WO2024203362A1 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
WO2024203362A1
WO2024203362A1 PCT/JP2024/009894 JP2024009894W WO2024203362A1 WO 2024203362 A1 WO2024203362 A1 WO 2024203362A1 JP 2024009894 W JP2024009894 W JP 2024009894W WO 2024203362 A1 WO2024203362 A1 WO 2024203362A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
organic resin
resin layer
substrate
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2024/009894
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English (en)
French (fr)
Japanese (ja)
Inventor
有平 松本
泉太郎 山元
幸雄 森田
和貴 西本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2025510456A priority Critical patent/JPWO2024203362A1/ja
Publication of WO2024203362A1 publication Critical patent/WO2024203362A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • a display device has been proposed that has a laminated structure in which wiring is arranged between multiple insulating layers.
  • the multilayer substrate according to one embodiment of the present invention has a carbonaceous substrate layer and an organic resin layer.
  • the organic resin layer is located on the carbonaceous substrate layer.
  • the carbonaceous substrate layer has a higher thermal conductivity than the organic resin layer.
  • FIG. 1 is a cross-sectional view showing an example of a multilayer substrate according to a first embodiment.
  • FIG. 2 is a cross-sectional view showing an example of a multilayer substrate according to the second embodiment.
  • FIG. 3A is a cross-sectional view illustrating an example of a multilayer substrate according to a third embodiment.
  • FIG. 3B is a cross-sectional view taken along line AA shown in FIG. 3A.
  • FIG. 4 is a cross-sectional view showing an example of a multilayer substrate according to the fourth embodiment.
  • the laminated structure described above has room for improvement in terms of heat dissipation.
  • First Embodiment Fig. 1 is a cross-sectional view showing an example of a multilayer substrate according to embodiment 1. As shown in Fig. 1, the multilayer substrate 1 according to embodiment 1 has a substrate 10 and an organic resin layer 20.
  • the substrate 10 has faces 101 and 102 located at both ends in the thickness direction. Face 101 is located on the organic resin layer 20 side. Face 102 is located on the opposite side to the organic resin layer 20.
  • substrate 10 has surface 101 and surface 102.
  • Substrate 10 may have a so-called hexahedral shape.
  • Surfaces 101 and 102 may be the surfaces of this hexahedron with the largest area.
  • Surfaces 101 and 102 may be arranged opposite each other on substrate 10, as shown in FIG. 1.
  • surfaces 101 and 102 may be arranged opposite each other on substrate 10, and each may constitute a main surface.
  • the substrate 10 may be composed of a carbonaceous substrate layer 11.
  • the carbonaceous substrate layer 11 may be used as the substrate 10.
  • the substrate 10 may be a carbonaceous substrate layer 11.
  • the substrate 10 has high heat dissipation properties and functions as a so-called heat dissipation substrate.
  • the organic resin layer 20 is located on the substrate 10.
  • the organic resin layer 20 is located above the carbonaceous substrate layer 11.
  • the organic resin layer 20 has faces 201 and 202 located at both ends in the thickness direction. Face 201 is located on the substrate 10 side, and face 202 is located on the opposite side to the substrate 10.
  • the organic resin layer 20 is, for example, a so-called organic base material having a polymer material.
  • the organic resin layer 20 may be, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, a polyimide resin, an olefin resin, or a polyphenylene resin.
  • the organic resin layer 20 may be, for example, polytetrafluoroethylene (PTFE) or other fluororesins, or polyphenylene ether resin.
  • PTFE polytetrafluoroethylene
  • the carbonaceous substrate layer 11 has a higher thermal conductivity than the organic resin layer 20. This results in a multilayer substrate 1 with high heat dissipation properties.
  • the carbonaceous substrate layer 11 may have a larger volume fraction than the organic resin layer 20.
  • the volume fraction of the carbonaceous substrate layer 11 refers to the volume fraction of the carbonaceous substrate layer 11 among the members constituting the multilayer substrate 1.
  • the volume fraction of the organic resin layer 20 refers to the volume fraction of the organic resin layer 20 among the members constituting the multilayer substrate 1.
  • the organic resin layer 20 may also contain carbon particles located in the polymer material.
  • the organic resin layer 20 may be a composite material in which a polymer material and carbon particles are combined.
  • the organic resin layer 20 contains the same chemical components as the adjacent carbonaceous substrate layer 11, which improves the bond strength between the carbon atoms when laminated together, thereby improving the durability of the multilayer substrate 1.
  • the organic resin layer 20 may also contain inorganic particles such as silica and alumina in addition to the carbon particles.
  • the organic resin layer 20 may also have a partial void 203.
  • the void 203 By having the void 203, the volume ratio of the organic resin layer 20 in the multilayer substrate 1 becomes even smaller. This further improves the heat dissipation properties of the multilayer substrate 1.
  • the void 203 has a shape or contour that corresponds to an open pore and a closed pore.
  • the organic resin layer 20 may have through holes 204 in addition to the voids 203.
  • the through holes 204 refer to spaces that penetrate between the surfaces 201 and 202 of the organic resin layer 20. This makes it difficult for heat to move in the lateral direction that intersects with the thickness direction of the organic resin layer 20, while making it easier for heat to move toward the carbonaceous substrate layer 11, which has a higher thermal conductivity than the organic resin layer 20. This makes it possible to improve the heat dissipation in the thickness direction (stacking direction) of the multilayer substrate 1.
  • the maximum diameter of the through holes 204 may be approximately 10 to 10,000 when the average value of the maximum diameters of the individual voids 203 measured for the voids 203 is taken as 1.
  • the maximum diameter of the through hole 204 may be defined as the larger of the maximum diameter of the space forming the through hole 204 or the maximum length in the thickness direction of the organic resin layer 20.
  • the number frequency or volume of the voids 203 may be distributed so that one side in the thickness direction is higher than the other side.
  • a heat-generating electrical element such as a semiconductor element is placed inside the through hole 204.
  • the electrical element is positioned in the thickness direction of the organic resin layer 20 on the side where the number frequency or volume of the voids 203 is high.
  • the volume refers to the total volume obtained by adding up the individual volumes of the multiple voids 203 contained in the volume of a specific portion of the organic resin layer 20.
  • a region where the number frequency of voids 203 is high is a region where the number frequency is 1.5 or more when the number frequency of a region where the number frequency of voids 203 is low is set to 1.
  • a region where the volume of voids 203 is high is a region where the volume of a region where the volume of voids 203 is low is set to 1.
  • the multilayer substrate 1 may have an intermediate member layer 12.
  • the intermediate member layer 12 is disposed between the carbonaceous substrate layer 11 and the organic resin layer 20.
  • the intermediate member layer 12 may be, for example, a metal plate.
  • the thermal conductivity of each of the members constituting the multilayer substrate 1 should preferably be in the following relationship: (carbonaceous substrate layer 11)>(intermediate member layer 12)>(organic resin layer 20).
  • Specific values of thermal conductivity may be: the thermal conductivity of the carbonaceous substrate layer 11 may be 1500 W/m ⁇ K or more and 2000 W/m ⁇ K or less, the thermal conductivity of the intermediate member layer 12 may be 300 W/m ⁇ K or more and 500 W/m ⁇ K or less, and the thermal conductivity of the organic resin layer 20 may be 0.005 W/m ⁇ K or more and 3 W/m ⁇ K or less.
  • Fig. 3A is a cross-sectional view showing an example of a multilayer substrate according to the third embodiment.
  • Fig. 3B is a cross-sectional view taken along line A-A in Fig. 3A.
  • the same reference numerals as those of the multilayer substrate 1 according to the first embodiment shown in Fig. 1 and the multilayer substrate 1 according to the second embodiment shown in Fig. 2 are used for the multilayer substrate 1 shown in Fig. 3A as well.
  • This is used for convenience, since the multilayer substrate according to the third embodiment is also based on the multilayer substrate 1 according to the first embodiment.
  • the multilayer substrate 1 shown below is the multilayer substrate 1 according to the third embodiment.
  • the multilayer substrate 1 of the third embodiment shown in Figures 3A and 3B has a different shape of through hole compared to the multilayer substrate 1 shown in Figure 2.
  • the through hole 204 formed in the multilayer substrate 1 of the third embodiment may be drum-shaped.
  • the shape of the through hole 204 here refers to the shape of the space provided in the organic resin layer 20.
  • the right-hand portion of the organic resin layer 20 shown in FIG. 3B is referred to as the first organic resin layer part 20R, and the left-hand portion is referred to as the second organic resin layer part 20L.
  • the upper portion of the organic resin layer 20 shown in FIG. 3B is referred to as the third organic resin layer part 20U, and the lower portion of the organic resin layer 20 is referred to as the fourth organic resin layer part 20S.
  • the through hole 204 being shaped like a drum means that the first organic resin layer part 20R and the second organic resin layer part 20L have a protruding part 205 on the through hole 204 side.
  • the organic resin layer 20 may have a protruding part 205 in the third organic resin layer part 20U and the fourth organic resin layer part 20S shown in FIG. 3B.
  • the protruding part 205 is a part that protrudes in a convex shape toward the through hole 204.
  • the protruding part 205 is a part that includes the surface (inner wall 20W) that connects the surface 201 and the surface 202 that constitute the organic resin layer 20.
  • the protruding portion 205 is a portion that protrudes from the line 20WL toward the through hole 204.
  • the protruding portion 205 is preferably formed so as to surround the periphery of the through hole 204.
  • the first organic resin layer part 20R, the second organic resin layer part 20L, the third organic resin layer part 20U, and the fourth organic resin layer part 20S that constitute the organic resin layer 20 each have an inner wall 20W on the through hole 204 side, and the inner wall 20W is connected around the periphery of the through hole 204.
  • the protruding portion 205 including the inner wall 20W of the through hole 204 may be arranged so as to extend from the first organic resin layer portion 20R through the fourth organic resin layer portion 20S and the second organic resin layer portion 20L to the third organic resin layer portion 20U.
  • the protruding portion 205 is preferably in an integrated state in the range from the first organic resin layer portion 20R through the fourth organic resin layer portion 20S and the second organic resin layer portion 20L to the third organic resin layer portion 20U.
  • the opening diameter of the through hole 204 is formed so as to be smallest at any position in the thickness direction between the surface 201 and the surface 202.
  • the opening diameter of the through hole 204 may be formed so as to be smallest at the center in the thickness direction of the organic resin layer 20.
  • the opening diameter of the through hole 204 may be the same diameter at the surface 201 position and the diameter at the surface 202 position, or may be different. If the diameter at the surface 201 position and the diameter at the surface 202 position are different diameters, the position of the top of the protruding portion 205 in the thickness direction may be shifted toward either the surface 201 side or the surface 202 side.
  • the position of the top of the protruding portion 205 in the thickness direction is closer to the smaller diameter.
  • the diameter refers to the diameter (maximum diameter) at which the diameter value is maximum when the diameter of the through hole 204 is measured.
  • thermally conductive member such as TIM (Thermal Interface Material)
  • the inserted thermally conductive member tends to conform to the inner wall 20W of the through-hole 204.
  • the protruding portion 205 the thermally conductive member inside the through-hole 204 is less likely to come off to the outside. This makes it possible to ensure stable heat dissipation.
  • this multilayer board 1 can be suitably used in equipment that generates large vibrations.
  • the protrusion 205 may be located around the entire circumference of the through hole 204, or may be located only around a portion of the circumference of the through hole 204.
  • Fourth Embodiment 4 is a cross-sectional view showing an example of a multilayer board according to the fourth embodiment.
  • the same reference numerals as those of the multilayer board 1 of the first embodiment shown in FIG. 1 and the multilayer board 1 of the second embodiment shown in FIG. 2 are used for the multilayer board 1 shown in the fourth embodiment.
  • This is used for convenience because the multilayer board of the fourth embodiment is also based on the multilayer board 1 of the first embodiment.
  • the multilayer board 1 shown below is the multilayer board 1 according to the fourth embodiment.
  • the multilayer board 1 of the fourth embodiment may have a board 10 including a second intermediate member layer 14 in addition to a first intermediate member layer 13.
  • first intermediate material layer 13 and the second intermediate material layer 14 may have the same average thickness or may have different average thicknesses. Furthermore, of the first intermediate material layer 13 and the second intermediate material layer 14, the thickness of the first intermediate material layer 13 on which the electrical element is mounted may be made thicker than the thickness of the second intermediate material layer 14. This is because the first intermediate material layer 13 on which the electrical element is mounted is more susceptible to thermal loads and is more susceptible to deformation than the second intermediate material layer 14.
  • the wiring sheet used is an uncured sheet with a copper foil wiring pattern formed on one surface by a transfer method.
  • the wiring pattern is arranged, for example, in an area excluding the through holes.
  • the copper foil wiring pattern used in the transfer method is, for example, a PET film with solid copper foil attached thereto, which is then patterned by etching.
  • the prepared wiring sheet is layered on a graphite sheet and pressurized and heated to obtain the base material for the multilayer board.
  • the conditions for pressurization and heating can be, for example, a temperature of 200°C, a pressure of 0.1 MPa, and a heating time of 5 hours.
  • the obtained base material is cut to a specified size to obtain a multilayer board.
  • the same conditions as above can also be used when using a composite sheet of copper foil layered on graphite instead of a graphite sheet.
  • the through hole 204 may be formed by setting the pressure conditions during the pressurization and heating described above to a high value (e.g., 0.13 MPa).
  • a multilayer substrate has a carbonaceous substrate layer and an organic resin layer, the organic resin layer is located on the carbonaceous substrate layer, The carbonaceous substrate layer has a higher thermal conductivity than the organic resin layer.
  • the carbonaceous substrate layer may have a larger volume fraction than the organic resin layer.
  • the thermal expansion coefficients of the carbonaceous substrate layer, the first intermediate member layer, and the organic resin layer may increase in this order.
  • the thermal conductivity of the carbonaceous substrate layer, the first intermediate member layer, and the organic resin layer may decrease in this order.
  • the organic resin layer may have a void.
  • the multilayer substrate of (5) above may further have through holes.
  • the through hole may be drum-shaped.
  • the multilayer substrate according to (3) or (4), further comprising a second intermediate member layer may be located on a surface of the carbonaceous substrate layer opposite to a surface on which the first intermediate member layer is located.
  • the main material of the carbonaceous substrate layer may be graphite.
  • the organic resin layer may contain a polymer material and carbon particles.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2024/009894 2023-03-24 2024-03-13 多層基板 Ceased WO2024203362A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025510456A JPWO2024203362A1 (https=) 2023-03-24 2024-03-13

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023048191 2023-03-24
JP2023-048191 2023-03-24

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WO2024203362A1 true WO2024203362A1 (ja) 2024-10-03

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Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140898A (ja) * 1983-12-22 1985-07-25 テイアールダブリユー　インコーポレーテツド 多層プリント回路板構造及びその製造方法
JPH10242594A (ja) * 1997-02-21 1998-09-11 Multi:Kk 中空導体基板及びプリント配線基板の製造方法
JP2002151811A (ja) * 2000-11-13 2002-05-24 Suzuki Sogyo Co Ltd 配線板用基板
JP2003209329A (ja) * 2002-01-11 2003-07-25 Suzuki Sogyo Co Ltd 配線板用基板
WO2011111684A1 (ja) * 2010-03-10 2011-09-15 新日鐵化学株式会社 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体
JP2012067221A (ja) * 2010-09-24 2012-04-05 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2012126104A (ja) * 2010-12-17 2012-07-05 Panasonic Corp 銅張積層板
WO2015064519A1 (ja) * 2013-11-01 2015-05-07 東レ・デュポン株式会社 グラファイト積層体
JP2018107154A (ja) * 2016-12-22 2018-07-05 住友金属鉱山株式会社 放熱基板
WO2018207821A1 (ja) * 2017-05-10 2018-11-15 積水化学工業株式会社 絶縁性シート及び積層体
WO2020235329A1 (ja) * 2019-05-20 2020-11-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板
WO2021187090A1 (ja) * 2020-03-17 2021-09-23 京セラ株式会社 発光装置
JP6986212B1 (ja) * 2020-02-07 2021-12-22 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、及びプリント配線板

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140898A (ja) * 1983-12-22 1985-07-25 テイアールダブリユー　インコーポレーテツド 多層プリント回路板構造及びその製造方法
JPH10242594A (ja) * 1997-02-21 1998-09-11 Multi:Kk 中空導体基板及びプリント配線基板の製造方法
JP2002151811A (ja) * 2000-11-13 2002-05-24 Suzuki Sogyo Co Ltd 配線板用基板
JP2003209329A (ja) * 2002-01-11 2003-07-25 Suzuki Sogyo Co Ltd 配線板用基板
WO2011111684A1 (ja) * 2010-03-10 2011-09-15 新日鐵化学株式会社 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体
JP2012067221A (ja) * 2010-09-24 2012-04-05 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2012126104A (ja) * 2010-12-17 2012-07-05 Panasonic Corp 銅張積層板
WO2015064519A1 (ja) * 2013-11-01 2015-05-07 東レ・デュポン株式会社 グラファイト積層体
JP2018107154A (ja) * 2016-12-22 2018-07-05 住友金属鉱山株式会社 放熱基板
WO2018207821A1 (ja) * 2017-05-10 2018-11-15 積水化学工業株式会社 絶縁性シート及び積層体
WO2020235329A1 (ja) * 2019-05-20 2020-11-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板
JP6986212B1 (ja) * 2020-02-07 2021-12-22 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、及びプリント配線板
WO2021187090A1 (ja) * 2020-03-17 2021-09-23 京セラ株式会社 発光装置

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