TWI653099B - Wiping mechanism and wafer residue cleaning device using the same - Google Patents

Abstract

The invention provides a wiping mechanism and a wafer residue cleaning device using the wiping mechanism. The wiping mechanism includes a first pressing member which can be driven to move up and down. The first pressing member is provided with fine adjustment and linkage. One of the first pressing components is an adjusting component for adjusting the horizontal height of the wiper head on both sides in the X-axis direction and the Y-axis direction; a wiping material component on which a strip-shaped wiping material is wound; On a pressing seat, the wiping material component is linked with the pressing seat, and the first pressing member and a second pressing member on the pressing seat form a pressing module and are arranged on a fixed A seat, wherein the first pressing component is provided with a heat source, the second pressing component has the same structure as the first pressing component but is not provided with a heat source; the first pressing component can be driven to press against the wiper head The wiper is cleaned against the surface of the workpiece to be applied.

Description

Wiping mechanism and wafer residue cleaning device using the same

The invention relates to a wiping mechanism and a wafer residue cleaning device using the same, and more particularly to a wiping mechanism capable of removing residual glue for individual crystal grains and a wafer residue cleaning device using the wiping mechanism.

According to the general wafer processing process, adhesive is often used for spraying or dipping on the die or its periphery. These adhesives usually remain on the die after the process is completed, and some must be removed, otherwise it will affect the next process. It is difficult to completely remove the adhesive regardless of cleaning with any solvent. In the previous technology, the entire wafer was wiped to remove the residual surface The glue is cleared.

The wiping operation of the entire wafer in the prior art can only be applied to the situation where the wafer surface has a large amount of adhesive residue, and it is only applicable to 2D wafers. Since the wafer process has developed to a 3D process, it is often used in After the circle has been cut out of the grains, it is still necessary to apply glue between the grains, so many times the occurrence of residual glue will not be a large piece, but will only remain on some individual grains. Circle cleaning is difficult to effectively clean individual crystal grains.

That is, the object of the present invention is to provide a wiping mechanism which can clean the residual glue for individual crystal grains.

Another object of the present invention is to provide a wafer residue cleaning device using the wiping mechanism.

The wiping mechanism according to the purpose of the present invention includes: a first pressing member that can be driven to move up and down. The first pressing member is provided with a fine-tuning and interlocking movement head of one of the first pressing members in the X axis direction. A component for adjusting the horizontal height on both sides of the Y-axis; a wiper component on which a strip-shaped wiper is wound; the first pressing component is provided on a pressing seat, and the wiper component and the pressing component The abutting frame is linked, and the first abutting component and a second abutting component on the abutting frame form a abutting module and are arranged on a fixed seat, wherein the first abutting component is provided with a heat source, and the The second pressing component has the same structure as the first pressing component but is not provided with a heat source; the first pressing component can be driven to press the wiper head against the swab to clean the surface to be applied.

According to another object of the present invention, a wafer residue cleaning device uses the wiping mechanism as described above, which includes: a first working area and a second working area separated by a gantry rail frame by a machine; a detection mechanism , Located on the side of the gantry rail facing the first work area, inspecting the workpieces to be applied in the first work area; a pick-and-place mechanism, located in the first work area of the machine, including spaced-apart Two clamp bases; a carrier set on the machine. The second work area can be driven to move to the first work area and the second work area, and accepts the work piece from the pick-and-place mechanism or delivers the work piece to be used. A picking and placing mechanism; the wiping mechanism is provided on the side of the gantry rail frame facing the second work area, and the first pressing component can be driven to press against the wiping material to clean the residual work on the carrier to be applied.

According to another object of the present invention, another wafer residue cleaning device includes: a first working area and a second working area separated by a gantry rail by a machine; a detection mechanism provided in the first working direction; One side of the gantry rail frame in the area inspects the workpieces to be applied in the first work area; a pick-and-place mechanism is set in the first work area of the machine, and includes two clamp seats spaced apart; a carrier platform The second working area located on the machine can be driven to move to the first working area and the second working area, and accept the application workpiece from the pick-and-place mechanism or deliver it to the pick-and-place mechanism; a wiping mechanism It is located on the side of the gantry rail frame facing the second working area and includes: a first pressing component that can be driven to move up and down. The first pressing component is provided on a pressing seat and the pressing On the seat The first pressing component and a second pressing component form a pressing module; a wiping material component is provided with a band-shaped wiping material wound around it; the first pressing component can be driven to move the pressing head The wiper is cleaned against the surface of the workpiece to be applied on the stage.

According to the wiping mechanism of the embodiment of the present invention and the wafer residue cleaning device using the wiping mechanism, since the wiping mechanism adopts a one-by-one wiping cleaning method for the grains, it can be cleaned separately for the grains with residual gums detected. In addition to achieving a better cleaning effect, the cleaning of the residual glue on the entire wafer can be efficiently performed; and the workpiece to be applied has been heated by the heating element on the stage, so that the residual glue is heated to perform a bottom-to-side alignment. In the case that the piece is to be subjected to the first pyrolysis procedure of the workpiece, the wiping mechanism is executed by the first pressing component with a heat source and then a second pyrolysis procedure for the individual grains from top to bottom is performed. The residual glue on the crystal grains has been melted into a liquid dilution state, and then wiped by the second pressing component without a heat source, which can make the cleaning of the residual glue easier, and cooperate with the linear laser beam projected by the line laser altimeter. The glue effect is checked to complete the cleaning of each grain without any omissions; while the wiper assembly of the wiper mechanism releases the wiper through the roll in the release area to the hollow roll in the take-up area to rewind the wipe, during which Wipes can be self-cleaning without interruption The upper roller is adhered with cleaning liquid, and the weight of the wiper is adjusted through the weight wheel and the adjustment of the tightness of the material in the entire flow path, so that the cleaning operation of the glue can be performed continuously and automatically, and the cleaning efficiency is greatly improved. ; At the same time, the pressing module uses the elastic elements on the upper and lower sides of the second rail seat to have an elastic buffer when the Z axis is displaced up and down, so that the first pressing component or the second pressing component on the pressing module is pressed. When the rubbing material is pressed against the surface of the crystal grain, in addition to being monitored by the load cell on the stage to monitor the downward pressure channel, the downward pressure itself has a buffer, which can reduce the damage to the crystal grains on the workpiece to be applied.

A‧‧‧machine

A1‧‧‧machine table top

A2‧‧‧ pedestal

A21‧‧‧upper surface

A3‧‧‧ transfer interval

A4‧‧‧First Work Area

A5‧‧‧Second Work Area

B‧‧‧ Longmen Rail

B1‧‧‧post

B2‧‧‧ beam

B3‧‧‧First Drive

B4‧‧‧Slide

B5‧‧‧Slide

B6‧‧‧slide

B7‧‧‧Second driver

C‧‧‧testing agency

D‧‧‧Pick-and-place

D1‧‧‧clip

D2‧‧‧Clamp

D3‧‧‧Inlay clip

D4‧‧‧ Pivot

D5‧‧‧Fixed

D6‧‧‧Driver

E‧‧‧rail mount

E1‧‧‧rail seat driver

F‧‧‧liquid supply mechanism

G‧‧‧ carrier

G1‧‧‧Fixed

G2‧‧‧carriage

G21‧‧‧upper surface

G22‧‧‧Support

G23‧‧‧Load-weight measuring element

G24‧‧‧ Positioning piece

G3‧‧‧Fixed

G31‧‧‧Seat

G311‧‧‧side

G32‧‧‧ frame feet

G33‧‧‧Positioning interval

G4‧‧‧Heating element

G41‧‧‧Heating rod

G5‧‧‧Positioning plate

G51‧‧‧Ditch

G52‧‧‧Ditch

G53‧‧‧Stoma

H‧‧‧ Wiping mechanism

H1‧‧‧ pressed against the seat

H11‧‧‧Fixed

H12‧‧‧Driver

H13‧‧‧First rail seat

H131‧‧‧Slide

H14‧‧‧Interlocking seat

H15‧‧‧Second rail seat

H151‧‧‧Slide

H152‧‧‧Slide

H153‧‧‧rail

H154‧‧‧Driver

H155‧‧‧Elastic element

H2‧‧‧Laser Altimeter

H21‧‧‧line laser beam

H3‧‧‧Pressing module

H31‧‧‧The first pressing component

H311‧‧‧Driver

H3111‧‧‧Fixed

H3112‧‧‧Connecting Block

H3113‧‧‧Side Seat

H312‧‧‧Adjustment kit

H3121‧‧‧The first adjustment seat

H3122‧‧‧Second adjustment seat

H3123‧‧‧The third adjustment seat

H3124‧‧‧Fixing

H3125‧‧‧Fixing

H313‧‧‧Joint Block

H3131‧‧‧Heating hole

H3132‧‧‧Temperature hole

H3133‧‧‧ Loading and unloading department

H3134‧‧‧Mounting hole

H3135‧‧‧Temperature Switch

H314‧‧‧Heating element

H315‧‧‧Pressed to the seat

H3151‧‧‧ Loading head

H3152‧‧‧ Mobile wipe head

H3153‧‧‧ Push handle

H3154‧‧‧Joint

H3155‧‧‧moving and wiping department

H3156‧‧‧Magnetic piece

H316‧‧‧Screw

H3161‧‧‧fine adjustment screw

H3162‧‧‧Fixed screw

H3163‧‧‧Adjustable screw

H3164‧‧‧ perforated

H3171‧‧‧pin

H3172‧‧‧Elastic element

H32‧‧‧Second pressing component

H33‧‧‧Seat

H4‧‧‧ wipe material assembly

H41‧‧‧Fixed frame

H411‧‧‧First Interval

H412‧‧‧Second Section

H413‧‧‧Fixed section

H414‧‧‧Release area

H4141‧‧‧Driver

H4142‧‧‧roller

H4143‧‧‧First steering wheel

H4144‧‧‧Second Steering Wheel

H4145‧‧‧weight wheel

H4146‧‧‧long slot

H4147‧‧‧ Counterweight

H4148‧‧‧Slide

H4149‧‧‧Sensor

H415‧‧‧Rewinding area

H4151‧‧‧Driver

H4152‧‧‧roller

H4153‧‧‧First steering wheel

H4154‧‧‧Second Steering Wheel

H4155‧‧‧weight wheel

H4156‧‧‧long slot

H4157‧‧‧ Counterweight

H4158‧‧‧Slide

H4159‧‧‧Sensor

H416‧‧‧Stained liquid area

H4161‧‧‧Cleaning liquid container

H4162‧‧‧roller

H4163‧‧‧Recent runner

H4164‧‧‧ Display

H4165‧‧‧The first activity wheel

H4166‧‧‧Second Activity Wheel

H4167‧‧‧long slot

H4168‧‧‧Shaft

H4169‧‧‧Rotary driver

H417‧‧‧Pull Zone

H4171‧‧‧Driver

H4172‧‧‧Drawing Pulley

H4173‧‧‧Bucket

H4174‧‧‧ Pivot

H4175‧‧‧Swing arm

H4176‧‧‧ pivot pin

H4177‧‧‧Elastic element

H418‧‧‧ wipe area

H4181‧‧‧First Guide Arm

H4182‧‧‧Second Guide Arm

H4183‧‧‧ Operating distance

H4184‧‧‧First support wheel

H4185‧‧‧Second support wheel

H4186‧‧‧Guide Wheel

H419‧‧‧Temperature Sensor

H4191‧‧‧ extension rod

H4192‧‧‧Fixed

H4193‧‧‧slide

H4194‧‧‧Slide

W‧‧‧ to be applied

W1‧‧‧steel frame

W2‧‧‧ Adhesive film

W3‧‧‧ Wafer

W4‧‧‧ Grain

FIG. 1 is a schematic perspective view of a mechanism on the side of a first working area of a wafer residue cleaning device table in an embodiment of the present invention.

FIG. 2 is a schematic perspective view of the mechanism of the second work area side of the wafer residue cleaning device table in the embodiment of the present invention.

FIG. 3 is a schematic front view of FIG. 1 in the embodiment of the present invention.

FIG. 4 is a schematic diagram on the left side of FIG. 1 in the embodiment of the present invention.

FIG. 5 is an exploded perspective view of a carrier in the embodiment of the present invention.

FIG. 6 is a schematic diagram of air holes on a positioning plate of a carrier in the embodiment of the present invention.

FIG. 7 is a schematic perspective view of the wiping mechanism in the embodiment of the present invention.

FIG. 8 is a schematic perspective view of the back side of the wiping mechanism in the embodiment of the present invention.

FIG. 9 is an exploded perspective view of the pressing seat and the pressing module in the embodiment of the present invention.

FIG. 10 is an exploded perspective view of the pressing module and the first pressing module in the embodiment of the present invention.

FIG. 11 is a three-dimensional exploded schematic view of an adjustment component in an embodiment of the present invention.

FIG. 12 is a schematic perspective view of a wipe material assembly in the embodiment of the present invention.

FIG. 13 is a schematic front view of a wipe material assembly surrounding a wipe material in an embodiment of the present invention.

FIG. 14 is a three-dimensional schematic diagram of the moving and erasing head of the first pressing component moving on the die of the wafer in the embodiment of the present invention.

FIG. 15 is a schematic diagram of detecting residual glue by using a line laser beam of a laser altimeter according to an embodiment of the present invention.

Please refer to FIGS. 1 and 2, an embodiment of the present invention can be described by the wafer residue cleaning device in the figure, including: a machine A, having a machine table A1, and two sides of the machine table A1 at one end of the machine A Each convex setting forms a pedestal A2 corresponding to the height, so that a concave-shaped transfer area A3 is formed between the two pedestals A2, The upper surface A21 of the two pedestals A2 forms a height difference with the table surface A1 of the other end of the machine A without the pedestal A2; a gantry rail frame B is straddled on the two pedestals A2 of the machine A with two pillars B1 A beam B2 is located between the two pillars B1. The gantry rail B separates machine A and plans a first work area A4 located on the other side of machine table A1 without machine table A2, and is located on two machine tables. The second work area A5 on the side of A2, wherein the first work area A4 is used to perform inspection of the workpiece W to be applied and the work W to be applied; the second work area A5 is used to treat the work W Perform the wiping operation; the workpiece W to be applied is a wafer W3 adhered to the adhesive film W2 attached to an annular steel frame W1, and the wafer W3 and the annular steel frame W1 maintain an annular distance The wafer W3 has finished cutting out the individual grains W4, and the residual glue is left on the grains W4 due to the relevant process; a detection mechanism C is composed of a CCD lens and is located in the first working area The side of the gantry rail B of A4 is driven by a first drive member B3 on the gantry rail B and can be used as the X axis on the X-axis slide rail B4 of the beam B2 on the gantry rail B After resetting, the CCD lens of the detection mechanism C inspects the workpiece W to be applied in the first work area A4 in the downward direction of the Z axis; a pick-and-place mechanism D is provided on the table surface of the first work area A4. On A1, it includes two clip holders D1 which are arranged at a distance from each other in the X-axis direction. The two clip holders D1 are respectively provided with recessed clamping members D3 opposite to each other and the latching sections D2 are provided. On the fixed seat D5 supported by a plurality of pivots D4 arranged in the Y-axis space, the two insert clips D3 are each driven by a driving member D6 on the fixed seat D5 below it, which can be used as the X-axis opposing clips. The ring-shaped steel frame W1 of the workpiece W to be applied makes the workpiece W to be horizontally straddled between the two insert clips D3; the fixed seat D5 can be driven to move up and down with the pivot D4 in conjunction with the insert clip D3. When the workpiece W to be applied is moved up and down by two linked clamps; when the workpiece W to be applied is clamped by the two insert clips D3, the height of the workpiece W to be applied is lower than the cross beam B2 of the gantry rail B and the detection mechanism. The height of the lower end of C; A rail seat E is provided on the machine table A1 and is arranged in the Y-axis direction. One end of the rail seat E extends below the workpiece W to be applied in the second clamping seat D1 of the pick-and-place mechanism D in the first work area A4. It is placed under the gantry rail B in the recessed transfer area A3 between the two bases A2 of the second work area A5, and one end is provided with a rail drive E1; a liquid supply mechanism F is provided at the first On the machine table A1 in a work area A4, a cleaning liquid is placed in the content, and a pipeline can be provided to convey the cleaning liquid. A carrier G is recessed between the two bases A2 of the second work area A5. In the transfer area A3, on the rail base E, and driven by the rail base driver E1 on the rail base E, it can be axially penetrated under the gantry rail B and displaced in the first working area A4 and the second working area. Room A5; please refer to Figures 3 and 4 at the same time. When the platform G can move through the gantry rail B in the first working area A4, it can be moved under the workpiece W to be applied to the two clamps D1 in the pick-and-place mechanism D. And pick up and put in place D to receive the applied workpiece W, and after receiving the applied workpiece W, it is moved to the bottom of the detection mechanism C for testing, and then the workpiece W to be applied is moved to the second work area A5 Carry out the rubber-rubbing operation. After the rubber-rubbing operation is completed and then moved back to the first work area A4, the work piece W to be applied which has completed the rubber-rubbing operation is delivered to the pick-and-place mechanism D; a wiping mechanism H is provided in the second work direction. On the slide seat B6 of the X-axis slide rail B5 on the side of the cross beam B2 of the gantry rail frame B in area A5, it can be driven by a second drive member B7 on the gantry rail frame B to act as an X on the slide rail B5. Reciprocating in the axial direction, the wiping mechanism H performs a gumming operation on the workpiece W to be applied to the second work area A5 in a downward direction of the Z axis.

Please refer to FIG. 5. The carrier G includes a fixed base G1 provided on the rail base E, and can be moved in the Y-axis direction by the drive of the rail base driver E1 on the rail base E. A carrier G2, On the fixed base G1, it can be driven and rotated by a driving member (not shown) in the fixed base G1. The carrier G2 is in the shape of a circular disk and is provided with a convex protrusion on the periphery and is slightly higher than the carrier G2. A plurality of support frames G22 on the upper surface G21 (four in this embodiment), and an upper surface G21 of the carrier G2 There is a load measuring element G23 in the center, and the upper surface G21 of the carrier plate G2 is provided with two positioning members G24 at an angle of ninety degrees on the outer peripheral side of the load measuring element G23. A fixed frame G3 is provided on the carrier plate G2. Above the load measuring element G23 above and measured by the load measuring element G23, it rests on the load measuring element G23 with one surface G31, and each of the frame feet G32 protruding outwardly is extended at four corners. It is set on the support frame G22 of the carrier G2, and the fixed frame G3 can be rotated in conjunction with the carrier G2. The four feet G32 on the fixed frame G3 are arranged at a 90-degree bifurcation with each other, and there is a space between every two feet G32. The adjacent seat surface G31 side G311 forms a straight edge, the two legs G32 and the adjacent seat surface G31 side G311 form a recessed positioning interval G33, and the fixed frame G3 is seated against the load with the seat surface G31. When measuring the element G23, two adjacent positioning sections G33 are just positioned by two positioning members G24 arranged at a 90-degree angle on the outer peripheral side of the load measuring element G23. A heating element G4 is composed of a plurality of heating rods. It is composed of G41. Each heating rod G41 is parallel to each other and is horizontally arranged above the fixed frame G3; a positioning plate G5 The heating element G4 is located on the fixing frame G3, and its four corners are each supported by the four legs G32 of the fixing frame G3. The heating element G4 is located between the positioning plate G5 and the fixing frame G3, and abuts on the lower surface of the positioning plate G5. The positioning disc G5 can be heated; the upper surface of the positioning disc G5 is provided with a plurality of annular concentric grooves G51 spaced apart from each other, and a linear groove G52 arranged at a ninety degree cross with each other, and the groove G51 intersects the groove G52 An air hole G53 (refer to FIG. 6) is provided in the groove at the place, and a negative pressure is passed through the air hole G53 to adsorb the load on the positioning plate G5.

Please refer to FIGS. 2, 7 and 8. The wiping mechanism H is provided with a pressing seat H1 and a fixing seat H11 which is one of the rectangles and stands in the Z-axis direction. The fixing seat H11 is fixed in the second working area A5. The gantry rail B is on the slide seat B6 of the X-axis slide rail B5 on the side of the beam B2 of the gantry rail B, and can be driven by the second driver B7 to perform X-axis slide on the slide rail B5; the back of the fixed seat H11 A linear laser altimeter H2 is fixed underneath, which is linked with the fixed base H11 and can project a linear laser beam H21 downwards; the fixed base H11 is provided with a pressing module H3 on the front side, and a first pressing module H31 And a second pressing component H32, wherein the first pressing component H31 is provided with a heat source; the pressing module H3 is driven by a driving member H12 above the fixed seat H11 of the seat frame H1 and can move up and down; A wipe material assembly H4 is provided with a slightly ㄇ -shaped fixing frame H41, and below the fixing frame H41 is provided a hollow first section H411 which is open at the bottom. Above the fixing frame H41 is also provided above the hollow first section H411. The hollow hollow second section H412, a rib-shaped fixing portion H413 is provided between the first section H411 and the second section H412, and the wipe material assembly H4 is fixed and received by the fixing portion H413 of the fixing frame H41 and the pressing seat H1. Its linkage.

Please refer to FIGS. 7 and 9. The pressing seat H1 is provided with a first Z-axis first rail seat H13 on the front side of the fixed seat H11, and a Z-axis slide rail (not shown) is provided on the rail seat H13. A slide seat H131 is provided on the slide rail. A linkage seat H14 is provided on the slide seat H131 and driven by a driving member H12 to perform Z-axis sliding. The linkage seat H14 is used for the fixing frame H41 of the wiping material assembly H4. The fixing part H413 is fixed on it, so that the wiping material assembly H4 can be driven by the driving member H12 to perform Z-axis sliding and interlock with the pressing seat H1; the sliding seat H131 under the interlocking seat H14 is provided with an X axis To the second rail seat H15, the second rail seat H15 can be moved up and down in the Z axis on the first rail seat H13, and the second rail seat H15 is provided with an X-axis slide rail H151 on which A sliding seat H152 for X-axis displacement is provided on the sliding rail H151; X-axis rails H153 are arranged parallel to each other at a distance below the sliding rail H151, and rails H152 are provided with X-axis sliding on the rail H153. The driving member H154, the upper and lower sides of the second rail seat H15 are provided with elastic elements H155 composed of springs with Z axial elastic force at intervals in the X axis, and the elastic elements H155 make the entire second rail seat H15 at Z Axially It has elastic buffering during downward displacement; the pressing module H3 is seated on the driving member H154 at the bottom of a frame H33 and can be driven by the X axis for displacement. The back side of the seat frame H33 is fixed against the same. The sliding seat H152 obtains a stable slip when being driven, so the pressing module H3 will use the elastic elements H155 on the upper and lower sides of the second rail seat H15 to elastically cushion the Z axis when it is displaced upward and downward.

Please refer to FIG. 10, the pressing module H3 is provided with a seat frame H33 for the first pressing module H31 and the second pressing module H32, respectively, to be arranged in parallel with each other in the Z-axis direction. Among them, the first pressing module H31 includes: a driving member H311, which is fixed on the seat frame H33 by a fixed seat H3111 and is linked by the seat frame H33. The driving member H311 drives a coupling seat H3112 below which can move up and down in the Z axis, and connects the seat A side seat H3113 linked to H3112 is fixed on one side; an adjusting assembly H312 is fixed at the upper end with a bottom of the first seat H3112 of the first adjusting seat H3121 and the driving member H311, and the first adjusting seat H3121 The side is fixed to the front side of the lower end of the side seat H3113; a coupling seat H313 is fixed at the upper end to a second adjustment seat H3122 at the lower end of the adjustment assembly H312. A heating hole H3131 is provided in the connection seat H313, and a temperature is provided on one side of the connection seat H313. The switch H3135 can stop heating when the detected temperature is higher than a predetermined value; the two oblique angles on the front side of the coupling base H313 are respectively provided with a temperature measuring hole H3132 communicating with the heating hole H3131; the lower end of the coupling base H313 is provided with a loading and unloading part H3133, with mounting holes H3134; one plus The hot piece H314 is a long rod-shaped body and is inserted into the heating hole H3131 of the coupling seat H313, which is monitored by the temperature switch H3135; a pressing seat H315 is arranged below the adjustment component H312 and is connected by the connecting seat H3112 can be moved up and down in the Z axis through linkage. It has a U-shaped loading and unloading head H3151 and a wiper head H3152 located at the lower end of the loading and unloading part H3151. H3133, and push the pin-shaped coupling H3154 linked to H3153 into the mounting hole H3134 of the loading and unloading unit H3133 by a push; the wiper head H3152 is a square body, and the lower end has a square flat wiper H3155 ; The bottom end of the heating element H314 is in contact with the wiper head H3152 and conducts heat to the wiper portion H3155 of the wiper head H3152; a pusher H3153 is provided with a magnetic member H3156, which can be attracted to the coupling seat H313 when the coupling member H3154 is inserted into the mounting hole H3134 of the loading and unloading section H3133, so that the pusher H3153 is not easy to slip off; the heating member H314 is heating the coupling seat H313 to conduct heat to the pressure seat H315 wiper head H3155 wiper head H3152, the loading and unloading head H3151 and wiper head H3152 are made of copper material; the adjustment component H312 is used to fine-tune and link the wiper head H3152 wiper head under the seat H315 The horizontal height of H3155 on both sides of the X-axis and Y-axis to match and correspond to the surface wiped below; the structure of the second pressing component H32 is the same as the first pressing component H31, except that the heating element H314 and temperature are not provided. Switch H3135 will not repeat the other components.

Please refer to FIG. 11, a third adjustment base H3123 is provided between the first adjustment base H3121 and the second adjustment base H3122 of the adjustment assembly H312; wherein, the first adjustment base H3121 located above and the third adjustment base H3123 located below A set of X-axis horizontal adjustment components is formed, and both sides of the X-axis are fixed with sheet-shaped fixing members H3124; the third adjustment seat H3123 located above and the second adjustment seat H3122 located below form a group of Y-axis The horizontal adjustment assembly is fixed with sheet-shaped fixing members H3125 on both sides in the Y-axis direction; the first adjustment seat H3121 located above and the third adjustment seat H3123 located below form a set of X-axis horizontal adjustment assemblies As an example, a set of screw connections H316 are screwed between the first adjustment base H3121 located above and the third adjustment base H3123 located below. The set of screw connections H316 includes: X of the first adjustment base H3121 located above One side of the axial offset is used to set a fine adjustment screw H3161 between the first adjusting seat H3121 located above and the third adjusting seat H3123 located below from the top, and the fixing parts H3124 from the two sides are used for each. Connect the upper end of the two side fixings H3124 with The four fixing screws H3182 fixed by the first adjusting seat H3121 above are fixed from one side H3124 Four adjustable screw joints H3163 for fixing the lower end of the fixing member H3124 to the third adjusting seat H3123 located below; the lower end of the fixing member H3124 through which the adjustable screw joint H3163 is screwed has a hole diameter H3164 that is more adjustable than the adjustable screw joint The outer diameter of the threaded part of H3163 is slightly larger, so that there is room for displacement. However, the set of two adjustable screw joints H3163 located on one side is normally screwed with the third adjustment seat H3123 located below. Another group of two adjustable screw joints H3163 on the same side as the fine adjustment screw H3161 is adopted with the third adjustment seat H3123 located below, which can be loosened or screwed randomly according to the need; on the same side as the fine adjustment screw H3161 Outside the fixing piece H3124, there are two pin pieces H3171 inserted through the lower end of the fixing piece H3124 and the third adjustment seat H3123 located below; on the same side as the fine adjustment screw H3161, the first adjustment seat H3121 located above and the lower adjustment seat Between the third adjusting seat H3123, two elastic elements H3172 composed of springs spaced apart from each other in the Y-axis direction are provided; the two-pin H3171 is inserted in a standard positioning state in a normal state. The fixing parts H3124 are spaced apart on both sides of the X axis. Therefore, you can first pull out the two pin H3171, and loosen the two adjustable screw H3163 on the same side as the fine adjustment screw H3161. Due to the hole H3164 and the outer diameter of the threaded part of the adjustable screw H3163, There is room for displacement, so the two elastic elements H3172 on the same side as the fine adjustment screw H3161 will be fixed on the first adjustment seat H3121 located above, and then a stretch will be pushed against the third adjustment seat H3123 located below. The driving force for moving the same side of the fine-adjusting screw H3161 downwards. By fine-tuning the fine-adjusting screw H3161, the driving force for the elastic element H3172 to stretch and push will push the third adjusting seat H3123 located below the same as the fine-adjusting screw H3161. This side of the side is pushed down to obtain the adjustment of the horizontal height of the third adjustment seat H3123X on both sides of the axis. After adjusting the positioning, the two adjustable screws H3163 on the same side as the fine adjustment screw H3161 are adjusted. Tighten and lock; the set of Y-axis horizontal adjustment components consisting of the third adjustment seat H3123 located above and the second adjustment seat H3122 located below the adjustment of the horizontal height on both sides of the Y-axis and the aforementioned X-axis The method of adjusting the horizontal height to both sides is the same, and the components are the same, but the setting orientation is set symmetrically in the Y axis, which can be understood from FIG. 11 and will not be described in detail.

Please refer to FIG. 8 and FIG. 12. A material releasing area H414 is provided on one side of the hollow recessed first section H411 under the H-shaped fixing frame H41 of the wiper assembly H4, and the other side of the hollow first section H411 is provided with a The winding area H415 is provided with a liquid-staining area H416 below the same side as the release area H414, and a pull-out area H417 is provided below the same side as the rolling-out area H412, formed between the liquid-sucking area H416 and the pull-out area H417 A wiping area H418; a temperature sensor H419 is fixed on a sliding seat H4193 by a fixing seat H4192 on the upper end of an extension rod H4191, which is arranged on the bottom edge of the hollow hollow second section H412 above the fixing frame H41 On the X-axis slide rail H4194, the temperature sensor H419 can be embedded in the coupling hole H313 (please refer to Figures 7 and 10) and detected in the temperature measuring hole H3132 communicating with the heating hole H3131 at the two oblique angles on the front side. The temperature of the heating element H314 is synchronized with the X-axis displacement with the first pressing component H31. Among them, the material release area H414 is provided with a winding shaft arranged in the Y-axis direction and driven by a driving member H4141 on the back side of the fixing frame H41. Material reel H4142, under the reel H4142, there is a first steering wheel with an X-axis spaced apart wheel axis arranged in the Y-axis direction H4143, the second steering wheel H4144, between the first steering wheel H4143, the second steering wheel H4144, a counterweight wheel H4145 with the axle axially arranged in the Y axis is located on the fixed frame H41 in the release area H414 A Z-axis long slot hole H4146, the axle of the counterweight wheel H4145 extends through the long slot hole H4146 and is linked to a counterweight H4147 on the back of the fixed frame H41. The counterweight H4147 is provided in a long slot hole H4146. On the Z-axis slide rail H4148 that is parallel to the long slot H4146 on the side, the weight wheel H4145 can be linked to move up and down in the Z axis. The travel distance of the up and down displacement is sensed by the upper and lower positions of a group. It is monitored and controlled by H4149; the winding area H415 is provided with an empty reel H4152 with a wheel shaft arranged in the Y-axis direction and driven by a drive member H4151 on the back side of the fixed frame H41. An X is provided below the reel H4152. Axial compartment The third steering wheel H4153 and the fourth steering wheel H4154 are arranged in the Y-axis direction from the axle. A counterweight wheel H4155 is arranged below the third steering wheel H4153 and the fourth steering wheel H4154 in the Y-axis direction. The wheel H4155 is located at a Z-axis long slot H4156 on the fixed frame H41 in the winding area H415. The wheel shaft of the weight wheel H4155 extends through the long slot H4156 and is linked with a counterweight H4157 on the back side of the fixed frame H41. The counterweight H4157 is located on a Z-axis slide rail H4158 on the side of a long slot H4156 and parallel to the long slot H4156, and the weight wheel H4155 can be linked up and down to move in the Z-axis direction. It is monitored and controlled by a component H4159 placed on the upper and lower positions of the component; a cleaning liquid container H4161 is set in the liquid-soaking zone H416, and it is placed on a holder H42 fixed at the lower end of the holder H41. A pipe (not shown) is connected between the liquid supply mechanisms F in 1 to obtain a supply of cleaning liquid from the liquid supply mechanism F. A roller H4162 is provided in the cleaning liquid container H4161, and the axis of the roller H4162 is the Y axis. Immerse the cleaning liquid container H4161 in the cleaning liquid container H4161 and a part of the circumference of the roller H4162. Is exposed outside the cleaning liquid container H4161, and the circumferential surface of the cleaning liquid container H4161 is arranged in a Y-axis embedded groove at an equal interval; a liquid-receiving area H416 is provided with a near-rotor H4163 in which the axle is arranged in the Y-axis direction, which is close to the The cleaning liquid container H4161 is located between the near runner H4163 and the roller H4162 of the cleaning liquid container H4161. There are a first movable wheel H4165 and a second movable wheel which are arranged in a group and spaced on a swing frame H4164. H4166, the first movable wheel H4165 and the second movable wheel H4166 are located in a Z-axis long slot H4167 on the fixed frame H41 in the liquid-soaking zone H416, and a shaft H4168 provided on the rear side of the swing frame H4164 extends through the length The slot H4167 is driven by a rotary drive member H4169 on the back side of the fixed frame H41, so that the swing frame H4164 can be swiveled and the first movable wheel H4165 can be moved down against the upper periphery of the upper roller H4162 of the cleaning liquid container H4161; The pull-out zone H417 is provided with a rotatable pull-out pulley H4172 driven by a drive member H4171 on the back side of the fixed frame H41, and its axis is arranged in the Y-axis direction. The circumferential surface of the pull-out pulley H4172 is arranged in the Y-axis at an equal interval. It is shaped like a groove; there is a wheel axle on the side of the pull pulley H4172, which is arranged in the Y-axis direction. The indentation wheel H4173 is also arranged on the circumferential surface in an equally spaced ring array in the shape of a Y-axis inset groove. The indentation wheel H4173 is provided on a swing arm H4175 pivoted on a fixed frame H41 with a pivot axis H4174 as a fulcrum. On the adjacent side of the indentation wheel H4173 on H4174, there is a pivot pin H4176 that is inserted in the fixing frame H41. The opposite side of the inset wheel H4173 of the pivot pin H4176 is an elastic element H4177 formed by a spring on the fixed frame H41. (Fig. 13) After pulling out the pivot pin H4176 which is inserted into the fixing frame H41, the swing arm H4175 will be pulled by the elastic element H4177 and engage the circumference of the pull wheel H4172; the wiping area H418 is provided with The first guide arm H4181 fixed by the fixing frame H41 of the liquid area H416 and extending obliquely downward, and the second guide arm H4182 fixed by the fixing frame H41 of the drawing area H417 and extending obliquely downward. A guide arm H4181 and a lower end of the second guide arm H4182 are close to each other to maintain an operating distance H4183. Each end is provided with a first support wheel H4184 and a second support wheel H4185 which are arranged in the Y axis direction at the end; the first support The bottom edge of the wheel H4184 and the second support wheel H4185 maintain the same X-axis horizontal height together; of which, the second guide A guide wheel H4186 is provided at the upper side of the arm H4182 adjacent to the pull pulley H4172 of the pull zone H417 in a Y-axis direction.

Please refer to FIGS. 12 and 13. In the wiping and cleaning of the residual glue, the rolled strip-shaped wipe material L is passed from the reel H4142 of the material release area H414 in sequence through the first steering wheel H4143, the counterweight wheel H4145, After the second steering wheel H4144, enter the wetted area H416 and pass by the near-wheel H4163, the first movable wheel H4165, the second movable wheel H4166, and the roller H4162, and then pass the first support wheel H4184 of the wiping zone H418. , The second support wheel H4185, the guide wheel H4186, and after entering the pull-in area H417 and passing the draw-in wheel H4172, enter the rewinding area H415 and pass the third steering wheel H4153, the counterweight wheel H4155, and the fourth steering wheel H4154, while being wound up by the empty reel H4152; wherein, when the swab L passes around the second movable wheel H4166, the second movable wheel H4166 can be driven to press against the swab L passing through the second movable wheel H4166 The cleaning liquid container H4161 has been wiped with the cleaning liquid roller H4162 to adhere to the cleaning liquid; the wipe material L is sandwiched by the embedded resistance wheel H4173 when passing around the pull pulley H4172, so that the pull pulley H4172 can be driven by the driving member H4171 Pull the swab around the wipe area H418 L is displaced. When the wiper L in the wiping area H418 is pulled to the counterweight wheel H4145 in the release area H414, it is forced to move up to the counterweight H4147 touching the upper sensing element H4149, which will cause the drive. H4141 drives the reel H4142 to release the swab L until the counterweight H4147 touches the sensor H4149 at the lower position. As in the rewinding area H415, when the swab L is pulled by the puller wheel H4172 to the rewinding area H415 The middle wiper L is relaxed until the counterweight H4157 linked to the counterweight wheel H4155 touches the sensor H4159 in the lower position, and the driver H4151 will drive the empty reel H4152 to wind up the wiper L until the counterweight H4157 touches the upper position. Up to the sensor H4159 to adjust the tightness of the swab L being drawn in the entire flow path; the pressing module H3 can be selectively performed by the first pressing module H31 or the second pressing module H32. Operate and press the wiper portions H3155 of the wiper head H3152 at the lower end of the seat H315 against the wiper material L between the first support wheel H4184 and the second support wheel H4185 in the wiping area H418.

The method for cleaning wafer residues according to the embodiment of the present invention is to perform the following steps: a feeding step, loading a workpiece W to be applied into the pick-and-place mechanism D, and receiving two clamping pieces D3 on two clamping seats D1 in a horizontal state. Clamping; the loading operation can be taken out and executed by a robot (not shown) from a load / unload (not shown); a loading step makes the stage G work by the second The area A5 passes through the gantry rail B through the gantry rail B and is displaced in the first working area A4 by the Y-axis linear displacement flow path, and is moved under the workpiece W to be applied between the two clamping seats D1 in the pick-and-place mechanism D, and the pick-and-place mechanism The two insert clips D3 on D receive the application workpiece W; when the application workpiece W is received by the carrier G, it will be adsorbed on the carrier G2 by the negative pressure in the air hole G53 and positioned on the carrier G2. And is heated by the heating element G4; a residual glue inspection step causes the stage G to be linearly displaced along the Y axis, and the flow path is moved back, and when the pick-up mechanism D is removed in the first work area A4, the workpiece to be applied is W receives the inspection mechanism C on the gantry rail B to check the residual glue status of each die W4 one by one; A step of changing the area, so that the workpiece W to be applied, which has completed the state of residual glue, is linearly displaced along the original Y axis by the stage G, and the flow path passes through the gantry rail B to move back to the second working area A5; The pressing mechanism H1 of the wiping mechanism H interlocks the wiping material assembly H4, and the wiping material L (see FIG. 14) is pressed against the wiping material H3155 of the wiping head H3152 of the first pressing unit H31 provided with a heat source. The wiper material L is pulled by the puller wheel H4172 and the puller wheel H4172 is moved between the bottom surface of the wiper portion H3155 of the wiper head H3152 and the upper surface of the crystal grain W4 to wipe the individual crystal grains W4 with residual glue detected. ; Since the area of the wiper head H3152 with a square-shaped lower flat square-shaped wiper portion H3155 is approximately the same as the surface area of the crystal grain W4, the wiping range can cover the entire crystal grain; After the wiping of the residual resin grains W4 is completed, the second wiping head H3152 of the wiping head H3152 of the component H32 is pressed against the wiping material L to wipe the grain W4 with residual gums detected. ; When the wiper part H3155 of the wiper head H3152 presses the wiper material L against the grain W4 on the workpiece W, the pressing force of the wiper head H3152 is loaded. For the measurement of the G23 load measuring element G23, once the set load value is reached, the moving head H3152 will stop pressing to avoid damaging the crystal grain W4. A cleaning inspection step will make the workpiece to be applied W the stage G Displace along the Y-axis linear flow path toward the pick-and-place mechanism D, and press the second working area A5 below the gantry rail B against the line H1 of the line laser altimeter H2 below the back of the mount H1 holder H11. The linear laser beam H21 is projected to inspect the grains W4 originally detected with residual glue (see Figure 15); when the grains that have not been cleaned as expected are detected, the workpiece W is to be placed on the stage G re-execute the aforementioned grain W4 wiping step along the Y-axis linear displacement flow path; when all the grains W4 originally detected with residual glue have been inspected to meet the expected level, they are deemed to have been cleaned; a replacement Steps, the workpiece to be applied W has been cleaned, and the stage G is linearly displaced along the Y axis in the Y-axis. The flow path passes under the gantry rail B and is displaced in the direction of the pick-and-place mechanism D in the first work area A4, and moved into the pick-and-place mechanism D. Between the clamp bases D1, the two insert clamps D3 on the pick-and-place mechanism D receive the work pieces W for supply. The robot removes it, transfers it to the feeding and receiving device, and executes loading of the workpiece W to be processed in the next cycle.

The wiping mechanism and the wafer residue cleaning device using the wiping mechanism in the embodiment of the present invention, since the wiping mechanism H uses the crystal grains W4 to clean the wafers one by one, so the wafers W4 with residual gums can be cleaned separately. In addition to achieving a better cleaning effect, the cleaning of the residual glue on the entire wafer can be efficiently performed; and the workpiece W to be applied has been heated by the heating element G4 on the stage G, so that the residual glue is warmly performed In the case of the first pyrolysis process of the entire piece of workpiece W to be applied from the bottom, the wiping mechanism H is executed by the first pressing component H31 with a heat source, and the second is performed from the top to the bottom for the individual die W4. Pyrolysis process, the residual glue on the grain W4 that has been rubbed has been melted into a liquid dilution state, and then wiped by a second heat-resistant second pressing component H32, which can make the cleaning of the residual glue easier, and cooperate with the line mine The linear laser beam H21 projected by the altimeter H2 checks the effect of the eraser, which can complete the cleaning of each crystal without any omission; and the wiper assembly H4 of the wiping mechanism H is released by the reel H4142 in the release area H414. The wipe material L to the winding area H415, the hollow reel H4152, takes up the wipe material. Make the wipe material L be able to adhere to the cleaning liquid container H4161 with the cleaning liquid on the roller H4162 without interruption, and adjust the weight of the wipe material L in the entire flow path through the weight wheels H4145 and H4155. The cleaning operation of the glue can be carried out continuously and automatically, so that the cleaning efficiency is greatly improved; at the same time, the module H3 has an elastic buffer when the upper and lower elastic elements H155 of the second rail seat H15 are displaced in the Z axis. When the first pressing component H31 or the second pressing component H32 on the pressing module H3 is pressed against the surface of the die, it is monitored under the measurement of the load measuring element G23 on the stage G. Outside the pressure channel, the pressing force of the downward pressure itself has a buffer, which can reduce the damage of the crystal grains W4 on the workpiece W to be applied.

However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.

Claims (17)

A wiping mechanism includes: a first pressing member which can be driven to move up and down; the first pressing member is provided with a fine-tuning and interlocking movement head of one of the first pressing members in the X-axis direction and the Y-axis direction; A horizontal height adjustment assembly on both sides; a wiping material assembly on which a band-shaped wiping material is wound; the first pressing member is provided on a pressing seat, and the wiping member is linked with the pressing seat The first pressing component and a second pressing component on the pressing seat frame form a pressing module and are arranged on a fixed seat, wherein the first pressing component is provided with a heat source and the second pressing component The component has the same structure as the first pressing component but is not provided with a heat source; the first pressing component can be driven to press the wiper head against the swab material against the surface of the workpiece to be cleaned. According to the wiping mechanism described in item 1 of the scope of the patent application, wherein the first pressing component includes: a driving member that drives a link seat below the driving member to move up and down in the Z axis; the upper end of the adjusting component and the The connecting seat of the driving member is fixed; a pressing seat is arranged below the adjusting component, and can be moved up and down in the Z axis by the connecting seat; it is provided with a moving wiper, and the lower end of the moving wiper has a movement Rub the Department. The wiping mechanism according to item 2 of the scope of the patent application, wherein a coupling seat is provided between the adjusting component and the pressing seat. According to the wiping mechanism described in item 3 of the scope of patent application, wherein the coupling seat is provided with a heating element, and a temperature switch is provided on one side of the coupling seat, and the heating can be stopped when the detected temperature is higher than a predetermined value. The wiping mechanism according to item 3 of the scope of the patent application, wherein the coupling seat is provided with a heating element and a temperature sensor, and the temperature sensor is synchronously displaced with the first pressing component. The wiping mechanism according to item 3 of the scope of patent application, wherein a lower end of the coupling seat is provided with a loading and unloading part; the pressing seat is provided with a loading and unloading part that can be nested in the lower end of the coupling seat, and is linked by a push. The coupling member is connected with the loading and unloading part. The wiping mechanism according to item 1 of the scope of the patent application, wherein the adjustment component includes a set of X-axis horizontal adjustment components and a Y-axis horizontal adjustment component. The wiping mechanism according to item 7 of the scope of the patent application, wherein the adjustment component includes a first adjustment base and a second adjustment base, and a third adjustment base is provided between the first adjustment base and the second adjustment base, wherein the X axis The horizontal adjustment component is composed of a first adjustment base located above and a third adjustment base located below. The Y axial adjustment component is composed of a third adjustment base located above and a second adjustment base located below. The wiping mechanism according to item 8 of the scope of the patent application, wherein the two sides of the upper adjustment seat and the lower adjustment seat of each of the axial horizontal adjustment components are fixed with fixing members, and the upper adjustment seat and the A set of screwing members are screwed between the lower adjusting seats. The wiping mechanism according to item 9 of the scope of the patent application, wherein the set of screwing members includes: one side of the upper side of the adjustment seat is provided for screwing the upper adjustment seat and the lower adjustment seat from top to bottom. Fine-adjusting screw connection, four fixed screw connections for fixing the upper end of the two side fixing members and the adjustment seat located on the upper side from the external parts of the two sides, and adjustment of the lower end of the fixing member and the lower position from the outside of the one fixing member Seat fixed adjustable screw. According to the wiping mechanism described in item 10 of the scope of patent application, wherein the perforation hole diameter of the lower end of the fixing member of the adjustable screw connector is slightly larger than the outer diameter of the threaded portion of the adjustable screw member, leaving a displaceable space therebetween. Yuyu, but the set of two adjustable screw connections on one side adopts the normal screwing of the adjustment seat located on the lower side, and the other set of two adjustable screw connections on the same side with the fine adjustment screw connection uses the lower one. The adjustment base can be loosened or screwed randomly as required. The wiping mechanism according to item 11 of the scope of patent application, wherein the fixing member on the same side as the fine adjustment screw is provided with a pin inserted through the lower end of the fixing member and the adjusting seat located below; the screw connection with the fine adjustment An elastic element is provided between the upper adjustment seat on the same side of the piece and the lower adjustment seat. The wiping mechanism according to item 1 of the scope of the patent application, wherein the pressing seat is provided with a first rail seat on the front side of the fixed seat, the first rail seat is provided with a slide rail, and the slide rail is provided with a slide seat. An interlocking seat is arranged on the slide seat and driven by a driving member to perform sliding movement. The interlocking seat is used for fixing the swabbing component on it, so that the swabbing component is linked with the pressing frame. The wiping mechanism according to item 13 of the scope of the patent application, wherein the slide base is provided with a second rail base, the second rail base is provided with a slide rail, and a slide base which is displaceable on the slide rail is provided thereon, Rails are arranged parallel to each other at a distance below the slide rail, and the rail is provided with a driving member capable of sliding on the rail. The pressing module is driven to be displaced by the driving member. According to item 14 of the scope of the patent application, the upper and lower sides of the second rail seat are respectively provided with elastic elements, and the elastic elements make the entire second rail seat have elastic buffering when the upper and lower sides are displaced. A wafer residue cleaning device using the wiping mechanism according to any one of claims 1 to 15 of the patent application scope, comprising: a machine separated by a gantry rail frame into a first work area and a second work Area; a detection mechanism, located on the side of the gantry rail towards the first work area, to inspect the workpiece to be applied in the first work area; a pick-and-place mechanism, located in the first work area of the machine, Including two clamp bases arranged at a distance; a carrier set on the machine, the second working area can be driven to move to the first working area and the second working area, and the pick-and-place mechanism accepts the workpiece or will A mechanism for delivering and placing workpieces to be applied; the wiping mechanism is provided on the side of the gantry rail toward the second work area, and the first pressing component can be driven to press against the workpiece to be applied on the stage Perform adhesive cleaning. A wafer residue cleaning device includes: a machine is used to separate a first working area and a second working area by a gantry rail; a detection mechanism is provided on a side of the gantry rail toward the first working area; To inspect the workpiece to be applied in the first work area; a pick-and-place mechanism is provided in the first work area of the machine, and includes two clamps spaced apart; a carrier is provided in the second work machine; The work area can be driven to be displaced in the first work area and the second work area, and the pick-and-place mechanism accepts the applied workpiece or delivers the workpiece to be placed to the pick-and-place mechanism; a wiping mechanism is provided in the second work area One side of the gantry rail frame includes: a first pressing component that can be driven to move up and down, the first pressing component is arranged on a pressing seat, and the first pressing part on the pressing seat The module and a second pressing component form a pressing module; a wiping material component on which a strip-shaped wiping material is wound; the first pressing component can be driven to press the wiping material with a moving wiper head. Clean the surface of the workpiece to be applied on the stage.