WO2024077887A1 - 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用 - Google Patents

改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用 Download PDF

Info

Publication number
WO2024077887A1
WO2024077887A1 PCT/CN2023/085349 CN2023085349W WO2024077887A1 WO 2024077887 A1 WO2024077887 A1 WO 2024077887A1 CN 2023085349 W CN2023085349 W CN 2023085349W WO 2024077887 A1 WO2024077887 A1 WO 2024077887A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
amino silicone
silicone resin
amino
cyanate
Prior art date
Application number
PCT/CN2023/085349
Other languages
English (en)
French (fr)
Inventor
崔春梅
焦锋
王辉
谌香秀
丁铁矿
Original Assignee
苏州生益科技有限公司
常熟生益科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202211240716.XA external-priority patent/CN115850710B/zh
Priority claimed from CN202211241857.3A external-priority patent/CN116239777A/zh
Priority claimed from CN202211241822.XA external-priority patent/CN116120560B/zh
Application filed by 苏州生益科技有限公司, 常熟生益科技有限公司 filed Critical 苏州生益科技有限公司
Priority to KR1020237020919A priority Critical patent/KR20240052716A/ko
Publication of WO2024077887A1 publication Critical patent/WO2024077887A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/06—Copolymers with styrene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to the technical field of electronic materials, and in particular to a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer, and applications of the resin composition.
  • Bismaleimide resin cured products have excellent properties such as high temperature resistance, moisture and heat resistance, high modulus, low CTE, and high strength, and are particularly suitable for use as the base resin for IC packaging substrates and similar substrates.
  • They also have disadvantages such as high brittleness and poor processing performance, which limit their large-scale application.
  • silicone rubber powder is introduced into the bismaleimide resin.
  • the introduction of silicone rubber powder improves the water absorption and toughness of the cured product of bismaleimide resin to a certain extent, but the silicone rubber powder has a small density, is easy to agglomerate, and has poor dispersibility. It floats on the upper layer of the bismaleimide resin glue to form a phase separation, resulting in the cured product of the bismaleimide resin being delaminated.
  • the prior art also directly adds silicone oil to the bismaleimide resin, but in the process of curing the cured product, if the silicone oil does not react completely, it is very easy to seep out of the system, affecting the production processability and seriously affecting the comprehensive performance of the final cured product.
  • the purpose of the present invention is to provide a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer and an application of the resin composition.
  • the modified bismaleimide prepolymer is modified by reacting a bismaleimide compound with an amino silicone resin with different amino equivalents, and the quality of the amino silicone resin and the bismaleimide compound is controlled, which not only improves the problem of high brittleness of the bismaleimide resin, but also better controls the reactivity of the bismaleimide resin and the rheology of the resin during high-temperature lamination, thereby improving the processing performance of the resin composition.
  • one embodiment of the present invention provides a modified bismaleimide prepolymer, which is obtained by reacting a bismaleimide compound with an amino silicone resin A and an amino silicone resin B, wherein the amino equivalent Ea A of the amino silicone resin A is different from the amino equivalent Ea B of the amino silicone resin B, and the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5-80):100.
  • the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (20-50):100.
  • the mass ratio of the amino silicone resin A to the amino silicone resin B is 1:(2-30).
  • the amino silicone resin A and the amino silicone resin B both contain the following structure:
  • R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.
  • the side chain of the amino silicone resin A and/or the amino silicone resin B contains at least one amino group.
  • the amino silicone resin A and/or the amino silicone resin B contains at least one amino group at the terminal.
  • One embodiment of the present invention further provides a resin composition, comprising the following components by weight:
  • the modified bismaleimide prepolymer is the aforementioned modified bismaleimide prepolymer.
  • the cyanate resin is selected from one or more of bisphenol A cyanate resin, bisphenol F cyanate resin, bisphenol S cyanate resin, bisphenol E cyanate resin, bisphenol M cyanate resin, double bond-containing cyanate resin, phosphorus-containing cyanate resin, phenolic cyanate resin, biphenyl cyanate resin, naphthalene ring cyanate resin, and dicyclopentadiene cyanate resin.
  • the cyanate ester resin is a naphthalene-type cyanate ester resin or/and a phenolic-type cyanate ester resin as shown in the following structure:
  • R6 is hydrogen, methyl or ethyl, and n2 is an integer from 1 to 10;
  • n is an integer of 1-10.
  • the elastomer is selected from at least one of styrene elastomers, methacrylate elastomers, and silicone elastomers.
  • a silane coupling agent and a dispersant are also included.
  • the silane coupling agent is an epoxy silane coupling agent
  • the dispersant is a phosphate dispersant and/or a modified polyurethane dispersant
  • the weight ratio of the silane coupling agent to the dispersant is 2:1 to 10:1.
  • One embodiment of the present invention further provides a use of the above-mentioned resin composition in a prepreg, a laminate, an insulating film, an insulating board, a copper-clad board, a circuit substrate and an electronic device.
  • the modified bismaleimide prepolymer provided by the present invention improves the reactivity and brittleness of the bismaleimide compound by reacting the bismaleimide compound with an amino silicone resin with different amino equivalents; at the same time, the masses of the amino silicone resin and the bismaleimide compound are controlled, the rheological reaction window of the resin composition is well adjusted, and the risk of defects such as substrate drying or white lines due to overly fast reaction during the lamination process of the resin composition is reduced.
  • FIG. 1 is a rheological curve diagram of Example 2 of the present invention and Comparative Example 2.
  • the embodiment of the present invention provides a modified bismaleimide prepolymer, which is obtained by reacting a bismaleimide compound with an amino silicone resin A and an amino silicone resin B, wherein the amino equivalent Ea A of the amino silicone resin A is different from the amino equivalent Ea B of the amino silicone resin B, and the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5-80):100.
  • the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (20-50):100.
  • the mass ratio of the amino silicone resin A to the amino silicone resin B is 1:(2-30).
  • the bismaleimide compound and the amino silicone resin A are reacted at 60-90° C. for 0.5-1.5 hours, and then the temperature is raised to 90-130° C., and then the amino silicone resin B is added and the reaction is continued for 0.5-2 hours.
  • At least one of aminophenol, carboxylic acid or carboxylic anhydride is added during the reaction in an amount of 0.1 to 10 parts by weight.
  • the phenolic hydroxyl group, carboxyl group and anhydride group in the aminophenol, carboxylic acid or carboxylic anhydride can react with the bismaleimide compound, thereby improving the reactivity.
  • amino equivalent Ea A of the amino silicone resin A is 100 g/mol ⁇ Ea A ⁇ 500 g/mol
  • the amino equivalent Ea B of the amino silicone resin B is 500 g/mol ⁇ Ea B ⁇ 1600 g/mol.
  • the absolute value of the difference in amino equivalent weight between the silicone resin A and the silicone resin B is 100 g/mol to 600 g/mol.
  • amino silicone resin A and amino silicone resin B contain the following structure:
  • R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.
  • amino silicone resin A and/or the amino silicone resin B contains at least one amino group on the side chain.
  • amino silicone resin A and/or the amino silicone resin B contains at least one amino group at the terminal.
  • the aforementioned bismaleimide compound can be selected from at least one of the following structures:
  • R2 is hydrogen, methyl or ethyl, R1 is methylene, ethylene or, and n is an integer from 1 to 10;
  • n is an integer from 1 to 10;
  • n is an integer from 1 to 10;
  • n is an integer from 1 to 10;
  • R is hydrogen, methyl or ethyl, and n is an integer of 1-10.
  • the present invention also provides a resin composition, comprising the following components by weight:
  • the modified bismaleimide prepolymer is the aforementioned modified bismaleimide prepolymer.
  • the cyanate resin is selected from one or more of bisphenol A cyanate resin, bisphenol F cyanate resin, bisphenol S cyanate resin, bisphenol E cyanate resin, bisphenol M cyanate resin, double bond-containing cyanate resin, phosphorus-containing cyanate resin, phenolic cyanate resin, biphenyl cyanate resin, naphthalene ring cyanate resin, and dicyclopentadiene cyanate resin.
  • the cyanate ester resin is a naphthalene ring type cyanate ester resin or/and a phenolic type cyanate ester resin as shown in the following structure:
  • R6 is hydrogen, methyl or ethyl, and n2 is an integer from 1 to 10;
  • n is an integer of 1-10.
  • the elastomer is selected from at least one of styrene elastomers, methacrylate elastomers, and silicone elastomers.
  • the styrene elastomer is selected from H1041, H1043, H1051, H1052, H1053, H1221, P1500, P2000, M1911 or M1913 of Asahi Chemical; 8004, 8006, 8076, 8104, V9827, 2002, 2005, 2006, 2007, 2104, 7125, 4033, 4044, 4055, 4077, or 4099.
  • the methacrylate is selected from M51, M52, M22 or D51N of Arkema; LA-2330 of Kuraray; SG-P3 series or SG-80 series of Nagase.
  • Silicone elastomers include X-40-2670, R-170S, X-40-2705, X-40-2701, KMP-600, KMP-605, X-52-7030 from Xinyue Chemical; AY-42-119, EP-2600, EP-2601, EP-2720, TMS-2670, EXL-2315, EXL-2655 from DOW, etc.
  • the resin composition further comprises 0.01 to 5 parts by weight of a catalyst, wherein the catalyst is at least one of an imidazole catalyst, a pyridine catalyst, and an organic metal salt catalyst.
  • the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, modified imidazole, and zinc octoate.
  • the modified imidazole is shown in the following structure:
  • R3, R4, R5 and R6 are the same or different and are methyl, ethyl or tert-butyl respectively;
  • B is methylene, ethylene, P200F50, manufactured by JER, can be used.
  • R3, R4, R5 and R6 are the same or the same, and are methyl, ethyl or tert-butyl, respectively;
  • A is methylene, ethylene, Or aromatic hydrocarbon group, G8009L, first industrial production, can be used.
  • the resin composition further comprises 20 to 200 parts by weight of filler.
  • the filler comprises inorganic filler Materials, organic fillers, composite fillers.
  • the inorganic filler is selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.
  • the organic filler is selected from at least one of polytetrafluoroethylene powder, polyphenylene sulfide powder, and polyether sulfone powder.
  • the filler is spherical silica, alumina or aluminum hydroxide, more preferably spherical silica.
  • the filler content is 30 to 150 parts by weight.
  • the filler is surface treated with a silane coupling agent
  • the silane coupling agent is at least one of an aminosilane coupling agent, a carbon-carbon double bond-containing silane coupling agent, or an epoxysilane coupling agent.
  • the silane coupling agent is selected from one or more of KBM-573 manufactured by Shin-Etsu Chemical, Z-6883 manufactured by Dow Corning, KBM-1003 manufactured by Shin-Etsu Chemical, and KBM-1403 manufactured by Shin-Etsu Chemical.
  • the resin composition also includes a silane coupling agent and a dispersant
  • the silane coupling agent is an epoxy silane coupling agent
  • the dispersant is a phosphate or/and modified polyurethane
  • the weight ratio of the silane coupling agent to the dispersant is 2:1 to 10:1.
  • the resin composition also includes a flame retardant, which contains 5 to 50 parts by weight based on 100 parts by weight of the resin composition.
  • the flame retardant is selected from bromine flame retardants, phosphorus flame retardants, nitrogen flame retardants, silicone flame retardants, organic metal salt flame retardants, etc.
  • the flame retardant is selected from phosphazene with the brand name SPB-100 produced by Otsuka Chemical of Japan; modified phosphazenes with the brands BP-PZ, PP-PZ, SPCN-100, SPV-100 and SPB-100L.
  • dyes may be added to the resin composition, which may be fluorescent dyes or black dyes.
  • the fluorescent dyes may be pyrazoline compounds
  • the black dyes may be liquid or powdered carbon black, pyridine complexes, azo complexes, quinone compounds, zirconium nitride, titanium oxide, titanium nitride, black talc, cobalt chromium metal oxides, azine or phthalocyanine, etc.
  • the present invention also provides the use of the resin composition in prepregs, laminates, insulating films, insulating boards, circuit substrates and electronic devices, which are specifically described as follows:
  • the present invention also provides a prepreg, comprising a reinforcing material and the above-mentioned resin composition, the prepreg
  • the preparation method is as follows: the resin composition is dissolved in a solvent to prepare a glue solution, and then the reinforcing material is immersed in the above glue solution, and the immersed reinforcing material is taken out and baked at 100 to 180° C. for 1 to 15 minutes; after drying, a semi-cured sheet can be obtained.
  • the solvent is selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
  • the reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics.
  • the reinforcing material is glass fiber cloth; among the glass fiber cloth, open fiber cloth or flat cloth is preferably used, and the glass fiber cloth is preferably E glass fiber cloth, S glass fiber, or Q glass fiber.
  • the glass fiber cloth is chemically treated with a coupling agent to improve the interface bonding between the resin composition and the glass fiber cloth.
  • the coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent to provide good water resistance and heat resistance.
  • An embodiment of the present invention also provides a laminate, comprising a piece of the aforementioned prepreg and a metal foil arranged on at least one side of the prepreg; or comprising a composite sheet formed by overlapping multiple pieces of the aforementioned prepreg and a metal foil arranged on at least one side of the composite sheet.
  • the laminate is prepared by the following method: a metal foil is coated on one or both sides of a prepreg, or at least two prepregs are stacked to form a composite sheet, a metal foil is coated on one or both sides of the composite sheet, and the metal foil laminate is obtained by hot pressing.
  • the hot pressing conditions are: pressing at 0.2-2MPa and 150-250°C for 2-4 hours.
  • the metal foil is selected from copper foil or aluminum foil.
  • the thickness of the metal foil is 5 micrometers, 8 micrometers, 12 micrometers, 18 micrometers, 35 micrometers or 70 micrometers.
  • An embodiment of the present invention further provides an insulating board, comprising at least one of the aforementioned prepreg sheets.
  • the embodiment of the present invention further provides an insulating film, comprising a carrier film and the above-mentioned resin composition coated thereon, and the thermal index of the insulating film is significantly improved.
  • the insulating film is prepared by the following method: the resin composition is dissolved in a solvent to prepare a glue solution, the glue solution is then coated on a carrier film, and the carrier film coated with the glue solution is heated and dried to obtain the insulating film.
  • the aforementioned solvent is selected from at least one of acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.
  • the carrier film is selected from at least one of PET film, PP film, PE film and PVC film.
  • An embodiment of the present invention further provides a circuit substrate, comprising one or more of the aforementioned prepreg, laminate, insulating plate, and insulating film.
  • An embodiment of the present invention further provides an electronic device, comprising the aforementioned circuit substrate; since the heat resistance of the circuit substrate is greatly improved, the safety of the electronic device is significantly improved.
  • the corresponding solid substances are weighed, and the glue solution of each weighed solid substance is adjusted to a solid content of 60% by a solvent.
  • the glue solution is applied on E glass fiber cloth, and after impregnation, it is placed in a 160°C forced air drying oven and baked for 3 to 6 minutes to form a semi-cured sheet.
  • the prepreg was cut to 300 ⁇ 300 mm, and an electrolytic copper foil was placed on each side of the prepreg to form a certain stacking structure, and then sent to a vacuum press for pressing to obtain a metal foil laminate (or copper-clad laminate).
  • the specific performance tests are shown in Table 2.
  • PCT 2HR water absorption rate determination Take 3 samples of 10cm ⁇ 10cm, 0.40mm thickness, with metal foil removed from both sides, dry at 100°C for 2 hours, weigh and record the weight as W1, then treat in a pressure cooker tester at 121°C and 2 atmospheres for 2 hours, weigh and record the weight as W2, and determine the water absorption rate as (W2-W1)/W1 ⁇ 100%;
  • Secondary surface defects Use the standard test method specified in IPC-TM-650 to determine whether there are defects such as dry flowers and white lines in the substrate through visual inspection or slicing method.
  • Examples 1 to 3 have excellent high Tg, low water absorption, low CTE value and good apparent quality, among which Example 1 has a higher Tg value and low CTE than Comparative Example 1, and Example 2 has a higher Tg value and lower CTE than Comparative Example 2.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

本发明提供一种改性双马来酰亚胺预聚物、树脂组合物及其应用，改性双马来酰亚胺预聚物通过双马来酰亚胺化合物与氨基有机硅树脂A、氨基有机硅树脂B反应获得，其中，所述氨基有机硅树脂A的氨基当量EaA与所述氨基有机硅树脂B的氨基当量EaB不同，所述氨基有机硅树脂A和所述氨基有机硅树脂B质量的总和与所述双马来酰亚胺化合物的质量之比为（5～80）:100。本发明改善了双马来酰亚胺化合物的反应性，控制了改性双马来酰亚胺预聚物应用于封装基板等基板材料领域时，高温层压时的流变性。

Description

改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
本申请要求了申请日为2022年10月11日，申请号为202211240716.X，发明名称为“改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子材料技术领域，尤其涉及一种改性双马来酰亚胺预聚物、含有改性双马来酰亚胺预聚物的树脂组合物及树脂组合物的应用。
背景技术
近年来电子设备向小型化、高性能化方向发展，在印制线路板中配线密度的高度化、高集聚化不断发展，这对覆铜板的耐热性和可靠性提出了更高的要求。尤其是在半导体封装基板中，在封装组装时芯片与有机基板之间的热膨胀率之差导致翘曲问题。
双马来酰亚胺树脂固化物具有耐高温、耐湿热、高模量、低CTE、高强度等优异性能，特别适合用作IC封装载板和类载板的基体树脂。但是也存在脆性大、加工性能差等缺点，限制了其大规模应用。
现有技术中为了改善双马来酰亚胺树脂的固化物存在的上述问题，通过在双马来酰亚胺树脂引入硅橡胶粉末，硅橡胶粉末的引入使得双马来酰亚胺树脂的固化物的吸水率、韧性有一定改善，但硅橡胶粉末的密度较小、易团聚、分散性差，其漂浮在双马来酰亚胺树脂胶液上层，形成相分离，导致双马来酰亚胺树脂的固化物出现分层等问题。除此之外，现有技术还在双马来酰亚胺树脂中直接加入硅油，但是在固化物层压过程中，硅油若反应不全面则极容易从体系中渗出，影响生产加工性，并严重影响最终固化物的综合性能。
发明内容
本发明的目的在于提供一种改性双马来酰亚胺预聚物、含有改性双马来酰亚胺预聚物的树脂组合物及树脂组合物的应用，改性双马来酰亚胺预聚物通过双马来酰亚胺化合物与不同氨基当量的氨基有机硅树脂进行反应改性，并控制氨基有机硅树脂与双马来酰亚胺化合物的质量，不仅改善了双马来酰亚胺树脂脆性大的问题，还较好的控制了双马来酰亚胺树脂的反应性和高温层压时树脂的流变性，从而改善了树脂组合物加工性能。
为了实现上述发明目的之一，本发明一实施方式提供一种改性双马来酰亚胺预聚物，通过双马来酰亚胺化合物与氨基有机硅树脂A、氨基有机硅树脂B反应获得，其中，所述氨基有机硅树脂A的氨基当量EaA与所述氨基有机硅树脂B的氨基当量EaB不同，所述氨基有机硅树脂A和所述氨基有机硅树脂B质量的总和与所述双马来酰亚胺化合物的质量之比为(5～80):100。
作为本发明一实施方式的进一步改进，所述氨基有机硅树脂A和所述氨基有机硅树脂B质量的总和与所述双马来酰亚胺化合物的质量之比为(20～50):100。
作为本发明一实施方式的进一步改进，所述氨基有机硅树脂A和所述氨基有机硅树脂B的质量之比为1:(2～30)。
作为本发明一实施方式的进一步改进，所述氨基有机硅树脂A和所述氨基有机硅树脂B中均含有如下结构：
其中R和R’为C1～C5的烷基，m为1～30的整数。
作为本发明一实施方式的进一步改进，所述氨基有机硅树脂A和/或所述氨基有机硅树脂B中的侧链至少含有一个氨基。
作为本发明一实施方式的进一步改进，所述氨基有机硅树脂A和/或所述氨基有机硅树脂B中末端至少含有一个氨基。
本发明一实施方式还提供一种树脂组合物，以重量计，包括如下组分：
(a)改性双马来酰亚胺预聚物：30～100份；
(b)氰酸酯树脂：3～50份；
(c)弹性体：5～60份；
其中，所述改性双马来酰亚胺预聚物为前述的改性双马来酰亚胺预聚物。
作为本发明一实施方式的进一步改进，所述氰酸酯树脂选自双酚A氰酸酯树脂、双酚F氰酸酯树脂、双酚S型氰酸酯树脂、双酚E型氰酸酯树脂、双酚M型氰酸酯树脂、含双键氰酸酯树脂、含磷氰酸酯树脂、酚醛型氰酸酯树脂、联苯型氰酸酯树脂、萘环型氰酸酯树脂、双环戊二烯型氰酸酯树脂中的一种或几种。
作为本发明一实施方式的进一步改进，所述氰酸酯树脂为如下结构所示的萘型氰酸酯树脂或/和酚醛型氰酸酯树脂：
R6为氢、甲基或乙基，n2为1～10的整数；
n为1～10的整数。
作为本发明一实施方式的进一步改进，所述弹性体选自苯乙烯类弹性体、甲基丙烯酸酯类弹性体、有机硅类弹性体中至少一种。
作为本发明一实施方式的进一步改进，还包括硅烷偶联剂和分散剂。
作为本发明一实施方式的进一步改进，所述硅烷偶联剂为环氧硅烷偶联剂，所述分散剂为磷酸酯类分散剂和/或改性聚氨酯类分散剂，所述硅烷偶联剂和分散剂的重量比例为2:1～10:1。
本发明一实施方式还提供一种如前所述的树脂组合物在半固化片、层压板、绝缘薄膜、绝缘板、覆铜板、电路基板和电子器件中的应用。
本发明提供的一个或多个技术方案，至少具有如下技术效果或优点：
本发明提供的改性双马来酰亚胺预聚物通过双马来酰亚胺化合物与不同氨基当量的氨基有机硅树脂反应，改善双马来酰亚胺化合物的反应性和脆性；同时控制氨基有机硅树脂和双马来酰亚胺化合物的质量，很好地调节了树脂组合物的流变反应窗口，降低了树脂组合物在压合过程中因反应过快而出现基材干花或白纹的缺陷的风险。
附图说明
图1为本发明实施例2和对比例2的流变曲线图。
具体实施方式
以下将结合具体实施方式对本发明进行详细的描述，但这些实施方式并不限制本发明，本领域的普通技术人员根据这些实施方式所做的反应条件、反应物或原料用量上的变换均包含在本发明的保护范围内。
本发明实施例提供了一种改性双马来酰亚胺预聚物，通过双马来酰亚胺化合物与氨基有机硅树脂A、氨基有机硅树脂B反应获得，其中，氨基有机硅树脂A的氨基当量EaA与氨基有机硅树脂B的氨基当量EaB不同，氨基有机硅树脂A和氨基有机硅树脂B质量的总和与双马来酰亚胺化合物的质量之比为(5～80):100。
优选的，氨基有机硅树脂A和氨基有机硅树脂B质量的总和与双马来酰亚胺化合物的质量之比为(20～50):100。
进一步的，氨基有机硅树脂A和氨基有机硅树脂B的质量之比为1:(2～30)。
双马来酰亚胺化合物、氨基有机硅树脂A和氨基有机硅树脂B之间的具体反应如下：
先将双马来酰亚胺化合物与氨基有机硅树脂A在60-90℃下反应0.5-1.5小时后，温度升至90-130℃后再加入氨基有机硅树脂B后继续反应0.5-2小时。
优选的，在反应过程中添加氨基酚、羧酸或羧酸酐中至少一种，含量为0.1～10重量份，氨基酚、羧酸或羧酸酐中的酚羟基、羧基和酸酐基均能与双马来酰亚胺化合物反应，从而提升反应性。
进一步的，氨基有机硅树脂A的氨基当量EaA为100g/mol≤EaA≤500g/mol，氨基有机硅树脂B的氨基当量EaB的氨基当量为500g/mol＜EaB≤1600g/mol。
优选的，有机硅树脂A和有机硅树脂B的氨基当量差值的绝对值为100g/mol～600g/mol。
氨基有机硅树脂A和氨基有机硅树脂B中均含有以下结构：
其中，R和R’为C1～C5的烷基，m为1～30的整数。
进一步的，氨基有机硅树脂A和/或氨基有机硅树脂B中侧链上至少含有一个氨基。
进一步的，氨基有机硅树脂A和/或氨基有机硅树脂B中末端至少含有一个氨基。
进一步的，前述双马来酰亚胺化合物可以选自以下结构中的至少一种：
R2为氢、甲基或乙基，R1为亚甲基、亚乙基或，n为1～10的整数；
n为1～10的整数；
n为1～10的整数；
n为1～10的整数；
R为氢、甲基或乙基，n为1～10的整数。
本发明还提供一种树脂组合物，以重量计，包括如下组分：
(a)改性双马来酰亚胺预聚物：30～100份；
(b)氰酸酯树脂：3～50份；
(c)弹性体：5～60份；
其中，改性双马来酰亚胺预聚物为前述的改性双马来酰亚胺预聚物。
进一步的，氰酸酯树脂选自双酚A型氰酸酯树脂、双酚F型氰酸酯树脂、双酚S型氰酸酯树脂、双酚E型氰酸酯树脂、双酚M型氰酸酯树脂、含双键氰酸酯树脂、含磷氰酸酯树脂、酚醛型氰酸酯树脂、联苯型氰酸酯树脂、萘环型氰酸酯树脂、双环戊二烯型氰酸酯树脂中的一种或几种。
优选的，氰酸酯树脂为如下结构所示的萘环型氰酸酯树脂或/和酚醛型氰酸酯树脂：
R6为氢、甲基或乙基，n2为1～10的整数；
n为1～10的整数。
进一步的，弹性体选自苯乙烯类弹性体、甲基丙烯酸酯类弹性体、有机硅类弹性体中至少一种。
其中，苯乙烯类弹性体选自日本旭化成的H1041、H1043、H1051、H1052、H1053、H1221、P1500、P2000、M1911或M1913；可乐丽的8004、8006、8076、 8104、V9827、2002、2005、2006、2007、2104、7125、4033、4044、4055、4077或4099。
甲基丙烯酸酯类选自阿克玛的M51、M52、M22或D51N；可乐丽的LA-2330；长濑的SG-P3系列或SG-80系列。
有机硅类弹性体选自信越化学的X-40-2670、R-170S、X-40-2705、X-40-2701、KMP-600、KMP-605、X-52-7030；DOW的AY-42-119、EP-2600、EP-2601、EP-2720、TMS-2670、EXL-2315、EXL-2655等。
进一步的，树脂组合物还包括0.01～5重量份的催化剂，催化剂为咪唑类催化剂、吡啶类催化剂、有机金属盐类催化剂中至少一种。优选的，催化剂为4-二甲氨基吡啶、2-甲基咪唑、2-甲基4-乙基咪唑、2-苯基咪唑、改性咪唑以及辛酸锌中的至少一种。
所述改性咪唑为如下结构所示：
其中R3、R4、R5和R6相同或不同，分别为甲基、乙基或叔丁基，B为亚甲基、亚乙基、 可使用P200F50，JER制。
其中R3、R4、R5和R6相同或，同，分别为甲基、乙基或叔丁基，A为亚甲基、亚乙基、或芳香族碳氢基，可使用G8009L，第一工业制。
进一步的，树脂组合物中还包括20～200重量份填料。填料包括无机填 料、有机填料、复合填料。其中无机填料选自熔融二氧化硅、结晶型二氧化硅、球型二氧化硅、空心二氧化硅、氢氧化铝、氧化铝、滑石粉、氮化铝、氮化硼、碳化硅、硫酸钡、钛酸钡、钛酸锶、碳酸钙、硅酸钙、云母、玻璃纤维粉中的至少一种。有机填料选自聚四氟乙烯粉末、聚苯硫醚粉末、聚醚砜粉末中的至少一种。
优选的，填料为球形二氧化硅、氧化铝或氢氧化铝，更优选为球形二氧化硅。
优选的，填料含量为30～150重量份。
进一步的，填料用硅烷偶联剂进行表面处理，硅烷偶联剂为氨基硅烷偶联剂、含碳碳双键硅烷偶联剂或环氧硅烷偶联剂中至少一种。优选的，硅烷偶联剂选自牌号为信越化学制KBM-573、道康宁制Z-6883、牌号为信越化学制KBM-1003、牌号为信越化学制KBM-1403中的一种或多种。
进一步的，树脂组合物中还包括硅烷偶联剂和分散剂，硅烷偶联剂为环氧硅烷偶联剂，分散剂为磷酸酯类或/和改性聚氨酯类，且硅烷偶联剂和分散剂的重量比例为2:1～10:1。
进一步的，树脂组合物中还包括阻燃剂，以树脂组合物100重量份计，含5～50重量份，阻燃剂选自溴系阻燃剂、磷系阻燃剂、氮系阻燃剂、有机硅阻燃剂、有机金属盐阻燃剂等。
优选的，阻燃剂选自日本大冢化学制的牌号为SPB-100的磷腈；牌号为BP-PZ、PP-PZ、SPCN-100、SPV-100和SPB-100L的改性磷腈。
进一步的，树脂组合物中还可添加染料，可选为荧光染料或黑色染料，荧光染料具体可选择吡唑啉类化合物，黑色染料具体可选择液态或粉末状的炭黑、吡啶络合物、偶氮络合物、醌类化合物、氮化锆、氧化钛、氮化钛、黑滑石粉、钴铬铬金属氧化物、吖嗪或酞菁等。
本发明还提供上述树脂组合物在半固化片、层压板、绝缘薄膜、绝缘板、电路基板和电子器件中的应用，具体说明如下：
本发明提供还一种半固化片，包括增强材料和前述树脂组合物，半固化片 的制备方法为：将树脂组合物用溶剂溶解制成胶液，然后将增强材料浸渍在上述胶液中，将浸渍后的增强材料取出在100～180℃环境下烘烤1～15min；干燥后即可得到半固化片。
其中，溶剂选自丙酮、丁酮、甲苯、甲基异丁酮、N、N-二甲基甲酰胺、N、N-二甲基乙酰胺、乙二醇甲醚、丙二醇甲醚、苯、甲苯、二甲苯、环己烷中的至少一种。
增强材料选自天然纤维、有机合成纤维、有机织物、无机织物中的至少一种。优选地，增强材料采用玻璃纤维布；玻璃纤维布中优选使用开纤布或扁平布，玻璃纤维布优选为E玻璃纤维布、S玻璃纤维或Q玻璃纤维。
此外，当增强材料采用玻璃纤维布时，玻璃纤维布使用偶联剂进行化学处理，以改善树脂组合物与玻璃纤维布之间的界面结合。偶联剂优选用环氧硅烷偶联剂或者氨基硅烷偶联剂，以提供良好的耐水性和耐热性。
本发明实施例还提供一种层压板，包括一片前述半固化片以及设置在半固化片至少一侧表面的金属箔；或者包括由多片前述半固化片相互叠合而成的组成片以及设置在组合片至少一侧表面的金属箔。
层压板采用以下方法制备：在一片半固化片的一侧或双侧表面覆上金属箔，或者将至少两片半固化片叠合而成组成片，在组成片的一侧或双侧表面覆上金属箔，热压成形得到金属箔层压板。热压的压制条件为：在0.2～2MPa、150～250℃下压制2～4小时。
优选的，金属箔选自铜箔或铝箔。金属箔的厚度为5微米、8微米、12微米、18微米、35微米或70微米。
本发明实施例还提供了一种绝缘板，包括至少一片前述半固化片。
本发明实施例还提供了一种绝缘薄膜，包括载体膜以及涂覆在其上的前述树脂组合物，绝缘薄膜的热指数得到了明显提高。
绝缘薄膜采用以下方法制备：将前述树脂组合物用溶剂溶解制成胶液，然后在载体膜上涂覆该胶液，将涂覆胶液的载体膜加热干燥后，即可得到绝缘薄膜。
前述的溶剂选自丙酮、丁酮、甲苯、甲基异丁酮、N、N-二甲基甲酰胺、N、N-二甲基乙酰胺、乙二醇甲醚、丙二醇甲醚、苯、甲苯、二甲苯、环己烷中的至少一种。
载体膜选自PET膜、PP膜、PE膜、PVC膜中的至少一种。
本发明实施例还提供了一种电路基板，包括前述的半固化片、层压板、绝缘板、绝缘薄膜中的一种或多种。
本发明实施例还提供了一种电子器件，包括前述电路基板；由于电路基板的耐热性大大提高，故电子器件的安全性显著提高。
下面结合一些具体的合成例和对比例，对本申请的技术方案进行进一步说明。
合成例1：改性双马来酰亚胺预聚物Y1
在烧杯中加入100g双马来酰亚胺树脂(大和化学制，BMI-2300)、10g氨基有机硅树脂A(氨基当量为450g/mol，DOWSILTM BY 16-853)和适量的有机溶剂，在80℃下反应60min，升温至100℃再添加25g氨基有机硅树脂B(氨基当量为800g/mol，信越化学制X-22-161A)，继续反应90min，出料制得改性双马来酰亚胺预聚物Y1。
合成例2：改性双马来酰亚胺预聚物Y2
在烧杯中加入100g双马来酰亚胺树脂(日本化药制，MIR-3000)、5g氨基有机硅树脂A(氨基当量为430g/mol，信越化学制KF-8010)和适量的有机溶剂，在80℃下反应60min，升温至100℃再添加30g氨基有机硅树脂B(氨基当量为800g/mol，信越化学制X-22-161A)，继续反应90min，出料制得改性双马来酰亚胺预聚物Y2。
合成例3：改性双马来酰亚胺预聚物Y3
在烧杯中加入100g双马来酰亚胺树脂(大和化学制，BMI-2300)、10g氨基有机硅树脂A(氨基当量为450g/mol，DOWSILTM BY 16-853)、1g氨基酚和适量的有机溶剂，在80℃下反应60min，升温至100℃再添加25g氨基有机硅树脂B(氨基当量为800g/mol，信越化学制X-22-161A)，继续反应90min，出 料制得改性双马来酰亚胺预聚物Y3。
合成例4：改性双马来酰亚胺预聚物Y4
在烧杯中加入100g双马来酰亚胺树脂(日本化药制，BMI-2300)、10g氨基有机硅树脂A(氨基当量为430g/mol，信越化学制KF-8010)、1g氨基酚和适量的有机溶剂，在80℃下反应60min，升温至100℃再添加25g氨基有机硅树脂B(氨基当量为1500g/mol，信越化学制X-22-161B)，继续反应100min，出料制得改性双马来酰亚胺预聚物Y4。
合成对比例1：改性双马来酰亚胺预聚物Y5
在烧杯中加入100g双马来酰亚胺树脂(大和化成制，BMI-2300)、35g氨基有机硅树脂A(氨基当量为450g/mol，DOWSILTM BY 16-853)和适量的有机溶剂，在100℃下反应120min，出料制得改性双马来酰亚胺预聚物Y5。
合成对比例2：改性双马来酰亚胺预聚物Y6
在烧杯中加入100g双马来酰亚胺树脂(日本化药制，MIR-3000)、35g氨基有机硅树脂B(氨基当量为800g/mol，信越化学制X-22-161A)，1g氨基酚和适量有机溶剂，在100℃下反应120min，出料制得改性双马来酰亚胺预聚物Y6。
按照表1中的数据称取对应固体物质，将称取的各固体物质通过溶剂调节胶液至固含量60％，将胶液涂覆于E玻璃纤维布上，浸润后放置于160℃鼓风干燥箱中，烘烤3～6min，制成半固化片。
将半固化片裁剪至300×300mm，在半固化片两侧各放置一张电解铜箔，叠配成一定叠构，送入真空压机中压合制得金属箔层压板(或者覆铜层压板)，具体性能检测如表2所示。
表1树脂组合物成分表

表2性能表
对上述所有实施例1～5和比较例1～2中制备的半固化片和覆铜层压板进行性能测试。
1)玻璃化转变温度采用DMA(热机械分析)，升温速率为10℃/min；
2)PCT 2HR吸水率测定：取3块10cm×10cm、厚度为0.40mm、两面去除金属箔的样品，在100℃干燥2小时，称重，记重量为W1，然后在高压锅蒸煮试验(Pressure Cooker test)机中，在121℃、2个大气压下处理2小时,称重，重量记为W2，测定吸水率为(W2-W1)/W1×100％；
3)X/Y热膨胀系数(CTE)测定：采用TMA(热机械分析)，升温速率10℃/min，测试温度范围30～100℃；
4)次表观缺陷：采用IPC-TM-650中规定的标准方法测试，通过目视或切片方法判断基材中有无出现干花、白纹等缺陷。
由上述实验数据中可知，实施例1～3具有优异的高Tg、低吸水率、低CTE值和较好的表观质量，其中实施例1相比对比例1，具有更高的Tg值和低CTE，实施例2相比对比例2，具有更高的Tg值、更低的CTE。
此外，通过图1中对比例2和实施例2的流变曲线可知，实施例2的流变窗口更宽，最低熔融粘度更低，说明树脂反应较缓慢，有利于控制工艺性。
应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本 领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。

Claims (13)

  1. 一种改性双马来酰亚胺预聚物，其特征在于，通过双马来酰亚胺化合物与氨基有机硅树脂A、氨基有机硅树脂B反应获得，其中，所述氨基有机硅树脂A的氨基当量EaA与所述氨基有机硅树脂B的氨基当量EaB不同，所述氨基有机硅树脂A和所述氨基有机硅树脂B质量的总和与所述双马来酰亚胺化合物的质量之比为(5～80):100。
  2. 根据权利要求1所述的改性双马来酰亚胺预聚物，其特征在于，所述氨基有机硅树脂A和所述氨基有机硅树脂B质量的总和与所述双马来酰亚胺化合物的质量之比为(20～50):100。
  3. 根据权利要求1或2所述的改性双马来酰亚胺预聚物，其特征在于，所述氨基有机硅树脂A和所述氨基有机硅树脂B的质量之比为1:(2～30)。
  4. 根据权利要求1所述的改性双马来酰亚胺预聚物，其特征在于，所述氨基有机硅树脂A和所述氨基有机硅树脂B中均含有如下结构：
    其中R和R’为C1～C5的烷基，m为1～30的整数。
  5. 根据权利要求1所述的改性双马来酰亚胺预聚物，其特征在于，所述氨基有机硅树脂A和/或所述氨基有机硅树脂B中的侧链至少含有一个氨基。
  6. 根据权利要求1所述的改性双马来酰亚胺预聚物，其特征在于，所述氨基有机硅树脂A和/或所述氨基有机硅树脂B中末端至少含有一个氨基。
  7. 一种树脂组合物，其特征在于，以重量计，包括如下组分：
    (a)改性双马来酰亚胺预聚物：30～100份；
    (b)氰酸酯树脂：3～50份；
    (c)弹性体：5～60份；
    其中，所述改性双马来酰亚胺预聚物为权利要求1所述的改性双马来酰亚胺预聚物。
  8. 根据权利要求7所述的树脂组合物，其特征在于，所述氰酸酯树脂选 自双酚A型氰酸酯树脂、双酚F型氰酸酯树脂、双酚S型氰酸酯树脂、双酚E型氰酸酯树脂、双酚M型氰酸酯树脂、含双键氰酸酯树脂、含磷氰酸酯树脂、酚醛型氰酸酯树脂、联苯型氰酸酯树脂、萘环型氰酸酯树脂、双环戊二烯型氰酸酯树脂中的一种或几种。
  9. 根据权利要求8所述的树脂组合物，其特征在于，所述氰酸酯树脂为如下结构所示的萘型氰酸酯树脂或/和酚醛型氰酸酯树脂：
    结构式(1)，R6为氢、甲基或乙基，n2为1～10的整数；
    结构式(2)，n为1～10的整数。
  10. 根据权利要求7所述的树脂组合物，其特征在于，所述弹性体选自苯乙烯类弹性体、甲基丙烯酸酯类弹性体、有机硅类弹性体中至少一种。
  11. 根据权利要求7所述的树脂组合物，其特征在于，还包括硅烷偶联剂和分散剂。
  12. 根据权利要求11所述的树脂组合物，其特征在于，所述硅烷偶联剂为环氧硅烷偶联剂，所述分散剂为磷酸酯类分散剂和/或改性聚氨酯类分散剂，所述硅烷偶联剂和分散剂的重量比例为2:1～10:1。
  13. 如权利要求7所述的树脂组合物在半固化片、层压板、绝缘薄膜、绝缘板、覆铜板、电路基板和电子器件中的应用。
PCT/CN2023/085349 2022-10-11 2023-03-31 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用 WO2024077887A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020237020919A KR20240052716A (ko) 2022-10-11 2023-03-31 개질된 비스말레이미드 프리폴리머, 수지 조성물 및 수지 조성물의 용도

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202211240716.XA CN115850710B (zh) 2022-10-11 2022-10-11 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN202211241857.3A CN116239777A (zh) 2022-10-11 2022-10-11 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN202211241857.3 2022-10-11
CN202211241822.XA CN116120560B (zh) 2022-10-11 2022-10-11 改性双马来酰亚胺预聚物的制备方法、树脂组合物及树脂组合物的应用
CN202211240716.X 2022-10-11
CN202211241822.X 2022-10-11

Publications (1)

Publication Number Publication Date
WO2024077887A1 true WO2024077887A1 (zh) 2024-04-18

Family

ID=90668643

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/085349 WO2024077887A1 (zh) 2022-10-11 2023-03-31 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用

Country Status (2)

Country Link
KR (1) KR20240052716A (zh)
WO (1) WO2024077887A1 (zh)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774282A (en) * 1986-11-20 1988-09-27 Amoco Corporation Thermoset composition comprising aromatic cyanate ester, allyl ethers of bisphenol and bismaleimide
US4885329A (en) * 1987-04-14 1989-12-05 Mitsui Petrochemical Industries, Ltd. Polyimide resin compositions
JPH0356533A (ja) * 1989-07-26 1991-03-12 Sumitomo Bakelite Co Ltd 半導体封止用樹脂の製造方法
JPH0525452A (ja) * 1990-11-30 1993-02-02 Ube Ind Ltd 耐熱性の接着剤
JP2012236920A (ja) * 2011-05-12 2012-12-06 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
CN103342894A (zh) * 2013-07-29 2013-10-09 苏州生益科技有限公司 热固性树脂组合物及使用其制作的半固化片及层压板
CN104830059A (zh) * 2015-05-22 2015-08-12 苏州生益科技有限公司 一种树脂组合物及使用其制作的半固化片及层压板
JP2016033195A (ja) * 2014-07-31 2016-03-10 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板
CN107254049A (zh) * 2012-11-28 2017-10-17 日立化成株式会社 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜及层叠板
CN108137800A (zh) * 2016-05-02 2018-06-08 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠树脂片、层叠板、覆金属箔层叠板和印刷电路板
CN108559209A (zh) * 2017-12-29 2018-09-21 广东生益科技股份有限公司 树脂组合物、预浸料、层压板以及覆金属箔层压板
CN108779247A (zh) * 2016-04-05 2018-11-09 三菱瓦斯化学株式会社 树脂组合物和其制造方法、预浸料、树脂片、层叠板、覆金属箔层叠板以及印刷电路板
CN112080102A (zh) * 2019-06-13 2020-12-15 苏州生益科技有限公司 树脂组合物及具有其的半固化片、绝缘薄膜、覆金属箔层压板、印制线路板
CN113121586A (zh) * 2019-12-31 2021-07-16 广东生益科技股份有限公司 一种改性马来酰亚胺化合物及其制备方法和应用
CN115850710A (zh) * 2022-10-11 2023-03-28 苏州生益科技有限公司 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774282A (en) * 1986-11-20 1988-09-27 Amoco Corporation Thermoset composition comprising aromatic cyanate ester, allyl ethers of bisphenol and bismaleimide
US4885329A (en) * 1987-04-14 1989-12-05 Mitsui Petrochemical Industries, Ltd. Polyimide resin compositions
JPH0356533A (ja) * 1989-07-26 1991-03-12 Sumitomo Bakelite Co Ltd 半導体封止用樹脂の製造方法
JPH0525452A (ja) * 1990-11-30 1993-02-02 Ube Ind Ltd 耐熱性の接着剤
JP2012236920A (ja) * 2011-05-12 2012-12-06 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
CN107254049A (zh) * 2012-11-28 2017-10-17 日立化成株式会社 硅氧烷化合物、改性酰亚胺树脂、热固性树脂组合物、预浸渍坯、带有树脂的膜及层叠板
CN103342894A (zh) * 2013-07-29 2013-10-09 苏州生益科技有限公司 热固性树脂组合物及使用其制作的半固化片及层压板
JP2016033195A (ja) * 2014-07-31 2016-03-10 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板
CN104830059A (zh) * 2015-05-22 2015-08-12 苏州生益科技有限公司 一种树脂组合物及使用其制作的半固化片及层压板
CN108779247A (zh) * 2016-04-05 2018-11-09 三菱瓦斯化学株式会社 树脂组合物和其制造方法、预浸料、树脂片、层叠板、覆金属箔层叠板以及印刷电路板
CN108137800A (zh) * 2016-05-02 2018-06-08 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠树脂片、层叠板、覆金属箔层叠板和印刷电路板
CN108559209A (zh) * 2017-12-29 2018-09-21 广东生益科技股份有限公司 树脂组合物、预浸料、层压板以及覆金属箔层压板
CN112080102A (zh) * 2019-06-13 2020-12-15 苏州生益科技有限公司 树脂组合物及具有其的半固化片、绝缘薄膜、覆金属箔层压板、印制线路板
CN113121586A (zh) * 2019-12-31 2021-07-16 广东生益科技股份有限公司 一种改性马来酰亚胺化合物及其制备方法和应用
CN115850710A (zh) * 2022-10-11 2023-03-28 苏州生益科技有限公司 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用

Also Published As

Publication number Publication date
KR20240052716A (ko) 2024-04-23

Similar Documents

Publication Publication Date Title
CN115850710B (zh) 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN108219371B (zh) 环氧树脂组合物、预浸料、层压板和印刷电路板
CN109054381B (zh) 改性马来酰亚胺树脂组合物及其制备的半固化片和层压板
CN116239777A (zh) 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
KR20160007599A (ko) 시아네이트 수지 조성물 및 그 용도
CN115433330A (zh) 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN109971175B (zh) 改性马来酰亚胺树脂组合物及其制备的半固化片和层压板
CN109535628B (zh) 一种阻燃型树脂预聚物及使用其制备的热固性树脂组合物、半固化片和层压板
CN116120560B (zh) 改性双马来酰亚胺预聚物的制备方法、树脂组合物及树脂组合物的应用
CN110662794A (zh) 无芯基板用预浸渍体、无芯基板、无芯基板的制造方法和半导体封装体
WO2024077887A1 (zh) 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN110662793B (zh) 无芯基板用预浸渍体、无芯基板和半导体封装体
CN112694451B (zh) 改性烯丙基化合物、双马来酰亚胺预聚物及其应用
CN112679951B (zh) 改性树脂组合物及其应用
CN109970952B (zh) 氰酸酯树脂组合物及其用途
CN116004007B (zh) 热固性树脂组合物及其应用
WO2024077886A1 (zh) 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN115305047B (zh) 一种fc-bga封装载板用增层胶膜及其制备方法和应用
CN116715959A (zh) 树脂组合物及其应用
CN116970169B (zh) 胺化合物改性马来酰亚胺预聚物、树脂组合物及其应用
CN115819766B (zh) 改性马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN114015046B (zh) 一种改性双马来酰亚胺预聚物及使用其制备的组合物、半固化片及其层压板
CN116836549A (zh) 树脂组合物及其应用
CN115449039B (zh) 改性双马来酰亚胺预聚物、树脂组合物及树脂组合物的应用
CN109971130B (zh) 氰酸酯树脂组合物及其用途

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23876099

Country of ref document: EP

Kind code of ref document: A1