TWI608875B - Stage and wafer residue cleaning device using the same - Google Patents

Description

Stage and wafer residual glue cleaning device using the same

The present invention relates to a stage and a wafer residual cleaning device using the same, and more particularly to a stage for carrying and positioning a wafer for processing the wafer on a stage and using the same. The wafer residual glue cleaning device of the stage.

According to the general wafer processing process, the adhesive is often sprayed or spotted on the die or its periphery. These adhesives usually remain on the die after the process is completed, and some must be removed or the next process will be affected. The adhesive is difficult to completely remove whether it is cleaned with any solvent. In the prior art, the entire wafer is wiped to clean the surface of the wafer. The glue is removed.

The prior art method of wiping the entire wafer can only be applied to the condition that the wafer surface has a large residual residue, and is only applicable to the 2D wafer; since the current wafer process has been developed to the 3D process, it is often in the crystal After the circle has finished cutting the grains, it is still necessary to apply the glue between the grains. Therefore, many times the residual glue will not occur in a large piece, but only will remain in some individual grains, and then the whole crystal will be used. Round cleaning is difficult to effectively clean individual dies.

Accordingly, it is an object of the present invention to provide a stage suitable for carrying and positioning wafers when performing residue cleaning for individual dies.

Another object of the present invention is to provide a wafer residual cleaning device that can use the stage.

The carrier according to the purpose of the present invention comprises: a fixing seat; a carrier plate disposed on the fixing base and rotatable by driving; the carrier is provided with a load measuring component; and a fixing frame is disposed at the loading And a positioning plate disposed on the fixing frame and coupled by the fixing frame, the upper surface of the positioning plate is provided with a gas hole, and the negative hole is provided with a negative pressure to carry the bearing on the positioning plate Adsorption is carried out.

According to another object of the present invention, a wafer residual cleaning apparatus includes: the stage, the stage is provided, and the wafer to be applied as a workpiece is disposed on the stage; and the detecting mechanism can treat The die is applied to the workpiece to inspect the residual rubber condition; a wiping mechanism is provided with a wiping material, and the individual individual crystal grains from which the residual glue is detected can be wiped one by one.

Another wafer residual glue cleaning device according to another object of the present invention includes: using the stage, comprising: a machine table having a machine table, a transfer section on the machine table; a gantry frame Separating the machine from a first working area and a second working area; a detecting mechanism is disposed on the side of the gantry rail facing the first working area, and performing the workpiece to be applied in the first working area A pick-and-place mechanism is disposed in the first working area of the machine, and includes two clamping seats disposed at intervals; a wiping mechanism is disposed on a side of the gantry rail facing the second working area, and is provided with a pressing seat And a wiper assembly; the press-fitted mount is provided with a first press-fit assembly, the wiper assembly provides a wiper thereon; the stage is disposed in the second working area of the machine and can be driven to be displaced In the first working area and the second working area, and receiving the workpiece from the pick-and-place mechanism or delivering the workpiece to the pick-and-place mechanism; the first pressing component can be driven to press against the material on the loading table The workpiece is to be applied for residue cleaning.

The stage of the embodiment of the present invention and the wafer residual glue cleaning device using the same, because the stage is provided to be applied as a workpiece, the heating element can be heated on the stage, and the residual glue is heated to perform a lower In the case where the entire piece is to be applied as the first pyrolysis process of the workpiece, the wiping mechanism is further executed by the first pressing assembly having the heat source, and a second pyrolysis process for the individual crystal grains from the top to the bottom is The residual glue on the die which has been rubbed has been melted into a liquid dilution state, and then wiped by the second pressure-bonding component without the heat source, the residual glue can be cleaned more easily, and the linearity of the line laser height detector is projected. The laser beam is used to check the rubbing effect, and the die cleaning can be completed without any omission; and the wiping member of the wiping mechanism releases the wiping material to the hollow reel of the winding area by the reel in the releasing area. The material can be used to continuously wipe the cleaning liquid from the roller on the cleaning liquid container, and adjust the weight of the cleaning material in the entire flow path through the weight wheel of the weight wheel to make the cleaning work clean. It can be continuously and continuously automated, which greatly improves the cleaning performance. At the same time, the elastic element of the upper and lower sides of the second rail seat is elastically buffered when the upper and lower sides of the second rail seat are displaced, so that the module is pressed against the module. When the first pressing component or the second pressing component is pressed against the surface of the die, the pressure of the pressing pressure itself is buffered except for the measurement of the lower pressure channel by the measurement of the load measuring component on the loading platform. It can reduce the damage of the crystal grains to be applied to the workpiece; The die is cleaned one by one, and the die with the residual glue can be cleaned separately. In addition to the better cleaning effect, the cleaning of the residual glue on the whole wafer can be performed efficiently.

A‧‧‧ machine

A1‧‧‧ machine table

A2‧‧‧ pedestal

A21‧‧‧ upper surface

A3‧‧‧Transfer interval

A4‧‧‧First Work Area

A5‧‧‧Second Work Area

B‧‧‧Longmen rail

B1‧‧‧ column

B2‧‧‧ beams

B3‧‧‧First drive

B4‧‧‧rails

B5‧‧‧rails

B6‧‧‧ slide

B7‧‧‧second drive

C‧‧‧Testing agency

D‧‧‧ pick-and-place mechanism

D1‧‧‧Clip seat

D2‧‧‧Card Department

D3‧‧‧Inlay clips

D4‧‧‧ pivot

D5‧‧‧ fixed seat

D6‧‧‧ drive parts

E‧‧‧ rail seat

E1‧‧‧ rail seat drive

F‧‧‧liquid supply mechanism

G‧‧‧ stage

G1‧‧‧ fixed seat

G2‧‧‧ Carrier

G21‧‧‧ upper surface

G22‧‧‧Support frame

G23‧‧‧Load weight measuring component

G24‧‧‧ positioning parts

G3‧‧‧ fixed frame

G31‧‧‧Seat

G311‧‧‧ side

G32‧‧‧ feet

G33‧‧‧ Positioning interval

G4‧‧‧ heating element

G41‧‧‧heating rod

G5‧‧‧ positioning plate

G51‧‧‧ Groove

G52‧‧‧ Groove

G53‧‧‧ stomata

H‧‧‧wiping mechanism

H1‧‧‧ against the frame

H11‧‧‧ fixed seat

H12‧‧‧ drive parts

H13‧‧‧First rail seat

H131‧‧ ‧ slide

H14‧‧‧ linkage seat

H15‧‧‧Second rail seat

H151‧‧‧rails

H152‧‧‧ slide

H153‧‧‧ rails

H154‧‧‧ drive parts

H155‧‧‧Flexible components

H2‧‧‧Laser altimeter

H21‧‧‧ line laser beam

H3‧‧‧Pressure module

H31‧‧‧First pressure component

H311‧‧‧ drive parts

H3111‧‧‧ Fixed seat

H3112‧‧‧ link

H3113‧‧‧ side seat

H312‧‧‧Adjustment components

H3121‧‧‧First adjustment seat

H3122‧‧‧Second adjustment seat

H3123‧‧‧ third adjustment seat

H3124‧‧‧Fixed parts

H3125‧‧‧Fixed parts

H313‧‧‧Connection

H3131‧‧‧heating hole

H3132‧‧‧Measurement hole

H3133‧‧‧Loading and Unloading Department

H3134‧‧‧ loading and unloading hole

H3135‧‧‧Temperature switch

H314‧‧‧heating parts

H315‧‧‧ pressed to the seat

H3151‧‧‧ loading and unloading head

H3152‧‧‧Missing head

H3153‧‧‧ push handle

H3154‧‧‧Connecting parts

H3155‧‧‧Missing Department

H3156‧‧‧ magnetic parts

H316‧‧‧ screw joint

H3161‧‧‧Micro-adjustment screw

H3162‧‧‧ fixing screw

H3163‧‧‧Adjustable screw

H3164‧‧‧Perforation

H3171‧‧ ‧ sales

H3172‧‧‧Flexible components

H32‧‧‧Second pressure component

H33‧‧‧Rack

H4‧‧‧Wash component

H41‧‧‧ Fixing frame

H411‧‧‧First interval

H412‧‧‧Second interval

H413‧‧‧Fixed Department

H414‧‧‧ release area

H4141‧‧‧ drive parts

H4142‧‧‧Reel

H4143‧‧‧First steering wheel

H4144‧‧‧Second steering wheel

H4145‧‧‧weight wheel

H4146‧‧‧Long slot

H4147‧‧‧weight

H4148‧‧‧rails

H4149‧‧‧Sensor

H415‧‧‧Retraction area

H4151‧‧‧ drive parts

H4152‧‧‧Reel

H4153‧‧‧First steering wheel

H4154‧‧‧Second steering wheel

H4155‧‧‧weight wheel

H4156‧‧‧ long slot

H4157‧‧‧weight

H4158‧‧‧rails

H4159‧‧‧Sensor

H416‧‧‧Dip area

H4161‧‧‧cleaning liquid container

H4162‧‧‧Roller

H4163‧‧‧near wheel

H4164‧‧‧Swing

H4165‧‧‧First activity round

H4166‧‧‧Second activity round

H4167‧‧‧Long slot

H4168‧‧‧ shaft

H4169‧‧‧Rotary drive

H417‧‧‧ Pulling area

H4171‧‧‧ drive parts

H4172‧‧‧ Pulling wheel

H4173‧‧‧Inclusion round

H4174‧‧‧ pivot

H4175‧‧‧ swing arm

H4176‧‧‧ pivot

H4177‧‧‧Flexible components

H418‧‧ Wipe area

H4181‧‧‧First guiding arm

H4182‧‧‧Second guiding arm

H4183‧‧‧ operation spacing

H4184‧‧‧First support wheel

H4185‧‧‧Second support wheel

H4186‧‧‧ Guide wheel

H419‧‧‧Temperature Sensor

H4191‧‧‧Extension rod

H4192‧‧‧ Fixed seat

H4193‧‧‧ slide

H4194‧‧‧rails

W‧‧‧ to be applied as a workpiece

W1‧‧‧ steel frame

W2‧‧‧ film

W3‧‧‧ wafer

W4‧‧‧ grain

1 is a perspective view showing the mechanism of the first working area side of the wafer residual glue cleaning device in the embodiment of the present invention.

2 is a perspective view showing the mechanism of the second working area side of the wafer residual glue cleaning device in the embodiment of the present invention.

3 is a front elevational view of FIG. 1 in an embodiment of the present invention.

4 is a schematic diagram of the left side of FIG. 1 in the embodiment of the present invention.

FIG. 5 is a perspective exploded view of the stage in the embodiment of the present invention.

Fig. 6 is a schematic view showing the air holes on the positioning plate of the stage in the embodiment of the present invention.

Figure 7 is a perspective view of the wiping mechanism in the embodiment of the present invention.

Figure 8 is a perspective view showing the back side of the wiping mechanism in the embodiment of the present invention.

FIG. 9 is a perspective exploded view of the seat frame and the pressing module in the embodiment of the present invention.

FIG. 10 is a perspective exploded view of the pressing module and the first pressing component in the embodiment of the present invention.

Figure 11 is a perspective exploded view of the adjustment assembly in the embodiment of the present invention.

Figure 12 is a perspective view of a wiper assembly in accordance with an embodiment of the present invention.

Figure 13 is a front elevational view of the wiper assembly of the embodiment of the present invention.

FIG. 14 is a perspective view showing the wiping head of the first pressing component in the embodiment of the present invention for wiping on the die of the wafer.

FIG. 15 is a schematic diagram of residual glue detection by a line laser beam of a laser height detector according to an embodiment of the present invention.

Please refer to FIG. 1 and FIG. 2 for illustrating the wafer residual glue cleaning device in the embodiment of the present invention, including: a machine table A having a machine table A1, and a machine table A1 on the machine A end. The pedestal A2 corresponding to the height is formed on the side, so that a recessed transfer section A3 is formed between the two pedestals A2, and the upper surface A21 of the two pedestals A2 and the other end of the machine A of the machine A without the pedestal A2 Forming a height drop; a gantry rail B, with two columns B1 spanning the two seats A2 of the machine A, a beam B2 is disposed between the two columns B1, the gantry rail B separating the machine A and The first working area A4 of the other machine table A1 of the machine A without the pedestal A2 and the second working area A5 of the second pedestal A2 are planned, wherein the first working area A4 is used for performing the fetching. The workpiece W is to be applied and the workpiece W is to be tested; the second working area A5 is used for the workpiece W to be rubbed; the workpiece W to be applied is attached to a ring steel frame W1. Wafer W3 on the attached film W2, The wafer W3 maintains an annular pitch with the annular steel frame W1, and the wafer W3 has finished cutting the grain-by-grained grain W4, and leaves a residual glue on the die W4 due to the related process; a detecting mechanism C , which is composed of a CCD lens, is disposed on the side of the gantry rail B facing the first working area A4, and is driven by a first driving member B3 on the gantry rail B to be on the gantry rail B upper beam B2 The X-axis slide rail B4 is X-axis reciprocating displacement, and the CCD lens of the detecting mechanism C inspects the workpiece W to be applied in the first working area A4 in the Z-axis downward direction; a pick-and-place mechanism D, It is disposed on the machine table A1 of the first working area A4, and comprises two clamping seats D1 disposed at intervals of X axial direction, and the two clamping seats D1 are respectively provided with the clamping members D3 of the opposite concave clamping portions D2. Each of the clamping members D3 is respectively disposed on a fixing base D5 supported by a plurality of pivots D4 arranged in the Y-axis direction, and the two clamping members D3 are respectively received by a driving member D6 on the lower fixing seat D5. Driven, the X-axis axially clamps the annular steel frame W1 to be applied as the workpiece W, so that the workpiece W to be applied is horizontally spanned between the two insert members D3; the fixed seat D5 and The movable clamping member D3 is driven to move up and down with the pivot D4, and the workpiece W to be applied by the interlocking movement is lifted up and down; and the height of the workpiece W to be applied when the clamping member D3 is clamped to be used as the workpiece W It is lower than the height of the lower beam B2 of the gantry rail B and the lower end of the detecting mechanism C; the rail seat E is disposed on the machine table A1 and is disposed in the Y-axis direction, and one end thereof extends in the first working area A4. In the mechanism D, the two clamps D1 are to be applied under the workpiece W, and the other end is passed through the lower gantry B and extends into the concave transfer section A3 between the two seats A2 of the second working area A5. And a rail seat driving member E1; a liquid supply mechanism F, disposed on the machine table A1 in the first working area A4, the content is provided with a cleaning liquid, and a pipeline can be provided for conveying the cleaning liquid; G is disposed on the rail seat E of the concave transfer section A3 between the two seats A2 of the second working area A5, and is driven by the rail seat drive member E1 of the rail seat E to be Y-axis through The gantry rail B is displaced below the first working area A4 and the second working area A5; please refer to Figures 3 and 4 at the same time. When the gantry rail B is displaced in the first working area A4, the loading platform G can be moved into the lower position of the two clamping seats D1 of the pick-and-place mechanism D to be applied under the workpiece W, and the receiving device D receives the workpiece for the workpiece. W, and after receiving the workpiece W, move to the lower side of the detecting mechanism C for testing, and then carry the workpiece to be moved to the second working area A5 to perform the rubbing operation, and then complete the rubbing operation and then move back. In the first working area A4, the workpiece W to be subjected to the rubbing operation is delivered to the pick-and-place mechanism D; a wiping mechanism H is disposed on the side of the beam B2 of the gantry rail B facing the second working area A5. The slide B6 of the X-axis slide rail B5 is driven by a second drive member B7 on the gantry rail B to be X-axis reciprocally displaced on the slide rail B5. The wiping mechanism H is oriented in the Z-axis direction. In the lower direction, the workpiece W to be transferred to the second work area A5 is subjected to a rubbing operation.

Referring to FIG. 5, the stage G includes: a fixing base G1 disposed on the rail base E, and driven by the rail seat driving member E1 of the rail seat E for Y-axis displacement, and a loading tray G2. The fixing seat G1 can be rotated by the driving member (not shown) of the fixing base G1, and the carrier G2 has a disk shape and is convexly arranged on the circumference and slightly raised above the carrier G2. a plurality of support frames G22 (four in the present embodiment) of the upper surface G21, a load weight measuring element G23 is disposed in the center of the upper surface G21 of the loading plate G2, and the upper surface G21 of the loading plate G2 is on the outer peripheral side of the load measuring element G23. Two positioning members G24 are respectively disposed at an angle of 90 degrees; a fixing frame G3 is disposed above the load measuring component G23 on the carrier G2 and is measured by the load measuring component G23, and is attached by a surface G31. The frame G32 which is disposed on the load weight measuring component G23 and extends outwardly from the four corners is respectively disposed on the support frame G22 of the carrier G2, and the fixed frame G3 can be rotated by the carrier G2. The four legs G32 on the fixed frame G3 are arranged at 90 degrees, and the G311 side G311 of the seat G31 between each two legs G32 is formed into a straight edge shape, and the two legs G32 and A concave positioning section G33 is formed between the adjacent side faces G31 of the seating surface G31, and the fixing frame G3 is When the seat surface G31 is disposed on the load-measuring component G23, the two adjacent positioning sections G33 are positioned by the two positioning members G24 disposed at an outer circumferential side of the load-weight measuring component G23 at a 90-degree angular orientation; The component G4 is composed of a plurality of heating rods G41, and each of the heating rods G41 is parallel and horizontally disposed above the fixing frame G3; a positioning plate G5 is disposed on the fixing frame G3, and the four corners are respectively fixed by the fixing frame The G3 is supported by the four legs G32. The heating element G4 is located between the positioning plate G5 and the fixing frame G3, and abuts against the lower surface of the positioning plate G5 to heat the positioning plate G5. The upper surface of the positioning plate G5 is provided with a ring. The plurality of concentric grooves G51 spaced apart from each other and the linear grooves G52 disposed at ninety degrees to each other are provided with a gas hole G53 in the groove at the intersection of the groove G51 and the groove G52 (please refer to FIG. 6) The negative pressure in the air hole G53 can adsorb the carrier on the positioning plate G5.

Referring to FIGS. 2, 7, and 8, the wiping mechanism H is provided with: a pressing frame H1, and a fixing seat H11 having a rectangular shape and a Z-axis standing, which is fixed in the second working area A5. The sliding block B6 of the X-axis slide rail B5 on the side of the beam B2 of the gantry rail B can be driven by the second driving member B7 to perform X-axis sliding on the sliding rail B5; the back side of the fixing seat H11 A line of laser height detector H2 is disposed below, and is coupled with the fixed seat H11 and can project a linear laser beam H21 downward; the front side of the fixing seat H11 is provided with a pressing module H3, which is composed of a first pressing component. The H31 and the second pressing component H32 are configured, wherein the first pressing component H31 is provided with a heat source; the pressing module H3 is driven by the driving member H12 above the fixing seat H11 of the frame H1 to be vertically displaced. A wiper assembly H4 is provided with a slightly ㄇ-shaped fixing frame H41, and a hollow first opening section H411 is arranged below the fixing frame H41, and the upper part of the fixing frame H41 is also hollowed over the first section H411. There is a hollow hollow second interval H412, and a rib-shaped fixing portion H413 is disposed between the first interval H411 and the second interval H412, and the wiper assembly H4 is The fixing portion H413 of the fixing frame H41 is fixed to and interlocked with the pressing frame H1.

Referring to FIGS. 7 and 9, the pressing seat frame H1 is provided with a Z-axis first rail seat H13 on the front side of the fixing base H11, and the rail seat H13 is provided with a Z-axis slide rail (not shown), and A sliding seat H131 is disposed on the sliding rail, and a connecting seat H14 is disposed on the sliding seat H131 and is driven by the driving member H12 to be Z-axis sliding. The connecting seat H14 is provided for the fixing frame H41 of the cleaning material assembly H4. The fixing portion H413 is fixed thereon, so that the wiper assembly H4 is driven by the driving member H12 to be Z-axis sliding and interlocked with the pressing frame H1; the sliding seat H131 below the connecting seat H14 is provided with an X-axis. To the second rail seat H15, the second rail seat H15 can be vertically displaced in the Z-axis on the first rail seat H13, and the second rail seat H15 is provided with an X-axis slide rail H151, which is provided with A slide H152 for X-axis displacement on the slide rail H151; an X-axis rail H153 is arranged in parallel below the slide rail H151, and the rail rod H152 is provided with an X-axis slip on the rail H153. The driving member H154, the upper and lower sides of the second rail seat H15 are respectively provided with a spring element H155 composed of a spring with a Z-axis elastic force at a distance from the X-axis, and the elastic member H155 makes the entire second rail seat H15 at Z. Axial The lower displacement has an elastic buffer; the pressing module H3 is mounted on the driving member H154 at the bottom of the frame H33 and is driven to be X-axis displacement, and the back side of the frame H33 is fixedly attached thereto. The slider H152 obtains a stable slip when being driven, so that the pressing module H3 has an elastic cushioning when the elastic member H155 on the upper and lower sides of the second rail seat H15 is displaced up and down in the Z-axis direction.

Referring to FIG. 10 , the pressing module H3 is configured by the frame H33 for the first pressing component H31 and the second pressing component H32 to be respectively disposed in the Z axis and in parallel; wherein the first pressing component The H31 includes: a driving member H311 fixed to the frame H33 by a fixing base H3111 and interlocked by the frame H33, and the driving member H311 drives a connecting seat H3112 below thereof to be displaced in the Z-axis direction, and the connecting seat One side of the H3112 is fixed with a side seat H3113 linked thereto; An adjusting component H312 has an upper end fixed to the bottom of the connecting seat H3112 of the driving member H311 by a top surface of the first adjusting seat H3121, and is fixed to a front side of the lower end of the side seat H3113 by a side of the first adjusting seat H3121; a connecting seat H313 The upper end is fixed with a second adjusting seat H3122 at the lower end of the adjusting component H312. The connecting seat H313 is provided with a heating hole H3131, and the side of the connecting seat H313 is provided with a temperature switch H3135, and the detecting temperature is higher than a predetermined value. When the heating is stopped, the temperature measuring holes H3132 communicating with the heating hole H3131 are respectively disposed at the two oblique surfaces of the front side of the joint H313; a loading and unloading portion H3133 is protruded from the lower end of the connecting seat H313, and the loading and unloading hole H3134 is disposed thereon; H314 is a long rod and is placed in the heating hole H3131 of the coupling seat H313, which is monitored by the temperature switch H3135. A pressing seat H315 is disposed under the adjusting component H312 and is interlocked by the connecting seat H3112. It can be used for the Z-axis up and down displacement, and is provided with a U-shaped loading and unloading head H3151 and a moving head H3152 at the lower end of the loading and unloading portion H3151. The loading and unloading head H3151 can be nested and positioned at the loading and unloading portion H3133 at the lower end of the coupling seat H313. And push H3 153 interlocking latch-shaped coupling member H3154 is inserted into the loading and unloading hole H3134 of the loading and unloading portion H3133 to be coupled; the wiping head H3152 has a one-piece shape, and the lower end has a square-shaped sliding portion H3155; the bottom end of the heating member H314 is The moving head H3152 contacts and transmits the heat source to the rubbing portion H3155 of the rubbing head H3152; a magnetic member H3156 is disposed on the side of the pusher H3153, and can be coupled with the coupling H3154 inserted into the loading and unloading hole H3134 of the loading and unloading portion H3133. The H313 is adsorbed, so that the pusher H3153 is not easily slipped; the heating member H314 heats the coupling seat H313 to conduct the heat to the moving portion H3155 of the moving head H3152 pressed against the seat H315, and the loading and unloading head H3151 and the wiping Head H3152 is made of copper material; The adjusting component H312 is used for fine-tuning and interlocking the lower horizontal height of the rubbing portion H3155 of the wiping head H3152 under the X-axis and the Y-axis to match and correspond to the surface wiped below; The structure of the pressing member H32 is the same as that of the first pressing member H31, and only the heating member H314 and the temperature switch H3135 are not provided, and other members will not be described.

Referring to FIG. 11 , a third adjustment seat H3123 is disposed between the first adjustment seat H3121 and the second adjustment seat H3122 of the adjustment component H312. The first adjustment seat H3121 located above and the third adjustment seat H3123 located below Forming a set of X-axis horizontal adjustment components, wherein the X-axis sides are respectively fixed by the sheet-shaped fixing members H3124; the upper third adjustment seat H3123 and the lower second adjustment seat H3122 form a set of Y-axis To the horizontal adjustment component, the two sides of the Y-axis are respectively fixed by the sheet-shaped fixing member H3125; the first adjusting seat H3121 located above and the third adjusting seat H3123 located below form a set of X-axis horizontal adjusting components For example, the first adjusting seat H3121 located above and the third adjusting seat H3123 located below are screwed by a set of screwing members H316, and the set of screwing members H316 includes: X of the first adjusting seat H3121 located above One side of the axially offset side is used for a fine adjustment screw H3161 between the first adjustment seat H3121 which is disposed above and below and the third adjustment seat H3123 which is located below, and is used separately from the two side fixing members H3124 The upper side of the two-sided fixture H3124 is located The fourth fixing screw H3182 fixed to the upper first fixing seat H3121 is externally fixed from the one side fixing member H3124 to fix the lower end of the fixing member H3124 and the fourth adjusting screw H3123 fixed to the lower third adjusting seat H3123; The hole H3164 at the lower end of the fixing member H3124 through which the adjustable screw member H3163 is threaded has a larger outer diameter than the thread portion of the adjustable screw member H3163, so that there is a margin for displacement, but the group located on one side The second adjustable screw H3163 is taken with the third adjustment seat H3123 located below. The second adjustable screw H3163 on the same side of the fine adjustment screw H3161 and the third adjustment seat H3123 located on the lower side can be loosened or screwed at random; in the fine adjustment screw A fixing member H3124 on the same side of the H3161 is provided with a second pin H3171 inserted through the lower end of the fixing member H3124 and the third adjusting seat H3123 located below; and a first adjusting seat H3121 located above the side of the fine adjusting screw H3161. Between the third adjustment seat H3123 located below, two elastic elements H3172 are formed by springs spaced apart in the Y-axis; the two-pin H3171 is inserted into a normal position in a normal state, and the tilt state must be adjusted once it appears. When the two fixing members H3124 are spaced apart on both sides of the X-axis, the two pin members H3171 can be pulled out first, and the two adjustable screw members H3163 can be loosened on the same side as the fine-tuning screw member H3161, because the perforation H3164 There is a margin between the aperture and the outer diameter of the threaded portion of the adjustable screw H3163. Therefore, the two elastic members H3172 on the same side of the fine adjustment screw H3161 will be fixed at the upper first adjustment seat H3121. A support is pushed against the third adjustment seat H31 located below The drive force that moves down on the same side as the fine adjustment screw H3161 is adjusted by the fine adjustment of the fine adjustment screw H3161, so that the driving force of the elastic element H3172 is pushed and the lower adjustment seat H3123 and the fine adjustment screw are connected. The side of the same side of the H3161 is pushed down to obtain the horizontal adjustment of the axial direction of the third adjusting seat H3123X located below, and the two adjustable snails on the same side as the fine adjustment screw H3161 are adjusted after positioning. The fitting H3163 is screwed tightly; the horizontal adjustment of the two sides of the Y-axis between the third adjusting seat H3123 located above and the second adjusting seat H3122 of the lower one is the same as the foregoing The adjustment method of the horizontal height on both sides of the X axis is the same, and the components thereof are also the same, but the orientation is set symmetrically in the Y axis, which can be understood from FIG. 11 and will not be described again.

Referring to FIGS. 8 and 12, a side of the first section H411 of the open recessed hollow portion of the wiper assembly H4 is provided with a release zone H414, and the first section of the hollow section H411 is provided with a side. a take-up area H415, which is provided with a liquid under the same side as the release area H414 In the area H416, a pull-in area H417 is disposed below the same side of the take-up area H412, and a wiping area H418 is formed between the immersion area H416 and the pull-in area H417; a temperature sensor H419 is one of the upper ends of an extension rod H4191 The fixing seat H4192 is fixed on a sliding seat H4193, and the sliding seat H4193 is disposed on the X-axis sliding rail H4194 at the bottom edge of the hollow hollow second section H412 above the fixing frame H41, and the temperature sensor H419 can be embedded in The temperature of the heating element H314 is detected in the temperature measuring hole H3132 of the connecting portion H313 (please refer to FIG. 7 and 10) and the heating hole H3131 at the front side of the inclined surface, and is synchronously X-axis displaced with the first pressing component H31; Wherein, the release material zone H414 is provided with a reel H4142 in which the wheel shaft is disposed in the Y-axis and is driven by a driving member H4141 on the back side of the fixing frame H41, and the X-axis spaced apart wheel axle is arranged under the reel H4142. The first steering wheel H4143 and the second steering wheel H4144 disposed in the Y-axis direction are disposed below the first steering wheel H4143 and the second steering wheel H4144. A weight wheel H4145 with an axle disposed in the Y-axis is disposed, and the weight wheel H4145 is located. In the release zone H414, a Z-axis long slot H4146 on the mounting bracket H41, the axle of the counterweight H4145 Extending through the long slot H4146 and interlocking with a weight H4147 on the back side of the fixed frame H41, the weight H4147 is disposed on a long slot H4146 side and parallel to the long slot H4146 on the Z-axis slide H4148. The weight wheel H4145 can be interlocked for up-and-down displacement in the Z-axis, and the stroke distance of the up-and-down displacement is monitored and controlled by a component of the upper and lower positions of the sensing member H4149; the winding area H415 is provided with the axle of the Y-axis. The idle reel H4152 is provided with a winding wiper driven by a driving member H4151 on the back side of the fixing frame H41, and a third steering wheel H4153 is provided under the reel H4152 with the X-axis spaced apart axles in the Y-axis direction. A steering wheel H4155 with an axle disposed in the Y-axis is disposed below the fourth steering wheel H4154, the third steering wheel H4153, and the fourth steering wheel H4154, and the weight wheel H4155 is located in the bracket H41 of the winding area H415. At the axial long slot H4156, the axle of the weight wheel H4155 extends through the slot H4156 and is coupled to a counterweight H4157 on the back side of the bracket H41. The counterweight H4157 is disposed on a long slot H4156 side and Long slot H4156 is parallel to the Z-axis slide rail H4158, and the weight wheel H4155 can be interlocked for Z-axis up and down displacement. The stroke distance of the up-and-down displacement is monitored and controlled by a component of the upper and lower positions of the sensing component H4159. The liquid immersion area H416 is provided with a cleaning liquid container H4161, which is disposed on the mounting frame H42 fixed at the lower end of the fixing frame H41, and is connected with a pipeline (not shown) between the liquid supply mechanism F in FIG. The supply of the cleaning liquid can be obtained from the liquid supply mechanism F. The cleaning liquid container H4161 is provided with a roller H4162. The wheel shaft of the roller H4162 is disposed on the cleaning liquid container H4161 in the Y-axis direction, and a part of the circumference of the roller H4162 is immersed in In the cleaning liquid container H4161, a part of the cleaning liquid container H4161 is exposed outside the cleaning liquid container H4161, and the circumferential surface thereof is arranged in an equidistant ring arrangement in the form of a Y-axis groove; the liquid-immersed area H416 is provided with an axle disposed in the Y-axis direction. The runner H4163 is adjacent to the cleaning liquid container H4161, and is disposed above the roller H4162 of the cleaning liquid container H4161 and the roller H4162 of the cleaning liquid container H4161, and is provided with a first group and a spacing between the first frame H4164. Activity wheel H4165, second activity wheel H4166, the first activity wheel H4165, second The moving wheel H4166 is located at a Z-axis long slot H4167 in the fixing frame H41 of the smear area H416, and the shaft H4168 disposed at the rear side of the pendulum H4164 extends through the long slot H4167 and is received on the back side of the fixed frame H41. The rotary driving member H4169 is driven to swing the swing frame H4164 so that the first movable wheel H4165 can be moved down against the upper circumference of the roller H4162 on the cleaning liquid container H4161; the pulling portion H417 is provided with a fixed frame H41 back. The side drive unit H4171 is driven, and the wheel shaft is arranged in the Y-axis direction of the rotatable pull-in wheel H4172. The circumferential surface of the pull-up wheel H4172 is arranged in an equi-spaced ring row in the shape of a Y-axis groove; the pull-up wheel H4172 is provided on the adjacent side. The wheel axle is disposed in the Y-axis direction of the entangled wheel H4173, and the circumferential surface thereof is also arranged in an equidistant ring arrangement in the form of a Y-axis groove. The rivet wheel H4173 is disposed on the fixing frame H41 with the pivot H4174 as a fulcrum. On the swing arm H4175, the arming pin H4173 on the swing arm H4174 is provided with a pivot pin H4176 which is pivoted to the fixing frame H41, and the other side swing arm H4174 of the pivot pin H4176 is received by the mounting frame H41. Composed of a spring The elastic member H4177 (Fig. 13) is pulled. After the pivot pin H4176 of the fixing frame H41 is pulled up, the swing arm H4175 is pulled by the elastic member H4177 to fit the circumference of the pulling wheel H4172; the wiping area H418 is set. a first guiding arm H4181 fixed by a fixing frame H41 of the smear area H416 and extending obliquely downward, and a second guiding arm fixed by the fixing frame H41 of the drawing area H417 and extending obliquely downward H4182, the first guiding arm H4181, the lower end of the second guiding arm H4182 are close to each other to maintain an operating pitch H4183, and each end is provided with a first supporting wheel H4184 and a second supporting wheel H4185 which are arranged in the Y axis of the axle; The bottom edges of the first support wheel H4184 and the second support wheel H4185 maintain a same X-axis horizontal height; wherein, the second guide arm H4182 is disposed adjacent to the pull-up wheel H4172 of the pull-out area H417. Guide wheel H4186 arranged in the Y direction.

Referring to FIGS. 12 and 13, in the wiping cleaning of the residual glue, the rolled strip-shaped wipe L is sequentially passed from the reel H4142 of the release material zone H414 to the first steering wheel H4143, the weight wheel H4145, After the second steering wheel H4144 enters the dip zone H416 and passes around the near revolving wheel H4163, the first movable wheel H4165, the second movable wheel H4166, and the roller H4162, and then passes through the first supporting wheel H4184 of the wiping area H418. The second support wheel H4185 and the guide wheel H4186 enter the pulling area H417 and pass through the pulling wheel H4172, enter the winding area H415 and pass through the third steering wheel H4153, the weight wheel H4155, and the fourth steering wheel. H4154 is taken up by the empty reel H4152; wherein, when the wipe L is wound around the second movable wheel H4166, the second movable wheel H4166 can be driven to press against the wipe L at the second movable wheel H4166. The roller H4162, which has been adhered to the cleaning liquid container H4161, is adhered to the cleaning liquid; the cleaning material L is clamped by the inset wheel H4173 when it is wound around the pulling wheel H4172, so that the pulling wheel H4172 can be driven by the driving member H4171. Pulling the wipe L in the wiping area H418 to be displaced, when the wipe L in the wiping area H418 is pulled to the release area When the weight wheel H4145 in the H414 is forced to move up to the sensing member H4149 where the counterweight H4147 touches the upper position, the driving member H4141 is caused to drive the reel H4142 to release the wipe material L until the counterweight H4147 touches the lower position. The piece is H4149; and at the winding area H415, when the material L is pulled by the pulling wheel H4172 to When the wiping material L in the take-up area H415 is loosened until the weight H4157 of the weighting wheel H4155 is linked to the sensing member H4159 at the lower position, the driving member H4151 will drive the empty reel H4152 to roll the receiving material L until the counterweight H4157 touches the sensing member H4159 at the upper position, thereby adjusting the tightness of the pulling material L to be pulled in the entire flow path; the pressing module H3 can selectively press the first component H31 or the second Pressing the component H32 to operate, and respectively pressing the wiper portion H3155 of the wiper head H3152 at the lower end of the press seat H315 to press the wipe between the first support wheel H4184 and the second support wheel H4185 in the wiping area H418 Above the material L.

In the embodiment of the present invention, the method for cleaning the residual adhesive of the wafer is performed by the following steps: a feeding step, loading the workpiece W into the pick-and-place mechanism D by the two clamping members D3 on the two clamping seats D1 to be in a horizontal state Clamping; the loading operation can be taken out and executed by a robot (not shown) from a loading/unloading device (not shown); a reclaiming step, the loading station G is operated by the second The area A5 is displaced by the y-axis linear displacement flow path through the gantry rail B in the first working area A4, and is moved into the lower part of the pick-and-place mechanism D between the two holders D1 to be applied under the workpiece W, and the self-picking mechanism The two inserting members D3 on the D are received by the workpiece W; when the workpiece W is to be taken up by the loading platform G, the carrier G2 is adsorbed by the negative pressure in the air hole G53 and positioned on the carrier G2. And being heated by the heating element G4; a residual glue inspection step, the stage G is moved back along the Y-axis linear displacement flow path, and in the first working area A4, when the pick-and-place mechanism D is removed, the workpiece is to be applied W is inspected by the detecting mechanism C on the gantry rail B one by one for each of the upper dies W4; a zone changing step is performed to complete the residual rubber condition to be applied to the workpiece W The stage G is displaced along the original Y-axis linear displacement flow path through the gantry rail B to return to the second working area A5; a die wiping step causes the wiping mechanism H to press the holder H1 to interlock the wiper assembly H4 to The rubbing portion H3155 of the rubbing head H3152 of the first pressing member H31 provided with the heat source presses the wiping material L (please refer to Fig. 14), and the wiper L is pulled by the pull wheel H4172 to pull the wheel H4172, and the bottom surface of the rubbing portion H3155 of the rubbing head H3152 is rubbed between the upper surface of the die W4, and the residual glue is detected. The individual crystal grains W4 are wiped; since the area of the square-shaped moving portion H3155 of the rectangular lower end of the moving head H3152 is approximately equal to the surface area of the crystal grain W4, the wiping range can cover the entire crystal grain; After the die W4 on which the residual glue is detected on the workpiece W is wiped, the wiper L is pressed against the wiper portion H3155 of the transfer head H3152 of the second press-fitting component H32 of the heat-free source, and the pair is detected. The die W4 of the residual glue is wiped; when the wiper H3155 of the transfer head H3152 presses the wiper L against the die W4 applied to the workpiece W, the biasing force of the wiper H3152 is pressed by the stage G The load weight measuring component G23 is measured, once the set load value is reached, the rubbing head H3152 will stop pressing down to avoid damage to the die W4; a cleaning inspection step, so that the workpiece W to be applied is carried by the stage G along the Y The axial linear displacement flow path is displaced toward the pick-and-place mechanism D, and is pressed against the seat frame H1 fixed seat H11 in the second working area A5 below the gantry rail B. The linear laser beam H21 projected by the line laser detector H2 at the lower side checks the grain W4 that has been detected to have residual glue (see Figure 15); when it is detected that the crystal is not cleaned to the expected extent In the case of granules, the workpiece W to be applied is linearly displaced by the stage G along the Y-axis, and the above-mentioned die W4 wiping step is re-executed; when all the grains W4 from which the residual glue is detected are inspected to have reached the desired level. At the time, it is determined that the cleaning has been completed; a replacement step has been cleaned and the workpiece is to be applied. The workpiece G is linearly displaced along the Y-axis by the stage G. The flow path passes through the gantry rail B to the first working area A4. The direction is displaced and moved into the two clamping seats D1 of the pick-and-place mechanism D, so that the two clamping members D3 on the pick-and-place mechanism D receive the workpiece W for the robot to take off and transfer into the receiving and receiving materials. The device is executed and the loading of the next cycle is performed as the workpiece W.

In the embodiment of the present invention, the stage and the wafer residual cleaning device using the stage, because the stage G is provided to be applied as the workpiece W, the heating element G4 can be heated on the stage G to make the residual glue In the case of performing the first pyrolysis process of the workpiece W to be performed by the lower heat, the wiping mechanism H is further executed by the first pressing member H31 having the heat source from the top to the bottom for the individual crystal grains W4. In the second pyrolysis process, the residual glue on the crystal grain W4 which has been rubbed has been melted into a liquid dilution state, and then wiped by the second pressure-receiving component H32 without the heat source, the residual glue cleaning can be performed more easily, and The linear laser beam H21 projected by the line laser height detector H2 is used to check the rubbing effect, and the die cleaning can be completed without any omission; and the wiper assembly H4 of the wiping mechanism H is wound by the release zone H414. The wheel H4142 releases the cleaning material L to the winding reel H4152 of the winding area H415, and the cleaning material L can be uninterruptedly adhered to the cleaning liquid from the cleaning machine H4161 on the roller H4162, and the weight is adjusted by the counterweight. The wheels H4145 and H4155 adjust the tightness of the pulling material L to be pulled in the entire flow path, so that the cleaning operation of the cleaning glue can be automatically performed without interruption, and the cleaning performance is greatly improved; at the same time, the second module is pressed against the module H3. The upper and lower elastic members H155 of the seat H15 are displaced up and down in the Z axis. The elastic buffering device presses the first pressing member H31 or the second pressing member H32 on the pressing module H3 against the surface of the die, except for the amount of the load measuring component G23 on the loading platform G. In addition to monitoring the lower pressure channel, the pressure of the lower pressure itself has a buffer, which can reduce the damage of the grain W4 to be applied to the workpiece W; and the grain W4 is cleaned one by one, and the residual glue can be detected for the detected The die W4 is cleaned separately, and in addition to achieving a better cleaning effect, the cleaning of the residual glue on the entire wafer can be performed efficiently.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

E‧‧‧ rail seat

E1‧‧‧ rail seat drive

G‧‧‧ stage

G1‧‧‧ fixed seat

G2‧‧‧ Carrier

G21‧‧‧ upper surface

G22‧‧‧Support frame

G23‧‧‧Load weight measuring component

G24‧‧‧ positioning parts

G3‧‧‧ fixed frame

G31‧‧‧Seat

G311‧‧‧ side

G32‧‧‧ feet

G33‧‧‧ Positioning interval

G4‧‧‧ heating element

G41‧‧‧heating rod

G5‧‧‧ positioning plate

G51‧‧‧ Groove

G52‧‧‧ Groove

Claims (9)

A loading platform includes: a fixing base; a loading tray disposed on the fixing base and rotatable by driving; the carrier is provided with a load measuring component; and a fixing frame is disposed on the carrier The positioning plate is disposed on the fixing frame and is connected by the fixing frame. The upper surface of the positioning plate is provided with a gas hole, and a negative pressure is passed through the air hole to adsorb the bearing on the positioning plate. The loading platform of claim 1, wherein the carrier is provided with a plurality of support frames on the periphery of the carrier, and the holders are respectively disposed on the support frame of the carrier with the legs extending outwardly. . The loading platform according to Item 1, wherein the carrier is provided with two positioning members at an angle of ninety degrees. The loading platform according to the first aspect of the patent application, wherein the fixing frame is provided with a nine-foot splitting arrangement of four legs, and a concave positioning section is formed between each of the two legs, and two adjacent positioning positions are provided. The interval is just positioned by the two positioning members. The loading platform according to claim 1, wherein the fixing seat is disposed on a rail seat, and is linearly displaced by the driving of the upper rail seat driving member of the rail seat. The stage according to claim 1, wherein the positioning plate is provided with a heating element. The loading platform according to claim 1, wherein the upper surface of the positioning plate is provided with a circular multi-ring concentric groove and a linear groove disposed at ninety degrees, and the air hole is disposed in the concave The intersection of the groove and the groove. A wafer residual glue cleaning device using the stage according to any one of claims 1 to 7, comprising: a machine table provided with the wafer to be applied as a workpiece on the stage A detecting mechanism can treat the die on the workpiece to check the residual rubber condition; and a wiping mechanism, which is provided with a wiping material, can wipe the individual die of the detected residual glue one by one. A wafer residual glue cleaning device using the stage according to any one of claims 1 to 7, comprising: a machine table having a machine table, a transfer section on the machine table; a gantry a rail frame separating the machine from a first working area and a second working area; a detecting mechanism disposed on a side of the gantry rail facing the first working area, to be applied to the first working area The workpiece is inspected; a pick-and-place mechanism is disposed in the first working area of the machine, and includes two clamping seats disposed at intervals; a wiping mechanism is disposed on a side of the gantry rail facing the second working area, and is provided with a pressure Abutting a frame and a wiper assembly; the press-fitted frame is provided with a first pressing component, the wiper assembly provides a wiper thereon; the carrier is disposed on the second working area of the machine and can be driven Displacement in the first working area and the second working section, and receiving the workpiece from the pick-and-place mechanism or delivering the workpiece to the pick-and-place mechanism; the first pressing component can be driven to press against the loading table The workpiece to be applied is used for cleaning the residual glue.