TWI653100B - Wiping mechanism and wafer residue cleaning device using the same - Google Patents

Abstract

The invention provides a wiping mechanism and a wafer residue cleaning device using the wiping mechanism. The wiping mechanism includes: a first pressing member, which can be driven to move up and down, and is provided with a moving wiping head; There is a fixed frame on which a strip-shaped wiping material is wound. In the wafer residue cleaning device, a machine is used to separate a first working area and a second working area by a gantry rail frame. The work piece to be applied in the first work area is inspected; a pick-and-place mechanism is provided in the first work area; a carrier can be driven to receive the work-to-be-work piece or the work-to-be-worked from the pick-and-place mechanism. The workpiece is delivered to the pick-and-place mechanism; the wiping mechanism is disposed in the second work area, and the first pressing member can be driven to press the wiping material against the wiping material against the surface of the workpiece to be cleaned by a moving wiper head.

Description

Wiping mechanism and wafer residue cleaning device using the same

The invention relates to a wiping mechanism and a wafer residue cleaning device using the wiping mechanism, and more particularly to a wiping mechanism capable of removing residual glue for individual dies and a wafer residue cleaning device using the wiping mechanism.

According to the general wafer processing process, adhesive is often used for spraying or dipping on the die or its periphery. These adhesives usually remain on the die after the process is completed, and some must be removed, otherwise it will affect the next process. It is difficult to completely remove the adhesive regardless of cleaning with any solvent. In the previous technology, the entire wafer was wiped to remove the residual surface The glue is cleared.

The wiping operation of the entire wafer in the prior art can only be applied to the situation where the wafer surface has a large amount of adhesive residue, and it is only applicable to 2D wafers. Since the wafer process has developed to a 3D process, it is often used in After the circle has been cut out of the grains, it is still necessary to apply glue between the grains, so many times the occurrence of residual glue will not be a large piece, but will only remain on some individual grains. Circle cleaning is difficult to effectively clean individual crystal grains.

That is, the object of the present invention is to provide a wiping mechanism which can clean the residual glue for individual crystal grains.

Another object of the present invention is to provide a wafer residue cleaning device using the wiping mechanism.

The wiping mechanism according to the purpose of the present invention includes: a first pressing member which can be driven to move up and down and is provided with a moving wiping head; a wiping material component is provided with a fixing frame on which a band-shaped wiping material is wound; One side of the fixed frame is provided with a material release area, and the other side is provided with a roll-up area. One of the material-release area and the roll-up area is provided with a roller for winding a wiper driven by a driving member. The material is wound from the material release area through a wiping area to the rewinding area. The wiping area is provided with a first guide arm and a second guide arm. The first guide arm, the second guide The arms are close to maintain an operating distance, and each is provided with a first support wheel and a second support wheel; the first pressing component can be driven to press the moving wiper head against the first cross-section in the wiping area. A support wheel and a second support wheel are above the swab to make the swab abut the surface of the workpiece to be cleaned.

According to another object of the present invention, a wafer residue cleaning device using the wiping mechanism includes: a first working area and a second working area separated by a gantry rail frame by a machine; a detection mechanism, It is arranged on the side of the gantry rail towards the first work area to inspect the workpieces to be applied in the first work area; a pick-and-place mechanism is provided in the first work area of the machine, including the spaced apart Two clamping bases are provided; a carrier is provided on the machine, and the second working area can be driven to be displaced in the first working area and the second working area, and receives the workpiece to be applied from the pick-and-place mechanism. Or deliver the workpiece to be applied to the pick-and-place mechanism; the wiping mechanism is provided on the side of the gantry rail toward the second work area, and the first pressing component can be driven to press the wiping material against the load The work piece to be applied on the table is cleaned by adhesive residue.

The wiping mechanism and the wafer residue cleaning device using the wiping mechanism according to the embodiment of the present invention, since the wiping mechanism adopts a one-by-one wiping cleaning method for the grains, it can be cleaned separately for the grains with residual gums detected. In addition to the better cleaning effect, the cleaning of the residual glue on the entire wafer can be performed efficiently; and the workpiece to be applied has been heated by the heating element on the stage, so that the residual glue is heated to perform the whole wafer from the bottom In the case of the first pyrolysis process of the workpiece, the wiping mechanism is executed by the first pressing component with a heat source and then a second pyrolysis process is performed for the individual grains from top to bottom. In order, the residual glue on the crystal grains that have been rubbed has been melted into a liquid dilution state, and then wiped by a second pressure-free component without a heat source, which can make cleaning of the residue easier, and cooperate with a line laser altimeter The projected linear laser beam is used to check the effect of the eraser, which can complete the cleaning of each crystal without omission; and the wiper assembly of the wiping mechanism releases the wiper to the hollow reel in the rewinding area by the reel in the release area. Roll up the wiper, during which the wiper can adhere to the cleaning liquid from the roller on the cleaning solution container without interruption, and adjust the tension of the wiper through the flow path through the weight wheel to adjust the tightness of the wiper in the entire flow path. The cleaning operation can be carried out continuously and automatically, which greatly improves the cleaning performance. At the same time, the pressing module uses the elastic elements on the upper and lower sides of the second rail base to have elastic buffering when the Z axis is moved up and down, so that the pressing When the first pressing component or the second pressing component on the module presses the wiper against the surface of the die, in addition to the downforce channel being monitored by the load cell on the stage, the downforce itself is With buffer, can reduce the grain on the workpiece to be applied Damaged.

A‧‧‧machine

A1‧‧‧machine table top

A2‧‧‧ pedestal

A21‧‧‧upper surface

A3‧‧‧ transfer interval

A4‧‧‧First Work Area

A5‧‧‧Second Work Area

B‧‧‧ Longmen Rail

B1‧‧‧post

B2‧‧‧ beam

B3‧‧‧First Drive

B4‧‧‧Slide

B5‧‧‧Slide

B6‧‧‧slide

B7‧‧‧Second driver

C‧‧‧testing agency

D‧‧‧Pick-and-place

D1‧‧‧clip

D2‧‧‧Clamp

D3‧‧‧Inlay clip

D4‧‧‧ Pivot

D5‧‧‧Fixed

D6‧‧‧Driver

E‧‧‧rail mount

E1‧‧‧rail seat driver

F‧‧‧liquid supply mechanism

G‧‧‧ carrier

G1‧‧‧Fixed

G2‧‧‧carriage

G21‧‧‧upper surface

G22‧‧‧Support

G23‧‧‧Load-weight measuring element

G24‧‧‧ Positioning piece

G3‧‧‧Fixed

G31‧‧‧Seat

G311‧‧‧side

G32‧‧‧ frame feet

G33‧‧‧Positioning interval

G4‧‧‧Heating element

G41‧‧‧Heating rod

G5‧‧‧Positioning plate

G51‧‧‧Ditch

G52‧‧‧Ditch

G53‧‧‧Stoma

H‧‧‧ Wiping mechanism

H1‧‧‧ pressed against the seat

H11‧‧‧Fixed

H12‧‧‧Driver

H13‧‧‧First rail seat

H131‧‧‧Slide

H14‧‧‧Interlocking seat

H15‧‧‧Second rail seat

H151‧‧‧Slide

H152‧‧‧Slide

H153‧‧‧rail

H154‧‧‧Driver

H155‧‧‧Elastic element

H2‧‧‧Laser Altimeter

H21‧‧‧line laser beam

H3‧‧‧Pressing module

H31‧‧‧The first pressing component

H311‧‧‧Driver

H3111‧‧‧Fixed

H3112‧‧‧Connecting Block

H3113‧‧‧Side Seat

H312‧‧‧Adjustment kit

H3121‧‧‧The first adjustment seat

H3122‧‧‧Second adjustment seat

H3123‧‧‧The third adjustment seat

H3124‧‧‧Fixing

H3125‧‧‧Fixing

H313‧‧‧Joint Block

H3131‧‧‧Heating hole

H3132‧‧‧Temperature hole

H3133‧‧‧ Loading and unloading department

H3134‧‧‧Mounting hole

H3135‧‧‧Temperature Switch

H314‧‧‧Heating element

H315‧‧‧Pressed to the seat

H3151‧‧‧ Loading head

H3152‧‧‧ Mobile wipe head

H3153‧‧‧ Push handle

H3154‧‧‧Joint

H3155‧‧‧moving and wiping department

H3156‧‧‧Magnetic piece

H316‧‧‧Screw

H3161‧‧‧fine adjustment screw

H3162‧‧‧Fixed screw

H3163‧‧‧Adjustable screw

H3164‧‧‧ perforated

H3171‧‧‧pin

H3172‧‧‧Elastic element

H32‧‧‧Second pressing component

H33‧‧‧Seat

H4‧‧‧ wipe material assembly

H41‧‧‧Fixed frame

H411‧‧‧First Interval

H412‧‧‧Second Section

H413‧‧‧Fixed section

H414‧‧‧Release area

H4141‧‧‧Driver

H4142‧‧‧roller

H4143‧‧‧First steering wheel

H4144‧‧‧Second Steering Wheel

H4145‧‧‧weight wheel

H4146‧‧‧long slot

H4147‧‧‧ Counterweight

H4148‧‧‧Slide

H4149‧‧‧Sensor

H415‧‧‧Rewinding area

H4151‧‧‧Driver

H4152‧‧‧roller

H4153‧‧‧First steering wheel

H4154‧‧‧Second Steering Wheel

H4155‧‧‧weight wheel

H4156‧‧‧long slot

H4157‧‧‧ Counterweight

H4158‧‧‧Slide

H4159‧‧‧Sensor

H416‧‧‧Stained liquid area

H4161‧‧‧Cleaning liquid container

H4162‧‧‧roller

H4163‧‧‧Recent runner

H4164‧‧‧ Display

H4165‧‧‧The first activity wheel

H4166‧‧‧Second Activity Wheel

H4167‧‧‧long slot

H4168‧‧‧Shaft

H4169‧‧‧Rotary driver

H417‧‧‧Pull Zone

H4171‧‧‧Driver

H4172‧‧‧Drawing Pulley

H4173‧‧‧Bucket

H4174‧‧‧ Pivot

H4175‧‧‧Swing arm

H4176‧‧‧ pivot pin

H4177‧‧‧Elastic element

H418‧‧‧ wipe area

H4181‧‧‧First Guide Arm

H4182‧‧‧Second Guide Arm

H4183‧‧‧ Operating distance

H4184‧‧‧First support wheel

H4185‧‧‧Second support wheel

H4186‧‧‧Guide Wheel

H419‧‧‧Temperature Sensor

H4191‧‧‧ extension rod

H4192‧‧‧Fixed

H4193‧‧‧slide

H4194‧‧‧Slide

W‧‧‧ to be applied

W1‧‧‧steel frame

W2‧‧‧ Adhesive film

W3‧‧‧ Wafer

W4‧‧‧ Grain

FIG. 1 is a schematic perspective view of a mechanism on the side of a first working area of a wafer residue cleaning device table in an embodiment of the present invention.

FIG. 2 is a schematic perspective view of the mechanism of the second work area side of the wafer residue cleaning device table in the embodiment of the present invention.

FIG. 3 is a schematic front view of FIG. 1 in the embodiment of the present invention.

FIG. 4 is a schematic diagram on the left side of FIG. 1 in the embodiment of the present invention.

FIG. 5 is an exploded perspective view of a carrier in the embodiment of the present invention.

FIG. 6 is a schematic diagram of air holes on a positioning plate of a carrier in the embodiment of the present invention.

FIG. 7 is a schematic perspective view of the wiping mechanism in the embodiment of the present invention.

FIG. 8 is a schematic perspective view of the back side of the wiping mechanism in the embodiment of the present invention.

FIG. 9 is an exploded perspective view of the pressing seat and the pressing module in the embodiment of the present invention.

FIG. 10 is an exploded perspective view of the pressing module and the first pressing module in the embodiment of the present invention.

FIG. 11 is a three-dimensional exploded schematic view of an adjustment component in an embodiment of the present invention.

FIG. 12 is a schematic perspective view of a wipe material assembly in the embodiment of the present invention.

FIG. 13 is a schematic front view of a wipe material assembly surrounding a wipe material in an embodiment of the present invention.

FIG. 14 is a three-dimensional schematic diagram of the moving and erasing head of the first pressing component moving on the die of the wafer in the embodiment of the present invention.

FIG. 15 is a schematic diagram of detecting residual glue by using a line laser beam of a laser altimeter according to an embodiment of the present invention.

Please refer to FIGS. 1 and 2, an embodiment of the present invention can be described by the wafer residue cleaning device in the figure, including: a machine A, having a machine table A1, and two sides of the machine table A1 at one end of the machine A Each convexity forms a pedestal A2 corresponding to the height, so that a concave transfer area A3 is formed between the two pedestals A2. The upper surface A21 of the two pedestals A2 is formed with the table surface A1 at the other end of the machine A without the pedestal A2. A height drop; a gantry rail B, two pillars B1 across the two bases A2 of the machine A, a beam B2 is located between the two pillars B1, the gantry rail B separates the machine A and plans A first work area A4 located on the other end of the machine platform A1 without a base A2, and a second work area A5 located on the side of the two bases A2, wherein the first work area A4 is used for picking and placing The workpiece W to be applied and the workpiece W to be applied are inspected; the second work area A5 is used for wiping the workpiece W to be applied; the workpiece W to be applied is a glued to an annular steel frame W1 Wafer W3 on the glue film W2 attached, the wafer W3 and the ring-shaped steel frame W1 maintain a ring-shaped distance, and the wafer W3 has completed cutting out the piece by piece. Die W4, and residual glue is left on die W4 due to related processes; A detection mechanism C, which is composed of a CCD lens, is disposed on the side of the gantry rail B toward the first work area A4, and is driven by a first driving member B3 on the gantry rail B to be mounted on the gantry rail. The X-axis slide rail B4 of the upper beam B2 of B makes X-axis reciprocating displacement, and the CCD lens of the detection mechanism C inspects the workpiece W to be applied in the first work area A4 in the downward direction of the Z-axis; The releasing mechanism D is provided on the machine table A1 of the first work area A4, and includes two clamping seats D1 arranged at a distance from each other in the X-axis direction, and the two clamping seats D1 are respectively provided with recesses of recessed latching portions D2. The clips D3 and the insert clips D3 are respectively located on the fixed seats D5 supported by the plurality of pivots D4 arranged at intervals in the Y axis. The two insert clips D3 are respectively received on the fixed seats D5 below it. Driven by a driving member D6, the ring-shaped steel frame W1 can be used to clamp the workpiece W to be applied in the X-axis direction, so that the workpiece W to be applied is horizontally straddled between the two embedded clamping members D3; the fixing seat D5 And the interlocking clamping piece D3 is driven up and down with the pivot D4, and the interlocking clamping piece D3 is used to lift and lower the workpiece W to be applied. The height of the workpiece W is lower than the height of the upper beam B2 of the gantry rail B and the lower end of the detection mechanism C; a rail base E is set on the machine table A1 and is arranged in the Y-axis direction, and one end thereof extends in the first working area A4 In the pick-and-place mechanism D, the two clamps D1 are below the workpiece W to be applied, and the other end passes through the gantry rail B and extends to the recessed transfer area A3 between the two bases A2 of the second work area A5. In one end, there is a rail seat driving member E1; a liquid supply mechanism F is provided on the machine table surface A1 in the first work area A4, and a cleaning liquid is arranged in the content, and a pipeline can be provided to transport the cleaning liquid. ; A carrier G is set on the rail base E in the concave transfer area A3 between the two bases A2 of the second work area A5, and can be used as Y by the drive of the rail base driver E1 on the rail base E The axis passes through the gantry rail B and moves between the first working area A4 and the second working area A5; please refer to Figures 3 and 4 at the same time. The carrier G can be displaced through the gantry rail B for the first work. While in zone A4, move into the workpiece holder W of the second clamping seat D1 in the pick-and-place mechanism D, and accept the workpiece W from the pick-and-place mechanism D, and After receiving the applied workpiece W, it is moved to the lower part of the detection mechanism C for inspection, and then the workpiece W to be applied is moved to the second work area A5 for the wiping operation. After completing the wiping operation, it is moved back to the first working area A4. At the middle time, the work piece W to be applied which has completed the rubber-rubbing operation is delivered to the pick-and-place mechanism D; a wiping mechanism H is provided on the X-axis slide rail of the cross beam B2 of the gantry rail B toward the second work area A5 The sliding seat B6 of B5 is driven by a second driving member B7 on the gantry rail B to perform X-axis reciprocating displacement on the sliding track B5. The wiping mechanism H is moved to the Z-axis downward direction to The work piece W to be applied in the second work area A5 is subjected to a rubbing operation.

Please refer to FIG. 5. The carrier G includes a fixed base G1 provided on the rail base E, and can be moved in the Y-axis direction by the drive of the rail base driver E1 on the rail base E. A carrier G2, On the fixed base G1, it can be driven and rotated by a driving member (not shown) in the fixed base G1. The carrier G2 is in the shape of a circular disk and is provided with a convex protrusion on the periphery and is slightly higher than the carrier G2. A plurality of support frames G22 on the upper surface G21 (four in this embodiment), a load measuring element G23 is provided in the center of the upper surface G21 of the carrier G2, and an upper surface G21 of the carrier G2 is on the outer peripheral side of the load measuring element G23 Two positioning members G24 are respectively provided at a 90-degree angle orientation; a fixed frame G3 is provided above the load measuring element G23 on the carrier G2 and is measured by the load measuring element G23, and it is attached with a surface G31 The supporting feet G32, which are located on the load measuring element G23 and extend outwardly at the four corners, are respectively seated on the supporting frame G22 of the carrier G2, and the stationary frame G3 can be rotated by the supporting of the carrier G2 ; The four legs G32 on the fixed frame G3 are arranged at a ninety degree bifurcation, and the seat surface G31 side G311 adjacent to each two legs G32 forms a straight edge, and the two legs G32 and A recessed positioning interval G33 is formed between the adjacent seating surface G31 sides G311, and the fixed frame G3 is seated against the load measuring element G23 with the seating surface G31. Two adjacent positioning intervals G33 are just measured by the load. The positioning of the two positioning members G24 set at the 90-degree angular orientation on the outer peripheral side of the element G23; A heating element G4 is composed of a plurality of heating rods G41. Each heating rod G41 is parallel and spaced horizontally above the fixed frame G3. A positioning plate G5 is provided on the fixed frame G3. Supported by the four legs G32 of the fixed frame G3, the heating element G4 is located between the positioning plate G5 and the fixed frame G3, and is abutted on the lower surface of the positioning plate G5 to heat the positioning plate G5; the upper surface of the positioning plate G5 is provided There are concentric grooves G51 with a plurality of annular rings spaced apart from each other, and linear grooves G52 arranged at a 90-degree intersection with each other. An air hole G53 is provided in the groove at the intersection of the groove G51 and the groove G52 (please see the figure for cooperation) 6) A negative pressure is passed through the air hole G53 to adsorb the load on the positioning plate G5.

Please refer to FIGS. 2, 7 and 8. The wiping mechanism H is provided with a pressing seat H1 and a fixing seat H11 which is one of the rectangles and stands in the Z-axis direction. The fixing seat H11 is fixed in the second working area A5. The gantry rail B is on the slide seat B6 of the X-axis slide rail B5 on the side of the beam B2 of the gantry rail B, and can be driven by the second driver B7 to perform X-axis slide on the slide rail B5; the back of the fixed seat H11 A linear laser altimeter H2 is fixed underneath, which is linked with the fixed base H11 and can project a linear laser beam H21 downwards; the fixed base H11 is provided with a pressing module H3 on the front side, and a first pressing module H31 and a second pressing component H32, wherein the first pressing component H31 is provided with a heat source; the pressing module H3 is driven by a driving member H12 above the fixed seat H11 of the holder H1 and can be moved up and down. A wipe material assembly H4 is provided with a slightly 略 -shaped fixing frame H41, and a lower opening first hollow section H411 is provided below the fixing frame H41, and the upper part of the fixing frame H41 is also provided above the hollow first section H411. There is a hollow hollow second section H412, and a rib-shaped fixing portion H413 is provided between the first section H411 and the second section H412. The fixing portion H413 of the fixing frame H41 is fixedly connected with the pressing seat frame H1 and is linked with it.

Please refer to FIGS. 7 and 9. The pressing seat H1 is provided with a first Z-axis first rail seat H13 on the front side of the fixed seat H11, and a Z-axis slide rail (not shown) is provided on the rail seat H13. A slide seat H131 is provided on the slide rail, and a linkage seat H14 is provided on the slide seat H131 and driven by a driving member H12 to act as Z Axial sliding, the interlocking seat H14 is fixed on the fixing part H413 of the fixing frame H41 of the wiping material component H4, so that the wiping material component H4 is driven by the driving member H12 to perform Z axial sliding and pressure Abutment on the seat frame H1 is linked; the slide seat H131 below the linked seat H14 is provided with an X-axis second rail seat H15, and the second rail seat H15 can be moved up and down in the Z axis on the first rail seat H13. An X-axis slide rail H151 is provided on the second rail seat H15, and a slide seat H152 capable of X-axis displacement on the slide rail H151 is provided thereon; an X-axis rail H153 is arranged parallel to the space below the slide rail H151. The rail H152 is provided with a driving member H154 that can perform X-axis sliding movement on the rail H153. The upper and lower sides of the second rail seat H15 are each provided with a Z-axis elastic force at an interval in the X-axis. A spring-formed elastic element H155, which makes the entire second rail seat H15 have an elastic buffer when the Z axis moves up and down; the pressing module H3 is seated on the driving member H154 with a base H33 at the bottom. Driven by it, it can make X-axis displacement. The back side of the seat frame H33 is fixed against the slide H152 at the same time to obtain a stable slip when driven. Therefore, pressing the module H3 will A second rail seat H15, H155 lower elastic member in the Z-axis, when the displacement of the elastic cushion.

Please refer to FIG. 10, the pressing module H3 is provided with a seat frame H33 for the first pressing module H31 and the second pressing module H32, respectively, to be arranged in parallel with each other in the Z-axis direction. Among them, the first pressing module H31 includes: a driving member H311, which is fixed on the mounting frame H33 by a fixed seat H3 111 and is linked by the mounting frame H33. The driving member H311 drives a coupling seat H3112 below which can be moved upward and downward in the Z axis and connected A side seat H3113 linked to the seat H3112 is fixed on one side; an adjustment module H312 is fixed at the upper end with a bottom of the first seat H3112, which is the upper surface of the first adjustment seat H3121, and the driving member H311, and the first adjustment seat H3121 The side is fixed to the front side of the lower end of the side seat H3113; a coupling seat H313 is fixed at its upper end to a second adjustment seat H3122 at the lower end of the adjustment assembly H312. A heating hole H3131 is provided in the coupling seat H313, and a side of the coupling seat H313 is provided. Temperature Switches H3135, heating can be stopped when the detected temperature is higher than a predetermined value; the two oblique angles on the front side of the coupling base H313 are respectively provided with temperature measuring holes H3132 communicating with the heating hole H3131; the lower end of the coupling base H313 is provided with a loading and unloading part H3133 There is a mounting hole H3134 on it; a heating element H314 is a long rod-shaped body and is inserted into the heating hole H3131 of the coupling seat H313, which is monitored by the temperature switch H3135; Below the adjustment component H312, it can be moved up and down in the Z axis by the linkage H3112. It has a U-shaped loading and unloading head H3151 and a wiper head H3152 located at the lower end of the loading and unloading part H3151. Position the mounting and dismounting part H3133 at the lower end of the coupling seat H313, and push and insert the pin-shaped coupling H3154 linked to H3153 with the loading and unloading hole H3134 of the mounting and dismounting part H3133 by a push; the wiper head H3152 has a square shape, and its lower end It has a square flat wiper H3155; the bottom end of the heating element H314 is in contact with the wiper H3152 and transmits heat to the wiper H3155 of the wiper H3152; a pusher H3153 is provided with a magnetic member H3156, Can be inserted in the coupling H3154 The mounting hole H3134 of H3133 is attracted to the coupling seat H313, so that the pusher H3153 is not easy to slip off; the heating element H314 is to heat the coupling seat H313 and transmit the heat temperature to the moving wiper H3152 which is pressed against the seat H315. The mounting and dismounting head H3151 and the wiper head H3152 are made of copper material; the adjustment component H312 is used to fine-tune and link the moving wiper H3155 of the wiper head H3152 under the seat H315 in the X axis and the Y axis. The horizontal height of the side corresponds to the surface wiped below. The structure of the second pressing component H32 is the same as that of the first pressing component H31, except that the heating element H314 and the temperature switch H3135 are not provided, and other components are not described in detail.

Please refer to FIG. 11, a third adjusting seat H3123 is provided between the first adjusting seat H3121 and the second adjusting seat H3122 of the adjusting assembly H312; H3121 and the third adjustment seat H3123 located below form a set of X-axis horizontal adjustment components, and the X-axis sides therebetween are fixed with sheet-shaped fixing members H3124; the third adjustment seat H3123 located above and the The second adjustment base H3122 forms a set of Y-axis horizontal adjustment components, and the two sides of the Y-axis in the middle are fixed with sheet-shaped fixing members H3125; the first adjustment base H3121 located above and the third adjustment base located below As an example, H3123 forms a group of X-axis horizontal adjustment components. The first adjustment seat H3121 located above and the third adjustment seat H3123 located below are screwed with a group of screwing members H316. The group of screwing members H316 includes: The X-axis offset side of the first adjustment base H3121 located above is used to screw-up a fine adjustment screw H3161 between the first adjustment base H3121 located above and the third adjustment base H3123 located below. Four fixing screws H3182 for fixing the upper end of the two side fixing members H3124 and the first adjusting seat H3121 located above from the outside of the fixing members H3124 on the two sides are used for fixing the lower end of the fixing members H3124 and the The lower third adjustment seat H3123 The fixed four adjustable screw joints H3163; among them, the lower end of the fixed part H3124 through which the adjustable screw joint H3163 is threaded has a hole H3164 whose diameter is slightly larger than that of the threaded part of the adjustable screw joint H3163, leaving a space between them. There is plenty of space, but the group of two adjustable screws H3163 on one side is normally screwed with the third adjustment seat H3123 located on the lower side, and the other two adjustable screws on the same side with the fine adjustment screw H3161 The connector H3163 and the third adjusting seat H3123 located below can be loosened or screwed randomly according to the need; in addition to the fixing member H3124 on the same side as the fine adjustment screw connector H3161, a lower end of the fixing member H3124 is inserted and is located below The second pin H3171 of the third adjustment seat H3123; between the first adjustment seat H3121 located on the same side as the fine adjustment screw H3161 and the third adjustment seat H3123 located below, there is a spaced apart Y axis. Two elastic elements H3172 composed of springs; the two-pin H3171 is inserted in a standard position in a normal state. Once the tilting state needs to be adjusted, the two fixing elements H3124 are arranged on the two sides of the X axis, so they can be pulled out first. Out of the two The pin H3171 is loosened and the two adjustable screw joints H3163 on the same side as the fine adjustment screw joint H3161 are loosened. Because the hole of the perforated H3164 and the outer diameter of the threaded part of the adjustable screw joint H3163 have a displaceable margin, so The two elastic elements H3172 on the same side as the fine adjustment screw H3161 will be fixed on the first adjustment seat H3121 located above, and then a stretch will be pushed against the third adjustment seat H3123 located on the lower side, which is on the same side as the fine adjustment screw H3161. The driving force of the shift, by fine-tuning the fine-adjusting screw H3161, the driving force that makes the elastic element H3172 stretch and push will push the third adjusting seat H3123 located on the same side as the fine-adjusting screw H3161 downwards and push against it. In order to obtain the adjustment of the horizontal height of the third adjustment seat H3123X on both sides of the axis below, after adjusting the positioning, the two adjustable screws H3163 on the same side as the fine adjustment screw H3161 are screwed and locked; this is located above The third Y-axis horizontal adjustment assembly of the third adjustment base H3123 and the second second adjustment base H3122 located below are used to adjust the horizontal heights on both sides of the Y-axis in the same way as the aforementioned method of adjusting the horizontal heights on both sides of the X-axis. The components are the same, but the orientation is set to the Y axis. It is arranged symmetrically, which can be understood from FIG. 11 and will not be described in detail.

Please refer to FIG. 8 and FIG. 12. A material releasing area H414 is provided on one side of the hollow recessed first section H411 under the H-shaped fixing frame H41 of the wiper assembly H4, and the other side of the hollow first section H411 is provided with a The winding area H415 is provided with a liquid-staining area H416 below the same side as the release area H414, and a pull-out area H417 is provided below the same side as the rolling-out area H412, formed between the liquid-sucking area H416 and the pull-out area H417 A wiping area H418; a temperature sensor H419 is fixed on a sliding seat H4193 by a fixing seat H4192 on the upper end of an extension rod H4191, which is arranged on the bottom edge of the hollow hollow second section H412 above the fixing frame H41 On the X-axis slide rail H4194, the temperature sensor H419 can be embedded in the coupling hole H313 (please refer to Figures 7 and 10) and detected in the temperature measuring hole H3132 communicating with the heating hole H3131 at the two oblique angles on the front side. The temperature of the heating element H314 is synchronized with the X-axis displacement of the first pressing component H31; The material release area H414 is provided with a reel H4142 for winding the swab in the Y-axis direction and driven by a driver H4141 on the back side of the fixed frame H41. An X-axis spaced-apart wheel axis is arranged below the reel H4142 in the Y-axis direction. Below the first steering wheel H4143, the second steering wheel H4144, between the first steering wheel H4143, the second steering wheel H4144, there is a counterweight wheel H4145 in which the axle is arranged in the Y axis direction, and the counterweight wheel H4145 is located on the release material. A Z-axis long slot H4146 on the fixed frame H41 in the area H414. The axle of the counterweight wheel H4145 extends through the long slot H4146 and is linked with a counterweight H4147 on the back side of the fixed frame H41. The counterweight H4147 It is set on a Z-axis slide rail H4148 on the side of a long slot H4146 and parallel to the long slot H4146, and the weight wheel H4145 can be linked to move up and down in the Z axis. The stroke distance of its up and down displacement is set by a group The upper and lower positions are monitored and controlled by the sensing element H4149; The winding area H415 is provided with an empty reel H4152, which is a winding wiper, driven by a drive element H4151 on the back side of the fixed frame H41. The third steering wheel H4153 and the fourth steering wheel are arranged below the reel H4152 in the X-axis spaced apart axial direction in the Y-axis direction. H4154, between the third steering wheel H4153 and the fourth steering wheel H4154, there is a counterweight wheel H4155 in which the axle is arranged in the Y-axis direction. The counterweight wheel H4155 is located in a Z-axis length on the fixed frame H41 in the winding area H415. At the slot H4156, the axle of the counterweight wheel H4155 extends through the long slot H4156 and is linked with a counterweight H4157 on the back side of the fixed frame H41. The counterweight H4157 is provided on the side of the long slot H4156 and is connected to the long slot. H4156 is parallel to the Z-axis slide rail H4158, and the weight wheel H4155 can be linked to move up and down in the Z-axis. The stroke distance of the up-and-down displacement is monitored and controlled by a group of sensing elements H4159 placed at the upper and lower positions. ; The liquid dipping zone H416 is provided with a cleaning liquid container H4161, which is placed on a shelf H42 fixed at the lower end of the fixed frame H41, and is connected with a pipeline (not shown) between the liquid supply mechanism F in FIG. 1 The supply of cleaning liquid can be obtained from the liquid supply mechanism F; a roller H4162 is provided in the cleaning liquid container H4161, and the axle of the roller H4162 is arranged in the Y-axis direction on the cleaning liquid container H4161 and a part of the circumference of the roller H4162 A part is immersed in the cleaning liquid container H4161, and a part of it is exposed outside the cleaning liquid container H4161. The circumferential surface of the cleaning liquid container H4161 is arranged in an equidistant ring array in a Y-axis embedded groove shape. A close-up wheel H4163 is provided, which is close to the cleaning liquid container H4161, and above the close-up wheel H4163 and the roller H4162 of the cleaning liquid container H4161, there is a pendulum arranged in two groups and spaced apart from each other. H4164 has a first movable wheel H4165 and a second movable wheel H4166. The first movable wheel H4165 and the second movable wheel H4166 are located at a Z-axis long slot H4167 on the fixed frame H41 in the liquid-impregnated area H416. The shaft H4168 on the rear side of the frame H4164 extends through the long slot H4167 and is driven by a rotary drive member H4169 on the back side of the fixed frame H41, so that the swing frame H4164 can swing and the first movable wheel H4165 can be moved down and abut The upper periphery of the upper roller H4162 of the cleaning liquid container H4161; the pull zone H417 is provided with a rotatable pull pulley H4172 driven by a drive member H4171 on the back side of the fixed frame H41, and the axle is arranged in the Y axis direction, and the pull pulley H4172 The circumferential surface is arranged in a uniformly spaced ring array in the shape of a Y-axis embedded groove; the pull pulley H4172 Adjacent to the side is provided with a wheel axially arranged in the Y axis of the indentation wheel H4173, the circumferential surface is also arranged in an equally spaced ring arrangement in the shape of the Y axis inward groove, the indentation wheel H4173 is provided with a pivot axis H4174 as a pivot pivot On the swing arm H4175 of the fixed frame H41, the pivot pin H4173 on the swing arm H4174 is also provided with a pivot pin H4176 which is inserted into the fixed frame H41. The swing arm H4174 on the other side of the pivot pin H4176 The elastic element H4177 (Fig. 13) composed of a spring on the fixing frame H41 is pulled. After the pivot pin H4176 inserted in the fixing frame H41 is pulled up, the swing arm H4175 will be pulled by the elastic element H4177 and engage the pull pulley. H4172 circumference; the wiping area H418 is provided with a first guide arm H4181 fixed by the fixing frame H41 in the wetted area H416 and extending obliquely downward, and fixed by the fixing frame H41 of the drawing area H417 and inclined obliquely The second guide arm H4182 extending downward, the first guide arm H4181, and the lower end of the second guide arm H4182 are close to each other to maintain an operating distance H4183, and each end is provided with a first support wheel with a wheel shaft arranged in the Y-axis direction. H4184, the second supporting wheel H4185; the bottom edges of the first supporting wheel H4184 and the second supporting wheel H4185 are common The same horizontal level in the X-axis direction is maintained; the upper guide wheel H4172 of the second guide arm H4182 is provided with a guide wheel H4186 in which the axle is arranged in the Y-axis direction adjacent to the pull wheel H4172 of the pull-out area H417.

Please refer to FIGS. 12 and 13. In the wiping and cleaning of the residual glue, the rolled strip-shaped wipe material L is passed from the reel H4142 of the material release area H414 in sequence through the first steering wheel H4143, the counterweight wheel H4145, After the second steering wheel H4144, enter the wetted area H416 and pass by the near-wheel H4163, the first movable wheel H4165, the second movable wheel H4166, and the roller H4162, and then pass the first support wheel H4184 of the wiping zone H418. , The second support wheel H4185, the guide wheel H4186, and after entering the pull-in area H417 and passing the draw-in wheel H4172, enter the rewinding area H415 and pass the third steering wheel H4153, the counterweight wheel H4155, and the fourth steering wheel H4154, while being wound up by the empty reel H4152; wherein, when the swab L passes around the second movable wheel H4166, the second movable wheel H4166 can be driven to press against the swab L passing through the second movable wheel H4166 The cleaning liquid container H4161 has been wiped with the cleaning liquid roller H4162 to adhere to the cleaning liquid; the wipe material L is sandwiched by the embedded resistance wheel H4173 when passing around the pull pulley H4172, so that the pull pulley H4172 can be driven by the driving member H4171 Pull around the swab material L in the wipe area H418 for displacement. When the swab material L in the wipe area H418 is pulled to the release area The counterweight wheel H4145 in H414 is forced to move up until the counterweight H4147 touches the sensor H4149 in the upper position, which will cause the driver H4141 to drive the reel H4142 to release the swab L until the counterweight H4147 touches the sensor in the lower position. It is the same as in the winding area H415. When the swab L is pulled by the pulling wheel H4172 to relax the swab L in the winding area H415 until the weight H4157 linked by the weight wheel H4155 touches the lower position When measuring the part H4159, the driving part H4151 will drive the empty reel H4152 to wind up the swab L until the weight H4157 touches the sensing part H4159 in the upper position, thereby adjusting the swab L to be pulled in the entire flow path. The pressing module H3 can be selectively operated by the first pressing module H31 or the second pressing module H32, and each is pressed by the moving portion H3155 of the moving head H3152 at the lower end of the pressing seat H315. Post this Around the wiper material L between the first support wheel H4184 and the second support wheel H4185 in the wiping area H418.

The method for cleaning wafer residues according to the embodiment of the present invention is to perform the following steps: a feeding step, loading a workpiece W to be applied into the pick-and-place mechanism D, and receiving two clamping pieces D3 on two clamping seats D1 in a horizontal state. Clamping; the loading operation can be taken out and executed by a robot (not shown) from a load / unload (not shown); a loading step makes the stage G work by the second The area A5 passes through the gantry rail B through the gantry rail B and is displaced in the first working area A4 by the Y-axis linear displacement flow path, and is moved under the workpiece W to be applied between the two clamping seats D1 in the pick-and-place mechanism D, and the pick-and-place mechanism The two insert clips D3 on D receive the application workpiece W; when the application workpiece W is received by the carrier G, it will be adsorbed on the carrier G2 by the negative pressure in the air hole G53 and positioned on the carrier G2. And is heated by the heating element G4; a residual glue inspection step causes the stage G to be linearly displaced along the Y axis, and the flow path is moved back, and when the pick-up mechanism D is removed in the first work area A4, the workpiece to be applied is W The inspection mechanism C on the gantry rail B inspects each of the die W4 one by one on its residual glue status; a zone change step makes the workpiece to be applied to complete the remaining glue status W The stage G is linearly displaced along the original Y-axis, and the flow path passes through the gantry rail B and is moved back to the second working area A5. A grain wiping step causes the wiping mechanism H to be pressed against the seat H1 in conjunction with the wiping material assembly H4. The first pressing member provided with a heat source presses against the wiper H3155 of the wiper head H3152 of the moving head H3152 to press the wiper L (see FIG. 14), and the wiper L is pulled by the pulling pulley H4172, and the wiper head is moved. The wiper part H3155 of H3152 wipes between the bottom surface of H3155 and the upper surface of die W4, and wipes the individual die W4 where residual glue is detected. Because the wiper head H3152 has a square flat lower end and a flat planar wiper part The area of H3155 is about the same as the surface area of the grain W4, so the wiping range can cover the entire grain; after the wiping of each of the grains W4 with residual glue detected on the workpiece W is completed, it is then pressed with a second source without heat. The wiper head H3155 of the wiper head H3152 of the module H32 presses the wiper material L on the die W4 with residual glue detected. Wipe; when the wiper part H3155 of the wiper head H3152 presses the wiper material L against the die W4 on the workpiece W, the pressing force of the wiper head H3152 is pressed by the amount of the load measuring element G23 in the stage G Measurement, once the set load value is reached, the moving head H3152 will stop pressing to avoid damaging the grain W4; a cleaning inspection step, the workpiece W to be applied is linearly displaced along the Y-axis by the flow path The pick-and-place mechanism D is displaced, and the second working area A5 below the gantry rail B is pressed against the linear laser altimeter H2 projected by the linear laser altimeter H2 below the rear side of the holder H1 holder H11. Detect residual grains W4 for inspection (see Figure 15); when grains that have not been cleaned as expected are detected, the workpiece W to be applied is linearly displaced along the Y axis by the stage G Re-execute the above-mentioned grain W4 wiping step; when all the grains W4 originally detected with residual glue have been inspected to meet the expected level, they are deemed to have been cleaned; a replacement step, which has been cleaned to be applied to the workpiece W the stage G is linearly displaced along the Y axis, and the flow path passes under the gantry rail B and is displaced in the direction of the pick-and-place mechanism D in the first working area A4, and Move into the two clamp holders D1 in the pick-and-place mechanism D, so that the two embedded clamps D3 on the pick-and-place mechanism D receive the work piece W for the robot to remove and transfer to the feeding and receiving device, and execute The next cycle of loading is to perform the workpiece W.

The wiping mechanism and the wafer residue cleaning device using the wiping mechanism in the embodiment of the present invention, since the wiping mechanism H uses the crystal grains W4 to clean the wafers one by one, so the wafers W4 with residual gums can be cleaned separately. In addition to achieving a better cleaning effect, the cleaning of the residual glue on the entire wafer can be efficiently performed; and the workpiece W to be applied has been heated by the heating element G4 on the stage G, so that the residual glue is warmly performed In the case of the first pyrolysis process of the entire piece of workpiece W to be applied from the bottom, the wiping mechanism H is executed by the first pressing component H31 with a heat source, and the second is performed from the top to the bottom for the individual die W4. Pyrolysis process, the residual glue on the grain W4 that has been rubbed has been melted into a liquid dilution state, and then wiped by a second heat-resistant second pressing component H32, which can make the cleaning of the residual glue easier, and cooperate with the line mine The linear laser beam H21 projected by the altimeter H2 checks the effect of the wipe. The inspection can complete the cleaning of each crystal without any omissions; and the wiper assembly H4 of the wiping mechanism H releases the wiper L to the hollow reel H4152 of the rewinding zone H415 through the reel H4142 in the release zone H414. In the meantime, the wiper material L can be adhered to the cleaning liquid container H4161 with the cleaning liquid on the roller H4162 without interruption, and the weight of the wiper material L is adjusted to be moderately tight through the weight wheels H4145 and H4155, so that the wiper will be wiped. The cleaning operation can be carried out continuously and automatically, which greatly improves the cleaning performance. At the same time, the module H3 has an elastic buffer when the elastic elements H155 on the upper and lower sides of the second rail seat H15 are displaced in the Z axis. When the first pressing component H31 or the second pressing component H32 on the pressing module H3 is pressed against the surface of the die, the down force is monitored in addition to the measurement by the load measuring element G23 on the stage G. Outside the track, the pressing force itself has a buffer, which can reduce the damage of the crystal grains W4 on the workpiece W to be applied.

However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.

Claims (13)

A wiping mechanism includes: a first pressing member which can be driven to move up and down and is provided with a wiping head; a wiping material component which is provided with a fixing frame around which a band-shaped wiping material is wound; A material release area is provided on one side, and a reeling area is provided on the other side. One of the material release area and the reeling area is provided with a reel driven by a driving member to wind the swab. The material area passes through a wiping area to the winding area. The wiping area is provided with a first guiding arm and a second guiding arm. The first guiding arm and the second guiding arm are close to each other. An operating distance is maintained, and each is provided with a first support wheel and a second support wheel; the first pressing component can be driven to press the moving wiper head against the first support wheel in the wiping area, The wiper between the second supporting wheels is above the wiper to abut the surface of the workpiece to be cleaned. The wiping mechanism according to item 1 of the scope of the patent application, wherein one of the material release area and the rewinding area is provided with a reel driven by a driving member, and a counterweight is provided below the reel. Wheel, the counterweight wheel and a counterweight provided on a slide rail are moved in a coordinated manner, and the swab material adjusts the tightness of the swab material being drawn in the entire flow path through the counterweight wheel. The wiping mechanism according to item 2 of the scope of the patent application, wherein a first steering wheel and a second steering wheel spaced apart from each other are arranged below the reel, and a space between the first steering wheel and the second steering wheel is provided below the reel. The weight wheel and the travel distance of the weight wheel displacement are monitored and controlled by a set of sensing elements. The wiping mechanism according to item 1 of the scope of the patent application, wherein the fixing frame is provided with a hollow first section and a fixing portion, and the wiping material component uses a fixing portion and a pressing seat provided with the first pressing component. The frame is fixed and connected with it, and the first pressing component is located in the hollow first section. The wiping mechanism according to item 1 of the scope of the patent application, wherein the fixed frame is provided with a temperature sensor, which is fixed on a slide base with a fixed base on the upper end of an extension rod, and the slide base is provided on the fixed frame. On a slide rail, the temperature sensor may be embedded in a coupling seat on the first pressing member to detect a temperature of a heating element and synchronously move with the first pressing member. According to the wiping mechanism described in item 1 of the scope of patent application, wherein the fixing frame is provided with a liquid dipping area below the same side as the material release area, and a pull-down area is provided under the same side as the winding area, and The liquid area and the drawing area form the wiping area; the swab is wound around the liquid-sucking area, the wiping area, and the drawing area from the release area to the winding area. According to the wiping mechanism described in item 6 of the patent application scope, wherein the liquid-stained area is provided with a cleaning liquid container, and a pipe connection is provided between the cleaning liquid container and the liquid supply mechanism to obtain the supply of the cleaning liquid. As described in claim 7 of the scope of the patent application, the cleaning container is provided with a roller, a part of the circumference of the roller is immersed in the cleaning container, and a part is exposed outside the cleaning container. The wiping mechanism according to item 8 in the scope of the patent application, wherein the liquid-stained area is provided with a close-up wheel, which is close to the cleaning container, and a swing frame is provided above the close-rotation wheel and the cleaning container. A first movable wheel, the pendulum is driven by a rotating drive member, so that the pendulum can be swiveled so that the first movable wheel can be moved down against the upper periphery of the roller on the cleaning container. The wiping mechanism according to item 6 of the scope of the patent application, wherein the pull zone is provided with a rotatable pull wheel driven by a driving member, an inset abutment wheel is provided adjacent to the draw wheel, and the inset abutment wheel is arranged on a swing On the arm, the swing arm is provided with a pivot pin that is inserted into the fixed frame. The swing arm is pulled by an elastic element. After the pivot pin is pulled out, the swing arm will be pulled by the elastic element and engage the pull wheel. circumference. The wiping mechanism according to item 6 of the scope of patent application, wherein the first guide arm extends from the liquid-stained area, the second guide arm extends from the pull-out area, the first support wheel, the second support wheel The bottom edges together maintain the same level. The wiping mechanism according to item 11 of the scope of patent application, wherein a guide wheel is provided above the second guide arm adjacent to one of the pull wheels of the pull zone. A wafer residue cleaning device using the wiping mechanism as described in any one of claims 1 to 12 of the patent application scope, comprising: a machine separated by a gantry rail frame into a first work area and a second work Area; a detection mechanism provided at the side of the gantry rail of the first work area to inspect the workpiece to be applied in the first work area; a pick-and-place mechanism provided at the first The working area includes two clamps spaced apart from each other; a carrier set on the machine; the second working area can be driven to be displaced in the first working area and the second working area, and from the pick-and-place mechanism Accept the workpiece to be applied or deliver the workpiece to the pick-and-place mechanism; the wiping mechanism is provided on the side of the gantry rail toward the second work area, and the first pressing component can be driven to press The wiper performs residual glue cleaning on the workpiece to be applied on the stage.