TWM387365U - Die bonding apparatus - Google Patents

Die bonding apparatus

Info

Publication number
TWM387365U
TWM387365U TW98220548U TW98220548U TWM387365U TW M387365 U TWM387365 U TW M387365U TW 98220548 U TW98220548 U TW 98220548U TW 98220548 U TW98220548 U TW 98220548U TW M387365 U TWM387365 U TW M387365U
Authority
TW
Taiwan
Prior art keywords
bonding apparatus
die bonding
die
bonding
Prior art date
Application number
TW98220548U
Other languages
Chinese (zh)
Inventor
Chun-Kuei Lai
Tzu-Peng Wu
Ee-Sun Lin
Tun-Chih Shih
Shih-Chuan Wang
Yi-Lun Lin
Chien-Chih Liu
Original Assignee
Gallant Prec Machining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gallant Prec Machining Co Ltd filed Critical Gallant Prec Machining Co Ltd
Priority to TW98220548U priority Critical patent/TWM387365U/en
Publication of TWM387365U publication Critical patent/TWM387365U/en

Links

TW98220548U 2009-11-06 2009-11-06 Die bonding apparatus TWM387365U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98220548U TWM387365U (en) 2009-11-06 2009-11-06 Die bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98220548U TWM387365U (en) 2009-11-06 2009-11-06 Die bonding apparatus

Publications (1)

Publication Number Publication Date
TWM387365U true TWM387365U (en) 2010-08-21

Family

ID=50604061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98220548U TWM387365U (en) 2009-11-06 2009-11-06 Die bonding apparatus

Country Status (1)

Country Link
TW (1) TWM387365U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107369609A (en) * 2016-05-11 2017-11-21 万润科技股份有限公司 Wafer residual glue cleaning method and device
TWI701760B (en) * 2015-03-16 2020-08-11 韓華精密機械股份有限公司 Equipment attaching apparatus and method for equipment attaching

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701760B (en) * 2015-03-16 2020-08-11 韓華精密機械股份有限公司 Equipment attaching apparatus and method for equipment attaching
CN107369609A (en) * 2016-05-11 2017-11-21 万润科技股份有限公司 Wafer residual glue cleaning method and device
TWI680019B (en) * 2016-05-11 2019-12-21 萬潤科技股份有限公司 Wafer adhesive cleaning method and device
CN107369609B (en) * 2016-05-11 2020-08-18 万润科技股份有限公司 Wafer residual glue cleaning method and device

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model