JPWO2024203362A1 - - Google Patents
Info
- Publication number
- JPWO2024203362A1 JPWO2024203362A1 JP2025510456A JP2025510456A JPWO2024203362A1 JP WO2024203362 A1 JPWO2024203362 A1 JP WO2024203362A1 JP 2025510456 A JP2025510456 A JP 2025510456A JP 2025510456 A JP2025510456 A JP 2025510456A JP WO2024203362 A1 JPWO2024203362 A1 JP WO2024203362A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023048191 | 2023-03-24 | ||
| PCT/JP2024/009894 WO2024203362A1 (ja) | 2023-03-24 | 2024-03-13 | 多層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024203362A1 true JPWO2024203362A1 (https=) | 2024-10-03 |
| JPWO2024203362A5 JPWO2024203362A5 (https=) | 2025-11-27 |
Family
ID=92905843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025510456A Pending JPWO2024203362A1 (https=) | 2023-03-24 | 2024-03-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024203362A1 (https=) |
| WO (1) | WO2024203362A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4591659A (en) * | 1983-12-22 | 1986-05-27 | Trw Inc. | Multilayer printed circuit board structure |
| JPH10242594A (ja) * | 1997-02-21 | 1998-09-11 | Multi:Kk | 中空導体基板及びプリント配線基板の製造方法 |
| JP2002151811A (ja) * | 2000-11-13 | 2002-05-24 | Suzuki Sogyo Co Ltd | 配線板用基板 |
| JP3980887B2 (ja) * | 2002-01-11 | 2007-09-26 | 株式会社タイカ | 配線板用基板 |
| WO2011111684A1 (ja) * | 2010-03-10 | 2011-09-15 | 新日鐵化学株式会社 | 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体 |
| JP2012067221A (ja) * | 2010-09-24 | 2012-04-05 | Sekisui Chem Co Ltd | 絶縁シート及び積層構造体 |
| JP5427164B2 (ja) * | 2010-12-17 | 2014-02-26 | パナソニック株式会社 | 銅張積層板及びその製造方法 |
| US10946617B2 (en) * | 2013-11-01 | 2021-03-16 | Du Pont-Toray Co., Ltd. | Graphite laminated body |
| JP2018107154A (ja) * | 2016-12-22 | 2018-07-05 | 住友金属鉱山株式会社 | 放熱基板 |
| JP6475897B1 (ja) * | 2017-05-10 | 2019-02-27 | 積水化学工業株式会社 | 絶縁性シート及び積層体 |
| WO2020235329A1 (ja) * | 2019-05-20 | 2020-11-26 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板 |
| TWI881041B (zh) * | 2020-02-07 | 2025-04-21 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板、及印刷配線板 |
| WO2021187090A1 (ja) * | 2020-03-17 | 2021-09-23 | 京セラ株式会社 | 発光装置 |
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2024
- 2024-03-13 WO PCT/JP2024/009894 patent/WO2024203362A1/ja not_active Ceased
- 2024-03-13 JP JP2025510456A patent/JPWO2024203362A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024203362A1 (ja) | 2024-10-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250911 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250911 |