TWI700134B - Cutting knife cleaning method, device and cutting equipment - Google Patents

Cutting knife cleaning method, device and cutting equipment Download PDF

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Publication number
TWI700134B
TWI700134B TW107144085A TW107144085A TWI700134B TW I700134 B TWI700134 B TW I700134B TW 107144085 A TW107144085 A TW 107144085A TW 107144085 A TW107144085 A TW 107144085A TW I700134 B TWI700134 B TW I700134B
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cleaning
cutting
cutter
cutting knife
patent application
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TW107144085A
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Chinese (zh)
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TW202021678A (en
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李孟全
林芳旭
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萬潤科技股份有限公司
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Priority to TW107144085A priority Critical patent/TWI700134B/en
Priority to CN201910846549.5A priority patent/CN111283799B/en
Publication of TW202021678A publication Critical patent/TW202021678A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/088Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B26D1/06Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/10Means for treating work or cutting member to facilitate cutting by heating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonmetal Cutting Devices (AREA)

Abstract

本發明提供一種切刀清潔方法、裝置及切割設備;該切刀清潔裝置用以清潔位於一切割裝置中一第一壓件與一第二壓件間的切刀,包括:一提升機構,設有一提升件與一驅動器,該提升件受該驅動器之作用可連動該第一壓件及該第二壓件位移,使該切刀之刀刃顯露;一清潔機構,設有一擦拭件;該清潔機構可受一驅動裝置驅動而位移使該擦拭件對該切刀之刀刃進行清潔。 The present invention provides a cutting knife cleaning method, device and cutting equipment; the cutting knife cleaning device is used to clean a cutting knife located between a first pressing member and a second pressing member in a cutting device, and includes: a lifting mechanism, There is a lifting member and a driver, and the lifting member is capable of moving the first pressing member and the second pressing member to make the blade of the cutter exposed by the action of the driver; a cleaning mechanism is provided with a wiper; the cleaning mechanism It can be driven by a driving device to move so that the wiper cleans the blade of the cutter.

Description

切刀清潔方法、裝置及切割設備 Cutting knife cleaning method, device and cutting equipment

本發明係有關於一種切刀清潔方法、裝置及切割設備,尤指一種可清潔用於切割晶片之切刀的切刀清潔方法、裝置及切割設備。 The present invention relates to a cutting knife cleaning method, device and cutting equipment, in particular to a cutting knife cleaning method, device and cutting equipment that can clean a cutting knife used for cutting wafers.

習知用於切割晶片之切割設備,可如專利號第I627042號「晶片切割裝置」專利案所揭露,該晶片切割設備設有包括:一載台,設於一機台台面上,以一載板載置一待切割元件,該載板下方設有一旋轉機構,可於X、Y平面旋轉調整該載板之方向,該旋轉機構下方設有一移動座,可使該載台於該機台台面上進行Y軸向上移動;一機架,以兩支柱與一橫樑所構成之龍門型式設在該機台台面上,該載台位於該機架下方之一作業空間,該機架設有一側面,其上設有兩個Z軸向滑軌;一進給裝置,設有一滑座與該兩個Z軸向滑軌相連,並以一動力源驅動一驅動桿,使該滑座可於Z軸向上移動;一晶片切割裝置,設於該滑座上,其設有一切刀夾設於一本體與一固定座之間,該本體與該固定座之下方各設有一第一壓件與一第二壓件,該本體、該固定座與該第一壓件、該第二壓件之間設有數個彈性件,該第一壓件與該第二壓件之間具有一間隙,可提供該切刀底部穿越;在欲進行該待切割元件切割時,該滑座帶動該晶片切割裝置下降,使該晶片切割裝置之一第一壓件與一第二壓件先壓制該待切割元件,並壓縮該數個彈性件使該切刀繼續向下移動穿經該間隙對該載台上之該待切割元件進行直線切割。 Conventional cutting equipment for cutting wafers, as disclosed in the Patent No. I627042 "Wafer Cutting Device", the wafer cutting equipment includes: a carrier, set on a machine table, with a carrier A component to be cut is placed on the board, a rotating mechanism is arranged under the carrier, which can rotate and adjust the direction of the carrier in the X and Y planes, and a moving seat is arranged under the rotating mechanism to allow the carrier to be placed on the machine table. It moves upward in the Y axis; a frame is set on the table of the machine in a gantry type composed of two pillars and a beam. The carrier is located in a working space below the frame. The frame is provided with a side surface. There are two Z-axis slide rails; a feeding device is provided with a sliding seat connected to the two Z-axis slide rails, and a driving rod is driven by a power source, so that the slide seat can move upward in the Z-axis Mobile; a wafer cutting device, set on the sliding seat, which is provided with a knife clamp between a body and a fixed seat, the body and the fixed seat are each provided with a first pressing member and a second A pressing piece, a plurality of elastic pieces are arranged between the body, the fixing seat, the first pressing piece, and the second pressing piece, and there is a gap between the first pressing piece and the second pressing piece, which can provide the cutting The bottom of the knife passes through; when the element to be cut is to be cut, the sliding seat drives the wafer cutting device to descend, so that a first pressing member and a second pressing member of the wafer cutting device first press and compress the element to be cut The plurality of elastic members make the cutting knife continue to move downward through the gap to perform linear cutting on the component to be cut on the carrier.

習知晶片切割設備所欲切割之待切割元件,其通常係貼附於一膠膜上,在切刀切割該待切割元件時,該切刀之底緣會觸碰該膠膜而沾附黏膠,使切割時所產生之粉塵又黏附於該切刀上,導致該切刀無法順利切割待切割元件;目前業界對於切刀沾附黏膠之對策,通常係在晶片切割設備使用一段時間後,操作人員以清潔布直接手動擦拭該切刀,如此不但耗費人力,且操作人員在擦拭之過程中亦有被該切刀割傷之風險。 The device to be cut to be cut by the conventional chip dicing equipment is usually attached to a plastic film. When the cutting knife cuts the device to be cut, the bottom edge of the cutting knife touches the plastic film and adheres to it. Glue causes the dust generated during cutting to adhere to the cutting knife, causing the cutting knife to fail to smoothly cut the components to be cut; the current industry countermeasures for cutting knives to stick to glue are usually after the chip cutting equipment has been used for a period of time , The operator directly manually wipes the cutter with a cleaning cloth, which not only consumes manpower, but also has the risk of being cut by the cutter during the wiping process.

爰是,本發明的目的,在於提供一種可節省人力之切刀清潔方法。 The purpose of the present invention is to provide a cleaning method for cutting knives that can save manpower.

本發明的另一目的,在於提供一種用以執行如所述切刀清潔方法的裝置。 Another object of the present invention is to provide a device for performing the cutting knife cleaning method.

本發明的又一目的,在於提供一種可節省人力之切刀清潔裝置。 Another object of the present invention is to provide a cutter cleaning device that can save manpower.

本發明的再一目的,在於提供一種使用所述切刀清潔裝置的設備。 Another object of the present invention is to provide an equipment using the cutter cleaning device.

本發明的又再一目的,在於提供一種可節省人力之切割設備。 Another object of the present invention is to provide a cutting device that can save manpower.

依據本發明目的之切刀清潔方法,包括:提供一機架,以兩支柱與一橫樑構成龍門型式;提供一切割裝置,設於該橫樑之前側,該切割裝置可下降以一切刀切割一待切割元件;提供一切刀清潔裝置,設有一清潔機構;提供一驅動裝置,設於該橫樑之後側;使該清潔機構受該驅動裝置驅動,伸經該橫樑下方對該切刀進行清潔。 The method for cleaning a cutter according to the object of the present invention includes: providing a frame with two pillars and a beam to form a gantry type; providing a cutting device arranged on the front side of the beam, the cutting device can be lowered and cut with a knife Cutting element; providing a knife cleaning device with a cleaning mechanism; providing a driving device arranged on the back side of the beam; enabling the cleaning mechanism to be driven by the driving device and extending under the beam to clean the cutting knife.

依據本發明另一目的之切刀清潔裝置,包括:用以執行如所述切刀清潔方法之裝置,該裝置設有該清潔機構。 A cutting knife cleaning device according to another object of the present invention includes: a device for performing the cutting knife cleaning method as described above, and the device is provided with the cleaning mechanism.

依據本發明又一目的之切刀清潔裝置,用以清潔位於一切割裝置中一第一壓件與一第二壓件間的切刀,包括:一提升機構,設有一提升件與一驅動器,該提升件受該驅動器之作用可連動該第一壓件及該第二壓件位 移,使該切刀之刃部顯露;一清潔機構,設有一擦拭件;該清潔機構可受一驅動裝置驅動而位移使該擦拭件對該切刀之刀刃進行清潔。 According to yet another object of the present invention, a cutter cleaning device for cleaning a cutter located between a first pressing member and a second pressing member in a cutting device includes: a lifting mechanism provided with a lifting member and a driver, The lifting member can be linked to the first pressing member and the second pressing member by the action of the driver Move to expose the blade of the cutter; a cleaning mechanism is provided with a wiper; the cleaning mechanism can be driven by a driving device to move so that the wiper cleans the blade of the cutter.

依據本發明再一目的之切割設備,使用如所述切刀清潔裝置,包括:一載台,設於一機台台面上,該載台上設有一載板供一待切割元件置放;該切割裝置受一進給裝置作用在Z軸方向上朝該載台靠近使該切刀對該待切割元件進行切割。 According to another object of the present invention, a cutting device using the cutting knife cleaning device includes: a carrier set on a machine table, the carrier is provided with a carrier board for placing a component to be cut; The cutting device is acted by a feeding device to approach the carrier in the Z-axis direction so that the cutting knife cuts the component to be cut.

依據本發明又再一目的之切割設備,使用如所述切刀清潔方法,包括:一載台,設於一機台台面上,該載台上設有一載板供該待切割元件置放;該切割裝置受一進給裝置作用在Z軸方向上朝該載台靠近使該切刀對該待切割元件進行切割。 According to another object of the present invention, a cutting device using the cutting knife cleaning method includes: a carrier set on a machine table, the carrier is provided with a carrier board for placing the component to be cut; The cutting device is acted on by a feeding device to approach the carrier in the Z-axis direction so that the cutter cuts the component to be cut.

本發明實施例之切刀清潔方法、裝置及切割設備,該清潔機構可自動移至該切割裝置之下方,並沿著該切刀之刀刃平移對該切刀進行清潔,不僅可節省人力,同時亦可減少操作人員在清潔切刀時被割傷之工傷事故。 According to the cutting knife cleaning method, device and cutting equipment of the embodiments of the present invention, the cleaning mechanism can automatically move below the cutting device and clean the cutting knife by translation along the blade of the cutting knife, which not only saves manpower, but also It can also reduce work-related accidents caused by operators being cut while cleaning the cutter.

A:機架 A: Rack

A1:支柱 A1: Pillar

A2:橫樑 A2: beam

A21:滑軌 A21: Slide rail

A22:滑塊 A22: Slider

A3:作業空間 A3: Work space

B:載台 B: Stage

B1:載板 B1: Carrier board

B2:旋轉機構 B2: Rotating mechanism

B3:移動座 B3: mobile seat

C:進給裝置 C: Feeding device

C1:滑座 C1: Slide

C2:驅動器 C2: Drive

C21:驅動桿 C21: Drive rod

D:切割裝置 D: Cutting device

D1:座體 D1: seat body

D11:安裝件 D11: Mounting parts

D12:安裝部 D12: Installation Department

D13:第一壓件 D13: The first pressure piece

D131:樞軸 D131: pivot

D14:彈性件 D14: Elastic part

D15:樞接部 D15: Pivot

D2:定位座 D2: positioning seat

D21:壓觸部 D21: Depression

D22:第二壓件 D22: The second pressure piece

D221:樞軸 D221: pivot

D222:受力部 D222: Forced part

D23:彈性件 D23: Elastic part

D3:切刀 D3: Cutter

D4:間隙 D4: Clearance

E:切刀清潔裝置 E: Cutter cleaning device

E1:提升機構 E1: Lifting mechanism

E11:提升件 E11: Lifting piece

E111:移動部 E111: Mobile Department

E112:連動部 E112: Linkage Department

E113:固定部 E113: Fixed part

E114:提升部 E114: Lifting Department

E12:驅動器 E12: Drive

E121:驅動桿 E121: Drive rod

E2:清潔機構 E2: Cleaning agency

E21:擦拭件 E21: Wipes

E22:吹氣管 E22: Blow pipe

E23:平台 E23: Platform

E24:連結件 E24: Connector

F:驅動裝置 F: Drive

F1:第一驅動機構 F1: The first drive mechanism

F11:驅動器 F11: Drive

F111:驅動桿 F111: Drive rod

F12:固定件 F12: fixed parts

F2:第二驅動機構 F2: second drive mechanism

F21:驅動器 F21: Drive

F211:驅動桿 F211: Drive rod

F3:第三驅動機構 F3: Third drive mechanism

F31:固定座 F31: fixed seat

F311:滑軌 F311: Slide rail

F312:滑軌 F312: Slide rail

F313:滑塊 F313: Slider

F314:滑塊 F314: Slider

F32:移動座 F32: mobile seat

F33:驅動器 F33: Drive

F331:驅動桿 F331: Drive rod

G:檢查機構 G: Inspection agency

G1:取像器 G1: Viewer

T:機台台面 T: machine table

W:待切割元件 W: component to be cut

圖1係本發明實施例中切割設備之示意圖。 Figure 1 is a schematic diagram of a cutting device in an embodiment of the present invention.

圖2係本發明實施例中切割裝置之示意圖。 Figure 2 is a schematic diagram of a cutting device in an embodiment of the present invention.

圖3係本發明實施例中切割裝置之切刀夾持於本體與定位座之間的示意圖。 Fig. 3 is a schematic diagram of the cutting knife of the cutting device clamped between the main body and the positioning seat in the embodiment of the present invention.

圖4係本發明實施例中切割裝置與提升機構配置關係之示意圖。 Fig. 4 is a schematic diagram of the configuration relationship between the cutting device and the lifting mechanism in the embodiment of the present invention.

圖5係本發明實施例中清潔機構與機架配置關係之示意圖。 Fig. 5 is a schematic diagram of the configuration relationship between the cleaning mechanism and the frame in the embodiment of the present invention.

圖6係本發明實施例中清潔機構移動至切割裝置下方之示意圖。 Figure 6 is a schematic diagram of the cleaning mechanism moving below the cutting device in the embodiment of the present invention.

請參閱圖1、2,本發明實施例之切刀清潔方法及裝置可使用如圖所示用於切割積層陶瓷電容(MLCC)之切割設備作說明,該切割設備設有:一機架A,以兩支柱A1與一橫樑A2所構成之龍門型式架設於一機台台面T上,該機架A設有由該兩支柱A1與該橫樑A2所圍設出之一作業空間A3;該橫樑A2之一側設有兩個Z軸方向之滑軌A21,並有兩滑塊A22分設於該兩滑軌A21上;一載台B,設於該機台台面T上,該載台B上設有一載板B1供一例如積層陶瓷電容(MLCC)之待切割元件W置放;該載板B1下方設有一旋轉機構B2,可於X、Y平面旋轉調整該載板B1之方向;該旋轉機構B2下方設有一移動座B3,該載台B可藉由該移動座B3進行Y軸方向之移入或移出該作業空間A3;一進給裝置C,設於該機架A之該橫樑A2前側,該進給裝置C設有一滑座C1與一例如馬達之Z軸方向之驅動器C2,該滑座C1設於該橫樑A2之兩滑塊A22上並受該驅動器C2之一例如螺桿之驅動桿C21作用,使該滑座C1可於Z軸方向上移動;一切割裝置D,設於該機架A之該橫樑A2前側並固設於該滑座C1上,可受該滑座C1之連動在Z軸方向上朝該載台B靠近或遠離;一切刀清潔裝置E,設有一提升機構E1與一清潔機構E2。 Please refer to Figures 1 and 2. The cutting knife cleaning method and device of the embodiment of the present invention can be illustrated using a cutting device for cutting multilayer ceramic capacitors (MLCC) as shown in the figure. The cutting device is provided with: a frame A, A gantry type composed of two pillars A1 and a beam A2 is erected on a machine platform T. The frame A is provided with a working space A3 surrounded by the two pillars A1 and the beam A2; the beam A2 One side is provided with two sliding rails A21 in the Z-axis direction, and two sliding blocks A22 are separately installed on the two sliding rails A21; a carrier B is installed on the table surface T of the machine, and the carrier B is A carrier board B1 is provided for placing a component W such as a multilayer ceramic capacitor (MLCC) to be cut; a rotating mechanism B2 is provided under the carrier board B1, which can rotate and adjust the direction of the carrier board B1 in the X and Y planes; the rotation A moving base B3 is provided under the mechanism B2, and the carrier B can be moved into or out of the working space A3 by the moving base B3 in the Y-axis direction; a feeding device C is arranged on the front side of the beam A2 of the frame A The feeding device C is provided with a sliding seat C1 and a Z-axis driver C2 such as a motor. The sliding seat C1 is arranged on the two sliding blocks A22 of the beam A2 and is driven by one of the drivers C2, such as a screw rod. The function of C21 makes the sliding seat C1 movable in the Z-axis direction; a cutting device D is arranged on the front side of the beam A2 of the frame A and fixed on the sliding seat C1, which can be linked by the sliding seat C1 Approaching or away from the carrier B in the direction of the Z axis; the knife cleaning device E is provided with a lifting mechanism E1 and a cleaning mechanism E2.

請參閱圖2、3,該切割裝置D設有:一座體D1,其一側設有一長條狀之安裝件D11,該安裝件D11之下方設有一安裝部D12;該座體D1之下方設有一第一壓件D13,並有兩個彈性件D14(圖2中僅示出一個)設於該座體D1與該第一壓件D13之間;該兩個彈性件D14分別套設於該第一壓件D13兩端側之兩個樞軸D131(圖2中僅示出一個)上,該兩個樞軸D131之上端各穿設於該座體D1內部之兩個樞孔(圖未示)中; 一定位座D2,設有一壓觸部D21對應該座體D1之安裝部D12;該定位座D2之一端與該座體D1之一樞接部D15樞接,使該定位座D2可相對於該座體D1樞轉;該定位座D2之下方設有一第二壓件D22,並有兩個彈性件D23設於該定位座D2與該第二壓件D22之間;該兩個彈性件D23分別套設於該第二壓件D22兩端側之兩個樞軸D221上,該兩個樞軸D221之上端各穿設於該定位座D2內部之兩個樞孔(圖未示)中;該第二壓件D22之兩端分別凸設有一受力部D222;一切刀D3,設於該座體D1與該定位座D2之間並靠抵在該安裝件D14下方使該切刀D3之上側受該安裝部D12與該壓觸部D21夾持;該切刀D3在尚未進行切割時,該切刀D3之底部用於切割之刀刃位於該第一壓件D13與該第二壓件D22之間的一間隙D4內,受該第一壓件D13與該第二壓件D22之保護。 Please refer to Figures 2 and 3, the cutting device D is provided with: a base body D1, one side of which is provided with a long strip-shaped mounting part D11, the mounting part D11 is provided with a mounting portion D12; the base body D1 is provided below There is a first pressing piece D13, and two elastic pieces D14 (only one is shown in FIG. 2) are arranged between the seat body D1 and the first pressing piece D13; the two elastic pieces D14 are respectively sleeved on the On the two pivots D131 (only one shown in Figure 2) on both ends of the first pressing member D13, the upper ends of the two pivots D131 respectively penetrate through two pivot holes (not shown in the figure) inside the seat D1 Show) in; A positioning seat D2 is provided with a pressing contact portion D21 corresponding to the mounting portion D12 of the seat body D1; one end of the positioning seat D2 is pivotally connected to a pivot portion D15 of the seat body D1, so that the positioning seat D2 can be relative to the The seat body D1 pivots; a second pressing member D22 is provided under the positioning seat D2, and two elastic members D23 are provided between the positioning seat D2 and the second pressing member D22; the two elastic members D23 are respectively The two pivots D221 sleeved on the two ends of the second pressing member D22, the upper ends of the two pivots D221 respectively pass through two pivot holes (not shown) inside the positioning seat D2; Both ends of the second pressing member D22 are respectively provided with a force receiving portion D222; the cutting knife D3 is arranged between the seat body D1 and the positioning seat D2 and abuts against the mounting member D14 to make the cutting knife D3 upper side It is clamped by the mounting portion D12 and the pressure contact portion D21; when the cutter D3 is not yet cutting, the cutting blade at the bottom of the cutter D3 is located between the first pressure piece D13 and the second pressure piece D22 A gap D4 between the two is protected by the first pressing member D13 and the second pressing member D22.

請參閱圖4,該提升機構E1設有一略呈ㄇ字型之提升件E11與一例如氣壓缸之Z軸方向之驅動器E12,該驅動器E12固設於該滑座C1上,該提升件E11受該驅動器E12之一驅動桿E121作用,使該提升件E11可於Z軸方向上移動,其中,該驅動器E1與其驅動桿E121因需避免與該驅動桿C21(圖1)干涉,故該驅動器E1與其驅動桿E121偏置於該滑座C1之一側且非對該提升件E11中間施力;該切割裝置D之上方設於該ㄇ字型之提升件E11所圍設的區間內,該提升件E11分為一位於上側之移動部E111與兩位於下側之連動部E112,該移動部E111與該驅動桿E121相連,該兩連動部E112略呈L字型且位於該提升件E11之兩旁側底部;該連動部E112設有一垂直設置之固定部E113與一水平設置之提升部E114;該固定部E113與該第一壓件D13相連固定,該提升部E114由該固定部E113朝該第二壓件D22方向延伸至該第二壓件D22之受力部D222的下方。 Please refer to FIG. 4, the lifting mechanism E1 is provided with a slightly ㄇ-shaped lifting member E11 and a Z-axis driver E12 such as a pneumatic cylinder. The driver E12 is fixed on the sliding seat C1, and the lifting member E11 is A driving rod E121 of the driver E12 acts to make the lifting member E11 movable in the Z-axis direction. The driver E1 and its driving rod E121 need to avoid interference with the driving rod C21 (FIG. 1), so the driver E1 Its driving rod E121 is offset on one side of the sliding seat C1 and does not apply force to the lifting element E11; the upper part of the cutting device D is arranged in the area enclosed by the U-shaped lifting element E11, the lifting The piece E11 is divided into a moving part E111 on the upper side and two linking parts E112 on the lower side. The moving part E111 is connected to the driving rod E121. The two linking parts E112 are slightly L-shaped and located on both sides of the lifting piece E11. Side bottom; the linkage portion E112 is provided with a vertically arranged fixing portion E113 and a horizontally arranged lifting portion E114; the fixing portion E113 is connected and fixed with the first pressing member D13, and the lifting portion E114 is turned from the fixing portion E113 to the first The direction of the second pressing member D22 extends below the force receiving portion D222 of the second pressing member D22.

請參閱圖5、6,該切刀清潔裝置E之清潔機構E2,其設有一擦拭件E21與一可撓性之吹氣管E22;該擦拭件E21設於一平台E23上,該擦拭 件E21可例如纖維材質之條狀物,其軸向與該切刀D3垂直;該吹氣管E22設於一連結件E24上,該吹氣管E22連通一氣閥(圖未示)並可彎折該吹氣管E22使其朝該切刀D3方向吹送氣體;該平台E23與該連結件E24相連;該清潔機構E2受一驅動裝置F所驅動進行X、Y、Z軸方向之移動,該驅動裝置F設於該機架A之該橫樑A2後側並設有一Y軸方向之第一驅動機構F1、一Z軸方向之第二驅動機構F2與一X軸方向之第三驅動機構F3;該第一驅動機構F1設有一例如氣壓缸之Y軸方向之驅動器F11於一固定件F12上,該驅動器F11之一驅動桿F111與該清潔機構E2相連固定,可對該清潔機構E2之連結件E24作用,使該清潔機構E2於Y軸方向上在該機架A之橫樑A2或該切割裝置D之下方間移動;該第一驅動機構F1設於一Z軸方向之第二驅動機構F2上,該第二驅動機構F2設有一例如氣壓缸之Z軸方向之驅動器F21,該第一驅動機構F1之固定件F12可受該驅動器F21之一驅動桿F211作用,使該第一驅動機構F1可連動該清潔機構E2一同於Z軸方向上移動;該第二驅動機構F2設於一X軸方向之第三驅動機構F3上,該第三驅動機構F3設有一固定座F31固設於該機架A之橫樑A2上,該固定座F31上設有兩個X軸方向之滑軌F311、F312於該固定座F31之一側與底部,並有兩滑塊F313、F314分設於該兩滑軌F311、F312上;該第三驅動機構F3設有一移動座F32與一例如馬達之X軸方向之驅動器F33,該移動座F32與該兩滑塊F313、F314相連並受該驅動器F33之一例如螺桿之驅動桿F331作用,使該第三驅動機構F3之移動座F32可連動該清潔機構E2與該第二驅動機構F2一同於X軸方向上移動;該移動座F32下方另設有一檢查機構G,其可受該移動座F32之連動於於X軸方向上移動,該檢查機構G設有一取像器G1。 Please refer to Figures 5 and 6, the cleaning mechanism E2 of the cutter cleaning device E is provided with a wiper E21 and a flexible blowing tube E22; the wiper E21 is set on a platform E23, and the wiper The piece E21 can be, for example, a strip of fiber material, the axial direction of which is perpendicular to the cutter D3; the blowing tube E22 is arranged on a connecting piece E24, and the blowing tube E22 is connected to an air valve (not shown) and can bend the The air blowing pipe E22 blows air toward the cutter D3; the platform E23 is connected to the connecting piece E24; the cleaning mechanism E2 is driven by a driving device F to move in the X, Y, and Z axis directions, and the driving device F It is arranged on the rear side of the beam A2 of the frame A and is provided with a first driving mechanism F1 in the Y-axis direction, a second driving mechanism F2 in the Z-axis direction, and a third driving mechanism F3 in the X-axis direction; the first The driving mechanism F1 is provided with a driver F11 in the Y-axis direction of a pneumatic cylinder on a fixing member F12. A driving rod F111 of the driver F11 is connected and fixed to the cleaning mechanism E2, which can act on the connecting member E24 of the cleaning mechanism E2. The cleaning mechanism E2 is moved in the Y-axis direction between the beam A2 of the frame A or below the cutting device D; the first driving mechanism F1 is arranged on a second driving mechanism F2 in the Z-axis direction, and the The second driving mechanism F2 is provided with a driver F21 in the Z-axis direction of, for example, a pneumatic cylinder. The fixing member F12 of the first driving mechanism F1 can be acted on by a driving rod F211 of the driver F21, so that the first driving mechanism F1 can link the cleaning The mechanism E2 moves together in the Z-axis direction; the second drive mechanism F2 is arranged on a third drive mechanism F3 in the X-axis direction, and the third drive mechanism F3 is provided with a fixing seat F31 fixed to the beam of the frame A On A2, the fixing seat F31 is provided with two X-axis sliding rails F311 and F312 on one side and bottom of the fixing seat F31, and two sliding blocks F313 and F314 are respectively arranged on the two sliding rails F311, F312 On; the third drive mechanism F3 is provided with a moving seat F32 and a driver F33 in the X-axis direction, such as a motor. The moving seat F32 is connected to the two sliders F313 and F314 and is driven by one of the drivers F33, such as a screw drive rod The function of F331 enables the moving seat F32 of the third drive mechanism F3 to link the cleaning mechanism E2 and the second drive mechanism F2 to move in the X-axis direction; there is another inspection mechanism G under the moving seat F32, which can be The moving seat F32 is linked to move in the X-axis direction, and the inspection mechanism G is provided with an image taker G1.

本發明實施例之切割設備在實施該待切割元件W切割時,包括以下步驟:一元件移送步驟:使該載台B搭載該待切割元件W,移入至該機架A之作業空間A3內之預設位置等待切割;一元件切割步驟:使該進給裝置C之滑座C1受該驅動器C2之驅動,帶動該切割裝置D下降至該切割裝置D之該第一壓件D13與該第二壓件D22先壓制該待切割元件W;使該切割裝置D繼續下降分別壓縮該第一壓件D13與該座體D1間之彈性件D14、該第二壓件D22與該定位座D2間之彈性件D23,使該第一壓件D13之樞軸D131與該第二壓件D22之樞軸D221分別穿入該座體D1與該定位座D2內;此時,該切刀D3繼續向下移動使其刀刃穿出該第一壓件D13與該第二壓件D22間之間隙D4對該待切割元件W進行直線切割;其中,該切刀D3在切割該待切割元件W時,可受一加熱器(圖未示)加熱使該待切割元件W軟化以利切割:每一次切割後該切割裝置D需上升,並再以該載台B移動或旋轉該待切割元件W至下一預設位置,如此往復進行該元件移送步驟與該元件切割步驟使該待切割元件W切割分成複數個成品;本發明實施例之切割設備在使用一段時間後需實施該切刀D3之清潔,包括以下步驟:一切刀顯露步驟:使該提升機構E1之驅動器E12驅動該提升件E11上升,使該提升件E11之連動部E112以其固定部E113連動該第一壓件D13向上拉提位移,同時以其提升部E114向上碰觸該第二壓件D22之受力部D222,使該第二壓件D22亦受力被向上拉提位移;使該切刀D3之刀刃由同時被拉提位移之該第一壓件D13與該第二壓件D22間之間隙D4顯露穿出; 一切刀清潔步驟:使該清潔機構E2受該第一驅動機構F1之作用在Y軸方向移動至該切割裝置D之下方後;以該第二驅動機構F2帶動該清潔機構E2在Z軸方向向上移動使該擦拭件E21可碰觸該切刀D3之刀刃且該吹氣管E22靠近該切刀D3之刀刃;再以該第三驅動機構F3帶動該清潔機構E2在X軸方向移動沿著該切刀D3之刀刃平移,以該擦拭件E21擦拭該切刀D3之刀刃並同時使該切刀D3受該吹氣管E22所吹出之氣體吹送,以藉由該吹氣管E22吹出之氣體冷卻該切刀D3,使沾附於該切刀D3上之黏膠硬化以利擦拭。 When cutting the component W to be cut, the cutting equipment of the embodiment of the present invention includes the following steps: a component transfer step: the carrier B carries the component W to be cut, and moves it into the working space A3 of the frame A The preset position is waiting for cutting; a component cutting step: the sliding seat C1 of the feeding device C is driven by the driver C2 to drive the cutting device D down to the first pressing member D13 and the second pressing member D13 of the cutting device D The pressing member D22 first presses the element W to be cut; the cutting device D continues to descend to compress the elastic member D14 between the first pressing member D13 and the seat D1, and the second pressing member D22 and the positioning seat D2. The elastic member D23 allows the pivot D131 of the first pressing member D13 and the pivot D221 of the second pressing member D22 to penetrate into the seat D1 and the positioning seat D2, respectively; at this time, the cutter D3 continues downward Move its blade to penetrate the gap D4 between the first pressing piece D13 and the second pressing piece D22 to cut the element W to be cut in a straight line; wherein, the cutter D3 can be subjected to cutting the element W to be cut. A heater (not shown in the figure) heats the component W to be cut to soften to facilitate cutting: the cutting device D needs to rise after each cut, and then move or rotate the component W to be cut by the stage B to the next preset Set the position, so that the component transfer step and the component cutting step are performed reciprocatingly so that the component to be cut W is cut into a plurality of finished products; the cutting device of the embodiment of the present invention needs to clean the cutter D3 after a period of use, including the following Step: All knife revealing step: Make the driver E12 of the lifting mechanism E1 drive the lifting piece E11 up, so that the linkage portion E112 of the lifting piece E11 links the first pressing piece D13 with its fixing portion E113 to pull up and move upward, and at the same time The lifting portion E114 upwardly touches the force receiving portion D222 of the second pressing member D22, so that the second pressing member D22 is also pulled up and displaced by force; the blade of the cutter D3 is pulled up and displaced by the same The gap D4 between the first pressing piece D13 and the second pressing piece D22 is exposed; Cutting knife cleaning step: make the cleaning mechanism E2 move under the cutting device D in the Y-axis direction by the action of the first drive mechanism F1; drive the cleaning mechanism E2 upward in the Z-axis direction by the second drive mechanism F2 Move so that the wiper E21 can touch the blade of the cutter D3 and the blowing tube E22 is close to the blade of the cutter D3; then the third drive mechanism F3 drives the cleaning mechanism E2 to move along the X-axis direction The blade of the knife D3 is translated, and the blade of the cutter D3 is wiped with the wiper E21 and the cutter D3 is blown by the gas blown by the blowing pipe E22, so as to cool the cutter by the gas blown by the blowing pipe E22 D3, harden the glue sticking to the cutter D3 to facilitate wiping.

本發明實施例之切割設備另可進行該切刀D3之檢查,包括以下步驟:一切刀檢查步驟:使該檢查裝置G受該第三驅動機構F3在X軸方向帶動,以該取像器G1順著該切刀D3之刀刃平移拍攝,以檢查該切刀D3有無崩裂之情形。 The cutting device of the embodiment of the present invention can also perform the inspection of the cutter D3, including the following steps: a cutting knife inspection step: the inspection device G is driven by the third drive mechanism F3 in the X-axis direction, and the imager G1 Move and shoot along the blade of the cutter D3 to check whether the cutter D3 is cracked.

本發明實施例之切刀清潔方法、裝置及切割設備,該清潔機構E2可自動移至該切割裝置D之下方,並沿著該切刀D3之刀刃平移對該切刀D3進行清潔,不僅可節省人力,同時亦可減少操作人員在清潔切刀時被割傷之工傷事故。 In the cutting knife cleaning method, device and cutting equipment of the embodiments of the present invention, the cleaning mechanism E2 can automatically move below the cutting device D, and move along the cutting edge of the cutting knife D3 to clean the cutting knife D3. It saves manpower and can also reduce work-related accidents caused by operators being cut while cleaning the cutter.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the foregoing are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent.

A:機架 A: Rack

A1:支柱 A1: Pillar

A2:橫樑 A2: beam

A21:滑軌 A21: Slide rail

A22:滑塊 A22: Slider

A3:作業空間 A3: Work space

B:載台 B: Stage

B1:載板 B1: Carrier board

B2:旋轉機構 B2: Rotating mechanism

B3:移動座 B3: mobile seat

C:進給裝置 C: Feeding device

C1:滑座 C1: Slide

C2:驅動器 C2: Drive

C21:驅動桿 C21: Drive rod

D:切割裝置 D: Cutting device

E:切刀清潔裝置 E: Cutter cleaning device

E1:提升機構 E1: Lifting mechanism

E2:清潔機構 E2: Cleaning agency

T:機台台面 T: machine table

W:待切割元件 W: component to be cut

Claims (16)

一種切刀清潔方法,包括:提供一機架,以兩支柱與一橫樑構成龍門型式;提供一切割裝置,設於該橫樑之前側,該切割裝置可下降以一切刀切割一待切割元件;提供一切刀清潔裝置,設有一清潔機構;提供一驅動裝置,設於該橫樑之後側;使該清潔機構受該驅動裝置驅動,伸經該橫樑下方對該切刀進行清潔。 A cutting knife cleaning method includes: providing a frame with two pillars and a beam forming a gantry type; providing a cutting device arranged on the front side of the beam, the cutting device can be lowered to cut an element to be cut with a cutter; The knife cleaning device is provided with a cleaning mechanism; a driving device is provided on the rear side of the beam; the cleaning mechanism is driven by the driving device and extends under the beam to clean the cutting knife. 如申請專利範圍第1項所述切刀清潔方法,其中,該清潔機構受該驅動裝置之一第一驅動機構之作用移動至該切割裝置之下方。 As described in the first item of the scope of patent application, the cutting knife cleaning method, wherein the cleaning mechanism is moved below the cutting device by a first driving mechanism of the driving device. 如申請專利範圍第1項所述切刀清潔方法,其中,該清潔機構受該驅動裝置之一第二驅動機構之作用向上移動,使該清潔機構之一擦拭件可碰觸該切刀之刀刃。 For example, the cutting knife cleaning method described in item 1 of the scope of patent application, wherein the cleaning mechanism is moved upward by a second driving mechanism of the driving device, so that a wiper of the cleaning mechanism can touch the blade of the cutting knife . 如申請專利範圍第1項所述切刀清潔方法,其中,該清潔機構受該驅動裝置之一第三驅動機構之作用,沿著該切刀之刀刃平移,以該清潔機構之一擦拭件擦拭該切刀之刀刃。 For example, the cutting knife cleaning method described in item 1 of the scope of patent application, wherein the cleaning mechanism is operated by a third driving mechanism of the driving device to translate along the blade of the cutting knife and wipe with a wiper of the cleaning mechanism The blade of the cutter. 如申請專利範圍第4項所述切刀清潔方法,其中,該擦拭件擦拭該切刀之刀刃時,該切刀受該清潔機構之一吹氣管所吹出之氣體吹送。 As described in item 4 of the scope of patent application, when the wiper wipes the blade of the cutter, the cutter is blown by the air blown by a blowing tube of the cleaning mechanism. 如申請專利範圍第1項所述切刀清潔方法,其中,該驅動裝置以一第一驅動機構、一第二驅動機構與一第三驅動機構使該清潔機構可進行X、Y、Z軸方向之位移。 For example, the knife cleaning method described in item 1 of the scope of patent application, wherein the driving device uses a first driving mechanism, a second driving mechanism, and a third driving mechanism to enable the cleaning mechanism to perform X, Y, and Z axis directions. The displacement. 如申請專利範圍第1項所述切刀清潔方法,其中,該清潔機構對該切割裝置之切刀進行清潔時,執行一切刀顯露步驟:使該切割裝置之一第 一壓件與一第二壓件受一提升機構之作用向上拉提,使該切刀之刀刃由該第一壓件與該第二壓件間的間隙顯露穿出。 For example, the cutting knife cleaning method described in item 1 of the scope of patent application, wherein, when the cleaning mechanism cleans the cutting knife of the cutting device, it performs the step of revealing all the knifes: making the cutting device one of the first A pressing piece and a second pressing piece are pulled upward by a lifting mechanism, so that the blade of the cutter is exposed through the gap between the first pressing piece and the second pressing piece. 一種切刀清潔裝置,包括:用以執行如申請專利範圍第1至7項任一項所述切刀清潔方法之裝置,該裝置設有該清潔機構。 A cutting knife cleaning device includes: a device for executing the cutting knife cleaning method as described in any one of items 1 to 7 of the scope of patent application, and the device is provided with the cleaning mechanism. 一種切刀清潔裝置,用以清潔位於一切割裝置中一第一壓件與一第二壓件間的切刀,包括:一提升機構,設有一提升件與一驅動器,該提升件受該驅動器之作用可連動該第一壓件及該第二壓件位移,使該切刀之刀刃顯露;一清潔機構,設有一擦拭件;該清潔機構可受一驅動裝置驅動而位移使該擦拭件對該切刀之刀刃進行清潔。 A cutter cleaning device for cleaning a cutter located between a first pressing part and a second pressing part in a cutting device, comprising: a lifting mechanism provided with a lifting part and a driver, and the lifting part is controlled by the driver The function can link the displacement of the first pressing member and the second pressing member to expose the blade of the cutter; a cleaning mechanism is provided with a wiper; the cleaning mechanism can be driven by a driving device to move to make the wiper to The blade of the cutter is cleaned. 如申請專利範圍第9項所述切刀清潔裝置,其中,該清潔機構設有一吹氣管可對該切刀吹送氣體。 For example, the cutting knife cleaning device described in item 9 of the scope of patent application, wherein the cleaning mechanism is provided with a blowing pipe which can blow air to the cutting knife. 一種切割設備,使用如申請專利範圍第9至10項任一項所述切刀清潔裝置,包括:一載台,設於一機台台面上,該載台上設有一載板供一待切割元件置放;該切割裝置受一進給裝置作用在Z軸方向上朝該載台靠近使該切刀對該待切割元件進行切割。 A cutting device using the cutter cleaning device as described in any one of items 9 to 10 in the scope of the patent application, comprising: a carrier set on a machine table, the carrier is provided with a carrier board for cutting Component placement; the cutting device is acted by a feeding device to approach the carrier in the Z-axis direction so that the cutter cuts the component to be cut. 如申請專利範圍第11項所述切割設備,其中,該切割裝置設有一座體與一定位座,該第一壓件與該第二壓件分別設於該座體與該定位座之下方;該座體與該第一壓件之間設有一彈性件,該定位座與該第二壓件之間設有一彈性件。 For example, the cutting device described in item 11 of the scope of patent application, wherein the cutting device is provided with a base and a positioning base, and the first pressing member and the second pressing member are respectively provided below the base and the positioning base; An elastic piece is arranged between the seat body and the first pressing piece, and an elastic piece is arranged between the positioning seat and the second pressing piece. 如申請專利範圍第11項所述切割設備,其中,該第二壓件之兩端各凸設有一受力部;該提升件受該驅動器之作用,使該提升件可於Z軸方向上移動;該提升件設有一固定部與一提升部,該固定部與該第一壓件相固 定,該提升部由該固定部朝該第二壓件方向延伸至該第二壓件之受力部的下方。 For example, the cutting device described in item 11 of the scope of patent application, wherein each end of the second pressing member is protruded with a force receiving part; the lifting member is acted on by the driver, so that the lifting member can move in the Z-axis direction ; The lifting member is provided with a fixed portion and a lifting portion, the fixed portion and the first pressing member are fixed Fixedly, the lifting portion extends from the fixing portion toward the second pressing member to below the force receiving portion of the second pressing member. 如申請專利範圍第11項所述切割設備,其中,該驅動裝置設有一Y軸方向之第一驅動機構、一Z軸方向之第二驅動機構與一X軸方向之第三驅動機構;該清潔機構設於該第一驅動機構上,使該清潔機構可於Y軸方向上移動;該第一驅動機構設於該第二驅動機構上,使該第一驅動機構可連動該清潔機構於Z軸方向上移動;該第二驅動機構設於該第三驅動機構上,使該第三驅動機構可連動該清潔機構與該第二驅動機構於X軸方向上移動。 For example, the cutting device described in item 11 of the scope of patent application, wherein the driving device is provided with a first driving mechanism in the Y-axis direction, a second driving mechanism in the Z-axis direction and a third driving mechanism in the X-axis direction; the cleaning The mechanism is arranged on the first drive mechanism so that the cleaning mechanism can move in the Y-axis direction; the first drive mechanism is arranged on the second drive mechanism so that the first drive mechanism can link the cleaning mechanism on the Z axis The second driving mechanism is arranged on the third driving mechanism, so that the third driving mechanism can link the cleaning mechanism and the second driving mechanism to move in the X-axis direction. 如申請專利範圍第14項所述切割設備,其中,該第三驅動機構上設有一檢查機構,該檢查機構設有一取像器可檢查該切刀有無崩裂。 For example, the cutting device described in item 14 of the scope of patent application, wherein the third driving mechanism is provided with an inspection mechanism, and the inspection mechanism is provided with an image capturing device to check whether the cutting knife is broken. 一種切割設備,使用如申請專利範圍第1至7項任一項所述切刀清潔方法,包括:一載台,設於一機台台面上,該載台上設有一載板供該待切割元件置放;該切割裝置受一進給裝置作用在Z軸方向上朝該載台靠近使該切刀對該待切割元件進行切割。 A cutting device using the cutting knife cleaning method as described in any one of items 1 to 7 of the scope of the patent application, comprising: a carrier set on a machine table, the carrier is provided with a carrier plate for the cutting Component placement; the cutting device is acted by a feeding device to approach the carrier in the Z-axis direction so that the cutter cuts the component to be cut.
TW107144085A 2018-12-07 2018-12-07 Cutting knife cleaning method, device and cutting equipment TWI700134B (en)

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