ZA894743B - Radiation-curable composition and radiation-sensitive recording material prepared therefrom for use with high-energy radiation - Google Patents

Radiation-curable composition and radiation-sensitive recording material prepared therefrom for use with high-energy radiation

Info

Publication number
ZA894743B
ZA894743B ZA894743A ZA894743A ZA894743B ZA 894743 B ZA894743 B ZA 894743B ZA 894743 A ZA894743 A ZA 894743A ZA 894743 A ZA894743 A ZA 894743A ZA 894743 B ZA894743 B ZA 894743B
Authority
ZA
South Africa
Prior art keywords
radiation
recording material
curable composition
sensitive recording
material prepared
Prior art date
Application number
ZA894743A
Other languages
English (en)
Inventor
Ralph Dammel
Dammel Ralph
Karl-Friedrich Doessel
Doessel Karl-Friedrich
Juergen Lingnau
Lingnau Juergen
Juergen Theis
Theis Juergen
Original Assignee
Hoechst Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst Ag filed Critical Hoechst Ag
Publication of ZA894743B publication Critical patent/ZA894743B/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G03F7/0295—Photolytic halogen compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
ZA894743A 1988-06-25 1989-06-22 Radiation-curable composition and radiation-sensitive recording material prepared therefrom for use with high-energy radiation ZA894743B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3821584A DE3821584A1 (de) 1988-06-25 1988-06-25 Strahlungshaertbares gemisch und daraus hergestelltes strahlungsempfindliches aufzeichungsmaterial fuer hochenergetische strahlung

Publications (1)

Publication Number Publication Date
ZA894743B true ZA894743B (en) 1990-04-25

Family

ID=6357316

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA894743A ZA894743B (en) 1988-06-25 1989-06-22 Radiation-curable composition and radiation-sensitive recording material prepared therefrom for use with high-energy radiation

Country Status (11)

Country Link
US (1) US5234791A (xx)
EP (1) EP0349803B1 (xx)
JP (1) JP2759079B2 (xx)
KR (1) KR0150441B1 (xx)
AU (1) AU627196B2 (xx)
BR (1) BR8903078A (xx)
DE (2) DE3821584A1 (xx)
FI (1) FI893071A (xx)
HK (1) HK123597A (xx)
SG (1) SG43323A1 (xx)
ZA (1) ZA894743B (xx)

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JP3004044B2 (ja) * 1990-10-29 2000-01-31 東洋合成工業株式会社 感光性着色樹脂組成物
US5312715A (en) * 1991-03-04 1994-05-17 Shipley Company Inc. Light-sensitive composition and process
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
JP2661417B2 (ja) * 1991-07-02 1997-10-08 日本ゼオン株式会社 レジスト組成物
JP2722870B2 (ja) * 1991-06-14 1998-03-09 日本ゼオン株式会社 レジスト組成物
GB2259152B (en) * 1991-06-14 1995-01-11 Nippon Zeon Co Resist composition
US5296332A (en) * 1991-11-22 1994-03-22 International Business Machines Corporation Crosslinkable aqueous developable photoresist compositions and method for use thereof
JP3429852B2 (ja) * 1993-06-04 2003-07-28 シップレーカンパニー エル エル シー ネガ型感光性組成物
US5370988A (en) * 1994-02-28 1994-12-06 Minnesota Mining And Manufacturing Company Print stabilizers and antifoggants for photothermography
CA2158915A1 (en) * 1994-09-30 1996-03-31 Dekai Loo Liquid photoimageable resist
JP3929653B2 (ja) 1999-08-11 2007-06-13 富士フイルム株式会社 ネガ型レジスト組成物
US6387596B2 (en) * 1999-08-30 2002-05-14 International Business Machines Corporation Method of forming resist images by periodic pattern removal
JP3989149B2 (ja) 1999-12-16 2007-10-10 富士フイルム株式会社 電子線またはｘ線用化学増幅系ネガ型レジスト組成物
US7521168B2 (en) 2002-02-13 2009-04-21 Fujifilm Corporation Resist composition for electron beam, EUV or X-ray
JP4303560B2 (ja) * 2003-10-31 2009-07-29 富士フイルム株式会社 染料含有硬化性組成物、並びに、カラーフィルターおよびその製造方法
KR101259491B1 (ko) * 2005-04-28 2013-05-06 후지필름 가부시키가이샤 착색제함유 경화성 조성물, 컬러필터 및 그 제조방법
JP4926552B2 (ja) * 2006-02-16 2012-05-09 富士フイルム株式会社 染料含有感光性組成物並びにそれを用いたカラーフィルター及びその製造方法
JP4624943B2 (ja) * 2006-03-07 2011-02-02 富士フイルム株式会社 染料含有ネガ型感光性組成物、カラーフィルタおよびその製造方法
CN115976811A (zh) 2018-06-01 2023-04-18 Lg电子株式会社 衣物处理装置
KR20200057545A (ko) 2018-11-16 2020-05-26 엘지전자 주식회사 의류처리장치

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Publication number Priority date Publication date Assignee Title
US3692560A (en) * 1969-09-18 1972-09-19 Bayer Ag Acid hardening resins which can be activated by ultraviolet light
JPS5423574B2 (xx) * 1972-09-13 1979-08-15
US4193799A (en) * 1976-07-09 1980-03-18 General Electric Company Method of making printing plates and printed circuit
US4189323A (en) * 1977-04-25 1980-02-19 Hoechst Aktiengesellschaft Radiation-sensitive copying composition
DE2718254C3 (de) * 1977-04-25 1980-04-10 Hoechst Ag, 6000 Frankfurt Strahlungsempfindliche Kopiermasse
US4289845A (en) * 1978-05-22 1981-09-15 Bell Telephone Laboratories, Inc. Fabrication based on radiation sensitive resists and related products
JPS561045A (en) * 1979-06-16 1981-01-08 Konishiroku Photo Ind Co Ltd Photosensitive composition
DE2928636A1 (de) * 1979-07-16 1981-02-12 Hoechst Ag Strahlungsempfindliches gemisch und verfahren zur herstellung von reliefbildern
US4398001A (en) * 1982-03-22 1983-08-09 International Business Machines Corporation Terpolymer resist compositions
DE3473359D1 (de) * 1983-06-29 1988-09-15 Fuji Photo Film Co Ltd Photosolubilizable composition
DE3406927A1 (de) * 1984-02-25 1985-08-29 Hoechst Ag, 6230 Frankfurt Strahlungsempfindliches gemisch auf basis von saeurespaltbaren verbindungen
ATE68272T1 (de) * 1984-06-01 1991-10-15 Rohm & Haas Lichtempfindliche beschichtungszusammensetzung, aus diesem hergestellte thermisch stabile beschichtungen und verfahren zur herstellung von thermisch stabilen polymerbildern.
CA1307695C (en) * 1986-01-13 1992-09-22 Wayne Edmund Feely Photosensitive compounds and thermally stable and aqueous developablenegative images
DE3621376A1 (de) * 1986-06-26 1988-01-07 Hoechst Ag Strahlungsempfindliches aufzeichnungsmaterial
FR2602235B1 (fr) * 1986-07-31 1988-10-07 Commissariat Energie Atomique Procede de fabrication de copolymeres greffes au moyen de faisceaux d'ions hautement energetiques et produits obtenus
DE3730787A1 (de) * 1987-09-13 1989-03-23 Hoechst Ag Positiv arbeitendes strahlungsempfindliches gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
DE3821585A1 (de) * 1987-09-13 1989-03-23 Hoechst Ag Positiv arbeitendes strahlungsempfindliches gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial fuer hochenergetische strahlung
EP0307752B1 (en) * 1987-09-16 1995-02-22 Hoechst Aktiengesellschaft Poly(3-mono- and 3,5-disubstituted-4-acetoxystyrenes and 4-hydroxy-styrenes)and their use
JPH01163207A (ja) * 1987-09-16 1989-06-27 Hoechst Ag ３，５−ジ置換−４−アセトキシスチレンの重合、加水分解および使用法
US4845011A (en) * 1987-10-23 1989-07-04 Hoechst Celanese Corporation Visible light photoinitiation compositions
GB8802314D0 (en) * 1988-02-03 1988-03-02 Vickers Plc Improvements in/relating to radiation-sensitive compounds
JPH0215270A (ja) * 1988-07-04 1990-01-18 Tosoh Corp フォトレジスト組成物

Also Published As

Publication number Publication date
EP0349803A3 (de) 1991-07-31
KR0150441B1 (ko) 1998-10-01
DE3821584A1 (de) 1989-12-28
KR910001446A (ko) 1991-01-30
BR8903078A (pt) 1990-02-06
FI893071A0 (fi) 1989-06-22
AU627196B2 (en) 1992-08-20
EP0349803A2 (de) 1990-01-10
AU3678189A (en) 1990-01-04
SG43323A1 (en) 1997-10-17
US5234791A (en) 1993-08-10
EP0349803B1 (de) 1997-03-05
JPH0252348A (ja) 1990-02-21
JP2759079B2 (ja) 1998-05-28
DE58909782D1 (de) 1997-04-10
FI893071A (fi) 1989-12-26
HK123597A (en) 1997-09-12

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