JPWO2024203362A5 - - Google Patents

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Publication number
JPWO2024203362A5
JPWO2024203362A5 JP2025510456A JP2025510456A JPWO2024203362A5 JP WO2024203362 A5 JPWO2024203362 A5 JP WO2024203362A5 JP 2025510456 A JP2025510456 A JP 2025510456A JP 2025510456 A JP2025510456 A JP 2025510456A JP WO2024203362 A5 JPWO2024203362 A5 JP WO2024203362A5
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JP
Japan
Prior art keywords
layer
organic resin
resin layer
substrate according
intermediate member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510456A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024203362A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/009894 external-priority patent/WO2024203362A1/ja
Publication of JPWO2024203362A1 publication Critical patent/JPWO2024203362A1/ja
Publication of JPWO2024203362A5 publication Critical patent/JPWO2024203362A5/ja
Pending legal-status Critical Current

Links

JP2025510456A 2023-03-24 2024-03-13 Pending JPWO2024203362A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023048191 2023-03-24
PCT/JP2024/009894 WO2024203362A1 (ja) 2023-03-24 2024-03-13 多層基板

Publications (2)

Publication Number Publication Date
JPWO2024203362A1 JPWO2024203362A1 (https=) 2024-10-03
JPWO2024203362A5 true JPWO2024203362A5 (https=) 2025-11-27

Family

ID=92905843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510456A Pending JPWO2024203362A1 (https=) 2023-03-24 2024-03-13

Country Status (2)

Country Link
JP (1) JPWO2024203362A1 (https=)
WO (1) WO2024203362A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
JPH10242594A (ja) * 1997-02-21 1998-09-11 Multi:Kk 中空導体基板及びプリント配線基板の製造方法
JP2002151811A (ja) * 2000-11-13 2002-05-24 Suzuki Sogyo Co Ltd 配線板用基板
JP3980887B2 (ja) * 2002-01-11 2007-09-26 株式会社タイカ 配線板用基板
WO2011111684A1 (ja) * 2010-03-10 2011-09-15 新日鐵化学株式会社 熱伝導性ポリイミドフィルム及びそれを用いた熱伝導性積層体
JP2012067221A (ja) * 2010-09-24 2012-04-05 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP5427164B2 (ja) * 2010-12-17 2014-02-26 パナソニック株式会社 銅張積層板及びその製造方法
US10946617B2 (en) * 2013-11-01 2021-03-16 Du Pont-Toray Co., Ltd. Graphite laminated body
JP2018107154A (ja) * 2016-12-22 2018-07-05 住友金属鉱山株式会社 放熱基板
JP6475897B1 (ja) * 2017-05-10 2019-02-27 積水化学工業株式会社 絶縁性シート及び積層体
WO2020235329A1 (ja) * 2019-05-20 2020-11-26 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板
TWI881041B (zh) * 2020-02-07 2025-04-21 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、疊層板、覆金屬箔疊層板、及印刷配線板
WO2021187090A1 (ja) * 2020-03-17 2021-09-23 京セラ株式会社 発光装置

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