CN220455183U

CN220455183U - Automatic alignment device for wafer detection

Info

Publication number: CN220455183U
Application number: CN202322080983.1U
Authority: CN
Inventors: 胡科
Original assignee: Shenzhen Desige Intelligent Technology Co ltd
Current assignee: Shenzhen Desige Intelligent Technology Co ltd
Priority date: 2023-08-04
Filing date: 2023-08-04
Publication date: 2024-02-06
Anticipated expiration: 2033-08-04

Abstract

The utility model discloses an automatic alignment device for wafer detection, which comprises a workbench, wherein a detection device is arranged above the workbench, a supporting frame is fixed at the top of the workbench, and a clamping mechanism is arranged on the supporting frame; the clamping mechanism comprises clamping rods arranged at four corners of the top of the supporting frame, a connecting mechanism is arranged at the bottom of the supporting frame, a driving mechanism for driving the connecting mechanism to move is arranged on the workbench, and the connecting mechanism is connected with the clamping rods; the driving mechanism comprises a bidirectional motor, the output shaft of the bidirectional motor is fixedly provided with a diamond, the connecting mechanism is connected with the diamond, the connecting mechanism comprises two first connecting rods which are respectively arranged at opposite angles of the diamond in a rotating mode, the first connecting rods are connected with mounting blocks in a rotating mode, and two ends of each mounting block are respectively provided with a second connecting rod in a rotating mode. The utility model realizes the automatic righting of the wafer, is suitable for righting wafers with different sizes, and conveniently and quickly realizes the detection.

Description

Automatic alignment device for wafer detection

Technical Field

The utility model relates to the technical field of wafer detection, in particular to an automatic alignment device for wafer detection.

Background

The wafer is a silicon wafer used for manufacturing a semiconductor circuit, and the silicon wafer is formed by grinding, polishing and slicing a silicon crystal bar. The wafer can be manufactured into different circuit element structures, and products with specific electrical properties can be produced through processing.

The semiconductor industry has a high accuracy requirement on wafers, and therefore, in order to screen out defective products to improve the quality of the wafers, defects on the surfaces of the wafers need to be detected. The common wafer detection methods include a needle contact method, an atomic force method, an optical method and the like, and as the optical detection method does not need to be in contact with the surface of the wafer, the possibility of damaging the wafer to be detected is reduced, and the optical method can realize real-time detection, the defect detection of the wafer by using the optical method is common in the semiconductor industry.

In view of the above related art, the inventors believe that, since the optical inspection method generally uses a microscope to observe and detect the surface of the wafer, but the sizes of the wafers produced at present are different, limited by the structure of the apparatus, it is difficult to adjust the wafer alignment microscope lens quickly and quickly.

Disclosure of Invention

The utility model aims to solve the defects in the prior art and provides an automatic alignment device for wafer detection.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the automatic wafer detection alignment device comprises a workbench, wherein a detection device is arranged above the workbench, a supporting frame is fixed at the top of the workbench, and a clamping mechanism is arranged on the supporting frame;

the clamping mechanism comprises clamping rods arranged at four corners of the top of the supporting frame, a connecting mechanism is arranged at the bottom of the supporting frame, a driving mechanism for driving the connecting mechanism to move is arranged on the workbench, and the connecting mechanism is connected with the clamping rods;

the driving mechanism comprises a bidirectional motor, the output shaft of the bidirectional motor is fixed with diamond-shaped blocks, and the connecting mechanism is connected with the diamond-shaped blocks.

As a further scheme of the utility model, the connecting mechanism comprises two first connecting rods which are respectively and rotatably arranged at opposite angles of the diamond-shaped blocks, the first connecting rods are rotatably connected with mounting blocks, two ends of each mounting block are rotatably provided with second connecting rods, the second connecting rods are rotatably provided with third connecting rods, and the third connecting rods are coaxially fixed in one-to-one correspondence with the clamping rods.

As a further scheme of the utility model, a hole is formed in the supporting frame, and a shaft on the third connecting rod penetrates through the hole to be fixed with the clamping rod.

As a further scheme of the utility model, the bottom of the supporting frame is fixedly provided with the mounting frame, and the bidirectional motor is fixed at the bottom of the mounting frame.

As a further scheme of the utility model, the inner wall of the supporting frame is uniformly provided with a rotating roller in a rotating way.

As a further scheme of the utility model, the end face of the clamping rod is provided with the extrusion assembly, the extrusion assembly comprises a first semi-cylinder fixed at one end of the clamping rod, a plurality of springs are fixed on the inner wall of the first semi-cylinder, and the other ends of the springs are fixed with the same second semi-cylinder.

As a further scheme of the utility model, the detection device comprises a support rod fixed on the top of the workbench, and a microscope is fixed on the top of the support rod.

The beneficial effects of the utility model are as follows:

the utility model comprises the following steps: through workstation, detection device, braced frame and fixture that sets up, wherein fixture includes first connecting rod, the second connecting rod, the third connecting rod, installation piece and actuating mechanism, wherein actuating mechanism includes bi-directional motor and diamond, can drive diamond through bi-directional motor and rotate, and then pull two first connecting rods, first connecting rod pulling second connecting rod, second connecting rod pulling third connecting rod, finally realize the rotation of clamping lever, four clamping rods synchronous extrusion wafer, realize the automatic righting of wafer, be suitable for the righting of different size wafers, convenient and fast realizes detecting.

The utility model comprises the following steps: the extrusion assembly comprises a first semi-cylinder, a second semi-cylinder and a spring, wherein the second semi-cylinder is in contact with the wafer, the spring can enable the first semi-cylinder and the second semi-cylinder to be far away in a natural state, and when the spring is pressed, the spring contracts to play a role in buffering.

The utility model comprises the following steps: the rotating rollers are uniformly arranged in the supporting frame, and play a role in supporting the wafer and facilitating the movement of the wafer.

Drawings

FIG. 1 is a schematic perspective view of an automatic alignment device for wafer inspection according to the present utility model;

FIG. 2 is a schematic view of a first partial perspective view of an automatic wafer inspection alignment apparatus according to the present utility model;

FIG. 3 is a schematic diagram of a second partial perspective view of an automatic wafer inspection alignment apparatus according to the present utility model;

fig. 4 is a schematic cross-sectional view of an extrusion assembly of an automatic wafer inspection device according to the present utility model.

In the figure: 1. a work table; 2. a support rod; 3. a microscope; 4. a support frame; 5. a clamping mechanism; 6. a mounting frame; 7. a bi-directional motor; 8. diamond-shaped blocks; 9. a first link; 10. a second link; 11. a third link; 12. a mounting block; 13. a rotating roller; 14. an extrusion assembly; 15. a first semi-cylinder; 16. a second semi-cylinder; 17. a spring; 18. and a clamping rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

Referring to fig. 1-4, an automatic wafer inspection aligning device comprises a workbench 1, wherein an inspection device is arranged above the workbench 1, a supporting frame 4 is fixed on the top of the workbench 1, and a clamping mechanism 5 is arranged on the supporting frame 4;

the clamping mechanism 5 comprises clamping rods 18 arranged at four corners of the top of the supporting frame 4, a connecting mechanism is arranged at the bottom of the supporting frame 4, a driving mechanism for driving the connecting mechanism to move is arranged on the workbench 1, and the connecting mechanism is connected with the clamping rods 18;

the driving mechanism comprises a bidirectional motor 7, a diamond-shaped block 8 is fixed on an output shaft of the bidirectional motor 7, and the connecting mechanism is connected with the diamond-shaped block 8.

In this embodiment, the connection mechanism includes two first connecting rods 9 respectively rotatably disposed at opposite angles of the diamond-shaped blocks 8, the first connecting rods 9 are rotatably connected with mounting blocks 12, two ends of each mounting block 12 are rotatably provided with second connecting rods 10, the second connecting rods 10 are rotatably provided with third connecting rods 11, and the third connecting rods 11 are coaxially fixed in one-to-one correspondence with the clamping rods 18.

In this embodiment, the supporting frame 4 is provided with a hole, and the shaft on the third link 11 is fixed to the clamping rod 18 through the hole.

In this embodiment, the bottom of the supporting frame 4 is fixed with a mounting frame 6, and the bi-directional motor 7 is fixed at the bottom of the mounting frame 6.

In this embodiment, the inner wall of the support frame 4 is uniformly provided with the rotating roller 13 in a rotating manner, the rotating roller 13 is uniformly provided in the support frame 4, and the rotating roller 13 plays a role in supporting the wafer and facilitating the movement of the wafer.

In this embodiment, the end face of the clamping rod 18 is provided with the extrusion assembly 14, the extrusion assembly 14 includes a first semi-cylinder 15 fixed at one end of the clamping rod 18, a plurality of springs 17 are fixed on the inner wall of the first semi-cylinder 15, the same second semi-cylinder 16 is fixed at the other end of the plurality of springs 17, the extrusion assembly 14 includes the first semi-cylinder 15, the second semi-cylinder 16 and the springs 17, the second semi-cylinder 16 contacts with the wafer, the springs 17 can keep the first semi-cylinder 15 and the second semi-cylinder 16 away from under the natural state, and when being pressed, the springs 17 shrink to play a role of buffering.

In this embodiment, the detection device includes a support rod 2 fixed on the top of the workbench 1, and a microscope 3 is fixed on the top of the support rod 2.

Working principle: when the automatic wafer aligning device is used, through the arranged workbench 1, the detection device, the supporting frame 4 and the clamping mechanism 5, wherein the clamping mechanism 5 comprises a first connecting rod 9, a second connecting rod 10, a third connecting rod 11, a mounting block 12 and a driving mechanism, the driving mechanism comprises a bidirectional motor 7 and a diamond-shaped block 8, the diamond-shaped block 8 can be driven to rotate through the bidirectional motor 7, the two first connecting rods 9 are pulled, the first connecting rod 9 pulls the second connecting rod 10, the third connecting rod 11 is pulled by the second connecting rod 10, the rotation of the clamping rods 18 is finally realized, the wafers are synchronously extruded by the four clamping rods 18, the automatic wafer aligning is realized, and meanwhile, the extruding assembly 14 is arranged, the extruding assembly 14 comprises a first semi-cylinder 15, a second semi-cylinder 16 and a spring 17, the second semi-cylinder 16 is contacted with the wafers, the spring 17 can enable the first semi-cylinder 15 and the second semi-cylinder 16 to be far away in a natural state, and the spring 17 is contracted when being pressed, and the spring 17 plays a buffering role; further, the rotating rollers 13 are uniformly arranged in the supporting frame 4, and the rotating rollers 13 play a role in supporting the wafer and facilitating the movement of the wafer.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be capable of being practiced otherwise than as specifically illustrated and described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The automatic wafer detection alignment device comprises a workbench (1) and is characterized in that a detection device is arranged above the workbench (1), a supporting frame (4) is fixed at the top of the workbench (1), and a clamping mechanism (5) is arranged on the supporting frame (4);

the clamping mechanism (5) comprises clamping rods (18) arranged at four corners of the top of the supporting frame (4), a connecting mechanism is arranged at the bottom of the supporting frame (4), a driving mechanism for driving the connecting mechanism to move is arranged on the workbench (1), and the connecting mechanism is connected with the clamping rods (18);

the driving mechanism comprises a bidirectional motor (7), a diamond-shaped block (8) is fixed on an output shaft of the bidirectional motor (7), and the connecting mechanism is connected with the diamond-shaped block (8).

2. The automatic wafer detection aligning device according to claim 1, wherein the connecting mechanism comprises two first connecting rods (9) which are respectively arranged at opposite angles of the diamond-shaped blocks (8) in a rotating mode, the first connecting rods (9) are rotatably connected with mounting blocks (12), two ends of each mounting block (12) are rotatably provided with second connecting rods (10), the second connecting rods (10) are rotatably provided with third connecting rods (11), and the third connecting rods (11) and the clamping rods (18) are coaxially fixed in a one-to-one correspondence mode.

3. An automatic wafer inspection alignment device according to claim 2, wherein the support frame (4) is provided with a hole, and the shaft of the third link (11) is fixed to the clamping rod (18) through the hole.

4. An automatic wafer inspection alignment device according to claim 3, characterized in that the bottom of the support frame (4) is fixed with a mounting frame (6), and the bi-directional motor (7) is fixed at the bottom of the mounting frame (6).

5. The automatic wafer inspection aligning device according to claim 4, wherein the inner wall of the supporting frame (4) is uniformly rotatably provided with a rotating roller (13).

6. The automatic wafer inspection aligning device according to claim 5, wherein an end face of the clamping rod (18) is provided with an extrusion assembly (14), the extrusion assembly (14) comprises a first semi-cylinder (15) fixed at one end of the clamping rod (18), a plurality of springs (17) are fixed on the inner wall of the first semi-cylinder (15), and the other ends of the springs (17) are fixed with the same second semi-cylinder (16).

7. The automatic wafer inspection alignment device according to claim 1, wherein the inspection device comprises a support rod (2) fixed on the top of the workbench (1), and a microscope (3) is fixed on the top of the support rod (2).