CN110538837B - Glue removing and recycling process for assembly - Google Patents

Glue removing and recycling process for assembly Download PDF

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Publication number
CN110538837B
CN110538837B CN201810750714.2A CN201810750714A CN110538837B CN 110538837 B CN110538837 B CN 110538837B CN 201810750714 A CN201810750714 A CN 201810750714A CN 110538837 B CN110538837 B CN 110538837B
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assembly
glue
recycling process
soaking
glue removing
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CN110538837A (en
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周群飞
陈凤
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Lansi Precision Taizhou Co ltd
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Lens Technology Changsha Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143Wipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
    • C23G5/036Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds having also nitrogen

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Solid Wastes (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The invention discloses a glue removing and recycling process for an assembly part, wherein the assembly part is an assembly part consisting of a glass part and a metal part, and comprises the following steps: disassembling each component of the assembly part by adopting a constant-temperature heating plate; placing the glass piece in the glue removing liquid to fully soak the residual glue part, and wiping the residual glue after soaking; soaking the metal piece in a constant-temperature heating degumming liquid; and cleaning and inspecting the glass piece and the metal piece, and putting into production for recycling. According to the above content, the glue removing process has the advantages of short time and low cost, does not damage the electroplating film layer, the printing ink and the appearance on each component, and each processed component can be directly put into production for reuse. Therefore, the assembly part glue removing and recycling process provided by the invention can remove the residual glue on the assembly part on the premise of not influencing the coating and the printing ink.

Description

Glue removing and recycling process for assembly
Technical Field
The invention relates to the field of assembly glue removal, in particular to an assembly glue removal recycling process.
Background
The assembled metal part is easy to have the phenomena of deviation, glue shortage, glue breaking, air bubbles, glue overflowing and the like in the attaching process, and the whole assembled part is unqualified. For non-qualified assemblies, such as assemblies of glass pieces and metal pieces; the assembly is usually reused and put into production again by processes including disassembly, deinking, flat grinding, inspection, plating, and assembly. However, after the treatment by the process, residual glue still remains on the glass and the metal piece, which affects the quality of products and finally causes scrapping of each component and serious waste; and the plating film and the printing ink on each component need to be manufactured again, so that the investment cost is increased.
Therefore, how to remove the residual glue on the assembly part on the premise of not affecting the coating and the ink to enable the assembly part to reach the standard of recycling is a difficult problem to be solved urgently in the field at the present stage.
Disclosure of Invention
In view of the above, the present invention provides a glue removing and recycling process for an assembly, which can remove the residual glue on the assembly without affecting the coating and the ink, so that the assembly reaches the recycling standard, and the problem in the field at the present stage is solved.
An assembly glue removing and recycling process, wherein the assembly is an assembly composed of a glass piece and a metal piece, and comprises the following steps:
firstly, disassembling each component of the assembly part by adopting a constant-temperature heating plate;
placing the glass piece into a glue removing solution to completely soak the residual glue part, and wiping the residual glue after soaking; soaking the metal piece in a constant-temperature heating degumming solution;
and step three, cleaning and inspecting the glass piece and the metal piece, and putting into production for recycling.
Preferably, the assembly part glue removing and recycling process is characterized in that the temperature range of the heating plate is 180-200 ℃; the heating time range of the heating plate is 1min-2 min.
Preferably, the assembly part glue removing and recycling process is characterized in that the glass piece is soaked for 50-70 min, and the glue removing liquid for soaking the glass piece is normal temperature;
preferably, the time for soaking the glass piece is 1 h.
Preferably, the assembly part glue removing and recycling process comprises the steps of soaking the metal piece in glue removing liquid with the temperature ranging from 90 ℃ to 100 ℃; the time range for soaking the metal piece is 5min-6 min.
Preferably, the assembly glue removing and recycling process comprises the steps of triethanolamine, ethyl lactate, propylene glycol phenyl ether acetate and nonylphenol polyoxyethylene ether.
Preferably, the assembly glue removing and recycling process is an auxiliary tool with good softness and adsorbability for wiping off the residual glue.
Preferably, the assembly glue removing and recycling process is carried out by a cotton swab as the auxiliary tool.
Preferably, the assembly part is subjected to glue removing and recycling process, and the auxiliary tool is dust-free cloth.
Preferably, the assembly part is subjected to glue removal and recycling process, and the glass piece is cleaned through an ultrasonic cleaning machine.
Preferably, the assembly part is subjected to glue removal and recycling, and the metal part is cleaned by rinsing.
The invention provides an assembly part glue removing and recycling process, wherein the assembly part is an assembly part formed by a glass part and a metal part, and the process comprises the following steps: disassembling each component of the assembly part by adopting a constant-temperature heating plate; placing the glass piece in the glue removing liquid to fully soak the residual glue part, and wiping the residual glue after soaking; soaking the metal piece in a constant-temperature heating degumming liquid; and cleaning and inspecting the glass piece and the metal piece, and putting into production for recycling. According to the above content, the glue removing process has the advantages of short time and low cost, does not damage the electroplating film layer, the printing ink and the appearance on each component, and each processed component can be directly put into production for reuse. Therefore, the assembly part glue removing and recycling process provided by the invention can remove the residual glue on the assembly part on the premise of not influencing coating and printing ink, so that the assembly part reaches the recycling standard, and the problem in the field at the present stage is solved.
Detailed Description
The core of the specific embodiment is to provide a glue removing and recycling process for an assembly, which can remove residual glue on the assembly on the premise of not affecting coating and ink, so that the assembly reaches the recycling standard, and the problem in the field at the present stage is solved.
The embodiments described below do not limit the contents of the invention described in the claims. The entire contents of the configurations shown in the following embodiments are not limited to those required as solutions of the inventions described in the claims.
The assembly part glue removing and recycling process provided by the specific embodiment is an assembly part formed by a glass part and a metal part, and comprises the following steps of: disassembling each component of the assembly part by adopting a constant-temperature heating plate; placing the glass piece in the degumming solution at normal temperature to fully soak the residual gum part, and wiping the residual gum after soaking; soaking the metal piece in a constant-temperature heating degumming liquid; and cleaning and inspecting the glass piece and the metal piece, and putting into production for recycling. According to the above content, the glue removing process has the advantages of short time and low cost, does not damage the electroplating film layer, the printing ink and the appearance on each component, and each processed component can be directly put into production for reuse. Therefore, the assembly part glue removing and recycling process provided by the invention can remove the residual glue on the assembly part on the premise of not influencing coating and printing ink, so that the assembly part reaches the recycling standard, and the problem in the field at the present stage is solved.
In the assembly glue removing and recycling process provided by the specific embodiment, the glue removing liquid can be produced by Shenzhen Yongan Fine chemical Co., Ltd, and the main components of the glue removing liquid comprise: triethanolamine, ethyl lactate, propylene glycol phenyl ether acetate, nonylphenol polyoxyethylene ether, and the like; and triethanolamine, ethyl lactate, propylene glycol phenyl ether acetate and nonylphenol polyoxyethylene ether can be used for removing glue at normal temperature without damaging ink.
The assembly glue removing and recycling process provided by the embodiment can be an auxiliary tool with good softness and adsorptivity, such as a cotton swab, dust-free cloth and the like, for wiping off residual glue on a glass piece.
In the assembly glue removing and recycling process provided by the specific embodiment, the temperature range of the heating plate can be 180-200 ℃.
According to the assembly glue removing and recycling process provided by the specific embodiment, the time range of heating the heating plate can be 1-2 min.
According to the assembly glue removing and recycling process provided by the specific embodiment, the time for soaking residual glue on the glass piece can be 1 hour. After soaking, using dust-free cloth or a cotton swab to wipe off residual glue, cleaning the glass piece by an ultrasonic cleaning machine to obtain a clean glass piece without residual glue, and repeatedly using the glass piece after the glass piece is inspected to reach the standard.
In the assembly part glue removing and recycling process provided by the specific embodiment, the metal piece is soaked in the glue removing liquid with the temperature ranging from 90 ℃ to 100 ℃.
According to the assembly part glue removing and recycling process provided by the specific embodiment, the time range for soaking the metal part can be 5-6 min. After soaking, the residual glue on the metal piece basically falls off, the metal piece without residual glue and clean can be obtained by rinsing with clear water, and the metal piece can be reused after being inspected to reach the standard.
Example 1
According to the assembly glue removing and recycling process provided by the embodiment, the heating plate heats the whole assembly, specifically, the temperature of the heating plate is 190 ℃, and the heating time is 1.5 min; then disassembling the heated assembly part, and soaking the disassembled glass substrate attached with the residual glue in a soaking tank for 1h, wherein the temperature of the soaking liquid is normal temperature; and (3) soaking the metal piece attached with the residual glue in another soaking tank for 5min at the soaking temperature of 100 ℃.
By adopting the combined process parameters of the embodiment, experimental tests show that the yield data of the glass substrate is 90.09%, and the yield data of the metal piece is 99.54%.
Example 2
Heating the assembly part by a heating plate, wherein the temperature of the heating plate is set to be 200 ℃, and the heating time is 1 min; disassembling the assembly parts, and soaking the glass substrate for 1h, wherein the soaking solution is at normal temperature; the metal piece is soaked for 6min at the temperature of 90 ℃. By adopting the combined process parameters of the embodiment, experimental tests show that the yield data of the glass substrate is 89.05%, and the yield data of the metal piece is 99.76%.
TABLE 1 statistical table of appearance yield
Figure BDA0001725470860000051
The following data characterize the yield parameters of the glass and metal articles obtained by the methods provided herein.
TABLE 2 statistics table for the yield of degumming
Sequence of Is thrown in Output of Yield of Total number of failures
Batch 1 650 646 99.4% 4
Batch 2 1700 1689 99.4% 11
Batch 3 1250 1242 99.4% 8
Accumulation 3600 3577 99.4% 23
TABLE 3 Friction test data after degumming (Standard values > 100)
Figure BDA0001725470860000061
TABLE 4 Water drop Angle test data before and after degumming of glass pieces (Standard ≥ 110)
Figure BDA0001725470860000062
Figure BDA0001725470860000071
It should be noted that the improved water drop angle test in the present embodiment is used for reflecting the surface cleanliness of the product; OK indicates that the residual glue on the surface of the product is removed completely without residue; PASS means PASS by test.
TABLE 5 post-adhesive removal reliability results (Performance test)
Figure BDA0001725470860000072
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. An assembly glue removing and recycling process, wherein the assembly is an assembly composed of a glass piece and a metal piece, and is characterized by comprising the following steps:
firstly, disassembling each component of the assembly part by adopting a constant-temperature heating plate;
placing the glass piece into a glue removing solution to completely soak the residual glue part, and wiping the residual glue after soaking; soaking the metal piece in a constant-temperature heating degumming solution;
step three, cleaning and inspecting the glass piece and the metal piece, and putting into production for recycling;
the time for soaking the glass piece is 50min-70min, and the degumming liquid for soaking the glass piece is normal temperature;
the degumming solution comprises triethanolamine, ethyl lactate, propylene glycol phenyl ether acetate and nonylphenol polyoxyethylene ether.
2. The assembly glue removing and recycling process according to claim 1, wherein the temperature of the heating plate ranges from 180 ℃ to 200 ℃; the heating time range of the heating plate is 1min-2 min.
3. The assembly glue removal recycling process according to claim 1, characterized in that preferably the glass piece is soaked for 1 h.
4. The assembly glue removing and recycling process according to claim 1, wherein the metal piece is soaked in a glue removing liquid at a temperature ranging from 90 ℃ to 100 ℃; the time range for soaking the metal piece is 5min-6 min.
5. The assembly glue removing and recycling process according to claim 1, wherein the residual glue is wiped off by an auxiliary tool with good softness and adsorptivity.
6. The assembly de-gumming recycling process of claim 5, wherein the auxiliary tool is a cotton swab.
7. The assembly de-gumming recycling process of claim 5, wherein the auxiliary tool is a dust-free cloth.
8. The assembly de-gumming recycling process of claim 1, wherein the glass piece is cleaned by an ultrasonic cleaner.
9. The assembly glue removing and recycling process according to claim 1, wherein the metal piece is cleaned by rinsing.
CN201810750714.2A 2018-07-10 2018-07-10 Glue removing and recycling process for assembly Active CN110538837B (en)

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CN114392949A (en) * 2021-12-31 2022-04-26 扬州景如源电镀设备配件有限公司 High-efficiency complete splicing glue removing process for electroplating roller

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CN201859840U (en) * 2010-10-16 2011-06-08 中芯国际集成电路制造(上海)有限公司 Cleaning device for degumming
CN201956324U (en) * 2010-11-25 2011-08-31 无锡春辉科技有限公司 Cleaning equipment for semiconductor wafer
CN203357389U (en) * 2013-06-17 2013-12-25 吴江市博众精工科技有限公司 Hot melting disassembling mechanism
CN104209303A (en) * 2014-07-30 2014-12-17 江西合力泰科技有限公司 Method for cleaning toughened glass of touch screen
CN104324922A (en) * 2014-09-17 2015-02-04 蓝思科技(长沙)有限公司 Method for removing adhesive residue of touch screen
CN107369609A (en) * 2016-05-11 2017-11-21 万润科技股份有限公司 Wafer residual glue cleaning method and device
CN207732800U (en) * 2017-11-23 2018-08-14 广东品胜电子股份有限公司 A kind of Mobile phone screen assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201859840U (en) * 2010-10-16 2011-06-08 中芯国际集成电路制造(上海)有限公司 Cleaning device for degumming
CN201956324U (en) * 2010-11-25 2011-08-31 无锡春辉科技有限公司 Cleaning equipment for semiconductor wafer
CN203357389U (en) * 2013-06-17 2013-12-25 吴江市博众精工科技有限公司 Hot melting disassembling mechanism
CN104209303A (en) * 2014-07-30 2014-12-17 江西合力泰科技有限公司 Method for cleaning toughened glass of touch screen
CN104324922A (en) * 2014-09-17 2015-02-04 蓝思科技(长沙)有限公司 Method for removing adhesive residue of touch screen
CN107369609A (en) * 2016-05-11 2017-11-21 万润科技股份有限公司 Wafer residual glue cleaning method and device
CN207732800U (en) * 2017-11-23 2018-08-14 广东品胜电子股份有限公司 A kind of Mobile phone screen assembly

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Effective date of registration: 20231123

Address after: 227 Xiangtai road Taizhou Jiangsu 225300

Patentee after: Lansi precision (Taizhou) Co.,Ltd.

Address before: 410100 No.99 Lixiang Road, Changsha Economic and Technological Development Zone, Hunan Province

Patentee before: LENS TECHNOLOGY (CHANGSHA) Co.,Ltd.

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