TWI738508B - Optical inspection system for inspecting residue remained on wafer chuck and optical inspection method for the same - Google Patents

Abstract

An optical inspection system and an optical inspection method is applied in a dark field environment to project a light beam to a wafer chuck in a low projecting angle, and then to capture a chuck inspection image. If there is any transparent residue being remained on the wafer chuck, a light scattering phenomenon is occurred at the edges of the transparent residue to project out a scattering light beam, and a total internal reflection phenomenon is occurred within the transparent residue. If the scattering light beam is projected out, a scattering boundary profile is presented in the chuck inspection image. A judgment of whether there is any transparent residue remained on the wafer chuck is made through judging whether any scattering boundary profile is presented in the chuck inspection image.

Description

Optical detection system and optical detection method for detecting residual glue of wafer sucker

The present invention relates to an optical inspection system and an optical inspection method, in particular to an optical inspection system and an optical inspection method for detecting residual glue on a wafer chuck.

In semiconductor technology, wafer processing is a very important and indispensable part. In some wafer processing processes, the wafer is cut in multiple stages, such as pre-cutting grooves for dividing into multiple processing areas, or cutting into multiple small chips for ultraviolet light irradiation or other processing. Process.

After the wafer is cut in multiple stages, in order to strengthen the support of the wafer or to arrange multiple cut small chips in order, at the same time, in order to be able to meet the operational needs of the optical-related process, it is often necessary to The light-transmitting adhesive film is attached to the wafer, and the wafer is sucked by a wafer chuck. After completing the related processing operations, the translucent film needs to be removed for subsequent processing operations. However, these translucent films are usually composed of a transparent film body and an adhesive. In the case of the adhesive film, there may be residual glue on the wafer chuck. The so-called residual glue may include fragments of the transparent film body and adhesive, or it may only contain scattered adhesives.

Once the wafer chuck still has adhesive residue, it will have an adverse effect on the subsequent process. Therefore, optical inspection equipment is needed to detect whether there is still adhesive residue on the wafer chuck. In the previous optical inspection technology, when the inspection beam irradiates the wafer chuck, it will be reflected from the wafer chuck. Therefore, there will be many bright reflection areas on the captured wafer chuck inspection image, which will lead to It is impossible to effectively distinguish whether there is residual glue in each detection area of the wafer chuck corresponding to the bright reflective area.

In the prior art, in order to avoid residual glue on the wafer chuck and adversely affect the subsequent process, a more conservative approach is to perform a process involving the use of light-transmitting adhesive film, regardless of whether the wafer chuck is actually on. If there is residual glue, the wafer chuck is always cleaned up, such as immersing the wafer chuck in the degumming solvent. As a result, it will lead to a longer overall process time and inefficiency.

In view of the fact that in the prior art, it is generally impossible to effectively identify whether there is residual glue in each inspection area of the wafer chuck due to the influence of light reflection, and even lead to the need to carry out a comprehensive residual glue removal operation, resulting in a longer overall process time. And other issues. The main purpose of the present invention is to provide an optical detection technology dedicated to detecting residual glue, so as to accurately detect the residual glue residue on the wafer chuck to determine whether the residual glue needs to be removed, or as a reference for selecting the residual glue removal method .

In order to solve the problems of the prior art, the necessary technical means adopted by the present invention is to provide an optical inspection system for detecting the residual glue of the wafer chuck, which is set in a wafer processing equipment including a wafer chuck, and the wafer The circular sucker has a suction plane for sucking a wafer. The optical inspection system is used to detect whether at least one light-transmitting adhesive remains on the wafer chuck after removing a light-transmitting adhesive film from the wafer in a dark field environment, and includes an illumination module , An image capture module and an image analysis module.

The lighting module projects a detection beam to the wafer chuck along a projection direction, and the angle between the projection direction and the suction plane is 0 to 10 degrees. The image capture module is set in the wafer processing equipment to capture at least one wafer chuck inspection image of the wafer chuck after the inspection beam is projected onto the wafer chuck; the image analysis module is electrically connected to the image The capture module is used to analyze whether there is at least one scattering boundary contour corresponding to the translucent residual glue in the detected image of the wafer chuck.

When there is translucent residue on the wafer chuck, the detection beam is projected from one of the first edges of the translucent residue into the translucent residue. After the translucent residue is totally reflected, the light is self-transmitting A second edge of the residual glue is projected, and the detection light beam projects at least one scattered light beam to the image capturing module on the first edge and the second edge, thereby presenting a scattering boundary contour in the detection image of the wafer chuck.

Based on the above-mentioned necessary technical means, preferably, the lighting module may include at least one line of lighting components, and each line of lighting components includes a plurality of linearly arranged lighting elements. Alternatively, the lighting module may also be a ring-shaped lighting assembly, and the ring-shaped lighting assembly may include a ring-shaped body and a plurality of lighting elements arranged on a ring-shaped inner wall of the ring-shaped body.

Based on the above necessary technical means, preferably, the image capturing module may include a lens group and an image sensing device, the lens group and the image sensing device are arranged along an imaging central axis, and the imaging central axis The system passes through the wafer suction cup. The image sensing device can be a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD). In terms of the relationship between the imaging center axis and the adsorption plane, the imaging center axis can be perpendicular or inclined to the adsorption plane.

In order to solve the problem of the prior art, another necessary technical means adopted by the present invention is to provide an optical inspection method for detecting the adhesive residue of the wafer chuck. It is an optical inspection method for detecting the adhesive residue of the wafer chuck. After removing a light-transmitting adhesive film from a wafer, in a dark field environment, it is used to detect whether at least one light-transmitting residual glue remains on at least one wafer chuck for absorbing the wafer. Wafer chuck It has a suction plane for sucking the wafer.

In the optical detection method, a detection beam is first projected to the wafer chuck along a projection direction, and the angle between the projection direction and the suction plane is 0 to 10 degrees. After the inspection beam is projected to the wafer chuck, at least one wafer chuck inspection image of the wafer chuck is further captured. Finally, analyze the wafer chuck to detect whether there is at least one scattering boundary contour corresponding to the translucent residual glue in the image.

When performing the optical inspection method, if there is translucent residue on the wafer chuck, the detection beam is projected from the first edge of one of the translucent residues into the translucent residue, and passes through the translucent residue. After reflection, it is projected from a second edge of the translucent residual glue film, and the detection beam projects at least one scattered beam on the first edge and the second side, so that the scattered beam is displayed in the at least one wafer detection image Border outline.

On the basis of the above-mentioned necessary technical means, it is better to analyze whether there is at least one scattering boundary contour corresponding to the translucent residual glue in the image detected by the wafer chuck, and then the at least one transmission boundary contour can be further analyzed by the scattering boundary contour. The quantity, area, or distribution location of the optical residue. Even better, it can further send out a reminder message of the suggested removal method for the residual glue based on the analyzed quantity, area or distribution position of the translucent residual glue.

Based on the above, because the optical inspection technology (including system and method) provided by the present invention for detecting the adhesive residue of the wafer chuck, it is based on the two characteristics of the translucent adhesive residue, that is, the "transmittance" The residual glue itself can transmit light, and the refractive index is greater than that of air" and "the edges of the translucent residual glue are mostly uneven torn edges." Therefore, the detection beam is illuminated at a low angle in a dark field environment. Scattering occurs at the edges of the translucent residual glue, and total reflection occurs inside the translucent residual glue. Therefore, it is possible to accurately determine whether there is translucent residual glue on the wafer chuck by analyzing the detection image of the wafer chuck to determine whether there is a scattering boundary contour. When there is translucent residual glue, the quantity, area or distribution position of translucent residual glue can be further analyzed accurately, so as to send out a reminder message of the recommended removal method of residual glue, which can be used as a reference basis for selecting the residual glue removal method. The removal of residual glue can be carried out more efficiently.

Since the optical inspection technology (including systems and methods) provided by the present invention for detecting the adhesive residue of the wafer chuck can be widely used to detect the adhesive residue of the wafer chuck of various wafer processing equipment, it is equivalent to the relevant components. Various local adjustments and improvements can be made in the selection of component replacement and placement position. The combination of implementations is too numerous to enumerate, so I will not repeat them here, and only list the best three implementations. Examples to be specific. In addition, the drawings in the embodiments are in a very simplified form, and the components are not presented in absolutely precise proportions, but are only used to conveniently and clearly assist in explaining the purpose and effects of the embodiments of the present invention.

Please refer to the first figure, which is a schematic diagram showing the components and the installation positions of the optical inspection system for detecting the adhesive residue of the wafer chuck provided by the first embodiment of the present invention. As shown in the first figure, an optical inspection system (hereinafter referred to as "optical inspection system") 1 for detecting adhesive residue on wafer chuck is installed in a wafer processing equipment 2 and the wafer processing equipment 2 includes A wafer chuck 21 and an inspection base 22 are provided. The wafer chuck 21 is disposed in a top groove (not numbered) of the inspection base 22 and has a suction plane 211 for sucking a wafer (not drawn).

The optical inspection system 1 is used to remove a light-transmitting adhesive film (not drawn) from the wafer, and detect whether at least one light-transmitting adhesive remains on the wafer chuck 21 in a dark field environment (in this In the embodiment, the wafer chuck 21 has three translucent residues 3a, 3b, and 3c), and includes an illumination module 11, an image capture module 12, and an image analysis module 13. The dark field environment refers to an internal environmental space inside the wafer processing process equipment 2, and the background brightness in the internal environmental space is much smaller than that provided by the illumination module 11 to the illuminated area in the internal environmental space The brightness produced by the lighting causes the background brightness to have a negligible effect on the detection results.

The lighting module 11 includes two-line lighting elements 111 and 112, and the line lighting elements 111 and 112 respectively include a plurality of linearly alternated lighting elements 1111 (marked in the second figure, the arrangement is similar or the same as the lighting element 1121) and 1121 . The lighting elements 1111 and 1121 may be LED light-emitting monomers. The line lighting components 111 and 112 can be two independent LED light bars, or can be integrated into a single L-shaped LED light bar.

The image capturing module 12 is set in the dark field environment in the wafer processing equipment 2 and may include a lens group 121 and an image sensor device 122. The lens group 121 and the image sensor device 122 are located along an imaging center Axis IA is set. When there are other components (such as rollers) in the wafer processing equipment 2 above the wafer chuck 21, the imaging center axis IA can pass through the center of the wafer chuck and be inclined to the suction plane 211, and there is an angle Φ1 between the two , So as to ensure that the image capturing module 12 can smoothly capture a complete image of the wafer chuck 21.

The lens group 121 can be formed by selectively configuring one or more lenses to meet the needs of the image sensing device 122 for capturing images (such as partial magnification imaging, wide-angle imaging, or global imaging). The image sensing device 122 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD).

The image analysis module 13 is electrically connected to the image capture module 12, and can be an image analysis module built in the wafer processing equipment 2 or a computer external to the wafer processing equipment 2 The image analysis module set up inside (as shown in the first picture).

Please further refer to the second to fourth figures, and also refer to the first figure. The second figure is a schematic diagram showing the detection beam scatters at the edge of the translucent residual glue in the first embodiment of the present invention and produces total reflection inside the translucent residual glue; the third figure shows the first implementation of the present invention In the example, when light-transmitting residue remains on the wafer chuck, a scattering boundary contour will appear in the inspection image of the wafer chuck; the fourth figure is a flowchart of the corresponding optical inspection method in the first embodiment of the present invention.

As shown in Figures 1 to 4, when the optical inspection system 1 provided by the first embodiment of the present invention is used to detect whether light-transmitting residue is left on the wafer chuck 21, the optical inspection method can be followed. The following steps are implemented.

First, the illumination module 11 can be used to project at least one detection beam on the wafer chuck 21 along a projection direction. The chuck 21 projects a detection beam. In this embodiment, only the drawing line lighting assembly 111 projects two detection beams on the wafer chuck 21 along a projection direction ID (only one of the detection beams ILB is indicated in the figure), and the detection here The light beam ILB refers to a collection of light beams projected by a plurality of lighting elements 1111. The angle θ between the projection direction ID and the suction plane 211 is 0 degrees to 10 degrees (including any angle between 0 degrees, 10 degrees, and 0 degrees to 10 degrees) (step S110). In this embodiment, preferably, the detection beam ILB is flatly attached to the adsorption plane 211 and projected, that is, the angle θ between the projection direction ID and the adsorption plane 211 is 0 degrees.

After the translucent adhesive film (not drawn) is removed from the wafer, the wafer chuck 21 used to adsorb the wafer may have translucent residue or no translucent residue. In this embodiment In this case, the light-transmitting residue 3a, 3b, and 3c remaining on the wafer chuck 21 is taken as an example. The translucent glue residue is mostly formed by the translucent glue film remaining on the wafer or wafer chuck 21 after being torn. Therefore, the translucent glue residue 3a, 3b, and 3c have the following two characteristics. The first characteristic is that the translucent residues 3a, 3b, and 3c are translucent, and the refractive index is smaller than that of air. The second feature is that the edges of the translucent residual glue 3a, 3b, and 3c are uneven edges. As we all know, since the edges of the translucent residual glue 3a, 3b, and 3c are caused by the tearing and breaking of the translucent film, they are uneven edges. The so-called unevenness includes the tensile fracture thickness caused by tearing. Uneven edge thickness caused by inconsistencies and uneven edge contour caused by tearing notches.

After the illumination module 11 projects the detection beam ILB on the wafer chuck 21 along the projection direction ID, the image capturing module 12 can be used to capture at least one wafer chuck detection image of the wafer chuck 21 (step S120), and in the third The picture shows one of the wafer chuck inspection images CI. Since there is an angle Φ1 between the imaging center axis IA and the suction plane 211 of the wafer chuck 21, the edge contour of the captured original wafer chuck detection image is not a perfect circle. The above-mentioned wafer chuck detection image CI is corrected The image captured when the simulated included angle Φ1 is 90 degrees.

When the detection beam ILB is flatly attached to the wafer chuck 21 and projected, or the angle θ between the projection direction ID and the suction plane 211 is less than 10 degrees, if the wafer chuck 21 does not have any remaining translucent glue, then The detection beam ILB will also be projected out flat on the wafer chuck 21, or reflected in a direction at a lower angle with the suction plane 211, so that the image capturing module 12 can hardly sense any detection beam ILB generated. bright.

If the light-transmitting glue residue 3a, 3b, and 3c shown in this embodiment remain on the wafer chuck 21, when the detection beam ILB is projected onto the light-transmitting glue residue 3a, it will start from one of the light-transmitting glue residues 3a. An edge 31a is projected into the translucent residual glue body 32a of the translucent residual glue 3a, and then projected from a second edge 33a of the translucent residual glue 3a.

Since the edges of the translucent residual glue 3a, 3b, and 3c are uneven edges, the detection light beam ILB will scatter at the first edge 31a and the second edge 33a to project scattered light beams SLB1 and SLB2, respectively. In addition, since the translucent residual glue 3a is translucent, the refractive index is smaller than that of air, and the aforementioned included angle θ is 0 to 10 degrees, the detection beam ILB will be totally reflected in the translucent residual glue body 32a. It will not be reflected outside the translucent residual glue 3a. There are similar optical phenomena for the translucent residual glue 3b and 3c. Due to the above-mentioned various reasons, the image capturing module 12 can only sense the scattered light beams (including the scattered light beams SLB1 and SLB2) generated at the edges of the translucent residual glue 3a (including the first edge 31a and the second edge 33a).

After capturing the wafer chuck detection image CI, the image analysis module 13 can be used to analyze whether the wafer chuck detection image CI has at least one scattering boundary contour corresponding to the translucent residual glue (step S130). In step 120 of this embodiment, because the wafer chuck 21 has translucent residues 3a, 3b, and 3c, the image capture module 12 will only sense the edges of the translucent residues 3a, 3b, and 3c. Therefore, in the captured wafer chuck inspection image CI, there will be three scattering boundary contours BP3a, BP3b and BP3c corresponding to the edge contours of the translucent residual glue 3a, 3b, and 3c. At this time, the image analysis module 13 will analyze the existence of the scattering boundary contour, and determine that the light-transmitting residual glue remains on the wafer chuck 21 based on this.

Conversely, if the wafer chuck 21 does not have any remaining light-transmitting residue, the image capture module 12 can hardly sense any light generated by the detection beam ILB, so the chuck detection image appears almost black As a result, the image analysis module 13 analyzes that there is no scattering boundary contour, and judges that there is no translucent residue remaining on the wafer chuck 21 based on this.

After the image analysis module 13 analyzes the existence of the scattering boundary contour, the quantity, area or distribution position of the translucent residual glue can be further analyzed (step S140). In this embodiment, the image analysis module 13 can analyze that there are three scattering boundary contours BP3a, BP3b, and BP3c in the wafer chuck detection image CI, and can analyze the quantity, area or distribution position of the translucent residual glue based on this. In this embodiment, the image analysis module 13 can analyze that the wafer chuck 21 has three translucent residues 3a, 3b, and 3c, and can use the wafer chuck to detect the image CI, combining the image capture module 12 with The distance between the wafer chuck 21, the included angle Φ1, the lens magnification and the built-in coordinate system of the image analysis module 13, analyze the area or distribution position of the translucent residual glue 3a, 3b, and 3c.

Preferably, the image analysis module 13 may further send out a reminder message of a suggested cleaning method for the residual glue according to the quantity, area or distribution position of the translucent residual glue. The prompt information of the recommended removal method for residual glue can be used as a reference basis for selecting the residual glue removal method, so that the residual glue removal work can be performed more efficiently (step S150).

For example: if there is no translucent residual glue, it can be judged that it will not cause a negative impact on the subsequent process, and it is recommended that it does not need to be removed. If the amount of remaining translucent residual glue is small, the area is small, or the distribution location is relatively concentrated, it can be judged that the negative impact on the subsequent process is small, and it is recommended not to remove it temporarily or choose to remove it only locally Way to remove residual glue. If the amount of translucent residual glue is large, the area is large or the distribution position is relatively scattered, it can be judged that it will have a greater negative impact on the subsequent process. It is recommended that the residual glue should be removed immediately by a comprehensive removal method.

Refer to the fifth figure, which is a schematic diagram showing the position of the image capturing module of the optical inspection system for detecting the adhesive residue of the wafer chuck provided by the second embodiment of the present invention. In the second embodiment of the present invention, the lighting module 11 is the same as the first embodiment, and also includes two line lighting components, and the positions of the two line lighting components are the same as those of the first embodiment. A line lighting assembly 111 is taken as a representative. The difference between the second embodiment and the first embodiment is that when there are no other components (such as rollers) in the wafer processing equipment above the wafer chuck 21, the image capture module 12 can be directly installed on the wafer chuck. Right above 21, that is, the imaging center axis IA passes through the center of the wafer chuck 21 and is perpendicular to the suction plane 211. In other words, the angle Φ2 existing between the imaging center axis IA and the adsorption plane 211 is 90 degrees.

Refer to the sixth figure, which is a schematic diagram showing the arrangement positions of the lighting module and the image capturing module of the optical inspection system for detecting the adhesive residue of the wafer chuck provided by the third embodiment of the present invention. In the third embodiment of the present invention, the difference from the first embodiment is that the lighting module 11 is replaced by another lighting module 14. The lighting module 14 is a ring-shaped lighting assembly, and the ring-shaped lighting assembly may include a ring-shaped body 141 and a plurality of lighting elements 142 arranged on an annular inner wall 1411 of the annular body 141. The ring-shaped body 141 can be directly combined with the detection base 22 shown in the first figure, and each of the lighting elements 142 projects a detection beam to the wafer chuck 21 along their respective projection directions, and the above-mentioned respective projection directions are the same as those of the wafer chuck. The included angles between the suction planes 211 of 21 are all the same, and are also in the range of 0 degrees to 10 degrees.

The advantage of using the ring-shaped lighting assembly is that the distance between each lighting element 142 and the edge of the wafer chuck 21 is approximately the same, so that the light field distribution of the detection beam irradiated by the wafer chuck is more uniform. In addition, the image capturing module 12 is also arranged directly above the wafer chuck 21, so that the included angle Φ3 between the imaging center axis IA and the suction plane 211 is 90 degrees.

To sum up, in the optical inspection technology (including system and method) provided by the present invention for detecting the adhesive residue of the wafer chuck, it makes full use of two of the transparent adhesive residues. Characteristics, that is, "the translucent residual glue itself can transmit light, and the refractive index is greater than air" and "the edges of the translucent residual glue are mostly uneven torn edges." Therefore, it is matched with low-angle illumination in a dark field environment In this way, the detection beam scatters at the edge of the translucent residual glue, and produces total reflection inside the translucent residual glue. Therefore, it is possible to accurately determine whether there is translucent residual glue on the wafer chuck by analyzing the detection image of the wafer chuck to determine whether there is a scattering boundary contour. When there is translucent residual glue, the quantity, area or distribution position of translucent residual glue can be further analyzed accurately, so as to send out a reminder message of the recommended removal method of residual glue, which can be used as a reference basis for selecting the residual glue removal method. The removal of residual glue can be carried out more efficiently.

Through the detailed description of the above preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent for which the present invention is intended.

1: Optical inspection system 11, 14: Lighting module 111, 112: line lighting components 1111, 1121: lighting components 12: Image capture module 121: lens group 122: image sensing device 13: Image analysis module 141: Ring body 1411: Annular inner wall 142: lighting components 2: Wafer processing process equipment 21: Wafer sucker 211: Adsorption plane 22: Detection base 3a, 3b, 3c: translucent residual glue 31a: first edge 32a: Translucent residual glue body 33a: second edge IA: imaging center axis Φ1, Φ2, Φ3: included angle θ: included angle ID: Projection direction ILB: detection beam SLB1, SLB2: scattered beam CI: Wafer suction cup inspection image BP3a, BP3b, BP3c: Scattering boundary contour

The first figure is a schematic diagram showing the components and installation positions of the optical inspection system for detecting the residual glue of the wafer chuck provided by the first embodiment of the present invention; The second figure is a schematic diagram showing that the detection beam scatters at the edge of the light-transmitting glue residue and generates total reflection inside the light-transmitting glue residue in the first embodiment of the present invention; The third figure shows that when the translucent residue remains on the wafer chuck in the first embodiment of the present invention, a scattering boundary contour will appear in the detection image of the wafer chuck; The fourth figure is a flowchart showing the corresponding optical detection method in the first embodiment of the present invention; The fifth figure is a schematic diagram showing the arrangement position of the image capture module of the optical inspection system for detecting the adhesive residue of the wafer chuck provided by the second embodiment of the present invention; and The sixth figure is a schematic diagram showing the arrangement positions of the lighting module and the image capturing module of the optical inspection system for detecting the adhesive residue of the wafer chuck provided by the third embodiment of the present invention.

1: Optical inspection system

11: Lighting module

111, 112: line lighting components

1121: lighting components

12: Image capture module

121: lens group

122: image sensing device

13: Image analysis module

2: Wafer processing process equipment

21: Wafer sucker

211: Adsorption plane

22: Detection base

3a, 3b, 3c: translucent residual glue

IA: imaging center axis

Φ 1: included angle

Claims (10)

An optical inspection system for detecting adhesive residue on a wafer chuck is provided in a wafer processing equipment including a wafer chuck, the wafer chuck has a suction plane for absorbing a wafer, the optical inspection system After removing a light-transmitting adhesive film from the wafer, it is used to detect whether at least one light-transmitting adhesive remains on the wafer chuck in a dark field environment, and includes: An illumination module, which projects at least one detection beam to the wafer chuck along a projection direction, and the angle between the projection direction and the suction plane is 0 degree to 10 degrees; An image capture module, which is installed in the wafer processing equipment, and is used to capture at least one wafer chuck inspection image of the wafer chuck after the at least one inspection beam is projected onto the wafer chuck; An image analysis module is electrically connected to the image capture module for analyzing whether the at least one wafer chuck detects whether there is at least one scattering boundary contour corresponding to the at least one light-transmitting residue; Wherein, when the at least one translucent residue remains on the at least one wafer chuck, the at least one detection beam is projected into the translucent residue from a first edge of the translucent residue, and passes through After the translucent residual glue is totally reflected, it is projected from a second edge of the translucent residual glue, and the detection beam projects at least one scattered beam on the first edge and the second edge, so as to The detection image of at least one wafer chuck presents the at least one scattering boundary contour. The optical inspection system for detecting adhesive residue on a wafer chuck according to claim 1, wherein the lighting module includes at least one linear lighting assembly, and the at least one linear lighting assembly includes a plurality of linearly arranged lighting elements. The optical inspection system for detecting glue residue on wafer chuck according to claim 1, wherein the lighting module is a ring-shaped lighting assembly, and the ring-shaped lighting assembly includes a ring-shaped body and a plurality of A lighting element on the inner wall of a ring-shaped body. The optical inspection system for detecting residual glue on a wafer chuck according to claim 1, wherein the image capturing module includes a lens group and an image sensing device, and the lens group and the image sensing device are along An imaging center axis is provided, and the imaging center axis passes through the wafer chuck. The optical inspection system for detecting adhesive residue on wafer chuck as described in claim 4, wherein the image sensing device is a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) ). The optical inspection system for detecting glue residue on a wafer chuck as described in claim 4, wherein the imaging center axis is perpendicular to the adsorption plane. The optical inspection system for detecting glue residue on a wafer chuck as described in claim 4, wherein the imaging center axis is inclined to the suction plane. An optical inspection method for detecting the adhesive residue of a wafer sucker, which is used to inspect at least one wafer used for adsorbing the wafer in a dark field environment after a light-transmitting adhesive film is removed from a wafer Whether at least one light-transmitting residue still remains on the sucker, the wafer sucker has a suction plane for sucking the wafer, the optical detection method includes the following steps: (a) At least one detection beam is projected to the wafer chuck along a projection direction, and the angle between the projection direction and the suction plane is 0 to 10 degrees; (b) After the at least one inspection beam is projected onto the wafer chuck, capture at least one wafer chuck inspection image of the wafer chuck; (c) Analyze whether the detected image of the at least one wafer chuck has at least one scattering boundary contour corresponding to the at least one light-transmitting residual glue; Wherein, when the at least one translucent residue remains on the at least one wafer chuck, the at least one detection beam is projected into the translucent residue from a first edge of the translucent residue, and passes through After the translucent residual glue is totally reflected, it is projected from a second edge of the translucent residual glue film, and the at least one detection beam projects at least one scattered beam on the first edge and the second edge, Therefore, the at least one scattering boundary contour is presented in the at least one wafer inspection image. The optical inspection method for detecting the residual glue of the wafer chuck as described in claim 8, further includes a step (d) after the step (c), and the step (d) is based on the at least one scattering boundary contour The quantity, area or distribution position of the at least one translucent residual glue is analyzed. The optical inspection method for detecting residual glue on a wafer chuck as described in claim 9, wherein after the step (d), a step (e) is further included, and the step (e) is based on the analyzed At least one amount, area or distribution position of the translucent residual glue sends out a reminder message of a suggested removal method for the residual glue.

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