WO2024124603A1 - 一种用于半导体封测的晶圆切割装置 - Google Patents

一种用于半导体封测的晶圆切割装置 Download PDF

Info

Publication number
WO2024124603A1
WO2024124603A1 PCT/CN2022/140251 CN2022140251W WO2024124603A1 WO 2024124603 A1 WO2024124603 A1 WO 2024124603A1 CN 2022140251 W CN2022140251 W CN 2022140251W WO 2024124603 A1 WO2024124603 A1 WO 2024124603A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
rack
shell
block
placement
Prior art date
Application number
PCT/CN2022/140251
Other languages
English (en)
French (fr)
Inventor
张琦
王增艳
Original Assignee
常州市芯之泰科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 常州市芯之泰科技有限公司 filed Critical 常州市芯之泰科技有限公司
Publication of WO2024124603A1 publication Critical patent/WO2024124603A1/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Definitions

  • the present invention relates to the technical field of semiconductor packaging and testing, and in particular to a wafer cutting device for semiconductor packaging and testing.
  • Semiconductor packaging and testing refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements.
  • the semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing.
  • the core part of the semiconductor chip is DIE.
  • DIE For the convenience of processing, many DIEs are processed on a circular substrate. After all DIEs on the substrate are processed, the substrate is cut with a blade or laser.
  • the Chinese patent with the announcement number CN112643219A discloses a laser wafer cutting device, including a bracket, a controller installed on the outer wall of the bracket, a control panel installed on the outer wall of the bracket, a cutting chamber installed on the top of the bracket, a moving chamber installed on the inner wall of the cutting chamber, a laser cutting head movably installed on the outer wall of the moving chamber, an electromagnetic slide rail installed on the inner wall of the cutting chamber, a clamping chamber installed on the top of the electromagnetic slide rail, and a first motor installed on the inner wall of the clamping chamber.
  • the present invention through the setting of the clamping block, enables the wafer to be cut to be clamped, through the setting of the electromagnetic slide rail, enables the clamping chamber to slide, through the setting of the moving chamber, enables the laser machine to move as needed, through the setting of the controller and the control panel, it is convenient for the user to control the internal parts thereof, and the structural design of the device is simple and ingenious, and is suitable for laser cutting wafers.
  • the wafer cutting equipment drives the wafer to move through the clamping chamber, and the moving chamber drives the laser cutting head to move for cutting; the two clamping blocks clamp the two ends of the circular substrate, and the clamping mechanism is not conducive to maintaining the stability of the wafer during the movement, which affects the cutting quality of the substrate.
  • the purpose of the present invention is to address the problems existing in the background technology and to provide a wafer cutting device for semiconductor packaging and testing.
  • a wafer cutting device for semiconductor packaging and testing comprising a housing a, a housing b, a fixing part, a mounting block, a screw a, a protective cover a, a support plate, a protective cover b, a mounting part, a mounting rod, a hydraulic rod mechanism a, a hydraulic rod mechanism b, a rack, a gear, a telescopic mechanism, a motor a, a driving wheel and a sliding block;
  • the lower end of the shell a is provided with a plurality of legs, the shell b is connected to the shell a, the shell b is communicated with the shell a, a door panel is rotatably provided on the shell b, a placement rack for placing substrates is provided inside the shell b, a handle is provided on the placement rack, a transparent plate is provided on the shell a, a fixing part is connected to the outer side of the shell a, and a plc control unit is provided inside the fixing part;
  • a moving bin and a cutting bin are provided in the shell a, two screw rods a are provided, the screw rods a are rotatably connected to the inner wall of the moving bin, the protective cover a is connected to the shell a, a driving mechanism a is provided in the protective cover a, the driving mechanism a is connected to the two screw rods a, the mounting block is threadedly connected to the two screw rods a, a mounting seat is slidably provided on the mounting block, a cylinder a is provided on the mounting block, the cylinder a is connected to the mounting seat, one end of the telescopic mechanism is connected to the mounting seat, a taking-out mechanism is provided at the top of the telescopic mechanism, a driven wheel is provided at the lower end of the telescopic mechanism, the motor a is connected to the mounting seat, the driving wheel is connected to the rotating shaft of the motor a, and the driving wheel is meshedly connected with the driven wheel;
  • a plurality of slide bars are arranged in the cutting chamber, a plurality of slide sleeves are arranged at the lower end of the support plate, the slide sleeves are slidably connected with the slide bars, the two ends of the hydraulic rod mechanism a are respectively connected with the support plate and the housing a, a placement plate is rotatably arranged on the support plate, the gear is connected with the placement plate through a connecting rod, the rack is slidably connected with the support plate, the gear is meshed with the rack, a baffle is arranged at the lower end of the support plate, and the hydraulic rod mechanism b is connected with the end of the baffle and the rack;
  • the protective cover b is connected to the shell a, and a driving mechanism b is arranged in the protective cover b.
  • the driving mechanism b connects the two screw rods b.
  • Connecting parts are arranged at both ends of the mounting rod, and the connecting parts are threadedly connected to the two screw rods b.
  • the sliding block is slidably connected to the mounting rod, and a cylinder b is arranged on the mounting rod, and the cylinder b is connected to the sliding block.
  • a laser cutting head is arranged at the lower end of the sliding block.
  • the removal mechanism includes a support block and a support bar, the support block is connected to the upper end of the telescopic mechanism, two support bars are provided, the two support bars are connected to the support block, the two support bars are symmetrically distributed on the support block, multiple protrusions are provided on the support bar, and a positioning mechanism is provided on the support block.
  • the driving mechanism a comprises a belt a and a motor b;
  • the ends of the two screw rods a are both provided with pulleys a, the belt a is matched and connected with the two pulleys a, the inner circumference of the belt a presses the outer circumference of the pulley a, and the motor b is connected with one pulley a;
  • the driving mechanism b comprises a belt b and a motor c;
  • the ends of the two screw rods b are both provided with pulleys b, the belt b is connected with the two pulleys b, the inner circumference of the belt b presses the outer circumference of the pulley b, and the motor c is connected with one pulley b.
  • a groove having the same shape as the substrate is provided on the placement plate, and a plurality of limiting plates for placing the substrate are provided around the groove.
  • a plurality of protrusions are provided at the lower end of the placement rack, a plurality of blind holes are provided in the shell body b, and the protrusions and the blind holes are matched and connected.
  • connecting blocks are provided at both ends of the rack, one end of the hydraulic rod mechanism b is connected to a connecting block, a slide groove is provided at the lower end of the support plate, pulleys are provided on both sides of the connecting block, and the pulleys are connected with the slide groove.
  • the placement rack is provided with a plurality of placement slots, and the plurality of placement slots are evenly distributed in the height direction of the placement rack.
  • the present invention also provides an operating method for a wafer cutting device for semiconductor packaging and testing, the operating method comprising the following steps:
  • the mounting block drives the taking-out mechanism to approach the substrate, take out the substrate, the motor A drives the driving wheel to rotate, the driving wheel drives the driven wheel to rotate and further drives the telescopic mechanism to rotate, and the cylinder A drives the telescopic mechanism and the taking-out mechanism to move toward the placement plate;
  • the taking-out mechanism places the substrate on the placement plate, starts the driving mechanism b, the mounting rod drives the laser cutting head to move in the length direction of the mounting part, and the cylinder b drives the sliding block to slide on the mounting rod to cut the substrate;
  • hydraulic rod mechanism b drives the rack to slide on the support plate, the rack is meshed with the gear, the gear drives the support plate to rotate 90 degrees, and cutting is performed again;
  • the taking-out mechanism takes out the cut substrate from the support plate
  • the taking-out mechanism places the cut substrate on the placement rack
  • the driving mechanism A is started through the PLC control system
  • the mounting block drives the taking-out mechanism to approach the substrate
  • a positioning mechanism is provided on the taking-out mechanism, the positioning mechanism scans and positions the substrate
  • the substrate is taken out
  • the motor A drives the driving wheel to rotate
  • the driving wheel drives the driven wheel to rotate and further drives the telescopic mechanism to rotate
  • the cylinder A drives the telescopic mechanism and the taking-out mechanism to move toward the placement plate
  • the taking-out mechanism places the substrate on the placement plate
  • the driving mechanism B is started
  • the mounting rod drives the laser cutting head to move in the length direction of the mounting part
  • the cylinder B drives the sliding block to slide on the mounting rod
  • the substrate is cut
  • the hydraulic rod mechanism B drives the rack to slide on the support plate
  • the rack is meshed with the gear
  • the gear drives the support plate to rotate ninety degrees, and cutting is performed again
  • FIG. 1 is a three-dimensional diagram of a wafer cutting device for semiconductor packaging and testing proposed by the present invention.
  • FIG. 2 is a three-dimensional diagram of another viewing angle of an embodiment of the present invention.
  • FIG3 is a schematic structural diagram of a wafer cutting device for semiconductor packaging and testing proposed by the present invention.
  • FIG. 4 is a schematic structural diagram of the lower end of a support plate in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the structure of point A in FIG. 3 in an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the structure inside the installation part in an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the structure of a slide groove and a pulley in an embodiment of the present invention.
  • FIG. 8 is a three-dimensional diagram of a placement plate in an embodiment of the present invention.
  • a wafer cutting device for semiconductor packaging and testing proposed by the present invention includes a housing a1, a housing b3, a fixing portion 6, a mounting block 11, a screw a12, a protective cover a13, a support plate 17, a protective cover b18, a mounting portion 20, a mounting rod 21, a hydraulic rod mechanism a23, a hydraulic rod mechanism b24, a rack 25, a gear 26, a telescopic mechanism 28, a motor a29, a driving wheel 30 and a sliding block 35;
  • the lower end of the shell a1 is provided with a plurality of legs 2, which are evenly distributed at the lower end of the shell a1.
  • the shell b3 is connected to the shell a1, and the shell b3 is communicated with the shell a1.
  • the shell b3 is rotatably provided with a door panel 7.
  • the shell b3 is provided with a placement rack 5 for placing a substrate 8, and the placement rack 5 is provided with a handle 9.
  • the shell a1 is provided with a transparent plate 4.
  • the fixing part 6 is connected to the outer side of the shell a1, and the fixing part 6 is provided with a plc control unit, and the various mechanisms inside the shell a1 are connected through the plc control system.
  • the placement rack 5 is provided with a plurality of placement slots 10 for the substrate 8, and the plurality of placement slots 10 are evenly distributed in the height direction of the placement rack 5;
  • a plurality of protrusions 40 are provided at the lower end of the placement rack 5, and a plurality of blind holes 41 are provided in the shell b3.
  • the protrusions 40 and the blind holes 41 are matched and connected to fix the placement rack 5 in the position of the shell b3;
  • a moving bin and a cutting bin are provided in the shell a1, two screw rods a12 are provided, the screw rods a12 are rotatably connected to the inner wall of the moving bin, a protective cover a13 is connected to the shell a1, a driving mechanism a14 is provided in the protective cover a13, the driving mechanism a14 is connected to the two screw rods a12, a mounting block 11 is threadedly connected to the two screw rods a12, a mounting seat 32 is slidably provided on the mounting block 11, a cylinder a is provided on the mounting block 11, the cylinder a is connected to the mounting seat 32, one end of the telescopic mechanism 28 is connected to the mounting seat 32, a taking-out mechanism is provided at the top of the telescopic mechanism 28, a driven wheel 31 is provided at the lower end of the telescopic mechanism 28, a motor a29 is connected to the mounting seat 32, a driving wheel 30 is connected to the rotating shaft of the motor a29, and the driving wheel 30
  • a plurality of slide bars 15 are arranged in the cutting chamber, and the plurality of slide bars 15 are evenly distributed.
  • a plurality of slide sleeves 16 are arranged at the lower end of the support plate 17, and the slide sleeves 16 are slidably connected with the slide bars 15, and the slide sleeves 16 correspond to the slide bars 15 one by one.
  • the two ends of the hydraulic rod mechanism a23 are respectively connected with the support plate 17 and the inner wall of the housing a1, and a placement plate 22 is rotatably arranged on the support plate 17, and a gear 26 is connected with the placement plate 22 through a connecting rod, and the gear 26 is coaxially distributed with the placement plate 22, and a rack 25 is slidably connected with the lower end of the support plate 17, and the gear 26 is meshedly connected with the rack 25, and a baffle is arranged at the lower end of the support plate 17, and one end of the hydraulic rod mechanism b24 is connected with the baffle, and the other end is connected with the end of the rack 25;
  • both ends of the rack 25 are provided with connecting blocks 27, one end of the hydraulic rod mechanism b24 is connected to a connecting block 27, a slide groove 33 is provided at the lower end of the support plate 17, and both sides of the connecting block 27 are provided with pulleys 34, and the pulleys 34 are connected with the slide groove 33;
  • a groove 39 having the same shape as the substrate 8 is provided on the placement plate 22, and a plurality of limiting plates 38 for placing the substrate 8 are provided around the groove 39;
  • the protective cover b18 is connected to the shell a1, and a driving mechanism b19 is provided in the protective cover b18.
  • the driving mechanism b19 connects the two screws b36.
  • Both ends of the mounting rod 21 are provided with connecting parts 37, and the connecting parts 37 are threadedly connected to the two screws b36.
  • the sliding block 35 is slidably connected to the mounting rod 21.
  • a cylinder b is provided on the mounting rod 21, and the cylinder b is connected to the sliding block 35.
  • a laser cutting head is provided at the lower end of the sliding block 35.
  • a plurality of substrates 8 are placed in the placement rack 5, the door panel 7 is opened to place the placement rack 5 in the housing B3, the door panel 7 is closed, the driving mechanism A14 is started by the PLC control system, the mounting block 11 drives the taking-out mechanism to approach the substrate 8, a positioning mechanism 42 is provided on the taking-out mechanism, the positioning mechanism 42 scans and positions the substrate 8, the substrate 8 is taken out, the motor A29 drives the driving wheel 30 to rotate, the driving wheel 30 drives the driven wheel 31 to rotate and further drives the telescopic mechanism 28 to rotate, the cylinder A drives the telescopic mechanism 28 and the taking-out mechanism to move toward the placement plate 22, and the taking-out mechanism moves the substrate 8.
  • the substrate 8 is placed on the placement plate 22, and the driving mechanism b19 is started.
  • the mounting rod 21 drives the laser cutting head to move in the length direction of the mounting part 20, and the cylinder b drives the sliding block 35 to slide on the mounting rod 21 to cut the substrate 8.
  • the hydraulic rod mechanism b24 drives the rack to slide on the support plate 17, and the rack 25 is meshed with the gear 26.
  • the gear drives the support plate 17 to rotate ninety degrees and cut again.
  • the removal mechanism takes the cut substrate 8 out of the support plate 17, and the removal mechanism places the cut substrate 8 on the placement rack 5. Repeat the above steps to cut multiple substrates 8 on the placement rack 5.
  • the utility model can autonomously cut multiple substrates 8 to be cut, and the device is simple and practical.
  • the groove 39 on the placement plate 22 can fix the position of the substrate 8, and the substrate 8 is cut by moving the laser cutting head.
  • the present invention proposes a wafer cutting device for semiconductor packaging and testing.
  • the removal mechanism in this embodiment includes a support block 43 and a support bar 44.
  • the support block 43 is connected to the upper end of the telescopic mechanism 28.
  • the two support bars 44 are connected to the support block 43.
  • the two support bars 44 are symmetrically distributed on the support block 43.
  • a plurality of protrusions are provided on the support bar 44.
  • a positioning mechanism 42 is provided on the support block 43.
  • the positioning mechanism 42 can determine the position of the substrate 8 to facilitate the removal of the substrate 8.
  • the support bar 44 supports the lower end surface of the substrate 8.
  • the support bar 44 is provided with multiple protrusions to increase the friction between the substrate 8 and the substrate 8 to facilitate removal.
  • the present invention proposes a wafer cutting device for semiconductor packaging and testing.
  • the driving mechanism a14 in this embodiment includes a belt a46 and a motor b47 ;
  • the ends of the two screw rods a12 are both provided with pulleys a45, and a belt a46 is connected with the two pulleys a45, the inner circumference of the belt a46 presses the outer circumference of the pulley a45, and the motor b47 is connected with one pulley a45;
  • the driving mechanism b19 includes a belt b49 and a motor c48;
  • the ends of the two screw rods b36 are both provided with pulleys b50, the belt b49 is connected with the two pulleys b50, the inner circumference of the belt b49 presses the outer circumference of the pulley b50, and the motor c48 is connected with one pulley b50;
  • the outer circumferential surfaces of the pulley a45 and the pulley b50 are provided with mounting grooves for mounting the belt a46 and the belt b49.
  • the motor b47 is started, and the motor b47 drives a pulley a45 to rotate.
  • the two pulleys a45 are connected by a belt a46.
  • the two pulleys a45 drive two screws a12 to rotate.
  • the mounting block 11 moves on the screw a12, and the driving mechanism b19 also has the same principle.
  • the present invention also provides an operating method for a wafer cutting device for semiconductor packaging and testing, the operating method comprising the following steps:
  • the mounting block 11 drives the taking-out mechanism to approach the substrate 8, the taking-out mechanism is provided with a positioning mechanism 42, the positioning mechanism 42 scans and positions the substrate 8, and the substrate 8 is taken out, the motor A29 drives the driving wheel 30 to rotate, the driving wheel 30 drives the driven wheel 31 to rotate and further drives the telescopic mechanism 28 to rotate, and the cylinder A drives the telescopic mechanism 28 and the taking-out mechanism to move toward the placement plate 22;
  • the taking-out mechanism places the substrate 8 on the placement plate 22, starts the driving mechanism b19, the mounting rod 21 drives the laser cutting head to move in the length direction of the mounting portion 20, and the cylinder b drives the sliding block 35 to slide on the mounting rod 21 to cut the substrate 8;
  • the hydraulic rod mechanism b24 drives the rack to slide on the support plate 17, the rack 25 is meshed with the gear 26, and the gear drives the support plate 17 to rotate 90 degrees, and cutting is performed again;
  • the taking-out mechanism takes out the cut substrate 8 from the support plate 17;
  • the taking-out mechanism places the cut substrate 8 on the placement rack 5;

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

本发明涉及半导体封测技术领域，具体为一种用于半导体封测的晶圆切割装置，包括壳体a、壳体b、固定部、安装块、螺杆a、防护罩a、支撑板、防护罩b、安装部、安装杆、液压杆机构a、液压杆机构b、齿条、齿轮、伸缩机构、电机a、主动轮和滑动块；本发明中取出机构包括支撑块和支撑条，支撑块连接伸缩机构的上端，支撑条设有两个，两个支撑条连接支撑块，两个支撑条在支撑块对称分布，支撑条上均设有多个凸起，支撑块上设有定位机构。本发明中，可自主切割多个待切割的基片，装置简单实用，放置板上的凹槽可固定基片的位置，通过激光切割头的移动对基片进行切割。

Description

一种用于半导体封测的晶圆切割装置 技术领域
本发明涉及半导体封测技术领域，具体为一种用于半导体封测的晶圆切割装置。
背景技术
半导体封测是指将通过测试的晶圆按照产品型号及功能需求加工得到独立芯片的过程。半导体生产流程由晶圆制造、晶圆测试、芯片封装和封装后测试组成的。半导体芯片的核心部分是DIE，为了加工方便，许多DIE加工在一片圆形基片上，基片上的所有DIE都加工完成后，再用刀片或激光将基片切开。
公告号为CN112643219A的中国专利公开了激光晶圆切割设备,包括支架，所述支架的外壁上安装有控制器，所述支架的外壁上安装有控制面板，所述支架的顶部安装有切割室，所述切割室的内壁上安装有移动室，所述移动室的外壁上活动安装有激光切割头，所述切割室的内壁上安装有电磁滑轨，所述电磁滑轨的顶部安装有夹持室，所述夹持室的内壁上安装有第一电机。本发明，通过夹块的设置，使得被切割的晶圆能够被夹持住，通过电磁滑轨的设置，使得夹持室能够进行滑动，通过移动室的设置，使得激光机能够根据所需进行移动，通过控制器和控制面板的设置，便于使用者能够对其内部的零件进行控制，本装置结构设计简单巧妙，适用于激光切割晶圆上。
但是上述技术方案中存在以下缺陷：上述技术方案中圆晶切割设备通过夹持室带动圆晶移动，移动室带动激光切割头移动进行切割；两个夹块夹住圆形基片的两端，夹持机构在移动的过程中不利于保持圆晶的稳定性，影响基片的切割质量。
发明内容
本发明目的是针对背景技术中存在的问题，提出一种的用于半导体封测的晶圆切割装置。
本发明的技术方案：一种用于半导体封测的晶圆切割装置，包括壳体a、壳体b、固定部、安装块、螺杆a、防护罩a、支撑板、防护罩b、安装部、安装杆、液压杆机构a、液压杆机构b、齿条、齿轮、伸缩机构、电机a、主动轮和滑动块；
壳体a下端设有多个支腿，壳体b连接壳体a，壳体b与壳体a连通，壳体b上转动设有门板，壳体b内设有用于放置基片的放置架，放置架上设有拉手，壳体a上设有透明板，固定部连接壳体a外侧，固定部内设有plc控制单元；
壳体a内设有移动仓和切割仓，螺杆a设有两个，螺杆a转动连接移动仓的内壁，防护罩a连接壳体a，防护罩a内设有驱动机构a,驱动机构a连接两个螺杆a，安装块与两个螺杆a螺纹配合连接，安装块上滑动设有安装座，安装块上设有气缸a，气缸a连接安装座，伸缩机构一端连接安装座，伸缩机构顶端设有取出机构，伸缩机构下端设有从动轮，电机a连接安装座，主动轮连接电机a的转动轴，主动轮与从动轮啮合连接；
切割仓内设有多个滑杆，支撑板下端设有多个滑动套，滑动套与滑杆滑动配合连接，液压杆机构a两端分别连接支撑板和壳体a，支撑板上转动设有放置板，齿轮通过连杆连接放置板，齿条滑动连接支撑板，齿轮与齿条啮合连接，支撑板下端设有挡板，液压杆机构b连接挡板和齿条的端头；
安装部设有两个，两个安装部均连接壳体a的内壁，安装部内均转动设有螺杆b，防护罩b连接壳体a，防护罩b内设有驱动机构b，驱动机构b连接两个螺杆b，安装杆的两端均设有连接部，连接部与两个螺杆b螺纹配合连接，滑 动块滑动连接安装杆，安装杆上设有气缸b，气缸b连接滑动块，滑动块的下端设有激光切割头。
优选的，取出机构包括支撑块和支撑条，支撑块连接伸缩机构的上端，支撑条设有两个，两个支撑条连接支撑块，两个支撑条在支撑块对称分布，支撑条上均设有多个凸起，支撑块上设有定位机构。
优选的，驱动机构a包括皮带a和电机b；
两个螺杆a的端头均设有带轮a，皮带a与两个带轮a配合连接，皮带a的内周面压紧带轮a的外周面，电机b连接一个带轮a；
驱动机构b包括皮带b和电机c；
两个螺杆b的端头均设有带轮b，皮带b与两个带轮b配合连接，皮带b的内周面压紧带轮b的外周面，电机c连接一个带轮b。
优选的，放置板上设有与基片形状相同的凹槽，凹槽的周围设有多个用于放置基片的限位板。
优选的，放置架的下端设有多个凸块，壳体b内设有多个盲孔，凸块余盲孔配合连接。
优选的，齿条的两端均设有连接块，液压杆机构b的一端连接一个连接块，支撑板下端设有滑槽，连接块的两侧均设有滑轮，滑轮与滑槽配合连接。
优选的，放置架上设有多个放置槽，多个放置槽在放置架的高度方向上均匀分布。
另一方面，本发明还提出一种用于半导体封测的晶圆切割装置的操作方法，操作方法包括以下步骤：
S1、首先将多个基片放置在放置架内，打开门板将放置架放置在壳体b内，关上门板；
S2、通过plc控制系统启动驱动机构a，安装块带动取出机构向基片靠近，取出基片，电机a带动主动轮转动，主动轮带动从动轮转动进一步带动伸缩机构转动，气缸a带动伸缩机构和取出机构向放置板移动；
S3、取出机构将基片放置在放置板上，启动驱动机构b，安装杆带动激光切割头在安装部的长度方向移动，气缸b带动滑动块在按安装杆上滑动，对基片进行切割；
S4、液压杆机构b带动齿条在支撑板上滑动，齿条与齿轮啮合连接，齿轮带动支撑板转动九十度，再次进行切割；
S5、取出机构将切割完成的基片从支撑板上取出；
S6、取出机构将切割完成的基片放置到放置架上；
S7、重复以上步骤对放置架上的多个基片进行切割。
与现有技术相比，本发明的上述技术方案具有如下有益的技术效果：
本发明中，首先将多个基片放置在放置架内，打开门板将放置架放置在壳体b内，关上门板，通过plc控制系统启动驱动机构a，安装块带动取出机构向基片靠近，取出机构上设有定位机构，定位机构对基片进行扫描定位，取出基片，电机a带动主动轮转动，主动轮带动从动轮转动进一步带动伸缩机构转动，气缸a带动伸缩机构和取出机构向放置板移动，取出机构将基片放置在放置板上，启动驱动机构b，安装杆带动激光切割头在安装部的长度方向移动，气缸b带动滑动块在按安装杆上滑动，对基片进行切割，液压杆机构b带动齿条在支撑板上滑动，齿条与齿轮啮合连接，齿轮带动支撑板转动九十度，再次进行切割，取出机构将切割完成的基片从支撑板上取出，取出机构将切割完成的基片放置到放置架上，重复以上步骤对放置架上的多个基片进行切割；本实用新型，可自主切割多个待切割的基片，装置简单实用，放置板上的凹槽可固定基片的 位置，通过激光切割头的移动对基片进行切割。
附图说明
图1为本发明提出的一种用于半导体封测的晶圆切割装置的立体图。
图2为本发明提出的一种实施例另一视角的立体图。
图3为本发明提出的一种用于半导体封测的晶圆切割装置的结构示意图。
图4为本发明提出的一种实施例中支撑板下端的结构示意图。
图5为本发明提出的一种实施例中图3中A处的结构示意图。
图6为本发明提出的一种实施例中安装部内的结构示意图。
图7为本发明提出的一种实施例中滑槽与滑轮的结构示意图。
图8为本发明提出的一种实施例中放置板的立体图。
附图标记：1、壳体a；2、支腿；3、壳体b；4、透明板；5、放置架；6、固定部；7、门板；8、基片；9、拉手；10、放置槽；11、安装块；12、螺杆a；13、防护罩a；14、驱动机构a；15、滑杆；16、滑动套；17、支撑板；18、防护罩b；19、驱动机构b；20、安装部；21、安装杆；22、放置板；23、液压杆机构a；24、液压杆机构b；25、齿条；26、齿轮；27、连接块；28、伸缩机构；29、电机a；30、主动轮；31、从动轮；32、安装座；33、滑槽；34、滑轮；35、滑动块；36、螺杆b；37、连接部；38、限位板；39、凹槽；40、凸块；41、盲孔；42、定位机构；43、支撑块；44、支撑条；45、带轮a；46、皮带a；47、电机b；48、电机c；49、皮带b；50、带轮b。
具体实施方式
实施例一
如图1-8所示，本发明提出的一种用于半导体封测的晶圆切割装置，包括壳体a1、壳体b3、固定部6、安装块11、螺杆a12、防护罩a13、支撑板17、 防护罩b18、安装部20、安装杆21、液压杆机构a23、液压杆机构b24、齿条25、齿轮26、伸缩机构28、电机a29、主动轮30和滑动块35；
壳体a1下端设有多个支腿2，多个支腿2在壳体a1下端均匀分布，壳体b3连接壳体a1，壳体b3与壳体a1连通，壳体b3上转动设有门板7，壳体b3内设有用于放置基片8的放置架5，放置架5上设有拉手9，壳体a1上设有透明板4，固定部6连接壳体a1外侧，固定部6内设有plc控制单元，通过plc控制系统连接壳体a1内部的各机构；
进一步的，放置架5上设有多个用于发昂子基片8的放置槽10，多个放置槽10在放置架5的高度方向上均匀分布；
进一步的，放置架5的下端设有多个凸块40，壳体b3内设有多个盲孔41，凸块40余盲孔41配合连接，固定放置架5在壳体b3的位置；
壳体a1内设有移动仓和切割仓，螺杆a12设有两个，螺杆a12转动连接移动仓的内壁，防护罩a13连接壳体a1，防护罩a13内设有驱动机构a14,驱动机构a14连接两个螺杆a12，安装块11与两个螺杆a12螺纹配合连接，安装块11上滑动设有安装座32，安装块11上设有气缸a，气缸a连接安装座32，伸缩机构28一端连接安装座32，伸缩机构28顶端设有取出机构，伸缩机构28下端设有从动轮31，电机a29连接安装座32，主动轮30连接电机a29的转动轴，主动轮30与从动轮31啮合连接；
切割仓内设有多个滑杆15，多个滑杆15均匀分布，支撑板17下端设有多个滑动套16，滑动套16与滑杆15滑动配合连接，滑动套16与滑杆15一一对应，液压杆机构a23两端分别连接支撑板17和壳体a1的内壁，支撑板17上转动设有放置板22，齿轮26通过连杆连接放置板22，齿轮26与放置板22同轴分布，齿条25滑动连接支撑板17的下端，齿轮26与齿条25啮合连接，支撑 板17下端设有挡板，液压杆机构b24的一端连接挡板，另一端连接齿条25的端头；
进一步的，齿条25的两端均设有连接块27，液压杆机构b24的一端连接一个连接块27，支撑板17下端设有滑槽33，连接块27的两侧均设有滑轮34，滑轮34与滑槽33配合连接；
进一步的，放置板22上设有与基片8形状相同的凹槽39，凹槽39的周围设有多个用于放置基片8的限位板38；
安装部20设有两个，两个安装部20均连接壳体a1的内壁，安装部20内均转动设有螺杆b36，防护罩b18连接壳体a1，防护罩b18内设有驱动机构b19，驱动机构b19连接两个螺杆b36，安装杆21的两端均设有连接部37，连接部37与两个螺杆b36螺纹配合连接，滑动块35滑动连接安装杆21，安装杆21上设有气缸b，气缸b连接滑动块35，滑动块35的下端设有激光切割头。
本发明中，首先将多个基片8放置在放置架5内，打开门板7将放置架5放置在壳体b3内，关上门板7，通过plc控制系统启动驱动机构a14，安装块11带动取出机构向基片8靠近，取出机构上设有定位机构42，定位机构42对基片8进行扫描定位，取出基片8，电机a29带动主动轮30转动，主动轮30带动从动轮31转动进一步带动伸缩机构28转动，气缸a带动伸缩机构28和取出机构向放置板22移动，取出机构将基片8放置在放置板22上，启动驱动机构b19，安装杆21带动激光切割头在安装部20的长度方向移动，气缸b带动滑动块35在按安装杆21上滑动，对基片8进行切割，液压杆机构b24带动齿条在支撑板17上滑动，齿条25与齿轮26啮合连接，齿轮带动支撑板17转动九十度，再次进行切割，取出机构将切割完成的基片8从支撑板17上取出，取出机构将切割完成的基片8放置到放置架5上，重复以上步骤对放置架5上的多个 基片8进行切割；本实用新型，可自主切割多个待切割的基片8，装置简单实用，放置板22上的凹槽39可固定基片8的位置，通过激光切割头的移动对基片8进行切割。
实施例二
如图1-3所示，本发明提出的一种用于半导体封测的晶圆切割装置，相较于实施例一，本实施例中取出机构包括支撑块43和支撑条44，支撑块43连接伸缩机构28的上端，支撑条44设有两个，两个支撑条44连接支撑块43，两个支撑条44在支撑块43对称分布，支撑条44上均设有多个凸起，支撑块43上设有定位机构42。
本实施例中，定位机构42可确定基片8的位置，便于取出基片8，支撑条44撑起基片8的下端面，支撑条44上设有多个凸起增大与基片8之间的摩擦力，便于取出。
实施例三
如图3所示，本发明提出的一种用于半导体封测的晶圆切割装置，相较于实施例一，本实施例中驱动机构a14包括皮带a46和电机b47；
两个螺杆a12的端头均设有带轮a45，皮带a46与两个带轮a45配合连接，皮带a46的内周面压紧带轮a45的外周面，电机b47连接一个带轮a45；
驱动机构b19包括皮带b49和电机c48；
两个螺杆b36的端头均设有带轮b50，皮带b49与两个带轮b50配合连接，皮带b49的内周面压紧带轮b50的外周面，电机c48连接一个带轮b50；
进一步的，带轮a45和带轮b50的外周面均设有用于安装皮带a46和皮带b49的安装槽。
本实施例中，启动电机b47，电机b47带动一个带轮a45转动，两个带轮 a45通过皮带a46配合连接，两个带轮a45带动两个螺杆a12转动，进一步的安装块11在螺杆a12上移动，驱动机构b19也是相同的原理。
本发明还提出一种用于半导体封测的晶圆切割装置的操作方法，操作方法包括以下步骤：
S1、首先将多个基片8放置在放置架5内，打开门板7将放置架5放置在壳体b3内，关上门板7；
S2、通过plc控制系统启动驱动机构a14，安装块11带动取出机构向基片8靠近，取出机构上设有定位机构42，定位机构42对基片8进行扫描定位，取出基片8，电机a29带动主动轮30转动，主动轮30带动从动轮31转动进一步带动伸缩机构28转动，气缸a带动伸缩机构28和取出机构向放置板22移动；
S3、取出机构将基片8放置在放置板22上，启动驱动机构b19，安装杆21带动激光切割头在安装部20的长度方向移动，气缸b带动滑动块35在按安装杆21上滑动，对基片8进行切割；
S4、液压杆机构b24带动齿条在支撑板17上滑动，齿条25与齿轮26啮合连接，齿轮带动支撑板17转动九十度，再次进行切割；
S5、取出机构将切割完成的基片8从支撑板17上取出；
S6、取出机构将切割完成的基片8放置到放置架5上；
S7、重复以上步骤对放置架5上的多个基片8进行切割。
上面结合附图对本发明的实施方式作了详细说明，但是本发明并不限于此，在所属技术领域的技术人员所具备的知识范围内，在不脱离本发明宗旨的前提下还可以作出各种变化。

Claims (8)

  1. 一种用于半导体封测的晶圆切割装置，其特征在于，包括壳体a(1)、壳体b(3)、固定部(6)、安装块(11)、螺杆a(12)、防护罩a(13)、支撑板(17)、防护罩b(18)、安装部(20)、安装杆(21)、液压杆机构a(23)、液压杆机构b(24)、齿条(25)、齿轮(26)、伸缩机构(28)、电机a(29)、主动轮(30)和滑动块(35)；
    壳体a(1)下端设有支腿(2)，壳体b(3)连接壳体a(1)，壳体b(3)上转动设有门板(7)，壳体b(3)内设有用于放置基片(8)的放置架(5)，放置架(5)上设有拉手(9)，壳体a(1)上设有透明板(4)，固定部(6)连接壳体a(1)外侧，固定部(6)内设有plc控制单元；
    壳体a(1)内设有移动仓和切割仓，螺杆a(12)设有两个，螺杆a(12)转动连接移动仓的内壁，防护罩a(13)连接壳体a(1)，防护罩a(13)内设有驱动机构a(14),驱动机构a(14)连接两个螺杆a(12)，安装块(11)与两个螺杆a(12)螺纹配合连接，安装块(11)上滑动设有安装座(32)，安装块(11)上设有气缸a，气缸a连接安装座(32)，伸缩机构(28)连接安装座(32)，伸缩机构(28)顶端设有取出机构，伸缩机构(28)下端设有从动轮(31)，电机a(29)连接安装座(32)，主动轮(30)连接电机a(29)的转动轴，主动轮(30)与从动轮(31)啮合连接；
    切割仓内设有多个滑杆(15)，支撑板(17)下端设有多个滑动套(16)，滑动套(16)与滑杆(15)滑动配合连接，液压杆机构a(23)两端分别连接支撑板(17)和壳体a(1)，支撑板(17)上转动设有放置板(22)，齿轮(26)通过连杆连接放置板(22)，齿条(25)滑动连接支撑板(17)，齿轮(26)与齿条(25)啮合连接，支撑板(17)下端设有挡板，液压杆机构b(24)连接 挡板和齿条(25)的端头；
    安装部(20)设有两个，两个安装部(20)均连接壳体a(1)的内壁，安装部(20)内均转动设有螺杆b(36)，防护罩b(18)连接壳体a(1)，防护罩b(18)内设有驱动机构b(19)，驱动机构b(19)连接两个螺杆b(36)，安装杆(21)的两端均设有连接部(37)，连接部(37)与两个螺杆b(36)螺纹配合连接，滑动块(35)滑动连接安装杆(21)，安装杆(21)上设有气缸b，气缸b连接滑动块(35)，滑动块(35)的下端设有激光切割头。
  2. 根据权利要求1所述的一种用于半导体封测的晶圆切割装置，其特征在于，取出机构包括支撑块(43)和支撑条(44)，支撑块(43)连接伸缩机构(28)的上端，支撑条(44)设有两个，两个支撑条(44)连接支撑块(43)，两个支撑条(44)在支撑块(43)对称分布，支撑条(44)上均设有多个凸起，支撑块(43)上设有定位机构(42)。
  3. 根据权利要求1所述的一种用于半导体封测的晶圆切割装置，其特征在于，驱动机构a(14)包括皮带a(46)和电机b(47)；
    两个螺杆a(12)的端头均设有带轮a(45)，皮带a(46)与两个带轮a(45)配合连接，皮带a(46)的内周面压紧带轮a(45)的外周面，电机b(47)连接一个带轮a(45)；
    驱动机构b(19)包括皮带b(49)和电机c(48)；
    两个螺杆b(36)的端头均设有带轮b(50)，皮带b(49)与两个带轮b(50)配合连接，皮带b(49)的内周面压紧带轮b(50)的外周面，电机c(48)连接一个带轮b(50)。
  4. 根据权利要求1所述的一种用于半导体封测的晶圆切割装置，其特征在于，放置板(22)上设有与基片(8)形状相同的凹槽(39)，凹槽(39)的周 围设有多个用于放置基片(8)的限位板(38)。
  5. 根据权利要求1所述的一种用于半导体封测的晶圆切割装置，其特征在于，放置架(5)的下端设有多个凸块(40)，壳体b(3)内设有多个盲孔(41)，凸块(40)余盲孔(41)配合连接。
  6. 根据权利要求1所述的一种用于半导体封测的晶圆切割装置，其特征在于，齿条(25)的两端均设有连接块(27)，液压杆机构b(24)的一端连接一个连接块(27)，支撑板(17)下端设有滑槽(33)，连接块(27)的两侧均设有滑轮(34)，滑轮(34)与滑槽(33)配合连接。
  7. 根据权利要求1所述的一种用于半导体封测的晶圆切割装置，其特征在于，放置架(5)上设有多个放置槽(10)，多个放置槽(10)在放置架(5)的高度方向上均匀分布。
  8. 根据权利要求1-7任一项所述的一种用于半导体封测的晶圆切割装置，还提出一种用于半导体封测的晶圆切割装置的操作方法，其特征在于，操作方法包括以下步骤：
    S1、首先将多个基片(8)放置在放置架(5)内，打开门板(7)将放置架(5)放置在壳体b(3)内，关上门板(7)；
    S2、通过plc控制系统启动驱动机构a(14)，安装块(11)带动取出机构向基片(8)靠近，取出基片(8)，电机a(29)带动主动轮(30)转动，主动轮(30)带动从动轮(31)转动进一步带动伸缩机构(28)转动，气缸a带动伸缩机构(28)和取出机构向放置板(22)移动；
    S3、取出机构将基片(8)放置在放置板(22)上，启动驱动机构b(19)，安装杆(21)带动激光切割头在安装部(20)的长度方向移动，气缸b带动滑动块(35)在按安装杆(21)上滑动，对基片(8)进行切割；
    S4、液压杆机构b(24)带动齿条在支撑板(17)上滑动，齿条(25)与齿轮(26)啮合连接，齿轮带动支撑板(17)转动九十度，再次进行切割；
    S5、取出机构将切割完成的基片(8)从支撑板(17)上取出；
    S6、取出机构将切割完成的基片(8)放置到放置架(5)上；
    S7、重复以上步骤对放置架(5)上的多个基片(8)进行切割。
PCT/CN2022/140251 2022-12-16 2022-12-20 一种用于半导体封测的晶圆切割装置 WO2024124603A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211623102.XA CN115890018A (zh) 2022-12-16 2022-12-16 一种用于半导体封测的晶圆切割装置
CN202211623102.X 2022-12-16

Publications (1)

Publication Number Publication Date
WO2024124603A1 true WO2024124603A1 (zh) 2024-06-20

Family

ID=86480564

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/140251 WO2024124603A1 (zh) 2022-12-16 2022-12-20 一种用于半导体封测的晶圆切割装置

Country Status (2)

Country Link
CN (1) CN115890018A (zh)
WO (1) WO2024124603A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117324788B (zh) * 2023-10-25 2024-06-25 苏州法特迪科技股份有限公司 一种晶圆激光切割机及晶圆驱动方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058489A (ja) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd 被加工物の分割方法及び分割装置
CN210616983U (zh) * 2019-08-05 2020-05-26 复汉海志(江苏)科技有限公司 一种用于半导体封装的晶圆切割装置
CN212823487U (zh) * 2020-08-31 2021-03-30 河南通用智能装备有限公司 一种激光切割用晶圆取料移动结构
CN112643219A (zh) * 2020-12-09 2021-04-13 苏州斯尔特微电子有限公司 激光晶圆切割设备
CN114833466A (zh) * 2022-05-23 2022-08-02 东莞市译码半导体有限公司 一种待上料功能的晶圆切割装置
CN115458468A (zh) * 2022-11-11 2022-12-09 扬州韩思半导体科技有限公司 一种半导体晶圆激光切割装置及方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058489A (ja) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd 被加工物の分割方法及び分割装置
CN210616983U (zh) * 2019-08-05 2020-05-26 复汉海志(江苏)科技有限公司 一种用于半导体封装的晶圆切割装置
CN212823487U (zh) * 2020-08-31 2021-03-30 河南通用智能装备有限公司 一种激光切割用晶圆取料移动结构
CN112643219A (zh) * 2020-12-09 2021-04-13 苏州斯尔特微电子有限公司 激光晶圆切割设备
CN114833466A (zh) * 2022-05-23 2022-08-02 东莞市译码半导体有限公司 一种待上料功能的晶圆切割装置
CN115458468A (zh) * 2022-11-11 2022-12-09 扬州韩思半导体科技有限公司 一种半导体晶圆激光切割装置及方法

Also Published As

Publication number Publication date
CN115890018A (zh) 2023-04-04

Similar Documents

Publication Publication Date Title
CN107186602B (zh) 一种五轴数控抛光机
WO2024124603A1 (zh) 一种用于半导体封测的晶圆切割装置
CN210232488U (zh) 不锈钢管用料口磨削装置
CN220341203U (zh) 一种半导体晶圆减薄持取装置
CN117020775B (zh) 一种电主轴磨削抛光装置及其方法
CN211332616U (zh) 一种大圆环打磨装置
CN219466370U (zh) 一种基于吸塑托盘制造的模切装置
CN111823086A (zh) 一种角度可调式机械加工用板材磨边装置
CN218964730U (zh) 一种cnc自动化设备用定位夹具
CN107309725B (zh) 双联结构卧轴圆台平面磨床
CN216398102U (zh) 一种机械加工用管道钻孔装置
CN106378652A (zh) 数控加工装置
CN114654373A (zh) 一种铸件加工用高精度抛光装置
CN113997184A (zh) 一种钢管用料口磨削加工装置
CN210452120U (zh) 一种可去除毛边的轴承倒角处理设备
CN206241711U (zh) 数控加工装置
CN214374039U (zh) 一种能自由调节测试台高度的耐磨耗试验机
CN221392226U (zh) 一种吸塑包装的吸塑成型用冲裁机
CN221088123U (zh) 一种定位夹具以及数控铣床
CN220944509U (zh) 一种电脑机箱加工用磨边装置
CN221135044U (zh) 一种四轴旋转液压夹具
CN111496149B (zh) 一种探针用双弯折机
CN215548504U (zh) 一种金属铸件维修平台
CN220533765U (zh) 一种锻焊加工用表面预处理装置
CN220881431U (zh) 一种减速机零部件生产用加工设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22968306

Country of ref document: EP

Kind code of ref document: A1