WO2024257724A1 - シール材の製造方法及びシール材 - Google Patents
シール材の製造方法及びシール材 Download PDFInfo
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- WO2024257724A1 WO2024257724A1 PCT/JP2024/021043 JP2024021043W WO2024257724A1 WO 2024257724 A1 WO2024257724 A1 WO 2024257724A1 JP 2024021043 W JP2024021043 W JP 2024021043W WO 2024257724 A1 WO2024257724 A1 WO 2024257724A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/102—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/042—Polymers of hydrocarbons as defined in group C08F10/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2003/1034—Materials or components characterised by specific properties
- C09K2003/1062—UV-curable materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09K2200/0625—Polyacrylic esters or derivatives thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Definitions
- This disclosure relates to a method for manufacturing a sealing material and the sealing material.
- liquid gaskets are obtained by applying a liquid curable resin composition to a sealing surface using a dispenser or the like and then curing the composition. Liquid gaskets have the following advantages (i) and (ii) over solid gaskets. (i) Since no mold is required for production, the shape of the liquid gasket can be made to match the shape of the workpiece to be sealed. (ii) Since the liquid curable resin composition can penetrate even rough sealing surfaces, the finishing costs of the sealing surface can be reduced.
- Liquid gaskets are mainly classified into formed in-place gaskets (FIPGs) and cured in-place gaskets (CIPGs).
- FIPG a liquid curable resin composition is applied to a first sealing surface to form a coating of the curable resin composition, the coating is brought into contact with a second sealing surface, and then the coating is cured to seal between the first sealing surface and the second sealing surface.
- CIPG a liquid curable resin composition is applied to a first sealing surface, cured to form a cured product of the curable resin (hereinafter simply referred to as the "cured product"), and then the second sealing surface is brought into contact with the cured product and pressure is applied to seal between the first sealing surface and the second sealing surface.
- cured product a cured product of the curable resin
- the sealing performance is ensured by the adhesion between the first and second sealing surfaces and the cured product.
- the sealing performance is ensured by the adhesion between the first sealing surface and the cured product and the elasticity of the cured product.
- the second sealing surface is not adhered to the cured product, so that the CIPG has an advantage over the FIPG in that it is easier to rework.
- Liquid gaskets require the curing of a curable resin composition during the assembly process. This means that liquid gaskets may have a longer cycle time than solid gaskets. However, if a photocurable resin composition that can be cured in a short time is used as the raw material for the liquid gasket, it is possible to shorten the cycle time.
- Patent Document 1 discloses a photocurable resin composition that can be suitably used as a sealing material for preventing dust and moisture from entering the interior of electronic devices (e.g., hard disk drives, smartphones, etc.).
- Patent Document 2 discloses a photocurable resin composition that can be suitably used as various sealing materials inside fuel cells.
- a compression set test is known as a method for evaluating sagging resistance. The smaller the compression set, the better the resistance to sagging.
- Known techniques for reducing the compression set of the cured product include blending an acrylic monomer having a propylene glycol skeleton into a photocurable resin composition (Patent Document 3), blending a polyfunctional photocurable monomer into a photocurable resin composition (Patent Document 4), blending a high molecular weight styrene-based elastomer into a photocurable resin composition (Patent Document 5), and blending two types of photoradical polymerization initiators into a photocurable resin composition (Patent Document 6).
- Compression set tests are often performed in accordance with JIS K6262 under measurement conditions in which the cured material is compressed to a compression ratio of 25% and left at 70°C for 22 hours (compression ratio: 25%, temperature: 70°C, holding time: 22 hours).
- compression ratio 25%, temperature: 70°C, holding time: 22 hours.
- fuel cell sealing materials may be used at compression ratios of up to 60%.
- Patent Document 1 JP 2021-021012 A
- Patent Document 2 JP 2022-057075 A
- Patent Document 3 JP 2017-122139 A
- Patent Document 4 JP 2022-024078 A
- Patent Document 5 International Publication No. 2020/137658
- Patent Document 6 International Publication No. 2016/194870
- Patent Document 7 JP 2005-285537 A
- a cured product of a photocurable resin As a sealant for fuel cells (particularly for CIPG), it is necessary that the compression set is low under evaluation conditions stricter than those of JIS K 6262. For example, even if the compression rate is about 50%, the compression set needs to be low.
- the operating temperature of a polymer electrolyte fuel cell is as high as nearly 100°C.
- the cured product of the photocurable resin must have a long life. Therefore, in evaluating durability, it is required that the compression set is low even after compression at a temperature significantly higher than 100°C for a time significantly longer than 22 hours.
- the cured products of conventional photocurable resins are insufficient in terms of low compression set and other properties under such strict evaluation conditions.
- Patent Document 3 describes that the incorporation of an acrylic monomer having a propylene glycol skeleton reduces the compression set at 100°C for 72 hours under 25% compression. However, because the propylene glycol skeleton has poor heat resistance, the compression set increases in tests at higher temperatures and for longer periods.
- Patent Document 4 describes that the incorporation of a multifunctional photocurable monomer reduces the compression set at 120°C for 100 hours and 150°C for 100 hours at 25% compression.
- the multifunctional photocurable monomer impairs the extensibility and flexibility of the cured product, so that the sealing material may be damaged at a high compression rate such as 50%, or if the part to be sealed has low rigidity, the elasticity of the sealing material may cause the part to deform during compression.
- Patent Document 5 describes how the incorporation of a high molecular weight styrene elastomer with a weight average molecular weight of 200,000 or more reduces the compression set at 70°C for 22 hours under 25% compression. However, at high temperatures above the glass transition temperature of polystyrene (100°C), the styrene elastomer flows, resulting in a large compression set.
- Patent Document 6 describes that the blending of two types of initiators reduces the compression set at 70°C for 22 hours under 25% compression. However, when the present inventors produced a cured product according to Patent Document 6 and performed a compression set test at 140°C for 72 hours under 50% compression, the compression set was large.
- the present disclosure has been made in consideration of the above circumstances.
- the problem to be solved by the embodiments of the present disclosure is to provide a method for producing a sealing material that can produce a sealing material with small compression set in a high compression ratio, high temperature, and long-term compression set test with short curing time, and the sealing material.
- a method for producing a photocurable resin composition comprising the steps of irradiating the photocurable resin composition with light (a) containing at least one wavelength (I) of 395 nm to 435 nm, and then irradiating the photocurable resin composition with light (b) containing at least one wavelength (II) of 200 nm to 385 nm,
- the irradiation energy of the light (a) in the wavelength range of 200 nm to 385 nm is 0.2 times or less than the irradiation energy of the light (a) in the wavelength range of 395 nm to 435 nm
- the photocurable resin composition contains the following components (A) to (D): a content of the (A) component being 10 parts by mass to 70 parts by mass, a content of the (B) component being 30 parts by mass to 90 parts by mass, a content of the (C) component being 0.01 parts by mass to 0.9 parts by mass, and a content of the (D) component being
- Component (A) a polymer having a number average molecular weight of 1000 or more and having two or more (meth)acryloyl groups;
- the illuminance of the light (a) is 100 mW/cm 2 to 5000 mW/cm 2
- the irradiation amount is 100 mJ/cm 2 to 5000 mJ/cm 2
- the illuminance of the light (b) is 100 mW/cm 2 to 5000 mW/cm 2
- the polymer The method for producing a sealing material according to ⁇ 1> or ⁇ 2>, wherein the compound is a urethane (meth)acrylate (A-1); or a (meth)acrylate (A-2) having a skeleton containing polyisobutylene and not having a urethane bond.
- the polymer is the urethane (meth)acrylate (A-1),
- ⁇ 5> The method for producing a sealing material according to ⁇ 3>, wherein the polymer is the (meth)acrylate (A-2).
- ⁇ 6> The method for producing a sealing material according to any one of ⁇ 1> to ⁇ 5>, wherein the component (C) includes at least one selected from the group consisting of an acylphosphine oxide compound, an ⁇ -aminoalkylphenone compound, an oxime ester compound, and a thioxanthone compound.
- ⁇ 7> The method for producing a sealing material according to any one of ⁇ 1> to ⁇ 6>, wherein the component (D) includes at least one selected from the group consisting of an ⁇ -hydroxyalkylphenone compound, a benzyl ketal compound, and a benzophenone compound.
- the sealing material is used for a fuel cell.
- Tg homopolymer glass transition temperature
- the polymer is, The sealing material according to ⁇ 9>, which is a urethane (meth)acrylate (A-1), or a (meth)acrylate (A-2) having a skeleton containing polyisobutylene and having no urethane bond.
- a method for producing a sealing material and a sealing material are provided that can produce a sealing material with small compression set in a high compression ratio, high temperature, and long-term compression set test with short curing time.
- a numerical range expressed using "to” means a range that includes the numerical values before and after "to” as the lower and upper limits.
- the amount of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise specified.
- the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages.
- the upper or lower limit value of the numerical range may be replaced with a value shown in the examples. In this disclosure, combinations of preferred aspects are more preferred aspects.
- (meth)acrylate means at least one of acrylate and methacrylate.
- urethane (meth)acrylate refers to a (meth)acrylate polymer having a urethane skeleton.
- the manufacturing method of the sealing material of the present disclosure includes a step of irradiating a photocurable resin composition with light (a) containing at least one wavelength (I) of 395 nm to 435 nm, and then irradiating with light (b) containing at least one wavelength (II) of 200 nm to 385 nm (hereinafter also referred to as an "irradiation step").
- the irradiation energy in the wavelength range of 200 nm to 385 nm is 0.2 times or less than the irradiation energy in the wavelength range of 395 nm to 435 nm.
- the photocurable resin composition contains the following components (A) to (D) (i.e., component (A), component (B), component (C), and component (D)).
- component (A) component i.e., component (A), component (B), component (C), and component (D)
- the content of the (A) component is 10 parts by mass to 70 parts by mass
- the content of the (B) component is 30 parts by mass to 90 parts by mass
- the content of the (C) component is 0.01 parts by mass to 0.9 parts by mass
- the content of the (D) component is 0.1 parts by mass to 5 parts by mass.
- Component (A) a polymer having two or more (meth)acryloyl groups and a number average molecular weight (hereinafter also referred to as "Mn") of 1000 or more.
- Component (B) a monofunctional (meth)acrylate having a homopolymer glass transition temperature (Tg) of 20°C or less, an alkyl group having 5 to 30 carbon atoms, and one (meth)acryloyl group per molecule.
- Component (D) a photoradical polymerization initiator having a molar absorption coefficient of less than 10 L/(mol cm) at any wavelength from 395 nm to 435 nm, and a molar absorption coefficient of 10 L/(mol cm) or more at the wavelength (II).
- the irradiation energy of the light (a) in the wavelength range of 200 nm to 385 nm is 0.2 times or less than the irradiation energy of the wavelength range of 395 nm to 435 nm" indicates that the light (a) may contain light in the wavelength range of 200 nm to 385 nm as long as the effect of the present disclosure is not impaired.
- Light in the wavelength range of 200 nm to 385 nm that may be included in the light (a) does not sufficiently promote curing of the photocurable resin composition.
- the ratio of the irradiation energy of the light (a) in the wavelength range of 200 nm to 385 nm to the irradiation energy of the light (a) in the wavelength range of 395 nm to 435 nm can be calculated, for example, by measuring the emission spectrum of the light (a) using a spectroradiometer.
- the term "number average molecular weight” refers to a value calculated by converting the molecular weight measured by gel permeation chromatography (hereinafter also referred to as "GPC") into polystyrene equivalent.
- Molar absorption coefficient refers to the value of ⁇ shown in the following formula (A).
- ⁇ is determined by the Beer-Lambert equation for an acetonitrile solution containing a photoradical polymerization initiator.
- I represents the intensity of transmitted light.
- Io represents the intensity of transmitted light through acetonitrile pure solvent.
- c represents the molar concentration (M).
- d represents the thickness (cm) of the solution layer.
- log(Io/I) represents absorbance.
- Formula (A): ⁇ log(Io/I)/(c ⁇ d)
- the molar absorption coefficient of the photoradical polymerization initiator can be measured, for example, according to the following method.
- the photoradical polymerization agent is dissolved in acetonitrile as a solvent to a concentration of 1 g/L, and the absorbance is measured at room temperature using a quartz cell with a UV-visible spectrophotometer, and the molar absorption coefficient is calculated using the Beer-Lambert law.
- the photoradical polymerization initiator is dissolved at a concentration that results in an absorbance in the range of 0.1 to 2.0, and the absorbance is measured at room temperature using a quartz cell with a UV-visible spectrophotometer, and the molar absorption coefficient is calculated using the Beer-Lambert law.
- the method for manufacturing the sealing material disclosed herein has the above configuration, and therefore can produce a sealing material with small compression set in a compression set test at a high compression ratio (compression ratio: 50%), high temperature (temperature: 140°C), and long time (holding time: 72 hours) with short curing time (total light exposure time: 10 seconds or less). Therefore, a sealing material with excellent reliability and durability can be produced with high productivity.
- the photocurable resin composition contains the component (A)
- a crosslinked structure is formed by carrying out the irradiation step. This improves the settling resistance of the sealant. As a result, the compression set of the sealant at high temperatures is reduced. If the content of the component (A) is less than 10 parts by mass, the blending effect of the component (A) is insufficient. If the content of the component (A) is more than 70 parts by mass, the compression resistance of the sealant is deteriorated, and cracks occur in the sealant when it is compressed.
- the photocurable resin composition lowers the glass transition temperature of the sealing material, and the sealing material has rubber elasticity at low temperatures (e.g., 0° C.).
- the monofunctional (meth)acrylate of the component (B) having an alkyl group having 5 or more carbon atoms the monofunctional (meth)acrylate can be miscible with the component (A), and the hydrolysis resistance of the sealing material is improved.
- the content of the (C) component being 0.01 parts by mass or more, the curing of the photocurable resin composition proceeds by the light irradiation (a).
- the curing of the photocurable resin composition by the light irradiation (a) does not proceed sufficiently, and the reaction rate of the photocurable resin composition does not increase fully. Therefore, the curing of the photocurable resin composition proceeds sufficiently by the subsequent light irradiation (b) (for this reason, the photocurable resin composition contains the (D) component).
- the content of the (C) component being 0.9 parts by mass or less, the compression set of the sealing material becomes small.
- the curing of the photocurable resin composition by the light irradiation (b) proceeds. As a result, the curing of the photocurable resin composition proceeds sufficiently after the light irradiation (a) is performed.
- the curing of the photocurable resin composition does not proceed sufficiently.
- the content of the (D) component being 5 parts by mass or less, the compression set of the sealing material is reduced.
- the curing of the photocurable resin composition is partially advanced by light irradiation (a), and then the curing of the photocurable resin composition is sufficiently advanced by light irradiation (b).
- the photoradical polymerization initiator i.e., components (C) and (D)
- the photoradical polymerization initiator is completely consumed before the curing of the curable resin composition has progressed sufficiently. Therefore, the curing of the curable resin composition cannot be sufficiently progressed in a short time.
- the compression set of the sealing material is small, but it takes a long time to cure the curable resin composition. For these reasons, it is presumed that the method for producing a sealing material disclosed herein can produce a sealing material with small compression set in a high compression ratio, high temperature, and long-term compression set test by curing in a short time.
- the method for producing a sealing material of the present disclosure may further include, in addition to the irradiation step, a step of preparing a photocurable resin composition (hereinafter also referred to as the "preparation step") and a step of molding the photocurable resin composition into the shape of a sealing material (hereinafter also referred to as the "molding step").
- the preparation step, molding step, and irradiation step are carried out in this order.
- the method for producing a sealing material of the present disclosure includes the preparation step, molding step, and irradiation step.
- the method for preparing the photocurable resin composition is not particularly limited and may be any known method.
- the photocurable resin composition may be kneaded using a kneading machine.
- kneading machines include a kneader, a Banbury mixer, a roll mill, and a single-screw extruder.
- Photocurable Resin Composition contains components (A) to (D) in specific ratios.
- Component (A) The photocurable resin composition contains component (A).
- Component (A) is a polymer having an Mn of 1000 or more and having two or more (meth)acryloyl groups.
- Component (A) preferably has two (meth)acryloyl groups.
- the Mn of component (A) is 1000 or more, preferably 1000 to 100,000, more preferably 3000 to 80,000, and even more preferably 5000 to 60,000.
- component (A) has an Mn of 1000 or more, the resulting sealing material has excellent adhesive strength.
- component (A) has an Mn of 100,000 or less, the solubility of component (A) in the photocurable resin composition is superior.
- the content of component (A) is 10 to 70 parts by mass relative to 100 parts by mass of the total of components (A) and (B).
- the content of component (A) may be 10 to 40 parts by mass, or 10 to 30 parts by mass.
- the content of component (A) may be 30 to 70 parts by mass, or 40 to 70 parts by mass.
- the polymer is not particularly limited, but is particularly preferably a (meth)acrylate polymer having a (meth)acryloyl group as part of the polymer backbone (particularly at the end of the polymer backbone).
- the backbone of the (meth)acrylate polymer is not particularly limited, and examples thereof include a urethane backbone (i.e., urethane (meth)acrylate), a hydrocarbon backbone without a double bond (e.g., polyisobutylene, hydrogenated polybutadiene, hydrogenated polyisoprene, etc.), a polyacrylic acid backbone, a polyether backbone, a hydrocarbon backbone with a double bond, a polyester backbone, and a polycarbonate backbone.
- urethane backbone i.e., urethane (meth)acrylate
- a hydrocarbon backbone without a double bond e.g., polyisobutylene, hydrogenated polybutadiene, hydrogenated polyiso
- the polymer is preferably a urethane (meth)acrylate (A-1) (hereinafter also referred to as “(A-1) component”), or a (meth)acrylate (A-2) (hereinafter also referred to as "(A-2) component”) that has a skeleton containing polyisobutylene and does not have a urethane bond.
- urethane (meth)acrylates having two (meth)acryloyl groups will also be referred to as "bifunctional urethane (meth)acrylates.”
- Component (A-1) As described above, the component (A-1) is a urethane (meth)acrylate (A-1) having an Mn of 1,000 or more and having two or more (meth)acryloyl groups.
- the (A-1) component may have a skeleton such as a hydrocarbon skeleton without a double bond (e.g., hydrogenated polybutadiene or hydrogenated polyisoprene), a polyether skeleton, a hydrocarbon skeleton with a double bond, a polyester skeleton, or a polycarbonate skeleton.
- a hydrocarbon skeleton without a double bond e.g., hydrogenated polybutadiene or hydrogenated polyisoprene
- a polyether skeleton e.g., a polyether skeleton, a hydrocarbon skeleton with a double bond, a polyester skeleton, or a polycarbonate skeleton.
- the (A-1) component contains a hydrocarbon skeleton having no double bonds or a polyether skeleton.
- the resulting sealing material has the physical properties required for a sealing material for fuel cells (i.e., heat resistance, hydrolysis resistance, and rubber elasticity at low temperatures).
- the (A-1) component is preferably a urethane acrylate, from the viewpoint of excellent photocuring speed of the photocurable resin composition.
- the (A-1) component may be a commercially available product.
- Examples of bifunctional urethane (meth)acrylates having a polyether skeleton include the Art Resin series (UN-6200, UN-6207, UN-6306, UN-6304, UN-6305, UN-6060S, etc.) manufactured by Negami Chemical Industrial Co., Ltd.
- the (A-1) component may contain only one type, or may contain two or more types.
- the (A-1) component contains two or more types of bifunctional urethane (meth)acrylates having a polyether skeleton (for example, two types, UN-6304 and UN-6305), a cured product with excellent rubber elasticity at low temperatures can be obtained.
- the polymer is the urethane (meth)acrylate (A-1), and the urethane (meth)acrylate (A-1) contains a skeleton consisting of at least one of hydrogenated polybutadiene and hydrogenated polyisoprene (hereinafter also referred to as a "polydiene skeleton").
- a polydiene skeleton consisting of at least one of hydrogenated polybutadiene and hydrogenated polyisoprene
- component (A-1) contains a polydiene skeleton.
- component (A-1) examples include the following component (A-1-1) and the following component (A-1-2).
- Component (A-1-1) a urethane reaction product of a polydiene alcohol, a polyisocyanate, and a (meth)acrylate having a hydroxyl group.
- Component (A-1-2) an addition reaction product of a polydiene alcohol with a compound having an isocyanate group and a (meth)acryloyl group.
- component (A-1-1) namely polydiene diol, polyisocyanate, and compounds containing hydroxyl groups and (meth)acryloyl groups.
- Examples of the polydiene diol include polybutadiene diol, polyisoprene diol, and butadiene-styrene copolymer diol.
- Examples of the hydrogenated polydiene diol include hydrogenated polybutadiene diol, hydrogenated polyisoprene diol, and hydrogenated products of butadiene-styrene copolymer diol. Among these, those in which the double bonds are hydrogenated are preferred because they provide good compression set at high temperatures. Among these, hydrogenated polybutadiene diol or hydrogenated polyisoprene diol is preferred. Hydrogenated polybutadiene diol and hydrogenated polyisoprene diol may be used in combination.
- the Mn of the polydiene diol is preferably 500 to 5,000, more preferably 1,000 to 4,000.
- polyisocyanate a compound having two isocyanate groups in one molecule (hereinafter also referred to as "diisocyanate”) is preferred. If a compound having three or more isocyanate groups in one molecule is used, gelation may occur during synthesis, or even if synthesis can be performed without gelation, cracks may occur under high compression.
- diisocyanates examples include aliphatic diisocyanates (e.g., hexamethylene diisocyanate, etc.), alicyclic diisocyanates (e.g., isophorone diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, etc.), and aromatic diisocyanates (e.g., tolylene diisocyanate, diphenylmethane diisocyanate, tolidine diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, etc.).
- aliphatic diisocyanates e.g., hexamethylene diisocyanate, etc.
- alicyclic diisocyanates e.g., isophorone diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated diphenylmethane diisocyan
- Examples of compounds containing a hydroxyl group and a (meth)acryloyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, caprolactone-modified 2-hydroxyethyl (meth)acrylate, and glycidol di(meth)acrylate.
- the compound containing a hydroxyl group and a (meth)acryloyl group is preferably a hydroxyalkyl (meth)acrylate (such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, or 4-hydroxybutyl (meth)acrylate).
- Preferred methods for producing component (A-1-1) include, for example, Production Method 1 or Production Method 2.
- Production Method 1 is a method in which a polydiene diol is reacted with a diisocyanate to produce a urethane prepolymer having an isocyanate group, and the prepolymer is reacted with a compound containing a hydroxyl group and a (meth)acryloyl group.
- Production Method 2 is a method in which a polydiene diol, a diisocyanate, and a compound containing a hydroxyl group and a (meth)acryloyl group are reacted.
- the polydiene-based urethane (meth)acrylate obtained by the production method 1 is preferred. This makes it easy to control the molecular weight.
- the polydiene-based urethane (meth)acrylate obtained by the production method 1 has excellent solubility in other components.
- the resulting composition has excellent adhesive strength.
- the molar ratio of polydiene diol to diisocyanate is preferably 1:2.2 to 1:1.05, more preferably 1:2 to 1:1.1, and even more preferably 1:1.8 to 1:1.1.
- the resulting (A-1) component has excellent solubility with other (meth)acrylates, and the resulting sealant has excellent adhesive strength.
- Component (A-2) is a (meth)acrylate (A-2) having an Mn of 1000 or more, having two or more (meth)acryloyl groups, including a skeleton containing polyisobutylene (-[CH 2 C(CH 3 ) 2 ]- unit), and having no urethane bond.
- the skeleton of the component (A-2) may consist of polyisobutylene.
- the polymer is preferably the (meth)acrylate (A-2). This allows the method of producing a sealing material disclosed herein to produce a sealing material with a smaller compression set than when the polymer is component (A-1).
- the component (A-2) may be a commercially available product.
- An example of a commercially available product is "KANEKA EPION EP400V” manufactured by Kaneka Corporation.
- the photocurable resin composition contains component (B), which is a monofunctional (meth)acrylate having a homopolymer glass transition temperature (Tg) of 20° C. or lower, an alkyl group having 5 to 30 carbon atoms, and one (meth)acryloyl group per molecule.
- component (B) is a monofunctional (meth)acrylate having a homopolymer glass transition temperature (Tg) of 20° C. or lower, an alkyl group having 5 to 30 carbon atoms, and one (meth)acryloyl group per molecule.
- the glass transition temperature (Tg) of the homopolymer of component (B) is 20° C. or lower, and may be 0° C. or lower.
- the glass transition temperature (Tg) of the homopolymer of component (B) can be determined from the intersection of the tangent line at the inflection point and the baseline of the heat flux curve obtained using a differential scanning calorimeter. The measurement may be performed using the following measuring equipment and conditions.
- the heat flux curve is obtained by heating approximately 5 mg of a sample at 20°C/min to 70°C, holding it for 5 minutes, then cooling it at -20°C/min to -150°C, holding it for 5 minutes, and then heating it again at 20°C/min to 70°C.
- Examples of the (B) component include alkyl (meth)acrylates represented by the following general formula (1), and (meth)acrylates of ethylene oxide adducts of alkyl alcohols represented by the following general formula (2).
- the (B) component may be used alone or in any combination of two or more.
- R1 represents a hydrogen atom or a methyl group.
- R2 represents an alkyl group having 5 to 30 carbon atoms.
- n is an integer of 1 to 4.
- alkyl groups having 5 to 30 carbon atoms include pentyl, isopentyl, tert-pentyl, neopentyl, hexyl, 2-ethylhexyl, isohexyl, heptyl, octyl, isooctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl (lauryl), and isostearyl.
- the monofunctional (meth)acrylate is preferably a monofunctional acrylate (that is, R 1 in general formula (1) is a hydrogen atom).
- the content of the (B) component is 30 to 90 parts by mass, relative to 100 parts by mass of the total of the (A) and (B) components.
- the content of the (B) component may be 70 to 90 parts by mass, or 75 to 85 parts by mass.
- the content of the (B) component may be 30 to 70 parts by mass, or 40 to 60 parts by mass.
- the photocurable resin composition contains component (C), which is a photoradical polymerization initiator having a molar absorption coefficient of 10 L/(mol cm) or more at at least one wavelength (I) in the range of 395 nm to 435 nm.
- component (C) examples include acylphosphine oxide compounds, ⁇ -aminoalkylphenone compounds that satisfy the conditions of component (C), oxime ester compounds that satisfy the conditions of component (C), and thioxanthone compounds.
- Component (C) may be used alone or in any combination of two or more.
- Acylphosphine oxide compounds refer to compounds that have an acylphosphine oxide structure.
- ⁇ -aminoalkylphenone compounds refer to compounds that have an ⁇ -aminoalkylphenone structure.
- Oxime ester compounds refer to compounds that have an oxime ester structure.
- Thioxanthone compounds refer to compounds that have a thioxanthone structure.
- acylphosphine oxide compounds include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (DARCUR TPO) and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (Omnirad 380 (819)).
- ⁇ -aminoalkylphenone compounds that satisfy the requirements for component (C) include 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one (Omnirad 369) and 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one (IRGACURE 379 or 379EG).
- oxime ester compounds that satisfy the requirements for component (C) include 1,2-octanedione, 1-[4-(phenylthio)-, 2-(O-benzoyloxime) (IRGACURE OXE01).
- thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, isopropylthioxanthone, 1-chloro-4-propylthioxanthone, 3-[3,4-dimethyl-9-oxo-9H-thioxanthone-2-yl]oxy]-2-hydroxypropyl-N,N,N-trimethylammonium chloride, and fluorothioxanthone.
- component (C) contains at least one selected from the group consisting of acylphosphine oxide compounds, ⁇ -aminoalkylphenone compounds satisfying the conditions for component (C), oxime ester compounds satisfying the conditions for component (C), and thioxanthone compounds, which allows the curing of the photocurable resin composition to proceed efficiently in the irradiation step by light irradiation (a).
- the component (C) may be at least one selected from the group consisting of an acylphosphine oxide compound, an ⁇ -aminoalkylphenone compound satisfying the conditions for the component (C), an oxime ester compound satisfying the conditions for the component (C), and a thioxanthone compound.
- the component (C) more preferably contains an acylphosphine oxide compound, and even more preferably is an acylphosphine oxide compound.
- the content of component (C) is 0.01 to 0.9 parts by mass per 100 parts by mass of the total of components (A) and (B). From the viewpoint of further reducing the compression set, the content of component (C) is preferably 0.05 to 0.9 parts by mass, more preferably 0.05 to 0.5 parts by mass, even more preferably 0.05 to 0.4 parts by mass, and particularly preferably 0.1 to 0.4 parts by mass.
- the photocurable resin composition contains component (D), which is a photoradical polymerization initiator having a molar absorption coefficient of less than 10 L/(mol cm) at any wavelength from 395 nm to 435 nm and a molar absorption coefficient of 10 L/(mol cm) or more at at least one wavelength (II) from 200 nm to 385 nm.
- component (D) is a photoradical polymerization initiator having a molar absorption coefficient of less than 10 L/(mol cm) at any wavelength from 395 nm to 435 nm and a molar absorption coefficient of 10 L/(mol cm) or more at at least one wavelength (II) from 200 nm to 385 nm.
- component (D) examples include ⁇ -hydroxyalkylphenone compounds, ⁇ -aminoalkylphenone compounds that satisfy the conditions of component (D), oxime ester compounds, benzyl ketal compounds, or benzophenone compounds that satisfy the conditions of component (D).
- Component (D) may be used alone or in any combination of two or more.
- ⁇ -Hydroxyalkylphenone compounds refers to compounds that have an ⁇ -hydroxyalkylphenone structure.
- Benzil ketal compounds refers to compounds that have a benzil ketal structure.
- Benzophenone compounds refers to compounds that have a benzophenone structure.
- ⁇ -hydroxyalkylphenone compounds include 2-hydroxy-1-[4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl]-2-methylpropan-1-one (Omnirad 127D), 1-hydroxycyclohexyl phenyl ketone (Omnirad 184), 2-hydroxy-2-methyl-1-phenylpropan-1-one (Omnirad 1173), 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one (Omnirad 2959), and oligo[2-hydroxy-2-methyl-1-[4-1-(methylvinyl)phenyl]propanone (ESACURE ONE).
- An example of an ⁇ -aminoalkylphenone compound that satisfies the condition of component (D) is 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1-one (IRGACURE907).
- An example of a benzyl ketal compound is 2,2-dimethoxy-1,2-diphenylethan-1-one (Omnirad 651).
- Examples of oxime ester compounds that satisfy the requirements for component (D) include ethanone, 1-[9-(ethyl)-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, and 1-(O-acetyloxime) (IRGACURE OXE02).
- benzophenone compounds include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2,4,6-trimethylbenzophenone, 4-phenylbenzophenone, 4-(4-methylphenylthio)benzophenone, 1-[4-(4-benzoylphenylsulfanyl)phenyl]-2-methyl-2-(4-methylphenylsulfonyl)propan-1-one, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, and 4-methoxy-4'-dimethylaminobenzophenone.
- the component (D) preferably contains at least one selected from the group consisting of an ⁇ -hydroxyalkylphenone compound, a benzyl ketal compound, and a benzophenone compound, which allows the curing of the photocurable resin composition to proceed efficiently and sufficiently in the irradiation step (b) by light irradiation.
- the component (D) may be at least one selected from the group consisting of ⁇ -hydroxyalkylphenone compounds, benzil ketal compounds, and benzophenone compounds.
- the content of component (D) is 0.1 to 5 parts by mass per 100 parts by mass of the total of components (A) and (B). From the viewpoint of reducing the compression set, the content of component (D) is preferably 0.2 to 4 parts by mass, and more preferably 0.5 to 2 parts by mass.
- the photocurable resin composition may contain other components as long as they do not impair the effects of the present disclosure.
- other components include thermal polymerization initiators, ultraviolet absorbers, light stabilizers, antioxidants, polymerization inhibitors, silane coupling agents, non-reactive polymers, fillers, metal fine particles, metal oxide fine particles, ion trapping agents, defoamers, leveling agents, dyes or pigments, etc.
- the method for molding the photocurable resin composition is appropriately selected depending on the shape of the sealing material, and any known method may be used.
- the photocurable resin composition can be molded, for example, using a coating device with a needle-shaped coating section.
- the coating device ejects the photocurable resin composition from the needle-shaped coating section and molds the photocurable resin composition into a bead shape.
- the photocurable resin composition can be molded, for example, by injecting it into a mold.
- the gap in the mold i.e., the molding space
- the configuration of the mold is not particularly limited, and any known configuration can be used.
- the material of the mold is not particularly limited as long as it can cure the photocurable resin composition in the irradiation step, and examples of the material include glass, resin, and metal.
- the mold may also be equipped with a heating means, a cooling means, a decompression means, a pressurization means, and the like.
- the method of injecting the photocurable resin composition into the mold is not particularly limited, and any known method can be used.
- the photocurable resin composition is irradiated with light (a) containing at least one wavelength (I) of 395 nm to 435 nm, and then irradiated with light (b) containing at least one wavelength (II) of 200 nm to 385 nm. This cures the photocurable resin composition to obtain a sealing material.
- the wavelength of the light (a) is appropriately selected depending on the type of the component (C) and the type of the component (D), etc., so long as it includes at least one wavelength (I) between 395 nm and 435 nm.
- the wavelength (I) may include at least one between 395 nm and 420 nm, may include at least one between 400 nm and 410 nm, or may include 405 nm.
- the light (a) that can be preferably used has a maximum illuminance peak in the wavelength range of 395 to 435 nm within the wavelength range of 200 to 450 nm.
- the wavelength range with the maximum illuminance peak is preferably 395 to 420 nm, more preferably 400 to 410 nm.
- the illuminance of the light (a) is appropriately selected depending on the type of the component (C) and the type of the component (D), etc.
- the illuminance of the light (a) may be 100 mW/cm 2 to 5000 mW/cm 2 , may be 200 mW/cm 2 to 2000 mW/cm 2 , or may be 500 mW/cm 2 to 1500 mW/cm 2 .
- the dose of light (a) is appropriately selected depending on the type of component (C) and the type of component (D), etc.
- the dose of light (a) may be 100 mJ/cm 2 to 5000 mJ/cm 2 , 200 mJ/cm 2 to 4000 mJ/cm 2 , or 1000 mJ/cm 2 to 4000 mJ/cm 2 .
- the wavelength is 405 nm
- the illuminance is 500 mW/cm 2 to 1500 mW/cm 2
- the dose is 1000 mJ/cm 2 to 4000 mJ/cm 2. This allows the curing of the photocurable resin composition to progress partially and efficiently in a short time.
- the light source for light irradiation (a) is preferably an LED (light emitting diode), but multi-wavelength light sources such as low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, extra-high-pressure mercury lamps, and metal halide lamps equipped with wavelength-cutting filters can also be used.
- LED light emitting diode
- multi-wavelength light sources such as low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, extra-high-pressure mercury lamps, and metal halide lamps equipped with wavelength-cutting filters can also be used.
- the light irradiation (a) may be performed while heating the photocurable resin composition. After the light irradiation (a), the photocurable resin composition may be heated as necessary.
- the wavelength of the light (b) is appropriately selected depending on the type of the component (C) and the type of the component (D), etc., so long as it includes at least one wavelength (II) between 200 mm and 385 nm.
- the wavelength (II) is , 300 nm to 385 nm, may include at least one of 350 nm to 380 nm, or may include 365 nm.
- the wavelength range in which the maximum peak of illuminance occurs is preferably 300 to 385 nm, more preferably 350 ⁇ 385 nm.
- the illuminance of the light (b) is appropriately selected depending on the type of the component (C) and the type of the component (D).
- the illuminance of the light (b) is 100 mW/cm 2 to 5000 mW/cm 2. Alternatively, it may be 200 mW/cm 2 to 3000 mW/cm 2 , or it may be 500 mW/cm 2 to 2000 mW/cm 2 .
- the amount of irradiation of the light (b) is appropriately selected depending on the type of the component (C) and the type of the component (D), etc.
- the amount of irradiation of the light (b) is 200 mJ/cm 2 to 10,000 mJ/cm 2. It may be 0.01 to 10,000 mJ/cm 2 , or it may be 500 mJ/cm 2 to 10,000 mJ/cm 2 , or it may be 2,000 mJ/cm 2 to 7,000 mJ/cm 2 .
- the wavelength is 365 nm
- the illuminance is 500 mW/cm 2 to 2000 mW/cm 2
- the dose is 2000 mJ/cm 2 to 7000 mJ/cm 2. This allows the curing of the photocurable resin composition to proceed efficiently and sufficiently in a short time.
- the light source for light irradiation (b) is not particularly limited, and examples include LEDs, low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, and UV (ultraviolet) electrodeless lamps.
- Light irradiation (b) may be performed continuously after light irradiation (a). Light irradiation (b) may be performed while heating the photocurable resin composition. After light irradiation (b), the photocurable resin composition may be heated as necessary.
- Preferred aspects of light irradiation (a) and light irradiation (b) It is preferred that the illuminance of the light (a) is 100 mW/cm 2 to 5000 mW/cm 2 and the dose of the light (b) is 100 mW/cm 2 to 5000 mW/cm 2 and the dose of the light (b) is 100 mW/cm 2 to 5000 mW/cm 2 and 200 mJ/cm 2 to 10000 mJ/cm 2. This makes it possible to achieve both low compressive strain and short-time curing.
- sealing material (hereinafter also simply referred to as “sealing material") manufactured by the sealing material manufacturing method of the present disclosure is suitably used for purposes such as waterproofing, water control, vibration isolation, vibration damping, stress relaxation, gap filling, rattle prevention, shift prevention, or impact noise reduction.
- the shape of the seal material is appropriately selected depending on the application of the seal material, and examples include rings, packings, gaskets, diaphragms, oil seals, bearing seals, lip seals, plunger seals, door seals, lips, face seals, gas delivery plate seals, wafer support seals, and barrel seals.
- the sealing material has a small compression set in a compression set test conducted at high compression ratio, high temperature and for a long period of time.
- the sealing material exhibits excellent sealing properties over a long period of time from low to high temperatures.
- the sealing material is preferably used in fuel cells. Examples of fuel cells include solid polymer fuel cells.
- sealing materials for fuel cell applications will also be referred to as “sealing materials for fuel cells.”
- Examples of shapes of fuel cell sealing materials include O-ring, V-ring, rod, sheet, and block shapes.
- Fuel cell sealing materials can effectively seal between the components and between the components.
- components of a single cell include an electrolyte membrane, electrodes, separators, and a frame.
- the sealing material of the present disclosure contains a constituent unit derived from the following component (A) and a constituent unit derived from the following component (B): Compression set (based on JIS K6262:2013, except that the compression ratio is changed to 50%, the temperature to 140°C, and the holding time to 72 hours) is 35% or less.
- Component (A) a polymer having two or more (meth)acryloyl groups and a number average molecular weight of 1000 or more.
- Tg homopolymer glass transition temperature
- the sealing material disclosed herein has the above-mentioned configuration, and therefore exhibits small compression set in compression set tests at high compression ratios, high temperatures, and over long periods of time.
- component (A) Structural unit derived from component (A)
- component (A) include the same as those exemplified as component (A) in the method for producing a sealing material of the present disclosure.
- the polymer is preferably a urethane (meth)acrylate (A-1) or a (meth)acrylate (A-2) that contains a skeleton made of polyisobutylene and does not have a urethane bond. This reduces the compression set of the sealing material.
- the content of the constituent units derived from component (A) relative to a total of 100 parts by mass of the constituent units derived from component (A) and the constituent units derived from component (B) is not particularly limited, but is preferably 10 parts by mass to 70 parts by mass.
- the content of the constituent units derived from component (A) may be in the same range as the range exemplified as the content of component (A) in the method for producing a sealing material.
- component (B) examples include the same units as those exemplified as the component (B) in the production method for the sealing material of the present disclosure.
- the content of the structural units derived from component (B) is not particularly limited, and is preferably 30 parts by mass to 90 parts by mass, relative to 100 parts by mass of the total of the structural units derived from component (A) and the structural units derived from component (B).
- Examples of the content of the structural units derived from component (B) include the same ranges as those exemplified as the content of component (B) in the method for producing a sealing material.
- the compression set of the sealing material of the present disclosure is 35% or less, preferably 30% or less, and the closer to 0%, the better.
- the method for measuring the compression set is the same as the method described in the examples.
- As a method for adjusting the compression set to 35% or less the above-mentioned method for producing the sealing material of the present disclosure can be mentioned.
- the method for producing the sealing material disclosed herein is not particularly limited, and the sealing material is suitably produced by the method for producing the sealing material disclosed herein.
- sealing material of the present disclosure includes the same applications as those exemplified above for the sealing material produced by the method for producing the sealing material of the present disclosure.
- Component (A) As the component (A-1), the following PUA-1, PUA-2, UN-6304, and UN-6305 were prepared. As the component (A-2), the following EP400V was prepared.
- Component (B) As component (B), the following M-120, LA and NOAA were prepared.
- M-120 acrylate of 2-ethylhexyl alcohol and 2 moles of ethylene oxide adduct (Aronix "M-120” manufactured by Toagosei Co., Ltd.), Tg: -65°C "LA”: Lauryl acrylate ("LA” manufactured by Osaka Organic Chemical Industry Co., Ltd.), Tg: -23°C “NOAA”: n-octyl acrylate ("NOAA” manufactured by Osaka Organic Chemical Industry Co., Ltd.), Tg: -65°C
- Component (C) As component (C), the following TPO, O-380, and O-369 were prepared.
- O-380 bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide ("Omnirad 380" manufactured by IGM Resins), ⁇ (405 nm): 515 L/(mol cm) "O-369”: 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone ("Omnirad 369” manufactured by IGM Resins), ⁇ (405 nm): 57 L/(mol cm) "TPO”: 2,4,6-trimethylbenzoyl-diphenylphosphine oxide ("Omnirad TPO" manufactured by IGM Resins), ⁇ (405 nm): 202 L / (mol cm)
- Component (D) As component (D), the following O-127D, O-184, O-651 and E-ONE were prepared.
- O-127D 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one
- Omnirad 127D 2-hydroxy-1-(4-(4-(2-hydroxy-2-methylpropionyl)benzyl)phenyl)-2-methylpropan-1-one
- ⁇ molar absorption coefficient
- Molar absorption coefficient ⁇ is less than 10 L/(mol cm) at 395 to 435 nm (for example, ⁇ (405 nm): 0 L/(mol cm))
- ⁇ (365 nm) 18 L/(mol cm)
- O-651 2,2-dimethoxy-1,2-diphenylethan-1-one
- a 3L four-necked separable flask was charged with 900g (0.48 moles of hydroxyl groups) of GI-3000 (hydroxyl value 30.0 mg KOH/g, Mn approximately 4,000) manufactured by Nippon Soda Co., Ltd., as a hydrogenated polybutadiene having hydroxyl groups, 0.71g of 2,6-di-t-butyl-p-cresol, and 406g of lauryl acrylate (hereinafter referred to as "LA”), which were then attached to a stirrer and stirred until dissolved.
- LA lauryl acrylate
- thermometer, gas inlet tube, and reflux condenser were attached to the flask, and a mixture of oxygen and nitrogen gas (5% oxygen) was passed through the upper part of the liquid while stirring, and 71.2g of isophorone diisocyanate (0.64 moles of isocyanate groups) was added and mixed. 22g of LA in which 0.014g of ferric acetylacetonate had been dissolved was added to the solution and mixed, after which the temperature was raised. After stirring and mixing at 80°C for 1 hour, 23.1 g of 4-hydroxybutyl acrylate (0.16 moles of hydroxyl groups) was added and reacted for 3 hours.
- the disappearance of the isocyanate groups was confirmed by IR spectroscopy, and the synthesis was terminated.
- the resulting product was a mixture containing 70% urethane acrylate with a hydrogenated polybutadiene skeleton (i.e., "PUA-1") and 30% LA as a diluting monomer.
- GPC analysis of the resulting product confirmed that the peak of the PUA-1 component was distinct from the monomer components.
- the polystyrene-equivalent molecular weight of the PUA-1 component was Mn 16,000 and Mw 36,000.
- thermometer, gas inlet tube, and reflux condenser were attached to the flask, and a mixture of oxygen and nitrogen gas (5% oxygen) was passed through the top of the liquid while stirring, and 3g (0.02 moles of isocyanate groups) of 2-acryloyloxyethyl isocyanate (Showa Denko K.K.'s Karenz AOI) was added and mixed. 5 g of NOAA in which 0.003 g of ferric acetylacetonate had been dissolved was added and mixed, and the temperature was then raised. After stirring and mixing at 60°C for 30 minutes, the solution was cooled to 40°C.
- Molding process A silicone mold with a thickness of 1 mm was prepared and placed on a PET (polyethylene terephthalate) film.
- the photocurable resin composition prepared in [2.1] was poured into the silicone mold and laminated with a PET film.
- a 405 nm LED (surface type LED irradiator manufactured by CCS Co., Ltd.) was used as the light source of the irradiation light (405 nm).
- a 365 nm LED (surface type LED irradiator manufactured by ARK TECH Co., Ltd.) was used as the light source of the irradiation light (365 nm).
- a C12684 illuminance meter manufactured by Hamamatsu Photonics K.K. was used to measure the illuminance.
- the irradiated light (405 nm) did not contain any light in the wavelength range of 200 nm to 385 nm.
- the irradiation energy of the light (a) in the wavelength range of 200 nm to 385 nm was 0.2 times or less (i.e., 0 times) the irradiation energy in the wavelength range of 395 nm to 435 nm.
- the peak at about 1730 cm ⁇ 1 was used as the peak derived from the C ⁇ O bond, and the peak at about 1410 cm ⁇ 1 or 810 cm ⁇ 1 was used as the peak derived from the C ⁇ C bond.
- the reaction rate of the photocurable resin composition was evaluated using the reaction rate calculation results and based on the following reaction rate evaluation criteria.
- the evaluation results are shown in Tables 1 to 4.
- the acceptable evaluation result for the reaction rate of the photocurable resin composition is "A1".
- the rapid curing property of the photocurable resin composition was evaluated based on the following evaluation criteria for the total irradiation time using the total irradiation time.
- the evaluation results are shown in Tables 1 to 4.
- An acceptable evaluation result for the rapid curing property of the photocurable resin composition is "A2".
- Compression set test (50% compression, 140°C, 72 hours) A compression set test was carried out using a jig conforming to JIS K6262:2013. The second sealant was compressed at a compression rate of 50% using the jig to obtain a second sealant with the jig. The second sealant with the jig was placed in a thermostatic chamber (temperature: 140°C) and left for 72 hours. Thereafter, the second sealant with the jig was removed from the thermostatic chamber, the compression was released, and the second sealant was removed from the jig. Next, the second sealant was left at room temperature (25°C) for 30 minutes. Finally, the thickness of the second sealant was measured, and the compression set (hereinafter also referred to as "compression set (50% compression, 140°C, 72 hours)”) was calculated.
- the compression set of the sealing material was evaluated based on the following compression set evaluation criteria using compression set (50% compression, 140°C, 72 hours). The evaluation results are shown in Tables 1 to 4.
- the acceptable range of compression set of the sealing material is "A3+” or "A3".
- compression set test (50% compression, 120°C, 1000 hours)
- compression set The compression set of the second sealant (hereinafter also referred to as “compression set (50% compression, 120°C, 1000 hours)") was calculated in the same manner as in [2.3.2] above, except that the second sealant with the jig was placed in a thermostatic chamber (temperature: 120°C) and left for 1000 hours.
- the compression set (50% compression, 120°C, 1000 hours)) is shown in Tables 1 to 4.
- Evaluation criteria for the manufacturing method of the sealing material "A4+” Evaluation result of compression set is “A3+” and fast curing property is judged as “A2" "A4": Compression set judged as “A3” and fast curing judged as “A2” "B4": Compression set judged as “A3+” or "A3” and fast curing judged as “B2" "B4-”: Compression set judged to be "B3" or compression set not yet evaluated
- the manufacturing method of the sealing material of Comparative Examples 1 to 16 is not a manufacturing method of a sealing material that can manufacture a sealing material with small compression permanent set in a high compression ratio, high temperature, and long-term compression permanent set test by short-time curing.
- Examples 1 to 15 The manufacturing method of the sealing material of Examples 1 to 15 included an irradiation step in which light irradiation (a) and light irradiation (b) were performed.
- the photocurable resin composition contained components (A) to (D) in specific ratios. Therefore, the overall evaluation of Examples 1 to 15 was "A4+” or "A4". From these results, it was found that the manufacturing method of the sealing material of Examples 1 to 15 is a manufacturing method of a sealing material that can produce a sealing material with small compression set in a high compression ratio, high temperature, and long-term compression set test by short-time curing.
- Example 1 Comparison of Example 1 with Comparative Examples 1 to 6
- the photocurable resin composition was the same as that in Example 1, but the light irradiation (a) was not performed.
- the compression set of Comparative Example 1 was insufficient.
- the photocurable resin composition contained either the (C) component or the (D) component, and the content of either the (C) component or the (D) component was the same (0.5 parts by mass) as in Example 1.
- the illuminance was the same (750 mW/cm 2 ) as in Example 1, but the reaction rate was insufficient.
- Comparative Example 4 when the illuminance was low (50 mW/cm 2 ), the reaction rate increased sufficiently and the compression set was similar to that in Example 1, but the fast curing property was insufficient.
- the photocurable resin composition contained either the (C) component or the (D) component, and the content of the (C) component or the (D) component was the same as the sum (1 part by mass) of the content of the (C) component and the content of the (D) component in Example 1.
- the illuminance was the same as that in Example 1 (750 mW/cm 2 ), and the reaction rate was sufficient, but the compression set was insufficient.
- Example 3 Comparison of Example 3 with Comparative Examples 8 to 10
- the photocurable resin composition was the same as that in Example 3, but the light irradiation (a) was not performed.
- the compression set was worse than that in Example 3, and the rapid curing property was insufficient.
- the photocurable resin composition did not contain the (D) component, and the content of the (C) component was the same as that (0.1 parts by mass) in Example 3, which was relatively low.
- the illuminance was the same as that in Example 3 (750 mW/cm 2 ), but the reaction rate was insufficient.
- the illuminance was low (30 mW/cm 2 ), and the reaction rate and compression set were similar to those in Example 3, but the fast curing property was insufficient.
- Example 3 Comparison of Example 3 with Examples 5 and 6 As component (C), "TPO” (Example 5), an acylphosphine oxide compound like “Omnirad 380", and “Omnirad 369” (Example 6), an ⁇ -aminoalkylphenone compound, were investigated. In Examples 5 and 6, both had sufficient compression set. Examples 3 and 5 (acylphosphine oxide compounds) had better compression set.
- Example 3 Comparison of Example 3 with Examples 11 and 12 As component (D), "Omnirad 184" (Example 11), an ⁇ -hydroxyalkylphenone compound like “Omnirad 127D,” and “Omnirad 651” (Example 12), a benzyl ketal compound, were investigated. The compression set evaluation was satisfactory.
- Example 13 Comparison of Example 13, Example 14, and Comparative Examples 13 to 15 A urethane acrylate with a hydrogenated polybutadiene skeleton as the (A) component and a lauryl acrylate with an alkyl acrylate as the (B) component were examined.
- the compression set was good by carrying out an irradiation process including light irradiation (a) and light irradiation (b) containing the (C) component and the (D) component in a specific ratio (Example 13).
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Abstract
Description
(i)製造に金型は必要とされないために、液状ガスケットの形状は、シールするワークの形状に応じた形状にすることができること
(ii)液状の硬化型樹脂組成物はシール面が粗くても浸透するために、シール面の仕上げコストが下げられること
FIPGでは、液状の硬化型樹脂組成物を第1シール面に塗布して硬化型樹脂組成物の塗布物を形成し、塗布物に第2シール面を接触させた後に、塗布物を硬化させて、第1シール面と第2シール面との間がシールされる。
CIPGでは、液状の硬化型樹脂組成物を第1シール面に塗布し、硬化させて、硬化型樹脂の硬化物(以下、単に「硬化物」ともいう)を形成した後に、硬化物に第2シール面を接触させて圧力を加えることで、第1シール面と第2シール面との間がシールされる。
したがって、FIPGでは、第1シール面及び第2シール面と硬化物との接着により、シール性が確保される。CIPGでは、第1シール面と硬化物との接着、及び硬化物の弾性力により、シール性が確保される。CIPGでは、第2シール面と硬化物とは接着していないため、CIPGは、FIPGに対して、リワーク性に優れるという利点がある。
特許文献2には、燃料電池内部の各種シール材として好適に使用できる光硬化型樹脂組成物が開示されている。
特許文献2:特開2022-057075号公報
特許文献3:特開2017-122139号公報
特許文献4:特開2022-024078号公報
特許文献5:国際公開第2020/137658号
特許文献6:国際公開第2016/194870号
特許文献7:特開2005-285537号公報
固体高分子型燃料電池の作動温度は100℃近くの高温になる。加えて、光硬化型樹脂の硬化物は長寿命であることも必要である。そのため、耐久性の評価では、100℃よりかなり高い温度で、22時間よりかなり長時間圧縮した後でも、圧縮永久歪みが低いことが求められる。
しかし、以下に示すように、従来の光硬化型樹脂の硬化物は、このような厳しい評価条件では、低圧縮永久歪みなどの点で性能が不十分であった。
本開示の実施形態が解決しようとする課題は、高圧縮率、高温及び長時間の圧縮永久歪み試験において圧縮永久歪みが小さいシール材を短時間硬化で製造することができるシール材の製造方法、及びシール材を提供することである。
前記光(a)において波長範囲200nm~385nmの照射エネルギーが波長範囲395nm~435nmの照射エネルギーの0.2倍以下であり、
前記光硬化型樹脂組成物が、下記の(A)成分~(D)成分を含有し、
前記(A)成分及び前記(B)成分の合計100質量部に対して、前記(A)成分の含有量が10質量部~70質量部、前記(B)成分の含有量が30質量部~90質量部、前記(C)成分の含有量が0.01質量部~0.9質量部、前記(D)成分の含有量が0.1質量部~5質量部である、シール材の製造方法。
(A)成分:数平均分子量が1000以上である、2個以上の(メタ)アクリロイル基を有するポリマー
(B)成分:ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30であるアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレート
(C)成分:前記波長(I)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤
(D)成分:395nm~435nmのいずれの波長においてもモル吸光係数が10L/(mol・cm)未満、かつ前記波長(II)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤
<2> 前記光(a)の照度が100mW/cm2~5000mW/cm2、照射量が100mJ/cm2~5000mJ/cm2であり、前記光(b)の照度が100mW/cm2~5000mW/cm2、照射量が200mJ/cm2~10000mJ/cm2である、前記<1>に記載のシール材の製造方法。
<3> 前記ポリマーが、
ウレタン(メタ)アクリレート(A-1)、又は
ポリイソブチレンを含む骨格を含み、かつウレタン結合を有しない(メタ)アクリレート(A-2)である、前記<1>又は<2>に記載のシール材の製造方法。
<4> 前記ポリマーが、前記ウレタン(メタ)アクリレート(A-1)であり、
前記ウレタン(メタ)アクリレート(A-1)が、水素添加ポリブタジエン、及び水素添加ポリイソプレンの少なくとも一方からなる骨格を含む、前記<3>に記載のシール材の製造方法。
<5> 前記ポリマーが、前記(メタ)アクリレート(A-2)である、前記<3>に記載のシール材の製造方法。
<6> 前記(C)成分が、アシルフォスフィンオキサイド系化合物、α-アミノアルキルフェノン系化合物、オキシムエステル系化合物、及びチオキサントン系化合物からなる群より選択される少なくとも1つを含む、前記<1>~<5>のいずれか1つに記載のシール材の製造方法。
<7> 前記(D)成分が、α-ヒドロキシアルキルフェノン系化合物、ベンジルケタール系化合物、及びベンゾフェノン系化合物からなる群より選択される少なくとも1つを含む、前記<1>~<6>のいずれか1つに記載のシール材の製造方法。
<8> 前記シール材が、燃料電池用途である、前記<1>~<7>のいずれか1つに記載のシール材の製造方法。
<9> 下記の(A)成分に由来する構成単位と、下記の(B)成分に由来する構成単位と、を含み、
圧縮永久歪み(JIS K6262:2013に準拠、但し、圧縮率を50%に、温度を140℃に、保持時間を72時間に変更)が、35%以下である、シール材。
(A)成分:数平均分子量が1000以上である、2個以上の(メタ)アクリロイル基を有するポリマー
(B)成分:ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30であるアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレート
<10> 前記ポリマーが、
ウレタン(メタ)アクリレート(A-1)、又は
ポリイソブチレンを含む骨格を含み、かつウレタン結合を有しない(メタ)アクリレート(A-2)である、前記<9>に記載のシール材。
本開示において、組成物中の各成分の量は、組成物中に各成分に該当する物質が複数存在する場合は、特に断らない限り、組成物中に存在する当該複数の物質の合計量を意味する。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において、好ましい態様の組み合わせは、より好ましい態様である。
本開示における基(原子団)の表記において、置換及び無置換を記していない表記は、置換基を有さないものと共に置換基を有するものをも包含するものである。
本開示において、「(メタ)アクリレート」とは、アクリレート及びメタクリレートの少なくとも一方を意味する。
本開示において、「ウレタン(メタ)アクリレート」とは、ウレタン骨格を有する(メタ)アクリレートポリマーを意味する。
本開示のシール材の製造方法は、光硬化型樹脂組成物に対して、395nm~435nmの少なくとも1つの波長(I)を含む光(a)を照射し、次いで200nm~385nmの少なくとも1つの波長(II)を含む光(b)を照射する工程(以下、「照射工程」ともいう)を含む。前記光(a)において波長範囲200nm~385nmの照射エネルギーが波長範囲395nm~435nmの照射エネルギーの0.2倍以下である。前記光硬化型樹脂組成物は、下記の(A)成分~(D)成分(すなわち、(A)成分、(B)成分、(C)成分及び(D)成分)を含有する。前記(A)成分及び前記(B)成分の合計を100質量部に対して、前記(A)成分の含有量が10質量部~70質量部、前記(B)成分の含有量が30質量部~90質量部、前記(C)成分の含有量が0.01質量部~0.9質量部、前記(D)成分の含有量が0.1質量部~5質量部である。
(A)成分:数平均分子量(以下、「Mn」ともいう)が1000以上である2個以上の(メタ)アクリロイル基を有するポリマー
(B)成分:ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30であるアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレート
(C)成分:前記波長(I)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤
(D)成分:395nm~435nmのいずれの波長においてもモル吸光係数が10L/(mol・cm)未満、かつ前記波長(II)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤
「数平均分子量」とは、ゲルパーミエーションクロマトグラフィー(以下、「GPC」ともいう)により測定した分子量をポリスチレン換算した値を示す。
以下に記載の測定条件にてゲルパーミエーションクロマトグラフィー(GPC)測定を行い、ポリスチレン換算による数平均分子量(Mn)及び重量平均分子量(Mw)を得ることができる。
<測定条件>
装置 :東ソー(株)製HLC-8320
カラム :東ソー(株)製TSKgel-SuperMultipore HZ-M(4.6mmID×15cm)×3本(低分子用、排除限界分子量200万)
カラム温度 :40℃
溶離液 :テトラヒドロフラン(0.35ml/min)
検出器 :RI
サンプル濃度:0.1%
式(A):ε=log(Io/I)/(c×d)
光ラジカル重合開始剤のモル吸光係数は、例えば次に記載の方法に従って測定できる。溶剤としてアセトニトリルを用い、濃度が1g/Lとなるよう光ラジカル重合剤を溶解させ、石英セルを用い、紫外可視分光光度計で吸光度を室温条件で測定し、ランバート・ベールの法則を用いて算出する。吸光度が2.0を超える波長については、吸光度が0.1~2.0の範囲になる濃度で光ラジカル重合開始剤を溶解させ、石英セルを用い、紫外可視分光光度計で吸光度を室温条件で測定し、ランバート・ベールの法則を用いて算出する。
以下、「200nm~385nmの少なくとも1つの波長(II)を含む光(b)を照射すること」を「光照射(b)」ともいう。
光硬化型樹脂組成物が(A)成分を含むことにより、照射工程の実施により架橋構造が形成される。これにより、シール材の耐へたり性は、向上する。その結果、シール材の高温での圧縮永久歪みは、小さくなる。(A)成分の含有量が10質量部未満であると、(A)成分の配合効果は不十分となる。(A)成分の含有量が70質量部超であると、シール材の耐圧縮性が悪化して、シール材の圧縮時にシール材に割れが発生する。
光硬化型樹脂組成物は、(B)成分を含むことにより、シール材のガラス転移温度が低下して、シール材は低温(例えば、0℃)でゴム弾性を有する。(B)成分の単官能(メタ)アクリレートが、炭素数5以上のアルキル基を有することで、(A)成分と混和できるとともに、シール材の耐加水分解性は向上する。
(C)成分の含有量が0.01質量部以上であることにより、光照射(a)により光硬化型樹脂組成物の硬化は進行する。光照射(a)による光硬化型樹脂組成物の硬化は、十分に進んでおらず、光硬化型樹脂組成物の反応率が上がりきっていない。そのため、続く光照射(b)により、光硬化型樹脂組成物の硬化を十分に進行させる(そのために、光硬化型樹脂組成物は、(D)成分を含有する)。(C)成分の含有量が0.9質量部以下であることにより、シール材の圧縮永久歪みは、小さくなる。
(D)成分の含有量が0.1質量部以上であることにより、光照射(b)による光硬化型樹脂組成物の硬化は進行する。これにより、光照射(a)の実施後に、光硬化型樹脂組成物の硬化は十分に進行する。(D)成分の含有量が0.1質量部未満であると、光硬化型樹脂組成物の硬化は十分に進行しない。(D)成分の含有量が5質量部以下であることにより、シール材の圧縮永久歪みは小さくなる。
本開示では、光照射(a)により光硬化型樹脂組成物の硬化を一部進行させた後に、光照射(b)により光硬化型樹脂組成物の硬化を十分に進行させる。そうすることで、(C)成分及び(D)成分の含有量が少なくても、照射工程の実施により、光硬化型樹脂組成物を短時間で硬化させることができる。その結果、シール材の圧縮永久歪みは、小さくなる。
照射工程において、光照射(a)及び光照射(b)の一方のみが実施される場合、硬化型樹脂組成物の短時間硬化と、シール材の圧縮永久歪みを小さくすることとの両立は、困難となる。
詳しくは、光ラジカル重合開始剤(すなわち、(C)成分及び(D)成分)の含有量が多い場合、高照度の光を用いて短時間で硬化型樹脂組成物の硬化を十分に進行させられるが、得られるシール材の圧縮永久歪みは大きい。
光ラジカル重合開始剤(すなわち、(C)成分及び(D)成分)の含有量が少なく、かつ高照度の光が用いられる場合、硬化型樹脂組成物の硬化が十分に進行する前に光ラジカル重合開始剤はすべて消費される。そのため、短時間で硬化型樹脂組成物の硬化を十分に進行させることができない。光ラジカル重合開始剤(すなわち、(C)成分及び(D)成分)の含有量が少なく、かつ低照度の光が用いられる場合、シール材の圧縮永久歪みは小さいが、硬化型樹脂組成物を硬化するために長時間を要する。
これらにより、本開示のシール材の製造方法は、高圧縮率、高温及び長時間の圧縮永久歪み試験において圧縮永久歪みが小さいシール材を短時間硬化で製造することができると推測される。
準備工程では、光硬化型樹脂組成物を準備する。
光硬化型樹脂組成物は、(A)成分~(D)成分を特定の割合で含有する。
光硬化型樹脂組成物は、(A)成分を含有する。(A)成分は、Mnが1000以上である、2個以上の(メタ)アクリロイル基を有するポリマーである。(A)成分は、2個の(メタ)アクリロイル基を有することが好ましい。
(A-1)成分は、上述したように、Mnが1000以上である、2個以上の(メタ)アクリロイル基を有するウレタン(メタ)アクリレート(A-1)である。
これにより、耐熱性と耐加水分解性に一層優れた硬化物を得ることができる。
・(A-1-1)成分:ポリジエン系アルコール、ポリイソシアネート、及び水酸基を有する(メタ)アクリレートのウレタン化反応物
・(A-1-2)成分:ポリジエン系アルコールに対するイソシアネート基と(メタ)アクリロイル基を有する化合物の付加反応物
これらのうち、二重結合に水素添加したものが、高温での圧縮永久歪みが良好になるため好ましい。中でも、水素添加ポリブタジエンジオール又は水素添加ポリイソプレンジオールが好ましい。水素添加ポリブタジエンジオールおよび水素添加ポリイソプレンジオールは、併用されてよい。
ポリジエンジオールのMnは、好ましくは500~5000、より好ましくは1000~4000である。
ジイソシアネートとしては、例えば、脂肪族ジイソシアネート(例えば、ヘキサメチレンジイソシアネート等)、脂環式ジイソシアネート(例えば、イソホロンジイソシアネート、水添トリレンジイソシアネート、水添ジフェニルメタンジイソシアネート、又は水添キシリレンジイソシアネート等)、又は芳香族ジイソシアネート(例えば、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、トリジンジイソシアネート、ナフタレンジイソシアネート、又はキシリレンジイソシアネート等)等が挙げられる。
これら化合物の中でも、水酸基及び(メタ)アクリロイル基を含む化合物としては、ヒドロキシアルキル(メタ)アクリレート(2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、又は4-ヒドロキシブチル(メタ)アクリレート等)が好ましい。
本開示においては、製法1で得られたポリジエン系ウレタン(メタ)アクリレートが好ましい。これにより、分子量の制御が容易である。製法1で得られるポリジエン系ウレタン(メタ)アクリレートが、他の成分に対する溶解性に優れる。得られる組成物が接着力に優れる。
(A-2)成分は、上述したように、Mnが1000以上である、2個以上の(メタ)アクリロイル基を有し、ポリイソブチレン(-[CH2C(CH3)2]-単位)を含む骨格を含み、かつウレタン結合を有しない(メタ)アクリレート(A-2)である。(A-2)成分の骨格は、ポリイソブチレンからなってもよい。
光硬化型樹脂組成物は、(B)成分を含有する。(B)成分は、ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30のアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレートである。
(B)成分のホモポリマーのガラス転移温度(Tg)は、示差走査熱量計を用いて得られた熱流束曲線のベースラインと変曲点での接線の交点から決定できる。測定機器、及び測定条件は以下の通り設定して測定してよい。
熱流束曲線は、試料約5mgを20℃/minで70℃まで昇温し、5分間保持した後、-20℃/minで-150℃まで冷却し、5分間保持した後、再び20℃/minで70℃まで昇温する条件として得る。
<測定機器及び測定条件>
測定機器:NETZSCH社製DSC 214 Polyma
測定雰囲気:窒素雰囲気下
光硬化型樹脂組成物は、(C)成分を含有する。(C)成分は、395nm~435nmの少なくとも1つの波長(I)においてモル吸光係数が10L/(mol・cm)以上となる光ラジカル重合開始剤である。
(C)成分の条件を満たすα-アミノアルキルフェノン化合物としては、例えば、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタン-1-オン(Omnirad 369)、又は2-ジメチルアミノ-2-(4-メチル-ベンジル)-1-(4-モルフォリン-4-イル-フェニル)-ブタン-1-オン(IRGACURE379又は379EG)等が挙げられる。
(C)成分の条件を満たすオキシムエステル系化合物としては、例えば、1,2-オクタンジオン,1-[4-(フェニルチオ)-,2-(O-ベンゾイルオキシム)(IRGACURE OXE01)等が挙げられる。
チオキサントン系化合物としては、例えば、チオキサントン、2-クロロチオキサントン、2,4-ジエチルチオキサントン、イソプロピルチオキサントン、1-クロロ-4-プロピルチオキサントン、3-[3,4-ジメチル-9-オキソ-9H-チオキサントン-2-イル]オキシ]-2-ヒドロキシプロピル-N,N,N-トリメチルアンモニウムクロライド又はフロロチオキサントン等が挙げられる。
(C)成分は、アシルフォスフィンオキサイド系化合物、(C)成分の条件を満たすα-アミノアルキルフェノン系化合物、(C)成分の条件を満たすオキシムエステル系化合物、及びチオキサントン系化合物からなる群より選択される少なくとも1つであってもよい。
得られるシール材の圧縮永久歪みをより低くする観点から、(C)成分は、アシルフォスフィンオキサイド化合物を含むことがより好ましく、アシルフォスフィンオキサイド化合物であることがさらに好ましい。
光硬化型樹脂組成物は、(D)成分を含有する。(D)成分は、395nm~435nmのいずれの波長においてもモル吸光係数が10L/(mol・cm)未満、かつ200nm~385nmの少なくとも1つの波長(II)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤である。
(D)成分の条件を満たすα-アミノアルキルフェノン化合物としては、例えば、2-メチル-1[4-(メチルチオ)フェニル]-2-モルフォリノプロパン-1-オン(IRGACURE907)等が挙げられる。
ベンジルケタール系化合物としては、例えば、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン(Omnirad 651)等が挙げられる。
(D)成分の条件を満たすオキシムエステル系化合物としては、例えば、エタノン,1-[9-(エチル)-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(O-アセチルオキシム)(IRGACURE OXE02)等が挙げられる。
ベンゾフェノン系化合物としては、例えば、ベンゾフェノン、2-メチルベンゾフェノン、3-メチルベンゾフェノン、4-メチルベンゾフェノン、2,4,6-トリメチルベンゾフェノン、4-フェニルベンゾフェノン、4-(4-メチルフェニルチオ)ベンゾフェノン、1-[4-(4-ベンゾイルフェニルスルファニル)フェニル]-2-メチル-2-(4-メチルフェニルスルフォニル)プロパン-1-オン、4,4'-ビス(ジメチルアミノ)ベンゾフェノン、4,4'-ビス(ジエチルアミノ)ベンゾフェノン又は4-メトキシ-4'-ジメチルアミノベンゾフェノン等が挙げられる。
前記(D)成分は、α-ヒドロキシアルキルフェノン系化合物、ベンジルケタール系化合物、及びベンゾフェノン系化合物からなる群より選択される少なくとも1つであってもよい。
光硬化型樹脂組成物は、本開示の効果を損なわない限り、他の成分を含有してもよい。他の成分としては、例えば、熱重合開始剤、紫外線吸収剤、光安定剤、酸化防止剤、重合禁止剤、シランカップリング剤、非反応性ポリマー、フィラー、金属微粒子、金属酸化物微粒子、イオントラップ剤、消泡剤、レベリング剤、色素又は顔料等が挙げられる。
成形工程では、光硬化型樹脂組成物をシール材の形状に成形する。
照射工程では、光硬化型樹脂組成物に対して、395nm~435nmの少なくとも1つの波長(I)を含む光(a)を照射し、次いで200nm~385nmの少なくとも1つの波長(II)を含む光(b)を照射する。これにより、光硬化型樹脂組成物は硬化して、シール材が得られる。
光(a)の波長は、395nm~435nmの少なくとも1つの波長(I)を含めば、(C)成分の種類及び(D)成分の種類等に応じて適宜選択される。波長(I)は、395nm~420nmの少なくとも1つを含んでもよいし、400nm~410nmの少なくとも1つを含んでもよいし、405nmを含んでもよい。
光(a)として200~450nmの波長範囲において395~435nmの波長範囲に照度の極大ピークを有するものを好ましく使用できる。照度の極大ピークとなる波長範囲は好ましくは395~420nm、より好ましくは400~410nmである。
光(a)の照度は、(C)成分の種類及び(D)成分の種類等に応じて適宜選択される。光(a)の照度は、100mW/cm2~5000mW/cm2であってもよいし、200mW/cm2~2000mW/cm2であってもよいし、500mW/cm2~1500mW/cm2であってもよい。
光(a)の照射量は、(C)成分の種類及び(D)成分の種類等に応じて適宜選択される。光(a)の照射量は、100mJ/cm2~5000mJ/cm2であってもよいし、200mJ/cm2~4000mJ/cm2であってもよいし、1000mJ/cm2~4000mJ/cm2であってもよい。
光(b)の波長は、200mm~385nmの少なくとも1つの波長(II)を含めば、(C)成分の種類及び(D)成分の種類等に応じて適宜選択される。波長(II)は、300nm~385nmの少なくとも1つを含んでもよいし、350nm~380nmの少なくとも1つを含んでもよいし、365nmを含んでもよい。
光(b)として200~450nmの波長範囲において200~385nmの波長範囲に照度の極大ピークを有するものを好ましく使用できる。照度の極大ピークとなる波長範囲は好ましくは300~385nm、より好ましくは350~385nmである。
光(b)の照度は、(C)成分の種類及び(D)成分の種類等に応じて適宜選択される。光(b)の照度は、100mW/cm2~5000mW/cm2であってもよいし、200mW/cm2~3000mW/cm2であってもよいし、500mW/cm2~2000mW/cm2であってもよい。
光(b)の照射量は、(C)成分の種類及び(D)成分の種類等に応じて適宜選択される。光(b)の照射量は、200mJ/cm2~10000mJ/cm2であってもよいし、500mJ/cm2~10000mJ/cm2であってもよいし、2000mJ/cm2~7000mJ/cm2であってもよい。
前記光(a)の照度が100mW/cm2~5000mW/cm2、照射量が100mJ/cm2~5000mJ/cm2であり、前記光(b)の照度が100mW/cm2~5000mW/cm2、照射量が200mJ/cm2~10000mJ/cm2であることが好ましい。これにより、低圧縮歪みと短時間硬化を両立させることができる。
本開示のシール材の製造方法によって製造されるシール材(以下、単に「シール材」ともいう)は、例えば、防水、制水、防振、制振、応力緩和、隙間補完、がたつき防止、ずれ防止、又は衝突音軽減等の目的で好適に用いられる。
本開示のシール材は、下記の(A)成分に由来する構成単位と、下記の(B)成分に由来する構成単位と、を含む。圧縮永久歪み(JIS K6262:2013に準拠、但し、圧縮率を50%に、温度を140℃に、保持時間を72時間に変更)は、35%以下である。
(A)成分:数平均分子量が1000以上である2個以上の(メタ)アクリロイル基を有するポリマー
(B)成分:ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30であるアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレート
(A)成分としては、本開示のシール材の製造方法の(A)成分として例示したものと同様のものが挙げられる。中でも、前記ポリマーは、ウレタン(メタ)アクリレート(A-1)、又はポリイソブチレンからなる骨格を含み、かつウレタン結合を有しない(メタ)アクリレート(A-2)であることが好ましい。これにより、シール材の圧縮永久歪みは、低減する。
(B)成分としては、本開示のシール材の製造方法の(B)成分として例示したものと同様のものが挙げられる。
(A)成分に由来する構成単位及び(B)成分に由来する構成単位の合計100質量部に対して、(B)成分に由来する構成単位の含量は、特に限定されず、好ましくは30質量部~90質量部である。(B)成分に由来する構成単位の含量としては、シール材の製造方法において(B)成分の含有量として例示した範囲と同様の範囲が挙げられる。
本開示のシール材の圧縮永久歪みは、35%以下であり、好ましくは30%以下であり、0%に近いほど好ましい。圧縮永久歪みの測定方法は、実施例に記載の方法と同様である。圧縮永久歪みを35%以下に調整する方法としては、上述した本開示のシール材の製造方法が挙げられる。
シール材の原料として、下記の材料を準備した。
(A-1)成分として、下記のPUA-1、PUA-2、UN-6304及びUN-6305を準備した。(A-2)成分として、下記のEP400Vを準備した。
・「UN-6304」:ポリエーテル骨格を有する二官能ウレタンアクリレート(根上工業(株)製の「アートレジン UN-6304」、Mw:13000、Tg:-74℃、粘度:200,000mPa・s25℃)
・「UN-6305」:ポリエーテル骨格を有する二官能ウレタンアクリレート(根上工業(株)製の「アートレジン UN-6305」、Mw:27000、Tg:-74℃、粘度:1,600,000mPa・s25℃)
・「PUA-1」 :水素添加ポリブタジエン骨格を有するウレタンアクリレート(下記の合成例1の生成物に含まれるウレタンアクリレート成分)
・「PUA-2」 :水素添加ポリイソプレン骨格を有するウレタンアクリレート(下記の合成例2の生成物に含まれるウレタンアクリレート成分)
・「EP400V」:アクリロイル末端ポリイソブチレン((株)カネカ製の「KANEKA EPION EP400V」、Mn=15,000、Mw=17,000、粘度3,500,000mPa・s23℃)
(B)成分として、下記のM-120、LA及びNOAAを準備した。
・「LA」 :ラウリルアクリレート(大阪有機化学工業(株)製の「LA」)、Tg:-23℃
・「NOAA」 :n-オクチルアクリレート(大阪有機化学工業(株)製の「NOAA」)、Tg:-65℃
(C)成分として、下記のTPO、O-380及びO-369を準備した。
・「O-369」:2-ベンジル-2-ジメチルアミノ-4’-モルフォリノブチロフェノン(IGMレジン社製の「Omnirad 369」)、ε(405nm):57L/(mol・cm)
・「TPO」 :2,4,6-トリメチルベンゾイル-ジフェニルホスフィンオキサイド(IGMレジン社製の「Omnirad TPO」)、ε(405nm):202L/(mol・cm)
(D)成分として、下記のO-127D、O-184、O-651及びE-ONEを準備した。
・「O-184」 :1-ヒドロキシ-シクロヘキシル-フェニル-ケトン(IGMレジン社製の「Omnirad 184」)395~435nmではモル吸光係数εは10L/(mol・cm)未満(例えば、ε(405nm):0L/(mol・cm))、ε(365nm):18L/(mol・cm)
・「O-651」 :2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン(IGMレジン社製の「Omnirad 651」)395~435nmではモル吸光係数εは10L/(mol・cm)未満(例えば、ε(405nm):0L/(mol・cm))、ε(365nm):121L/(mol・cm)
・「E-ONE」:オリゴ[2-ヒドロキシ-2-メチル-1-[4-1-(メチルビニル)フェニル]プロパノン(IGMレジン社製の「ESACURE ONE」、395~435nmではモル吸光係数εは10L/(mol・cm)未満(例えば、ε(405nm):0L/(mol・cm))、ε(365nm):33L/(mol・cm))
(A-1)成分としてのPUA-1(水素添加ポリブタジエン骨格を有するウレタンアクリレート)は、下記のようにして合成した。
(A-1)成分としてのPUA-2(水素添加ポリイソプレン骨格を有するウレタンアクリレート)は、下記のように合成した。
[2.1]準備工程
成分(A)~成分(D)を表1~表4に示す割合で配合し、常法に従って攪拌混合して、光硬化型樹脂組成物を得た。光硬化型樹脂組成物の調整の際、必要に応じて、約80℃に加熱した。
尚、(B)成分の部数は、合成例1および合成例2の生成物中に含まれる(B)成分を含んでおり、(B)成分は合成例1および合成例2の生成物中に含まれる(B)成分と後から添加した(B)成分の合計部数を示す。
[2.2.1]成形工程
PET(ポリエチレンテレフタラート)フィルム上に設置した厚さ1mmのシリコーン枠型を準備した。[2.1]で調製した光硬化型樹脂組成物をシリコーン枠型に流し込み、PETフィルムでラミネートした。
シリコーン枠型に流し込まれた光硬化型樹脂組成物に405nmの波長を有する光(以下、「照射光(405nm)」ともいう)(光(a)に対応)を照射し、次いで、365nmの波長を有する光(以下、「照射光(365nm)」ともいう)(光(b)に対応)を照射した。これにより、光硬化型樹脂組成物の硬化物(以下、「第1シール材」ともいう)が得られた。照射光(405nm)の光源には、405nmのLED(CCS株式会社製の面型LED照射器)を使用した。照射光(365nm)の光源には、365nmのLED(ARK TECH株式会社製の面型LED照射器)を使用した。照度測定には、浜松ホトニクス(株)製のC12684照度計を使用した。
第1シール材のIRスペクトルと、光硬化型樹脂組成物の未硬化物のIRスペクトルと、をPerkin Elmer社製のFT-IR装置「Spectrum two」で測定した。IRスペクトルからC=O結合に由来するピークとC=C結合に由来するピークの高さを算出し、以下の計算式(B)より、反応率を計算した。
「A1」:反応率が95%以上
「B1」:反応率が95%未満
「反応率が95%未満であったこと」は、光硬化型樹脂組成物の硬化が十分進行しておらず、第1シール材が得られなかったことを示す。
光硬化型樹脂組成物の反応率が95%以上であった実施例及び比較例(評価結果が「A1」であった実施例及び比較例)について、405nmのLEDの照射時間と、365nmのLEDの照射時間と、を合算して、照射時間の合計を算出した。
「A2」:照射時間の合計が10秒以下
「B2」:照射時間の合計が10秒超
光硬化型樹脂組成物の反応率が95%以上であった実施例及び比較例(評価結果が「A1」であった実施例及び比較例)について、圧縮永久歪み測定を以下の方法で実施した。
シリコーン枠型のサイズを変更したことの他は、上記[2.2.2]と同様にして照射工程を実施して、光硬化型樹脂組成物の硬化物(以下、「第2シール材」ともいう)を得た。第2シール材のサイズは、縦7mm×横2mm×厚さ1mmであった。
JIS K6262:2013に準拠する治具で圧縮永久歪み試験を実施した。治具を用いて第2シール材を圧縮率50%で圧縮して、治具付き第2シール材を得た。治具付き第2シール材を恒温槽(温度:140℃)に入れて72時間放置した。その後、治具付き第2シール材を恒温槽から取り出し、圧縮を解放して第2シール材を治具から取り出した。次いで、第2シール材を室温(25℃)下で30分放置した。最後に、第2シール材の厚みを測定し、圧縮永久歪み(以下、「圧縮永久歪み(50%圧縮、140℃、72時間)」ともいう)を算出した。
「A3+」:圧縮永久歪みが35%以下
「A3」 :圧縮永久歪みが35%超え45%以下
「B3」 :圧縮永久歪みが45%超え
治具付き第2シール材を恒温槽(温度:120℃)に入れて1000時間放置したことの他は、上記[2.3.2]と同様にして、第2シール材の圧縮永久歪み(以下、「圧縮永久歪み(50%圧縮、120℃、1000時間)」ともいう)を算出した。圧縮永久歪み(50%圧縮、120℃、1000時間)を表1~表4に示す。
速硬化性の評価結果と圧縮永久歪みの評価結果とを用いて、以下の評価基準で、シール材の製造方法を総合的に評価した。
「A4+」:圧縮永久歪みの評価結果が「A3+」、かつ速硬化性判定が「A2」
「A4」 :圧縮永久歪み判定が「A3」、かつ速硬化性判定が「A2」
「B4」 :圧縮永久歪み判定が「A3+」又は「A3」、かつ速硬化性判定が「B2」
「B4-」:圧縮永久歪み判定が「B3」又は圧縮永久歪みの未評価
[3.1]比較例1~16
比較例1、8では、光照射(a)が実施されなかった。比較例2、5、9、10、14、15では、(D)成分が含まれておらず、光照射(b)が実施されなかった。比較例3、4、6、13、16では、(C)成分が含まれておらず、光照射(a)が実施されなかった。比較例7では、(C)成分の含有量が、0.01質量部~0.9質量部の範囲内ではなかった。比較例11、12では、(D)成分の含有量が、0.1質量部~5質量部の範囲内ではなかった。そのため、比較例1~16の総合評価は、「B4」又は「B4-」であった。これらの結果から、比較例1~16のシール材の製造方法は、高圧縮率、高温及び長時間の圧縮永久歪み試験において圧縮永久歪みが小さいシール材を短時間硬化で製造することができるシール材の製造方法ではないことがわかった。
実施例1~実施例15のシール材の製造方法は、光照射(a)及び光照射(b)が実施される照射工程を含んでいた。光硬化型樹脂組成物は、(A)成分~(D)成分を特定の割合で含有していた。そのため、実施例1~15の総合評価は、「A4+」又は「A4」であった。これらの結果から、実施例1~15のシール材の製造方法は、高圧縮率、高温及び長時間の圧縮永久歪み試験において圧縮永久歪みが小さいシール材を短時間硬化で製造することができるシール材の製造方法であることがわかった。
比較例1では、光硬化型樹脂組成物は実施例1と同一であったが、光照射(a)が実施されなかった。比較例1の圧縮永久歪みは、十分ではなかった。
比較例2~4では、光硬化型樹脂組成物は、(C)成分及び(D)成分の一方を含有し、(C)成分及び(D)成分の一方の含有量が実施例1と同じ含有量(0.5質量部)であった。比較例2、3では、照度は実施例1と同じ照度(750mW/cm2)であったが、反応率は十分ではなかった。比較例4では、照度が低い(50mW/cm2)と反応率が十分に上がり、圧縮永久歪みは実施例1と同程度であったが、速硬化性は、十分ではなかった。
比較例5、6では、光硬化型樹脂組成物は、(C)成分又は(D)成分の一方を含有し、その(C)成分又は(D)成分の含有量は、実施例1の(C)成分の含有量と(D)成分の含有量の合計(1質量部)と同じであった。比較例5、6では、照度は実施例1と同じ照度(750mW/cm2)であり、反応率が十分であったが、圧縮永久歪みが十分ではなかった。
実施例2、3では、(C)成分の含有量が実施例1より少なく、圧縮永久歪みは、実施例1より低かった。実施例4では、(C)成分の含有量が実施例2、3より少なく、圧縮永久歪みは実施例1より高かった。
比較例7では、(C)成分の含有量が高く、圧縮永久歪みは十分ではなかった。
実施例1と実施例3との対比から、圧縮永久歪み(圧縮率:50%、温度:140℃、保持時間:72時間)が良好だと、圧縮永久歪み(圧縮率:50%、温度:120℃、保持時間:1,000時間)も良好であった。
比較例8では、光硬化型樹脂組成物は実施例3と同一であったが、光照射(a)は実施されなかった。比較例8では、圧縮永久歪みが実施例3より悪化するとともに、速硬化性は十分ではなかった。
比較例9、10では、光硬化型樹脂組成物は(D)成分を含有せず、(C)成分の含有量は比較的低い実施例3の含有量(0.1質量部)と同一であった。比較例9では、照度が実施例3と同じ照度(750mW/cm2)であったが、反応率は十分ではなかった。比較例10では、照度が低く(30 mW/cm2)、反応率及び圧縮永久歪みは実施例3と同程度であったが、速硬化性は十分ではなかった。
(C)成分として、「Omnirad 380」と同じくアシルフォスフィンオキサイド系化合物である「TPO」(実施例5)と、α-アミノアルキルフェノン化合物である「Omnirad 369」(実施例6)とを検討した。実施例5、6では、圧縮永久歪みはどちらも十分であった。実施例3及び5(アシルホスフィンオキシド系化合物)の方が、圧縮永久歪みはより良好であった。
(D)成分の含有量が0.5質量部より高い場合について検討した。(D)成分の含有量が2質量部以上であると、(D)成分の含有量が高くなるにつれて圧縮永久歪みは高くなった(実施例8、9、10、比較例11、12)。(D)成分の含有量が0.2質量部では、圧縮永久歪みは実施例3より高かった(実施例7)。
(D)成分として、「Omnirad 127D」と同じくα-ヒドロキシアルキルフェノン系化合物である「Omnirad 184」(実施例11)と、ベンジルケタール系化合物である「Omnirad 651」(実施例12)を検討した。圧縮永久歪み評価は、十分であった。
(A)成分として水素添加ポリブタジエン骨格のウレタンアクリレートと、(B)成分としてアルキルアクリレートのラウリルアクリレートとを検討した。これまでのポリエーテル骨格のウレタンアクリレートを用いた場合と同様に、(C)成分及び(D)成分を特定の割合で含有し、光照射(a)及び光照射(b)を含む照射工程の実施により圧縮永久歪みは良好であった(実施例13)一方で、(C)成分又は(D)成分のいずれか一方を含有し、光照射(a)又は光照射(b)のいずれか一方を含む照射工程を実施した場合、反応率が十分ではなかったり、反応率は十分であったが圧縮永久歪みが十分ではなかったりした(比較例13~15)。(A)成分として水素添加イソプレン骨格のウレタンアクリレートを検討したところ、圧縮永久歪みは十分であった(実施例14)。
(A)成分としてポリイソブチレンジアクリレートと、(B)成分としてアルキルアクリレートのn-オクチルアクリレートとを検討した。これまでのウレタンアクリレートを用いた場合と同様に、(C)成分及び(D)成分を特定の割合で含有し、光照射(a)及び光照射(b)を含む照射工程の実施により圧縮永久歪みは良好であった(実施例15)一方で、(D)成分のみを含有し、光照射(b)のみを含む照射工程を実施した場合、反応率は十分であったが圧縮永久歪みが十分ではなかった(比較例16)。
本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。
Claims (10)
- 光硬化型樹脂組成物に対して、395nm~435nmの少なくとも1つの波長(I)を含む光(a)を照射し、次いで200nm~385nmの少なくとも1つの波長(II)を含む光(b)を照射する工程を含み、
前記光(a)において波長範囲200nm~385nmの照射エネルギーが波長範囲395nm~435nmの照射エネルギーの0.2倍以下であり、
前記光硬化型樹脂組成物が、下記の(A)成分~(D)成分を含有し、
前記(A)成分及び前記(B)成分の合計100質量部に対して、前記(A)成分の含有量が10質量部~70質量部、前記(B)成分の含有量が30質量部~90質量部、前記(C)成分の含有量が0.01質量部~0.9質量部、前記(D)成分の含有量が0.1質量部~5質量部である、シール材の製造方法。
(A)成分:数平均分子量が1000以上である、2個以上の(メタ)アクリロイル基を有するポリマー
(B)成分:ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30であるアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレート
(C)成分:前記波長(I)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤
(D)成分:395nm~435nmのいずれの波長においてもモル吸光係数が10L/(mol・cm)未満、かつ前記波長(II)においてモル吸光係数が10L/(mol・cm)以上である光ラジカル重合開始剤 - 前記光(a)の照度が100mW/cm2~5000mW/cm2、照射量が100mJ/cm2~5000mJ/cm2であり、
前記光(b)の照度が100mW/cm2~5000mW/cm2、照射量が200mJ/cm2~10000mJ/cm2である、請求項1に記載のシール材の製造方法。 - 前記ポリマーが、
ウレタン(メタ)アクリレート(A-1)、又は
ポリイソブチレンを含む骨格を含み、かつウレタン結合を有しない(メタ)アクリレート(A-2)である、請求項1又は請求項2に記載のシール材の製造方法。 - 前記ポリマーが、前記ウレタン(メタ)アクリレート(A-1)であり、
前記ウレタン(メタ)アクリレート(A-1)が、水素添加ポリブタジエン、及び水素添加ポリイソプレンの少なくとも一方からなる骨格を含む、請求項3に記載のシール材の製造方法。 - 前記ポリマーが、前記(メタ)アクリレート(A-2)である、請求項3に記載のシール材の製造方法。
- 前記(C)成分が、アシルフォスフィンオキサイド系化合物、α-アミノアルキルフェノン系化合物、オキシムエステル系化合物、及びチオキサントン系化合物からなる群より選択される少なくとも1つを含む、請求項1又は請求項2に記載のシール材の製造方法。
- 前記(D)成分が、α-ヒドロキシアルキルフェノン系化合物、ベンジルケタール系化合物、及びベンゾフェノン系化合物からなる群より選択される少なくとも1つを含む、請求項6に記載のシール材の製造方法。
- 前記シール材が、燃料電池用途である、請求項7に記載のシール材の製造方法。
- 下記の(A)成分に由来する構成単位と、下記の(B)成分に由来する構成単位と、を含み、
圧縮永久歪み(JIS K6262:2013に準拠、但し、圧縮率を50%に、温度を140℃に、保持時間を72時間に変更)が、35%以下である、シール材。
(A)成分:数平均分子量が1000以上である、2個以上の(メタ)アクリロイル基を有するポリマー
(B)成分:ホモポリマーのガラス転移温度(Tg)が20℃以下であり、炭素数が5~30であるアルキル基を有し、1分子中に1個の(メタ)アクリロイル基を有する単官能(メタ)アクリレート - 前記ポリマーが、
ウレタン(メタ)アクリレート(A-1)、又は
ポリイソブチレンを含む骨格を含み、かつウレタン結合を有しない(メタ)アクリレート(A-2)である、請求項9に記載のシール材。
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