YU44502A - Postupak za izradu jednog izvora isparavanja - Google Patents
Postupak za izradu jednog izvora isparavanjaInfo
- Publication number
- YU44502A YU44502A YU44502A YUP44502A YU44502A YU 44502 A YU44502 A YU 44502A YU 44502 A YU44502 A YU 44502A YU P44502 A YUP44502 A YU P44502A YU 44502 A YU44502 A YU 44502A
- Authority
- YU
- Yugoslavia
- Prior art keywords
- evaporation source
- pulverulent
- manufacturing
- back plate
- target
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3491—Manufacturing of targets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
Pronalazak se odnosi na postupak za izradu jednog izvora isparavanja za fizičko razdvajanje pare. Izvor isparavanja se sastoji od jednog bloka koji pored jedne ili više drugih komponenata ima jednu aluminijumsku komponentu i jednu zadnju ploču, povezanu sa blokom, od materijala bolje toplotne provodijivosti od bloka. Prema pronalasku se zadnja ploča od praškastog polaznog materijala zajedno sa komponentama bloka u jedna preko druge naslaganim frakcijama praška presuje i potom obradjuje.[The invention relates to a method for producing an evaporation source for physical vapour deposition. The evaporation source consists of the actual sputter target, which comprises an aluminium component and one or more additional components and of a back plate of a material with greater thermal conductivity than the target. According to the invention, the back plate is compressed from pulverulent starting material, together with the pulverulent components of the sputter targets in superposed pulverulent layers and is subsequently formed.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0085100U AT4240U1 (de) | 2000-11-20 | 2000-11-20 | Verfahren zur herstellung einer verdampfungsquelle |
Publications (2)
Publication Number | Publication Date |
---|---|
YU44502A true YU44502A (sh) | 2005-03-15 |
RS49852B RS49852B (sr) | 2008-08-07 |
Family
ID=3501235
Country Status (21)
Country | Link |
---|---|
US (1) | US6908588B2 (sh) |
EP (1) | EP1335995B1 (sh) |
JP (1) | JP4226900B2 (sh) |
KR (1) | KR100775140B1 (sh) |
CN (1) | CN1268780C (sh) |
AT (2) | AT4240U1 (sh) |
AU (1) | AU775031B2 (sh) |
BG (1) | BG64450B1 (sh) |
CA (1) | CA2375783C (sh) |
CZ (1) | CZ298911B6 (sh) |
DE (1) | DE50103914D1 (sh) |
DK (1) | DK1335995T3 (sh) |
ES (1) | ES2227293T3 (sh) |
HR (1) | HRP20020100B1 (sh) |
HU (1) | HU225577B1 (sh) |
MX (1) | MXPA02001478A (sh) |
MY (1) | MY128636A (sh) |
PL (1) | PL199272B1 (sh) |
RS (1) | RS49852B (sh) |
SI (1) | SI1335995T1 (sh) |
WO (1) | WO2002040735A1 (sh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100441733C (zh) * | 2004-03-30 | 2008-12-10 | 株式会社延原表 | 蒸镀工序用喷嘴蒸发源 |
EP1831423A2 (en) * | 2004-11-18 | 2007-09-12 | Honeywell International, Inc. | Methods of forming three-dimensional pvd targets |
DE102004060423B4 (de) * | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Rohrtarget und dessen Verwendung |
DE102006003279B4 (de) * | 2006-01-23 | 2010-03-25 | W.C. Heraeus Gmbh | Sputtertarget mit hochschmelzender Phase |
US20070251819A1 (en) * | 2006-05-01 | 2007-11-01 | Kardokus Janine K | Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets |
US8778987B2 (en) * | 2007-03-13 | 2014-07-15 | Symrise Ag | Use of 4-hydroxychalcone derivatives for masking an unpleasant taste |
US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
US20100140084A1 (en) * | 2008-12-09 | 2010-06-10 | Chi-Fung Lo | Method for production of aluminum containing targets |
AT12021U1 (de) * | 2010-04-14 | 2011-09-15 | Plansee Se | Beschichtungsquelle und verfahren zu deren herstellung |
KR101988391B1 (ko) | 2011-06-27 | 2019-06-12 | 솔레라스 리미티드 | 스퍼터링 타겟 |
US9992917B2 (en) | 2014-03-10 | 2018-06-05 | Vulcan GMS | 3-D printing method for producing tungsten-based shielding parts |
KR102111833B1 (ko) | 2014-06-27 | 2020-05-18 | 플란제 콤포지트 마테리얼스 게엠베하 | 스퍼터링 타겟 |
AT14497U1 (de) * | 2015-01-26 | 2015-12-15 | Plansee Composite Mat Gmbh | Beschichtungsquelle |
JP6728839B2 (ja) * | 2016-03-24 | 2020-07-22 | 大同特殊鋼株式会社 | プレス成形品の製造方法およびスパッタリングターゲット材 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126451A (en) * | 1977-03-30 | 1978-11-21 | Airco, Inc. | Manufacture of plates by powder-metallurgy |
JPS60194070A (ja) | 1984-03-16 | 1985-10-02 | Tokuyama Soda Co Ltd | スパツタリングタ−ゲツト |
AT388752B (de) * | 1986-04-30 | 1989-08-25 | Plansee Metallwerk | Verfahren zur herstellung eines targets fuer die kathodenzerstaeubung |
JPS63169307A (ja) * | 1987-01-06 | 1988-07-13 | Tokyo Tungsten Co Ltd | W又はW合金/Mo又はMo合金張り合わせ材料の製造方法 |
JPH0196068A (ja) * | 1987-10-07 | 1989-04-14 | Nippon Chemicon Corp | 窒化アルミニウム焼結体の製造方法 |
JPH0741304B2 (ja) * | 1990-03-13 | 1995-05-10 | 株式会社神戸製鋼所 | 高A1含有Ti合金の熱間押出方法 |
US5342571A (en) * | 1992-02-19 | 1994-08-30 | Tosoh Smd, Inc. | Method for producing sputtering target for deposition of titanium, aluminum and nitrogen coatings, sputtering target made thereby, and method of sputtering with said targets |
JPH06128738A (ja) * | 1992-10-20 | 1994-05-10 | Mitsubishi Kasei Corp | スパッタリングターゲットの製造方法 |
US5397050A (en) * | 1993-10-27 | 1995-03-14 | Tosoh Smd, Inc. | Method of bonding tungsten titanium sputter targets to titanium plates and target assemblies produced thereby |
US5656216A (en) * | 1994-08-25 | 1997-08-12 | Sony Corporation | Method for making metal oxide sputtering targets (barrier powder envelope) |
US6073830A (en) * | 1995-04-21 | 2000-06-13 | Praxair S.T. Technology, Inc. | Sputter target/backing plate assembly and method of making same |
US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
US5863398A (en) * | 1996-10-11 | 1999-01-26 | Johnson Matthey Electonics, Inc. | Hot pressed and sintered sputtering target assemblies and method for making same |
FR2756572B1 (fr) | 1996-12-04 | 1999-01-08 | Pechiney Aluminium | Alliages d'aluminium a temperature de recristallisation elevee utilisee dans les cibles de pulverisation cathodiques |
US5963778A (en) | 1997-02-13 | 1999-10-05 | Tosoh Smd, Inc. | Method for producing near net shape planar sputtering targets and an intermediate therefor |
JP3946298B2 (ja) * | 1997-03-25 | 2007-07-18 | 本田技研工業株式会社 | セラミックス−金属傾斜機能材およびその製造方法 |
US6010583A (en) | 1997-09-09 | 2000-01-04 | Sony Corporation | Method of making unreacted metal/aluminum sputter target |
JPH11106904A (ja) * | 1997-09-29 | 1999-04-20 | Riyouka Massey Kk | スパッタリングターゲットの製造方法 |
US6579431B1 (en) * | 1998-01-14 | 2003-06-17 | Tosoh Smd, Inc. | Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers |
JPH11200030A (ja) | 1998-01-20 | 1999-07-27 | Sumitomo Chem Co Ltd | スパッタリングターゲット用バッキングプレート |
US6183686B1 (en) * | 1998-08-04 | 2001-02-06 | Tosoh Smd, Inc. | Sputter target assembly having a metal-matrix-composite backing plate and methods of making same |
US6328927B1 (en) * | 1998-12-24 | 2001-12-11 | Praxair Technology, Inc. | Method of making high-density, high-purity tungsten sputter targets |
JP2000273623A (ja) * | 1999-03-29 | 2000-10-03 | Japan Energy Corp | Ti−Al合金スパッタリングターゲット |
US6042777A (en) * | 1999-08-03 | 2000-03-28 | Sony Corporation | Manufacturing of high density intermetallic sputter targets |
-
2000
- 2000-11-20 AT AT0085100U patent/AT4240U1/de not_active IP Right Cessation
-
2001
- 2001-11-06 MY MYPI20015103A patent/MY128636A/en unknown
- 2001-11-07 HU HU0301848A patent/HU225577B1/hu not_active IP Right Cessation
- 2001-11-07 MX MXPA02001478A patent/MXPA02001478A/es active IP Right Grant
- 2001-11-07 WO PCT/AT2001/000349 patent/WO2002040735A1/de active IP Right Grant
- 2001-11-07 EP EP01980044A patent/EP1335995B1/de not_active Expired - Lifetime
- 2001-11-07 JP JP2002543043A patent/JP4226900B2/ja not_active Expired - Lifetime
- 2001-11-07 PL PL355115A patent/PL199272B1/pl unknown
- 2001-11-07 CN CNB018030033A patent/CN1268780C/zh not_active Expired - Lifetime
- 2001-11-07 AU AU11982/02A patent/AU775031B2/en not_active Ceased
- 2001-11-07 SI SI200130263T patent/SI1335995T1/xx unknown
- 2001-11-07 RS YUP-445/02A patent/RS49852B/sr unknown
- 2001-11-07 AT AT01980044T patent/ATE278050T1/de active
- 2001-11-07 KR KR1020027004639A patent/KR100775140B1/ko active IP Right Grant
- 2001-11-07 DK DK01980044T patent/DK1335995T3/da active
- 2001-11-07 DE DE50103914T patent/DE50103914D1/de not_active Expired - Lifetime
- 2001-11-07 ES ES01980044T patent/ES2227293T3/es not_active Expired - Lifetime
- 2001-11-07 CA CA002375783A patent/CA2375783C/en not_active Expired - Fee Related
- 2001-11-07 CZ CZ20020669A patent/CZ298911B6/cs not_active IP Right Cessation
-
2002
- 2002-01-31 BG BG106371A patent/BG64450B1/bg unknown
- 2002-02-01 HR HR20020100A patent/HRP20020100B1/xx not_active IP Right Cessation
- 2002-06-12 US US10/167,787 patent/US6908588B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SI1335995T1 (en) | 2005-06-30 |
EP1335995B1 (de) | 2004-09-29 |
AU775031B2 (en) | 2004-07-15 |
JP2004513244A (ja) | 2004-04-30 |
HRP20020100A2 (en) | 2003-12-31 |
BG106371A (en) | 2002-08-30 |
US20020155016A1 (en) | 2002-10-24 |
PL355115A1 (en) | 2004-04-05 |
HUP0301848A2 (en) | 2003-09-29 |
KR100775140B1 (ko) | 2007-11-12 |
MXPA02001478A (es) | 2002-09-23 |
JP4226900B2 (ja) | 2009-02-18 |
US6908588B2 (en) | 2005-06-21 |
DE50103914D1 (de) | 2004-11-04 |
CA2375783A1 (en) | 2002-05-20 |
CN1268780C (zh) | 2006-08-09 |
ES2227293T3 (es) | 2005-04-01 |
RS49852B (sr) | 2008-08-07 |
AU1198202A (en) | 2002-05-27 |
HU225577B1 (en) | 2007-03-28 |
KR20020074145A (ko) | 2002-09-28 |
AT4240U1 (de) | 2001-04-25 |
MY128636A (en) | 2007-02-28 |
WO2002040735A1 (de) | 2002-05-23 |
HRP20020100B1 (en) | 2010-11-30 |
CN1392904A (zh) | 2003-01-22 |
PL199272B1 (pl) | 2008-09-30 |
BG64450B1 (en) | 2005-02-28 |
ATE278050T1 (de) | 2004-10-15 |
CA2375783C (en) | 2007-05-08 |
CZ298911B6 (cs) | 2008-03-12 |
EP1335995A1 (de) | 2003-08-20 |
CZ2002669A3 (cs) | 2002-08-14 |
DK1335995T3 (da) | 2005-01-31 |
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