two on fetching device D
Embedding folder D3 accepts workpiece W to be applied；When applying workpiece W and being accepted by microscope carrier G, will on load plate G2 by stomata G53 institute
Lead to negative-pressure adsorption and be positioned on load plate G2, and heated element G4 heating；
One cull checking step, microscope carrier G is moved back along Y-axis straight-line displacement stream, and taken in the first workspace A4 in removal
During laying mechanism D, workpiece W to be applied is set to be inspected its cull shape to each tube core W4 thereon one by one by testing agency C on the rail gantry B of gantry
Condition；
One changes area's step, the workpiece W to be applied of completion cull situation is passed dragon along former Y-axis straight-line displacement stream by microscope carrier G
The second workspace A5 is returned in door track frame B displacements；
One tube core wipes step, the Wiping mechanism H mounting H1 gearings that compress is wiped material component H4, with the first pressure provided with thermal source
The shifting wiping portion H3155 of shifting rubbing head H3152 to component H31 overlays this and wipes material L (referring to Figure 14), and makes to wipe material L tension running wheels
H4172 pull wheel H4172, and move and wipe between rubbing head H3152 shifting wiping portion H3155 bottom surfaces and tube core W4 upper surfaces is moved, to tested
Go out to have the individual die W4 of cull to be wiped；Due to the shifting wiping portion of the shifting rubbing head H3152 square body shapes lower end square planar shape
The surface area of H3155 areas and tube core W4 is rough quite, therefore whole tube core can be covered by wiping scope；Each quilt on workpiece W to be applied
The tube core W4 that detection has cull is completed after wiping, then the shifting wiping portion with the apyrogenic second shifting rubbing head H3152 for compressing component H32
H3155 overlays this and wipes material L to be wiped to the tube core W4 for being detected cull；Overlayed in the shifting wiping portion H3155 for moving rubbing head H3152
Wipe material L to be butted on when applying tube core W4 on workpiece W, move force that rubbing head H3152 is pushed by loading measuring element G23 in microscope carrier G
Measurement, when the loading value of setting is reached, move rubbing head H3152 by stop push to avoid undermining tube core W4；
One cleaning checking step, makes workpiece W to be applied by microscope carrier G along Y-axis straight-line displacement stream toward fetching device D directions position
Move, and the line laser height finder below the second workspace A5 compression rivet holder frame H1 fixed seat H11 dorsal parts below the rail gantry B of gantry
H2 projects linear laser beam H21 and the former tube core W4 for being detected cull is checked and (referred to Figure 15)；When detection still
When having the tube core that cleaning does not reach expected degree, workpiece W to be applied is re-executed foregoing by microscope carrier G along Y-axis straight-line displacement stream
Tube core W4 wipes step；When the tube core W4 that all originals are detected cull is examined up to together in expected degree, it is identified
Cleaning is completed；
One changes part step, cleaned complete workpiece W to be applied by microscope carrier G along Y-axis straight-line displacement stream by under the rail gantry B of gantry
Side is moved into fetching device D between two holder D1 toward fetching device D direction displacements in the first workspace A4, is made on fetching device D
Two embedding folder D3 accept that workpiece W to be applied unloads so that robot takes away and unloading is put into the material supply device, and under performing
One circulation is loaded into workpiece W to be applied.
Wafer cull clean method of the embodiment of the present invention and device, due to adopting tube core W4, rubber cleaning mode is carried out one by one,
Therefore the tube core W4 separate cleanings for being detected cull can be directed to, in addition to up to preferable cleaning effect, for cull on full wafer wafer
Cleaning can be with efficient execution；And heated by heating element heater G4 on microscope carrier G in workpiece W to be applied and warmed cull
In the case of one is performed by lower workpiece W first time pyrolysis procedures to be applied to full wafer, Wiping mechanism H is by the first pressure with thermal source
One is performed again on to lower second of pyrolysis procedure for single tube core W4 to component H31, by the tube core W4 of carry out rubber
Upper cull melts into liquid dilution shape, then is compressed through apyrogenic second under component H32 wipings, can be easier cull cleaning
Carry out, and line of engagement laser altimeter H2 projects linear laser beam H21 and rubber effect is checked, can more exhaustive
The cleaning of each tube core of completion；And the Wiping mechanism H material component H4 that wipes wipes material L and arrived by rolling wheel H4142 releases in Shi Cai areas H414
Material is wiped in rolling wheel H4152 retractings hollow retracting area H415, is allow to wipe material L therebetween without interruption on automatically cleaning liquid container H4161
Roller H4162 attaches cleaning solution, and wipes what material L was pulled in whole stream through weighting distribution wheel weighting distribution wheel H4145, H4155 adjustment
Elastic appropriateness, the operation for cleaning rubber circulate continual automation and carried out, and greatly improve cleaning performance；Press simultaneously
To module H3 borrow the second upper and lower sides of rail chair H15 flexible member H155 in the up and down displacement of Z axis flexible buffering, make
Compress first on module H3 and compress component H31 or second and compress component H32 and compress when wiping material and being butted on die surfaces, except by microscope carrier
The upper loading measuring element G23 of G measurement and monitor and push outside power, the pressure pushed inherently have buffering, can reduce and treat
Tube core W4 on workpiece W is applied to be damaged.
Only as described above, only presently preferred embodiments of the present invention, when the model that the present invention can not be limited with this implement
Enclose, i.e., the simple equivalent changes and modifications made generally according to scope of the present invention patent and invention description content, all still belong to
In the range of patent of the present invention covers.
【Symbol description】
A board A1 board table tops
A2 pedestal A21 upper surfaces
The first workspaces of A3 transfers section A4
The second workspaces of A5 B gantry rail gantry
B1 column B2 crossbeams
B3 the first actuator B4 slide rails
B5 slide rail B6 slides
B7 the second actuator C testing agencies
D fetching device D1 holders
The embedding folders of D2 blocking parts D3
D4 pivot D5 fixed seats
D6 actuator E rail chairs
E1 rail chair actuator F liquid supplying devices
G microscope carrier G1 fixed seats
G2 load plate G21 upper surfaces
The loading measuring element of G22 support Gs 23
G24 keeper G3 fixed mounts
G31 seat surface G311 sides
G32 frame pin G33 positions section
G4 heating element heater G41 heating rods
G5 positioning disk G51 chases
G52 chase G53 stomatas
H Wiping mechanisms H1 compresses mounting
H11 fixed seat H12 actuators
H13 the first rail chair H131 slides
H14 continuous action bases the second rail chairs of H15
H151 slide rail H152 slides
H153 rail bar H154 actuators
H155 flexible member H2 laser altimeters
H21 line laser light beams H3 compresses module
H31 first compresses component H311 actuators
H3111 fixed seat H3112 joint seats
H3113 sides seat H312 adjusts component
H3121 the first adjusting seat the second adjusting seats of H3122
The adjusting seat H3124 fixtures of H3123 the 3rd
H3125 fixture H313 coupling seats
H3131 bottoming hole H3132 thermometer holes
H3133 handling parts H3134 handling holes
H3135 temperature switch H314 heating members
H315 compresses a H3151 handling head
H3152 moves rubbing head H3153 handles
H3154 connectors H3155 moves wiping portion
H3156 magnetic absorption member H316 spiro connecting pieces
H3161 fine setting spiro connecting pieces H3162 fixes spiro connecting piece
Spiro connecting piece H3164 perforation that H3163 is adjustable
H3171 pin member H3172 flexible members
H32 second compresses component H33 mountings
H4 wipes material component H41 fixed mounts
H411 first interval H412 second intervals
H413 fixed part H414 Shi Cai areas
H4141 actuator H4142 rolling wheels
H4143 the first deflecting roller the second deflecting rollers of H4144
H4145 weighting distribution wheel H4146 long slot bores
H4147 counterweight H4148 slide rails
H4149 sensing members H415 furls area
H4151 actuator H4152 rolling wheels
H4153 the first deflecting roller the second deflecting rollers of H4154
H4155 weighting distribution wheel H4156 long slot bores
H4157 counterweight H4158 slide rails
H4159 sensing members H416 is stained with liquid zone
H4161 cleaning liquid receptacle H4162 rollers
The nearly runner H4164 rockers of H4163
H4165 the first castor the second castors of H4166
H4167 long slot bore H4168 axostylus axostyles
H4169 rotary drives H417 pulls area
H4171 actuators H4172 pull wheels
H4173 is embedding to support wheel H4174 pivots
H4175 swing arm H4176 trunnions
H4177 flexible members H418 wipes area
H4181 the first guid arm the second guid arms of H4182
H4183 operation rooms are away from the support wheels of H4184 first
H4185 the second support wheel H4186 propelling sheaves
H419 temperature bar surveys device H4191 extension rods
H4192 fixed seat H4193 slides
H4194 slide rails W workpiece to be applied
W1 steel framework W2 glued membranes
W3 wafer W4 tube cores
Claims (13)
1. a kind of wafer cull clean method, including：Performed on a board：
One cull checking step, make the wafer of workpiece to be applied on a microscope carrier by a testing agency one by one to each tube core on wafer
Inspect its cull situation；
One tube core wipes step, makes a Wiping mechanism and the independent individual die for being detected cull is wiped one by one with wiping material
Wipe.
2. wafer cull clean method as claimed in claim 1, it is characterised in that the workpiece to be applied is accepted by a microscope carrier, and
It is positioned on a load plate of the microscope carrier by negative-pressure adsorption on load plate.
3. wafer cull clean method as claimed in claim 1, it is characterised in that the workpiece to be applied is by heating element heater on microscope carrier
Heat and cull is performed a pyrolysis procedure by lower workpiece to be applied to full wafer by warm.
4. wafer cull clean method as claimed in claim 1, it is characterised in that the workpiece to be applied is by a Wiping mechanism by having
Have thermal source first compresses component and performs one on to the lower pyrolysis procedure for single tube core.
5. wafer cull clean method as claimed in claim 1, it is characterised in that the workpiece to be applied is by the 1 of Wiping mechanism
One, which compresses component, is overlayed with a shifting rubbing head and wipes material and be butted on when tube core on workpiece is applied, and moves force that rubbing head pushes by a loading
The measurement of measuring element.
6. wafer cull clean method as claimed in claim 1, it is characterised in that the workpiece to be applied completes tube core and wipes step
Afterwards, perform one and project linear laser beam check cleaning whether reach expected degree to tube core with line laser height finder
Clean checking step.
7. wafer cull clean method as claimed in claim 1, it is characterised in that the workpiece to be applied is by the 1 of Wiping mechanism
One compress component with one shifting rubbing head overlay wipe material be butted on pressure when tube core on workpiece is applied, pushed by flexible member effect and
With buffering.
8. a kind of wafer cull cleaning device, including：
One board, has a board table top, and board table top is provided with a transfer section；
One gantry rail gantry, board is separated out one first workspace, and one second workspace；
One testing agency, located at gantry rail gantry side towards the first workspace, the workpiece to be applied in the first workspace is entered
Row is inspected；
One fetching device, located at board first workspace, including it is separated by two holders of spacing setting；
One microscope carrier, located at board second workspace can driven and displacement in the first workspace, the second operation interval, and ask for
Laying mechanism accepts workpiece to be applied or workpiece to be applied is delivered into fetching device；
One Wiping mechanism, located at gantry rail gantry side towards the second workspace, compress mounting provided with one and one wipe material component；Should
Compress mounting and compress component provided with one first, this is wiped material component offer one and wipes material pile warp thereon；
This first compress component driven can compress wipe material on microscope carrier workpiece to be applied carry out cull cleaning.
9. wafer cull cleaning device as claimed in claim 8, it is characterised in that the board is provided with a liquid supplying device, interior accommodating
There is cleaning solution, carry out cleaning solution provided with pipeline to be delivered to the cleaning liquid receptacle of Wiping mechanism one, the cleaning liquid receptacle is wiped material by this
Component wipes material pile warp.
10. wafer cull cleaning device as claimed in claim 8, it is characterised in that this compresses mounting and compresses component provided with second,
Wherein, first compress component and be provided with thermal source, the two changeable compresses wipes material, clear to carry out cull to the workpiece to be applied on microscope carrier
It is clean.
11. wafer cull cleaning device as claimed in claim 8, it is characterised in that this first compress component be provided with fine setting and even
Dynamic first, which compresses the one of component, moves rubbing head in X axis, the adjustment component of the both sides level height of Y-axis.
12. wafer cull cleaning device as claimed in claim 8, it is characterised in that this wipe material component be provided with adjust this wipe material around
If the counterweight of elasticity.
13. a kind of wafer cull cleaning device, including：Use the wafer cull clean method as described in any in claim 1 to 7
Device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105114522 | 2016-05-11 | ||
| TW105114522A TWI680019B (en) | 2016-05-11 | 2016-05-11 | Wafer adhesive cleaning method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107369609A true CN107369609A (en) | 2017-11-21 |
| CN107369609B CN107369609B (en) | 2020-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710059923.8A Active CN107369609B (en) | 2016-05-11 | 2017-01-24 | Wafer residual glue cleaning method and device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107369609B (en) |
| TW (1) | TWI680019B (en) |
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| CN110538837A (en) * | 2018-07-10 | 2019-12-06 | 蓝思科技（长沙）有限公司 | Glue removing and recycling process for assembly |
| CN111283799A (en) * | 2018-12-07 | 2020-06-16 | 万润科技股份有限公司 | Cutter cleaning method and device and cutting equipment |
| CN111359934A (en) * | 2020-04-10 | 2020-07-03 | 厦门柯尔自动化设备有限公司 | Wafer cleaning device and wafer cleaning method |
| CN114538107A (en) * | 2022-01-17 | 2022-05-27 | 东莞市安动半导体科技有限公司 | Automatic chip tray moving device and tray moving method thereof |
| CN114570684A (en) * | 2022-04-14 | 2022-06-03 | 乐山高测新能源科技有限公司 | Silicon wafer degumming treatment method, treatment system and degumming device |
| CN114602917A (en) * | 2022-04-14 | 2022-06-10 | 乐山高测新能源科技有限公司 | Degumming device |
| CN114653638A (en) * | 2022-04-14 | 2022-06-24 | 乐山高测新能源科技有限公司 | Silicon wafer degumming treatment method, treatment system and degumming device |
| CN115008621A (en) * | 2022-04-14 | 2022-09-06 | 乐山高测新能源科技有限公司 | Silicon wafer production system |
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| TWI738508B (en) * | 2020-09-15 | 2021-09-01 | 致茂電子股份有限公司 | Optical inspection system for inspecting residue remained on wafer chuck and optical inspection method for the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI680019B (en) | 2019-12-21 |
| TW201739524A (en) | 2017-11-16 |
| CN107369609B (en) | 2020-08-18 |
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