WO2024135630A1 - Composition de résine - Google Patents

Composition de résine Download PDF

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Publication number
WO2024135630A1
WO2024135630A1 PCT/JP2023/045354 JP2023045354W WO2024135630A1 WO 2024135630 A1 WO2024135630 A1 WO 2024135630A1 JP 2023045354 W JP2023045354 W JP 2023045354W WO 2024135630 A1 WO2024135630 A1 WO 2024135630A1
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Prior art keywords
resin
mass
resin composition
based elastomer
styrene
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PCT/JP2023/045354
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English (en)
Japanese (ja)
Inventor
高士 山本
和彦 森
茂 栗本
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株式会社レゾナック
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Publication of WO2024135630A1 publication Critical patent/WO2024135630A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/46—Reaction with unsaturated dicarboxylic acids or anhydrides thereof, e.g. maleinisation

Definitions

  • This disclosure relates to a resin composition.
  • Styrene-based elastomers which are composed of copolymers of aromatic vinyl compounds and conjugated diene compounds, or hydrogenated products thereof, are used in a variety of applications. It is known that styrene-based elastomers can be acid-modified with maleic anhydride or the like to impart properties such as adhesiveness and affinity (see, for example, Patent Document 1, etc.).
  • Acid-modified styrene-based elastomers are generally produced by kneading a styrene-based elastomer with maleic anhydride.
  • Commercially available acid-modified styrene-based elastomers do not have sufficient compatibility with other components such as thermosetting resins, so there is a need to improve compatibility. Therefore, the present disclosure aims to provide a resin composition containing a modified styrene-based elastomer that has excellent compatibility with other components.
  • a resin composition comprising a modified styrene-based elastomer having a graft ratio of maleic anhydride of 1.5 mass% or more and a thermosetting resin.
  • thermosetting resin comprises at least one selected from the group consisting of an epoxy resin, a cyanate ester resin, an acrylic resin, a silicone resin, a phenolic resin, a maleimide resin, a thermosetting polyimide resin, a polyurethane resin, a melamine resin, and a urea resin.
  • the content of the thermosetting resin is 10 parts by mass or more per 100 parts by mass of the total amount of the modified styrene-based elastomer and the thermosetting resin.
  • the term “process” includes not only independent processes, but also processes that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved.
  • the term “layer” includes structures with shapes formed over the entire surface as well as structures with shapes formed on only a portion of the surface when observed in a plan view.
  • a numerical range indicated using “ ⁇ ” indicates a range including the numerical values before and after " ⁇ " as the minimum and maximum values, respectively.
  • the upper or lower limit of a numerical range of a certain stage may be replaced with the upper or lower limit of a numerical range of another stage.
  • the upper or lower limit of the numerical range may be replaced with a value shown in the examples.
  • Solid content refers to the non-volatile content of the resin composition excluding volatile substances (water, solvent, etc.).
  • solid content refers to components other than the solvent that remain without volatilization during drying of the resin composition described later, and also includes components that are liquid, syrup-like, or waxy at room temperature (25°C).
  • domain refers to one of the phases that make up a phase-separated structure.
  • One method for evaluating the compatibility of polymer blends is to measure the domain size of microphase separation that exists when observing the cross section of a film molded product.
  • the cross section of a film molded product can be observed using an atomic force microscope (AFM), scanning electron microscope (SEM), transmission electron microscope (TEM), etc.
  • the resin composition according to the present embodiment contains a modified styrene-based elastomer having a graft ratio of maleic anhydride of 1.5 mass% or more and a thermosetting resin.
  • the modified styrene-based elastomer according to the present embodiment has reactivity with the thermosetting resin, and the cured product of the resin composition has excellent heat resistance, strength, etc.
  • the resin composition according to this embodiment can be prepared by mixing a modified styrene-based elastomer and a thermosetting resin.
  • the resin composition may further contain other components such as a curing accelerator, a filler, and a flame retardant.
  • the modified styrene-based elastomer according to the present embodiment has a graft ratio of maleic anhydride of 1.5 mass % or more.
  • the modified styrene-based elastomer according to this embodiment can be produced by reacting a styrene-based elastomer with maleic anhydride, and has a succinic anhydride group based on maleic anhydride in the side chain.
  • the styrene-based elastomer may be a copolymer having a structural unit derived from a styrene-based compound and a structural unit derived from a conjugated diene compound.
  • styrene-based compounds include styrene, ⁇ -methylstyrene, p-methylstyrene, and p-tert-butylstyrene.
  • styrene, ⁇ -methylstyrene, and 4-methylstyrene are preferred, with styrene being more preferred.
  • conjugated diene compounds include 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 1,3-pentadiene (piperylene), 1-phenyl-1,3-butadiene, 2,3-dimethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 3,4-dimethyl-1,3-hexadiene, and 4,5-diethyl-1,3-octadiene.
  • 1,3-butadiene and isoprene are preferred from the standpoint of availability and productivity.
  • the styrene-based elastomer may be a hydrogenated styrene-based elastomer in which at least a portion of the structural units derived from a conjugated diene compound are hydrogenated.
  • Examples of hydrogenated styrene-butadiene-styrene block copolymers (SEBS) and hydrogenated styrene-isoprene-styrene block copolymers are mentioned.
  • SEBS products include, for example, the Tuftec (registered trademark) H series manufactured by Asahi Kasei Corporation, the Septon (registered trademark) series manufactured by Kuraray Co., Ltd., and the Kraton (registered trademark) G Polymer series manufactured by Kraton Polymer Japan Co., Ltd.
  • the acid value of the modified styrene-based elastomer may be 20 to 120 mgKOH/g, 25 to 100 mgKOH/g, 30 to 90 mgKOH/g, or 35 to 80 mgKOH/g, in order to further increase compatibility.
  • the graft ratio of maleic anhydride in the modified styrene-based elastomer may be 1.5 mass% or more, 1.8 mass% or more, 2.0 mass% or more, 2.5 mass% or more, or 3.0 mass% or more from the viewpoint of further improving compatibility.
  • the graft ratio of maleic anhydride may be 10.0 mass% or less, 9.0 mass% or less, 8.0 mass% or less, or 7.0 mass% or less from the viewpoint of improving dielectric properties.
  • the graft ratio may be 1.5 to 10.0 mass%, 1.8 to 10.0 mass%, 2.0 to 9.0 mass%, 2.5 to 8.0 mass%, or 3.0 to 7.0 mass%.
  • the graft ratio can be calculated using the acid value of the modified styrene-based elastomer.
  • the acid value and graft ratio in this specification are values calculated by the method described in the Examples.
  • the method for producing a modified styrene-based elastomer includes a step of adding a radical generator to a mixture of a styrene-based elastomer and maleic anhydride dissolved in a solvent under a nitrogen atmosphere to react the styrene-based elastomer with the maleic anhydride.
  • the reaction temperature may be 60 to 100°C, 65 to 95°C, or 70 to 90°C. This makes it possible to obtain a modified styrene-based elastomer under milder conditions than in the conventional method of melt-kneading a styrene-based elastomer and maleic anhydride at a high temperature of 170°C or higher to react the styrene-based elastomer with maleic anhydride, and also makes it possible to increase the graft rate of maleic anhydride. After the reaction, unreacted maleic anhydride may be removed by extraction in order to suppress side reactions.
  • the amount of maleic anhydride per 100 parts by mass of styrene-based elastomer may be 5 parts by mass or more, 8 parts by mass or more, 10 parts by mass or more, or 15 parts by mass or more from the viewpoint of increasing the graft rate, and may be 50 parts by mass or less, 45 parts by mass or less, 40 parts by mass or less, or 35 parts by mass or less from the viewpoint of suppressing side reactions.
  • the amount of maleic anhydride may be 5 to 50 parts by mass, 8 to 45 parts by mass, 10 to 40 parts by mass, or 15 to 35 parts by mass.
  • Examples of the radical generator that can be used include organic peroxides and azo compounds.
  • Examples of the organic peroxides include dicumyl peroxide, benzoyl peroxide, 2-butanone peroxide, tert-butyl perbenzoate, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, bis(tert-butylperoxyisopropyl)benzene, and tert-butyl hydroperoxide.
  • Examples of the azo compounds include 2,2'-azobis(2-methylpropanenitrile), 2,2'-azobis(2-methylbutanenitrile), and 1,1'-azobis(cyclohexanecarbonitrile).
  • Solvents include, for example, butyl cellosolve, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, mesitylene, methoxyethyl acetate, ethoxyethyl acetate, butoxyethyl acetate, and ethyl acetate. These may be used alone or in combination of two or more. Among these, toluene, xylene, and propylene glycol monomethyl ether are preferred from the viewpoint of solubility.
  • thermosetting resin examples include epoxy resins, cyanate ester resins, acrylic resins, silicone resins, phenolic resins, maleimide resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins. These may be used alone or in combination of two or more.
  • epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, alicyclic epoxy resins, aliphatic linear epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol A novolac type epoxy resins, phenol aralkyl type epoxy resins, naphthol novolac type epoxy resins, naphthol aralkyl type epoxy resins, xylene novolac type epoxy resins, bifunctional biphenyl type epoxy resins, biphenyl aralkyl type epoxy resins, dicyclopentadiene type epoxy resins, and dihydroanthracene type epoxy resins.
  • the amount of the thermosetting resin in the resin composition is not particularly limited.
  • the amount of the thermosetting resin may be 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, or 40 parts by mass or more, or 95 parts by mass or less, 90 parts by mass or less, 85 parts by mass or less, or 80 parts by mass or less, per 100 parts by mass of the total amount of the modified styrene-based elastomer and the thermosetting resin.
  • the resin composition according to the present embodiment may further contain a curing accelerator.
  • the curing accelerator include various imidazole compounds, BF3 amine complexes, and phosphorus-based curing accelerators, which are latent heat curing agents.
  • imidazole compounds and phosphorus-based curing accelerators are preferred from the viewpoints of storage stability of the resin composition, handling of the semi-cured resin composition, and solder heat resistance of the cured product.
  • the resin composition according to the present embodiment may further contain a filler.
  • the filler include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, calcined clay, talc, aluminum borate, and silicon carbide. These may be used alone or in combination of two or more.
  • the particle size of the filler may be, for example, 0.01 to 20 ⁇ m or 0.1 to 10 ⁇ m.
  • particle size refers to the average particle size, and is the particle size at the point corresponding to 50% volume when a cumulative frequency distribution curve is calculated based on particle size, with the total volume of the particles being 100%.
  • the average particle size can be measured using a particle size distribution measuring device that uses a laser diffraction scattering method.
  • a coupling agent can be used in combination to improve the dispersibility of the filler and its adhesion to the organic component.
  • the coupling agent there are no particular limitations on the coupling agent, and for example, various silane coupling agents, titanate coupling agents, etc. can be used. These may be used alone or in combination of two or more.
  • the amount of coupling agent used there are also no particular limitations on the amount of coupling agent used, and for example, it may be 0.1 to 5 parts by mass, or 0.5 to 3 parts by mass, per 100 parts by mass of the filler used. Within this range, there is little deterioration in various properties, and it becomes easier to effectively utilize the features of the filler.
  • the so-called integral blending method may be used, in which the coupling agent is added after the filler is blended into the resin composition, but it is preferable to use a filler that has been surface-treated in advance with a coupling agent by a dry or wet method. By using this method, the characteristics of the filler can be more effectively expressed.
  • the resin composition according to the present embodiment may further contain a flame retardant.
  • the flame retardant is not particularly limited, but a bromine-based flame retardant, a phosphorus-based flame retardant, a metal hydroxide, etc. are preferably used.
  • the bromine-based flame retardant include brominated epoxy resins, brominated additive flame retardants, and brominated reaction flame retardants containing unsaturated double bond groups.
  • the phosphorus-based flame retardant include aromatic phosphate esters, phosphonate esters, phosphinate esters, and phosphazene compounds.
  • the metal hydroxide flame retardant include magnesium hydroxide and aluminum hydroxide.
  • the resin composition may be diluted with a solvent as necessary.
  • the solvent is not particularly limited, but can be selected taking into consideration the boiling point and volatility during film formation.
  • solvents include solvents with relatively low boiling points such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene. Solvents can be used alone or in combination of two or more.
  • the resin composition of this embodiment can be obtained by uniformly dispersing and mixing the above-mentioned components, and the preparation means, conditions, etc. are not particularly limited.
  • a method can be used in which the various components in the specified amounts are thoroughly and uniformly stirred and mixed using a mixer or the like, then kneaded using a mixing roll, extruder, kneader, roll, extruder, etc., and the resulting kneaded product is cooled and pulverized.
  • the kneading method is also not particularly limited.
  • resin film The resin composition according to the present embodiment can be used to produce a resin film.
  • resin film refers to an uncured or semi-cured film-like resin composition.
  • the method for producing the resin film is not limited, but for example, the resin film can be obtained by applying the resin composition onto a supporting substrate and drying the formed resin layer.
  • the resin composition can be applied onto a supporting substrate using a kiss coater, roll coater, comma coater, or the like, and then dried in a heated drying oven or the like at a temperature of, for example, 70 to 250°C, preferably 70 to 200°C, for 1 to 30 minutes, preferably 3 to 15 minutes. This makes it possible to obtain a resin film in which the resin composition is in a semi-cured state.
  • the semi-cured resin film can be further heated in a heating oven at a temperature of, for example, 170 to 250°C, preferably 185 to 230°C, for 60 to 150 minutes to thermally cure the resin film.
  • the thickness of the resin film according to this embodiment is not particularly limited, but is preferably 1 to 200 ⁇ m, more preferably 2 to 180 ⁇ m, and even more preferably 3 to 150 ⁇ m. By setting the thickness of the resin film within the above range, it is easy to achieve both a thin printed wiring board obtained using the resin film according to this embodiment and good high-frequency characteristics.
  • the supporting substrate is not particularly limited, but is preferably at least one selected from the group consisting of glass, metal foil, and PET film. Providing a supporting substrate for the resin film tends to improve storage properties and handling properties when used in the manufacture of printed wiring boards.
  • the resin film according to this embodiment can take the form of a support with a resin layer, which includes a resin layer containing the resin composition according to this embodiment and a supporting substrate, and may be peeled off from the supporting substrate when in use.
  • a prepreg can be produced using the resin composition according to this embodiment.
  • the resin composition according to this embodiment is applied to a fiber substrate, which is a reinforcing substrate, and the applied resin composition is dried to obtain a prepreg.
  • the prepreg may be obtained by impregnating the fiber substrate with the resin composition according to this embodiment and then drying the impregnated resin composition.
  • the fiber substrate to which the resin composition is attached is heated and dried in a drying oven at a temperature of 80 to 200 ° C. for 1 to 30 minutes to obtain a prepreg in which the resin composition is semi-cured. From the viewpoint of good moldability, it is preferable to coat or impregnate the fiber substrate with the resin composition so that the resin content in the prepreg after drying is 30 to 90% by mass.
  • the reinforcing substrate for the prepreg is not limited, but a sheet-like fiber substrate is preferred.
  • the sheet-like fiber substrate include inorganic fibers such as E glass, NE glass, S glass, and Q glass; and organic fibers such as polyimide, polyester, and tetrafluoroethylene.
  • the sheet-like fiber substrate those having shapes such as woven fabric, nonwoven fabric, and chopped strand mat can be used.
  • a laminate having a resin layer containing the cured product of the above-mentioned resin composition and a conductor layer can be provided.
  • a metal-clad laminate can be produced by using the above-mentioned resin film or the above-mentioned prepreg.
  • the method for producing the metal-clad laminate is not limited, but for example, one or more resin films or prepregs according to this embodiment are stacked, metal foil that will become a conductor layer is placed on at least one surface, and then, for example, heated and pressed at a temperature of 170 to 250°C, preferably 185 to 230°C, and a pressure of 0.5 to 5.0 MPa for 60 to 150 minutes, to obtain a metal-clad laminate having metal foil on at least one surface of the resin layer or prepreg that will become an insulating layer.
  • Heating and pressing can be performed, for example, under conditions of a vacuum degree of 10 kPa or less, preferably 5 kPa or less, and from the viewpoint of increasing efficiency, it is preferable to perform the heating and pressing in a vacuum. Heating and pressing are preferably performed for 30 minutes from the start to the end of molding.
  • Multilayer printed wiring board According to the present embodiment, it is possible to provide a multilayer printed wiring board including a resin layer containing the cured product of the above-mentioned resin composition and a circuit layer.
  • the upper limit of the number of circuit layers is not particularly limited, and may be 3 to 20 layers.
  • the multilayer printed wiring board can also be manufactured using, for example, the above-mentioned resin film, prepreg, or metal-clad laminate.
  • a multilayer printed wiring board can be produced by first placing a resin film on one or both sides of a core board on which a circuit has been formed, or by placing a resin film between multiple core boards, and then bonding each layer by pressure and heat lamination or pressure and heat press molding, and then performing circuit formation processing such as laser drilling, drilling, metal plating, metal etching, etc. If the resin film has a supporting substrate, the supporting substrate can be peeled off before the resin film is placed on or between the core boards, or it can be peeled off after the resin layer is attached to the core board.
  • Example 1 In a 2L flask equipped with a cooling tube, a nitrogen inlet tube, a thermocouple, and a stirrer, 950g of xylene, 100g of hydrogenated styrene-based thermoplastic elastomer (manufactured by Asahi Kasei Corporation, product name "Tuftec H1041"), and 12.5g of maleic anhydride (FUJIFILM Wako Pure Chemical Industries, Ltd.) were added, and the mixture was stirred at 80°C for 0.5 hours, followed by nitrogen bubbling at a flow rate of 0.5 cm 3 /L for 1.0 hour.
  • Example 2 The reaction was carried out in the same manner as in Example 1, except that the amount of maleic anhydride was changed to 17 g and the amount of benzoyl peroxide was changed to 6.5 g, to obtain a modified styrene-based elastomer (A2) having succinic anhydride groups.
  • A2 modified styrene-based elastomer having succinic anhydride groups.
  • Example 3 The reaction was carried out in the same manner as in Example 1, except that the amount of maleic anhydride was changed to 34 g and the amount of benzoyl peroxide was changed to 13 g, to obtain a modified styrene-based elastomer (A3) having succinic anhydride groups.
  • Example 4 The reaction was carried out in the same manner as in Example 1, except that the amount of maleic anhydride was changed to 8 g and the amount of benzoyl peroxide was changed to 3 g, to obtain a modified styrene-based elastomer (A4) having succinic anhydride groups.
  • Example 1 The reaction was carried out in the same manner as in Example 1, except that the amount of maleic anhydride was changed to 4 g and the amount of benzoyl peroxide was changed to 1.5 g, to obtain a modified styrene-based elastomer (A5) having succinic anhydride groups.
  • the acid value of the modified styrene-based elastomer is a value derived from two carboxy groups generated by hydrolysis of the succinic anhydride group.
  • Graft ratio [acid value (mg KOH/g)/molecular weight of KOH (mg/mol)] ⁇ 0.5 ⁇ molecular weight of maleic anhydride (g/mol) ⁇ 100(%)
  • thermosetting resin As the thermosetting resin, a thermosetting resin (B1) (xylene-novolac type epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name "YX7700”) and a thermosetting resin (B2) (bismaleimide resin, manufactured by DIC Corporation, trade name "NE-X-9470S”) were prepared, and "Tuftec H1041" was prepared as an unmodified styrene-based elastomer.
  • the modified styrene-based elastomer or the unmodified styrene-based elastomer and the thermosetting resin were mixed in the mass ratio shown in Table 2 or Table 3 to prepare a resin composition. 0.05 mL of the resin composition was attached to a preparation to form a resin layer.
  • the resin layer was covered with a cover glass and left to stand at 25 ° C. for 24 hours.
  • the domain size of the resin layer after standing was measured using an optical microscope (magnification 20 times). Compatibility was evaluated as follows: domain size less than 10 ⁇ m was rated as "A”, domain size 10 ⁇ m or more but less than 20 ⁇ m was rated as "B”, domain size 20 ⁇ m or more but less than 50 ⁇ m was rated as "C”, domain size 50 ⁇ m or more but less than 100 ⁇ m was rated as "D”, and domain size 100 ⁇ m or more was rated as "E”. The smaller the domain size, the better the compatibility.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Un aspect de la présente divulgation concerne une composition de résine contenant : un élastomère styrène modifié dans lequel le taux de greffage de l'anhydride maléique est de 1,5 % en masse ou plus ; et une résine thermodurcissable.
PCT/JP2023/045354 2022-12-22 2023-12-18 Composition de résine WO2024135630A1 (fr)

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PCT/JP2023/045354 WO2024135630A1 (fr) 2022-12-22 2023-12-18 Composition de résine

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JPH08259849A (ja) * 1995-03-24 1996-10-08 Daicel Chem Ind Ltd プライマー組成物、および難接着プラスチック素材の加工方法
WO2017057708A1 (fr) * 2015-09-30 2017-04-06 味の素株式会社 Composition de résine pour le scellement
JP2017125176A (ja) * 2016-08-31 2017-07-20 三井化学株式会社 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
WO2018116967A1 (fr) * 2016-12-22 2018-06-28 東亞合成株式会社 Composition adhésive, et film de revêtement, feuille de liaison, stratifié cuivré et matériau de blindage électromagnétique, chacun utilisant ladite composition adhésive
WO2022071150A1 (fr) * 2020-10-02 2022-04-07 昭和電工マテリアルズ株式会社 Film pour fixation temporaire, produit en couches pour fixation temporaire, et procédé de production de dispositif à semi-conducteur

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US4578429A (en) * 1984-08-31 1986-03-25 Shell Oil Company Selectively hydrogenated block copolymers modified with acid compounds or derivatives
JP3269158B2 (ja) * 1993-02-03 2002-03-25 三菱化学株式会社 積層体
JP2000017121A (ja) * 1998-07-02 2000-01-18 Mitsubishi Chemicals Corp 樹脂組成物
JP5804776B2 (ja) * 2011-05-31 2015-11-04 株式会社クラレ 多層構造体及びその製造方法
JP6943882B2 (ja) * 2017-01-05 2021-10-06 日本製紙株式会社 変性ポリオレフィン系樹脂
JP2019104832A (ja) * 2017-12-13 2019-06-27 ユニチカ株式会社 水性分散体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08259849A (ja) * 1995-03-24 1996-10-08 Daicel Chem Ind Ltd プライマー組成物、および難接着プラスチック素材の加工方法
WO2017057708A1 (fr) * 2015-09-30 2017-04-06 味の素株式会社 Composition de résine pour le scellement
JP2017125176A (ja) * 2016-08-31 2017-07-20 三井化学株式会社 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
WO2018116967A1 (fr) * 2016-12-22 2018-06-28 東亞合成株式会社 Composition adhésive, et film de revêtement, feuille de liaison, stratifié cuivré et matériau de blindage électromagnétique, chacun utilisant ladite composition adhésive
WO2022071150A1 (fr) * 2020-10-02 2022-04-07 昭和電工マテリアルズ株式会社 Film pour fixation temporaire, produit en couches pour fixation temporaire, et procédé de production de dispositif à semi-conducteur

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