WO2024066706A1 - 一种热处理装置 - Google Patents

一种热处理装置 Download PDF

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Publication number
WO2024066706A1
WO2024066706A1 PCT/CN2023/109218 CN2023109218W WO2024066706A1 WO 2024066706 A1 WO2024066706 A1 WO 2024066706A1 CN 2023109218 W CN2023109218 W CN 2023109218W WO 2024066706 A1 WO2024066706 A1 WO 2024066706A1
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WO
WIPO (PCT)
Prior art keywords
unit
substrate
heat treatment
treatment device
guide rail
Prior art date
Application number
PCT/CN2023/109218
Other languages
English (en)
French (fr)
Inventor
李康植
吴均
王晖
程成
郑敦宇
孙永成
王文军
邵乾
王俊
王德云
金泳律
Original Assignee
盛美半导体设备(上海)股份有限公司
盛美半导体设备韩国有限公司
清芯科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 盛美半导体设备(上海)股份有限公司, 盛美半导体设备韩国有限公司, 清芯科技有限公司 filed Critical 盛美半导体设备(上海)股份有限公司
Publication of WO2024066706A1 publication Critical patent/WO2024066706A1/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

Definitions

  • the invention relates to equipment in semiconductor production, in particular to a heat treatment device.
  • the photolithography process is to pattern a thin film deposited on a substrate, including a process of applying a photoresist liquid on the substrate by a coating device to form a photoresist film, an exposure process for irradiating light having a predetermined pattern onto the substrate, a development process of applying a developing solution to the photoresist film by a developing device to form a photoresist pattern, and the like.
  • the coating device includes a heat treatment device for heat-treating the substrate before and after the photoresist liquid is applied to the substrate.
  • the developing device also includes a heat treatment device for heat-treating the substrate before and after the developing process is performed on the substrate.
  • the heat treatment device includes a heating unit for heating the substrate and a cooling unit for cooling the substrate.
  • the internal space of the heat treatment device is limited, and how to arrange various devices in the limited space is an urgent problem to be solved.
  • the object of the present invention is to provide a heat treatment device to optimize the layout and structure of various components.
  • the present invention provides the following technical solutions:
  • a heat treatment device comprising a cooling unit, a heating unit and a transmission unit;
  • the cooling unit comprises a cooling plate for cooling a substrate,
  • the heating unit comprises a heating plate for heating a substrate;
  • the transmission unit comprises a transmission arm, a lifting module and a linear module, the transmission arm is movably arranged on the lifting module, and the lifting module is arranged on the linear module; the lifting module drives the transmission arm to rise and fall, the transmission arm is used to support the substrate, and the linear module drives the transmission arm between the cooling plate and the heating plate Transfer substrate.
  • the heat treatment device of the present invention has the following beneficial effects:
  • the cooling unit and the heating unit are integrated in a heat treatment device.
  • the transfer arm can move between the cooling unit and the heating unit to move the substrate without moving the cooling unit.
  • the transfer arm can rise and fall to pick up and place the substrate by driving the lifting module, avoiding the need to set up respective pick-up and placement devices at the positions of the cooling unit and the heating unit, reducing space occupancy, and optimizing the internal space of the heat treatment device.
  • FIG1 is a perspective view of a heat treatment device provided in Embodiment 1 of the present invention.
  • FIG2 is a top view of a heat treatment device provided in Embodiment 1 of the present invention.
  • FIG3 is a schematic diagram of the structure of a transmission unit provided in Embodiment 1 of the present invention.
  • FIG4 is a schematic diagram of the structure of a transmission unit provided in Embodiment 2 of the present invention.
  • FIG5 is a schematic diagram of the structure of a transmission unit provided in Embodiment 3 of the present invention.
  • FIG6 is a schematic diagram of the structure of a transmission unit provided in Embodiment 4 of the present invention.
  • FIG7 is a schematic flow chart of an exemplary substrate transmission method provided in Embodiment 5 of the present invention.
  • FIG8 is a schematic structural diagram of a substrate transmission method provided in Embodiment 5 of the present invention.
  • the device 1000 includes a housing, a cooling unit 200 , a heating unit 300 , a transmission unit 400 and a control unit 500 .
  • the housing is provided with an opening 110, through which the substrate enters the device 1000 or moves out of the device 1000.
  • the cooling unit 200, the heating unit 300 and the transmission unit 400 are all connected to the control unit 500 and are disposed in the housing.
  • the control unit 500 is used to control the operation of the cooling unit 200, the heating unit 300 and the transmission unit 400.
  • the cooling unit 200 includes a cooling plate 210, and the cooling plate 210 is used to support and cool the substrate.
  • the heating unit 300 includes a heating plate 310, and the heating plate 310 is used to support and heat the substrate.
  • the transmission unit 400 is disposed in the housing and installed on a side of the cooling unit 200 away from the heating unit 300.
  • the transmission unit 400 includes a transmission arm 410, a lifting module and a linear module.
  • the transmission arm 410 is movably disposed on the lifting module, and the lifting module is movably disposed on the linear module.
  • the transmission arm 410 is used to support the substrate and can move between the cooling unit 200 and the heating unit 300 under the drive of the linear module.
  • control unit 500 controls the lifting module and the linear module to operate.
  • the transmission arm 410 is disposed on the lifting module, and the lifting module drives the transmission arm 410 to rise and fall.
  • the linear module drives the transmission arm 410 to move linearly between above the cooling plate 210 and above the heating plate 310.
  • the lifting module includes a first driving unit 450, a first sliding member 481 and a first guide rail 480, and the first sliding member 481 is slidably arranged on the first guide rail 480.
  • the linear module includes a first moving member 430, a second driving unit 440, a conveyor belt 460, a second guide rail 490, a second moving member 431 and an auxiliary guide rail 420.
  • the second guide rail 490 is arranged in a housing, and the first moving member 430 is movably mounted on the second guide rail 490 and arranged on the conveyor belt 460.
  • the first driving unit 450 is arranged on the first moving member 430.
  • the auxiliary guide rail 420 is arranged on one side of the second guide rail 490 and is spaced from the second guide rail 490.
  • the second moving member 431 is movably arranged on the auxiliary guide rail 420.
  • the first guide rail 480 is arranged on the second moving member 431.
  • the first driving unit 450 is a slide cylinder, which includes an L-shaped second sliding member and a driving member.
  • the driving member is a cylinder assembly with a track inside. The driving member drives the second sliding member to move on the track.
  • the second driving unit 440 drives the conveyor belt 460 to work, and the conveyor belt 460 drives the first moving member 430 to move in the
  • the first moving member 430 moves with the lifting module, the transmission arm 410 and the second moving member 431, and the second driving unit 440 drives the second moving member 431 to slide on the auxiliary rail 420 and the first moving member 430 on the second rail 490.
  • the setting of the auxiliary rail 420 improves the moving speed of the transmission arm 410 and enhances the stability of the device.
  • the transmission unit 400 also includes two support members 412a and 412b.
  • the two support members 412a and 412b are respectively arranged on the transmission arm 410.
  • One side of the support member 412a is arranged on the second sliding member of the first driving unit 450.
  • One side of the support member 412b is arranged on the first sliding member 481.
  • a first driving unit 450 is used to drive the two support members 412a and 412b to move synchronously so that the lifting and lowering rates of the support members 412a and 412b on both sides are consistent.
  • the support member 412a is driven to rise and fall by the first driving unit 450 to drive the transfer arm 410 to rise and fall.
  • the transfer arm 410 can load and support the substrate when it rises in the vertical direction, and can unload the substrate when it falls in the vertical direction.
  • the first moving member 430 is removed, and the first driving unit 450 is directly and movably disposed on the second guide rail 490 , and the first driving unit 450 moves linearly on the second guide rail 490 .
  • the support members 412a, 412b and the transmission arm 410 are integrally formed.
  • the linear module further comprises a base 470, which is disposed on the bottom surface of the housing.
  • the conveyor belt 460 is connected to the base 470.
  • the lifting module includes two first driving units 450.
  • the two first driving units 450 drive the respective supporting members 412a, 412b to move.
  • the housing is provided with a guide groove 120.
  • the guide groove 120 is a moving path for guiding the support member 412a or 412b.
  • the housing includes a main housing 100 and an upper plate 130, and the upper plate 130 covers the main housing 100.
  • Two guide grooves 120 are provided on the main housing 100.
  • the two guide grooves 120 are arranged on both sides of the upper plate 130 to guide the movement of the support members 412a and 412b respectively.
  • one guide groove 120 is provided on the main housing 100.
  • the guide groove 120 can also be provided on the upper plate 130.
  • the upper plate 130 is disposed below the cooling plate 210 and covers the lifting module and the linear module.
  • the upper plate 130 is used to prevent particles generated during operation of the transmission unit 400 (eg, the second driving unit 440 ) from adhering to the substrate placed on the cooling plate 210 .
  • the transmission arm 410 includes a pair of arc-shaped support portions 415.
  • Each support portion 415 includes at least two protrusions 411 protruding from the inner side of the support portion 415.
  • the cooling plate 210 is provided with at least two grooves 220 along the outer circumferential edge.
  • the protrusions 411 are accommodated in the grooves 220 during the process of placing or taking the substrate by the transmission arm 410.
  • a support pin 413 is provided on the protrusion 411, and the support pin 413 supports the substrate.
  • the pair of arc-shaped support portions 415 has four protrusions 411, and the cooling plate 210 is correspondingly provided with four grooves 220.
  • a blocking portion 414 is provided on the support pin 413, and the blocking portion 414 contacts the outer edge of the substrate, and the blocking portion 414 can prevent the substrate from deviating from the support pin 413.
  • the heating unit 300 includes a cover plate 320, which is placed on the heating plate 310 to form a closed space, and the substrate is heated in the closed space to avoid heat loss during the heating process.
  • the third driving unit (not shown) drives the cover plate 320 to rise to a preset height, and when the substrate is placed on the heating plate 310, the third driving unit drives the cover plate 320 to descend to heat the substrate.
  • the first driving unit 450 , the second driving unit 440 and the third driving unit in the present application may be cylinders or motors.
  • the heating unit 300 has three ejector pins 330, which are connected to a fourth driving unit (not shown).
  • the fourth driving unit drives the ejector pins 330 to extend out of the heating plate 310 and support the substrate, or to move downward to the bottom of the heating plate 310 while supporting the substrate so that the substrate is transferred to the heating plate 310.
  • the linear module drives the transmission unit 400 to move between the cooling unit 200 and the heating unit 300
  • the lifting module drives the transmission unit 400 to rise and fall, thereby avoiding the need to respectively set up substrate receiving devices at the positions of the cooling unit 200 and the heating unit 300, reducing space occupancy and optimizing the internal space of the heat treatment device.
  • this embodiment provides a heat treatment device, which is different from the first embodiment in the structure of the transmission unit 400 .
  • the transport unit 400 includes a transport arm 410 , a lifting module, a linear module, and two support members 412 .
  • the lifting module includes a first driving unit 450 and two first guide rails 480
  • the linear module includes a second driving unit 440 and a conveyor belt 460 .
  • the linear module also includes two second guide rails 490 and two first moving members 430 arranged in parallel.
  • the second guide rails 490 are respectively arranged on both sides of the conveyor belt 460, and the two first moving members 430 are respectively movably installed on their respective second guide rails 490.
  • the two ends of the connecting member 432 are arranged on the two first moving members 430, and the middle part is arranged on the conveyor belt 460 to transmit the power of the conveyor belt 460 to the two first moving members 430, so that the second driving unit 440 drives the two first moving members 430 to move on their respective second guide rails 490.
  • the first driving unit 450 is arranged on the connecting member 432, and the two first guide rails 480 are respectively arranged on both ends of the connecting member 432.
  • Each support member 412 is slidably arranged on the corresponding first guide rail 480 through the first sliding member 481.
  • the first driving unit 450 drives the two support members 412 to rise and fall, thereby driving the transmission arm 410 to
  • the second driving unit 440 drives the lifting module, the supporting member 412 and the transmission arm 410 to move along the two second guide rails 490 through the two first moving members 430 .
  • two support members 412 are formed on one frame.
  • this embodiment provides a heat treatment device, which is different from the second embodiment in that:
  • the transmission arm 410 includes a pair of long strip-shaped support portions 415.
  • the linear module includes a second guide rail 490.
  • Each support portion 415 includes at least two support pins 413, and a blocking portion 414 is provided on the support pins 413.
  • the cooling plate 210 is provided with two slits (not shown) for accommodating the support pins 413. When the first moving member 430 moves on the second guide rail 490, the support pins 413 move in the slits of the cooling plate 210.
  • the shape of the support member 412 is different from that of the second embodiment.
  • the support member 412 of this embodiment is a strip-shaped plate structure, and both ends of the support member 412 are respectively connected to the corresponding support parts 415.
  • this embodiment provides a heat treatment device, which is different from the third embodiment in that:
  • the transmission arm 410 is a C-shaped structure, which includes two symmetrical parts.
  • the linear module and the lifting module are centrally arranged under one part. More space is left under the other part of the transmission arm 410 to place other components of the device 1000, while avoiding interference between the transmission unit 400 and other components.
  • the transmission unit is not provided with a support member 412, and the transmission arm 410 is directly arranged on the first sliding member 481.
  • the second guide rail 490 is arranged parallel to the conveyor belt 460, and the lifting module is arranged on the second guide rail 490 away from the conveyor belt 460.
  • the conveyor belt 460 and the second driving unit 440 are on one side.
  • the lifting module includes two first rails 480, and the first driving unit 450 drives the first sliding member 481 to rise and fall along the first rails 480.
  • the second driving unit 440 drives the lifting module and the transmission arm 410 to move linearly on the first rails 490.
  • the transmission arm 410 includes at least two protrusions 411 protruding from the inner side thereof.
  • the cooling plate 210 is provided with at least two grooves 220 along the outer circumferential edge.
  • the protrusions 411 are accommodated in the grooves 220 during the process of placing or taking the substrate by the transmission arm 410.
  • a support pin 413 is provided on the protrusion 411, and the support pin 413 supports the substrate.
  • the transmission arm 410 has four protrusions 411, and the cooling plate 210 is correspondingly provided with four grooves 220.
  • this embodiment provides an exemplary transmission method of the heat treatment apparatus.
  • FIG. 8 shows the non-working state of the apparatus.
  • (b) shows the working state of the transmission arm 410 rising to load and support the substrate W.
  • (c) shows the working state of the transmission unit 400 transporting the substrate W to the heating unit 300.
  • (d) shows the working state of the transmission unit 400 retreating after the heating unit 300 receives the substrate W.
  • (e) shows the working state of the heating unit 300 baking the substrate W after the transmission arm 410 returns to the initial position.
  • the first driving unit 450 drives the transfer arm 410 to rise to a preset position, and the substrate W is transferred into the device 1000 through the opening 110, and the substrate W is placed on the support pins 413, refer to Figure (b);
  • the third driving unit (not shown) drives the cover plate 320 to rise to a preset height, and the second driving unit 440 drives the first moving member 430 to move linearly, thereby moving the substrate W to the heating unit 300, refer to Figure (c);
  • the ejector pin 330 rises and extends above the heating plate 310 to receive the substrate W on the transfer arm 410.
  • the second driving unit 440 drives the first moving member 430 to return so that the transfer arm 410 returns to the initial position.
  • the ejector pin 330 descends to the bottom of the heating plate 310 to transfer the substrate W onto the heating plate 310, refer to Figure (d);
  • the third driving unit drives the cover plate 320 to descend, and the cover plate 320 is placed on the heating plate 310, and the heating plate 310 starts to bake the substrate W, refer to Figure (e);
  • the third driving unit drives the cover plate 320 to rise, and the ejector pins 330 rise to push the substrate W above the heating plate 310.
  • the second driving unit 440 drives the transfer arm 410 to move to the heating unit 300 and receive the baked substrate W.
  • the second driving unit 440 drives the transfer arm 410 and the substrate W to move to the cooling unit 200;
  • the transfer arm 410 descends to below the upper surface of the cooling plate 210, the upper surface of the cooling plate 210 receives the substrate W, and the cooling plate 210 cools the substrate W;
  • the first driving unit 450 drives the transfer arm 410 to rise.
  • the support pins 413 support the substrate W, and then the transfer arm 410 continues to rise to a preset height.
  • the substrate W is taken away and transferred to the outside of the device 1000.
  • the above method only exemplarily describes the substrate transmission method of the heat treatment device of the present invention. It can be understood that according to different process requirements, based on the heat treatment device of the present invention, the substrate can have different transmission methods.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

一种半导体生产中的设备，具体为一种热处理装置。装置包括冷却单元（200）、加热单元（300）和传输单元（400）。冷却单元（200）包括用于冷却基板(w)的冷却板(210)，加热单元（300）包括用于加热基板(w)的加热板(310)；传输单元（400）包括传输臂（410）、升降模块和直线模块，传输臂（410）承托基板(w)并在冷却单元（200）和加热单元（300）之间传输基板(w)；传输臂（410）设置在升降模块上，升降模块驱动传输臂（410）上升和下降，直线模块驱动传输臂（410）在冷却板(210)和加热板(310)之间传输基板(w)。这样优化了装置的内部空间。

Description

一种热处理装置 技术领域
本发明涉及半导体生产中的设备，具体为一种热处理装置。
背景技术
当前，通过执行例如薄膜沉积工艺、光刻工艺、蚀刻工艺和清洗工艺等一系列工艺，在诸如晶片的半导体衬底上制造半导体器件。光刻工艺以图案化沉积在基板上的薄膜，包括通过涂布设备在基板上施加光致抗蚀剂液体来形成光致抗蚀剂膜的工艺、用于将具有预定图案的光辐射到基板上的曝光工艺、通过显影设备将显影溶液施加到光致抗蚀剂膜上来形成光致抗蚀剂图案的显影工艺等。
涂布设备包括热处理装置，用于在将光致抗蚀剂液涂敷在基板上的处理之前和之后对基板进行热处理。此外，显影设备也包括热处理装置，用于在对基板执行显影处理之前和之后对基板进行热处理。
现有技术中，热处理装置包括用于基板加热的加热单元和用于基板冷却的冷却单元。热处理装置的内部空间有限，如何在有限空间内布局各装置是急需要解决的问题。
发明内容
针对上述存在的问题，本发明的目的在于提供一种热处理装置，优化各部件的布局和结构。
为实现上述目的，本发明提供如下技术方案：
一种热处理装置，包括冷却单元、加热单元和传输单元；所述冷却单元包括用于冷却基板的冷却板，所述加热单元包括用于加热基板的加热板；所述传输单元包括传输臂、升降模块和直线模块，所述传输臂活动设置在所述升降模块上，所述升降模块设置在所述直线模块上；所述升降模块驱动所述传输臂上升和下降，所述传输臂用于承托基板，所述直线模块驱动所述传输臂在所述冷却板和所述加热板之间 传输基板。
本发明的热处理装置与现有技术相比，本发明具有以下有益效果：
冷却单元与加热单元集成在一个热处理装置中，通过设置直线模块使得传输臂可在冷却单元与加热单元之间移动从而移动基板，无需移动冷却单元，且通过升降模块的驱动使得传输臂能够上升和下降以取放基板，避免了在冷却单元、加热单元位置处各自设置取放装置，减少了空间的占用，优化了热处理装置的内部空间。
附图概述
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。
图1为本发明实施例一提供的热处理装置的透视图；
图2为本发明实施例一提供的热处理装置的俯视图；
图3为本发明实施例一提供的传输单元的结构示意图；
图4为本发明实施例二提供的传输单元的结构示意图；
图5为本发明实施例三提供的传输单元的结构示意图；
图6为本发明实施例四提供的传输单元的结构示意图；
图7为本发明实施例五提供的一示例性的基板传输方法的流程示意图；
图8为本发明实施例五提供的基板传输方法的结构示意图。
本发明的较佳实施方式
为使得本发明的目的、特征、优点能够更加的明显和易懂，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，下面所描述的实施例仅仅是本发明一部分实施例，而非全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中设置的组件。当一个组件被 认为是“设置在”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中设置的组件。
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
实施例一
请参阅图1-3，本实施例提供一种热处理装置，装置1000包括壳体、冷却单元200、加热单元300、传输单元400和控制单元500。
壳体上开设有开口110，基板经开口110进入装置1000内或通过开口110移出装置1000外。冷却单元200、加热单元300和传输单元400均与控制单元500连接并设置在壳体内，控制单元500用于控制冷却单元200、加热单元300和传输单元400工作。
冷却单元200包括冷却板210，冷却板210用于承托基板并对基板进行冷却。加热单元300包括加热板310，加热板310用于承托基板并对基板进行加热。
传输单元400设置在壳体内并安装在冷却单元200远离加热单元300的一侧。传输单元400包括有传输臂410、升降模块和直线模块，传输臂410活动设置在升降模块上，升降模块活动设置在直线模块上，传输臂410用于承托基板，并在直线模块的驱动下能够在冷却单元200和加热单元300之间移动。
工作过程中，控制单元500控制升降模块和直线模块工作。传输臂410设置在升降模块上，升降模块驱动传输臂410上升和下降。直线模块驱动传输臂410在冷却板210上方和加热板310上方之间直线运动。
具体的，升降模块包括第一驱动单元450、第一滑动件481以及第一导轨480，第一滑动件481滑动设置在第一导轨480上。直线模块包括第一移动件430、第二驱动单元440、传送带460、第二导轨490、第二移动件431和一条辅助导轨420。第二导轨490设置在壳体内，第一移动件430活动安装在第二导轨490上且设置在传送带460上。第一驱动单元450设置在第一移动件430上。辅助导轨420设置在第二导轨490的一侧，且与第二导轨490间隔设置。第二移动件431活动设置在辅助导轨420上。第一导轨480设置在第二移动件431上。本实施例中，第一驱动单元450为滑台气缸，滑台气缸包括L型的第二滑动件和驱动件，驱动件为气缸组件，气缸组件内设轨道，驱动件驱动第二滑动件在轨道上运动。
第二驱动单元440驱动传送带460工作，传送带460带动第一移动件430在 第二导轨490上滑动，第一移动件430带着升降模块、传输臂410以及第二移动件431一起运动，第二驱动单元440驱动第二移动件431在辅助导轨420上以及第一移动件430在第二导轨490上同时滑动。辅助导轨420的设置提升了传输臂410的移动速率以及增强装置的稳定性。
传输单元400还包括两个支撑件412a、412b。两个支撑件412a、412b分别设置在传输臂410上。支撑件412a的一侧设置在第一驱动单元450的第二滑动件上。支撑件412b的一侧设置在第一滑动件481上。第二滑动件受驱动移动时，支撑件412a随第二滑动件移动从而带动传输臂410以及另一个支撑件412b一起运动，即传输臂410通过支撑件412a、412b共同滑动从而实现上升和下降。采用一个第一驱动单元450驱动两个支撑件412a、412b同步运动使得两侧的支撑件412a、412b升降速率一致。
支撑件412a在第一驱动单元450驱动下升降从而驱动传输臂410升降，传输臂410在竖直方向上升可装载基板并承托基板，在竖直方向下降可卸载基板。
可选地，去掉第一移动件430，第一驱动单元450直接活动设置在第二导轨490上，第一驱动单元450在第二导轨490上直线运动。
在一个可选的实施方式中，支撑件412a、412b和传输臂410一体成型。进一步地，直线模块还包括底座470，底座470设置在壳体内的底面上。传送带460连接到底座470上。
可选地，升降模块包括两个第一驱动单元450。两个第一驱动单元450驱动各自的支撑件412a、412b运动。
在一个可选的实施方式中，壳体上开设有导向槽120。导向槽120是引导支撑件412a或412b的移动路径。
本实施例中，壳体包括主壳体100和上板130，上板130盖在主壳体100上。主壳体100上开设有两个导向槽120。两个导向槽120设置在上板130的两侧，分别引导支撑件412a和412b移动。可选地，主壳体100上开设一个导向槽120。在其他实施方式中，导向槽120也可以开设在上板130上。
本实施例中，上板130设置在冷却板210下方且覆盖升降模块和直线模块。上板130用于防止传输单元400(例如第二驱动单元440)工作中产生的颗粒附着到放置在冷却板210上的基板上。
在一个可选的实施方式中，传输臂410包括一对弧形支撑部415。每个支撑部415包括从支撑部415内侧突出的至少两个凸起411。冷却板210沿着外圆周边缘设有至少两个凹槽220。传输臂410放置或取基板的过程中凸起411容纳在凹槽220内。此外，凸起411上设有支撑销413，支撑销413支撑基板。本实施例中，一对弧形支撑部415具有四个凸起411，冷却板210对应设有四个凹槽220。
在基板的移送过程中，基板容易出现滑动。进一步地，支撑销413上设有阻挡部414，阻挡部414与基板的外边缘接触，阻挡部414可防止基板从支撑销413上偏离出去。
进一步地，加热单元300包括盖板320，盖板320盖设在加热板310上并形成密闭空间，在密闭空间内加热基板，避免加热过程中的热损失。当基板被传送至加热板310上方前，第三驱动单元(未示出)驱动盖板320上升至预设高度，待将基板放置在加热板310上，第三驱动单元驱动盖板320下降，对基板进行加热处理。
本申请中的第一驱动单元450、第二驱动单元440和第三驱动单元可以为气缸或马达。
进一步地，加热单元300具有三个顶针330，顶针330与第四驱动单元(未示出)连接，第四驱动单元驱动顶针330伸出加热板310并支撑基板，或承托基板的同时向下移动至加热板310的下方使得基板转移至加热板310上。
本发明中，直线模块驱动传输单元400在冷却单元200与加热单元300之间移动，升降模块驱动传输单元400上升和下降，避免了在冷却单元200和加热单元300位置处各自设置基板接收装置，减少了空间的占用，优化了热处理装置的内部空间。
实施例二
如图4所示，本实施例提供一种热处理装置，与实施例一相比，区别在于传输单元400的结构。
传输单元400包括传输臂410、升降模块、直线模块和两个支撑件412。升降模块包括第一驱动单元450和两个第一导轨480，直线模块包括第二驱动单元440和传送带460。
直线模块还包括有两条平行排列的第二导轨490和两个第一移动件430，两条 第二导轨490分别设置在传送带460的两侧，两个第一移动件430分别活动安装在各自的第二导轨490上。连接件432两端设置在两个第一移动件430上，且中部设置在传送带460上以将传送带460的动力传递到两个第一移动件430，从而使得第二驱动单元440驱动两个第一移动件430分别在各自的第二导轨490上移动。第一驱动单元450设置在连接件432上，两个第一导轨480分别设置在连接件432两端，每个支撑件412通过第一滑动件481滑动设置在对应的第一导轨480上，第一驱动单元450驱动两个支撑件412升降进而带动传输臂410升降。
第二驱动单元440通过两个第一移动件430驱动升降模块、支撑件412和传输臂410沿两个第二导轨490移动。
在此实施例中，两个支撑件412形成在一个框架上。
本实施例的其他设置与实施例一相同，在此不再赘述。
实施例三
如图5所示，本实施例提供一种热处理装置，与实施例二相比，区别在于：
传输臂410包括一对长条状的支撑部415。直线模块包括一条第二导轨490。每个支撑部415包括至少两个支撑销413，支撑销413上设有阻挡部414。冷却板210开设有两条用于容纳支撑销413的狭缝(图未示)。第一移动件430在第二导轨490上移动时，支撑销413在冷却板210的狭缝内移动。
此外，支撑件412的形态与实施例二不一样，本实施例的支撑件412为条形板状结构，支撑件412的两端分别与对应的支撑部415连接。
本实施例的其他设置与实施例二相同，在此不再赘述。
实施例四
如图6所示，本实施例提供一种热处理装置，与实施例三相比，区别在于：
传输臂410为C型结构，C型结构包括对称的两部分。直线模块和升降模块集中设置在其中一部分的下方。传输臂410另一部分的下方留有更多空间以放置装置1000的其他部件，同时避免了传输单元400与其他部件干涉。传输单元没有设置支撑件412，传输臂410直接设置在第一滑动件481上。
第二导轨490和传送带460平行设置，升降模块设置在第二导轨490远离传 送带460和第二驱动单元440的一侧。升降模块包括两条第一导轨480，第一驱动单元450驱动第一滑动件481沿第一导轨480升降。第二驱动单元440驱动升降模块和传输臂410在第一导轨490上直线运动。
传输臂410包括从其内侧突出的至少两个凸起411。冷却板210沿着外圆周边缘设有至少两个凹槽220。传输臂410放置或取基板的过程中凸起411容纳在凹槽220内。此外，凸起411上设有支撑销413，支撑销413支撑基板。本实施例中，传输臂410具有四个凸起411，冷却板210对应设有四个凹槽220。
实施例五
如图7-8所示，针对实施例一至四的热处理装置，本实施例提供了一示例性的热处理装置的传输方式，图8中，(a)图表示装置未工作状态。(b)图表示传输臂410上升装载并承托基板W的工作状态。(c)图表示传输单元400运输基板W至加热单元300的工作状态。(d)图表示加热单元300接收基板W后传输单元400退回的工作状态。(e)图表示传输臂410回到初始位置后加热单元300烘烤基板W的工作状态。
结合参考图1-2、7-8所示，具体步骤包括：
S1：第一驱动单元450驱动传输臂410上升至预设位置，基板W经开口110传输至装置1000内，基板W放置在支撑销413上，参考(b)图；
S2：第三驱动单元(未示出)驱动盖板320上升至预设高度，第二驱动单元440驱动第一移动件430直线运动，从而将基板W移动到加热单元300处，参考(c)图；
S3：顶针330上升并伸出至加热板310的上方接收传输臂410上的基板W，第二驱动单元440驱动第一移动件430返回从而使传输臂410回到初始位置，顶针330下降至加热板310的下方将基板W转移至加热板310上，参考(d)图；
S4：第三驱动单元驱动盖板320下降，盖板320盖设在加热板310上，加热板310开始烘烤基板W，参考(e)图；
S5：烘烤完成后，第三驱动单元驱动盖板320上升，顶针330上升从而将基板W顶至加热板310的上方，第二驱动单元440驱动传输臂410移动至加热单元300，并接收烘烤后的基板W；
S6：第二驱动单元440驱动传输臂410和基板W移动到冷却单元200处；
S7：传输臂410下降到冷却板210上表面的下方，冷却板210上表面接收基板W，冷却板210冷却基板W；
S8：基板W冷却之后，第一驱动单元450驱动传输臂410上升，先是支撑销413承托基板W，后传输臂410继续上升至预设高度，基板W被取走并传送到装置1000的外部。
下一片基板W重复上述S1-S8步骤。
上述方法仅示例性的描述了本发明热处理装置的基板传输方式，可以理解的是，根据不同的工艺需求，基于本发明的热处理装置，基板可以有不同的传输方式。
以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (14)

  1. 一种热处理装置，其特征在于，包括冷却单元(200)、加热单元(300)和传输单元(400)；
    所述冷却单元(200)包括用于冷却基板的冷却板(210)，所述加热单元(300)包括用于加热基板的加热板(310)；
    所述传输单元(400)包括传输臂(410)、升降模块和直线模块，所述传输臂(410)活动设置在所述升降模块上，所述升降模块设置在所述直线模块上；
    所述传输臂(410)用于承托基板，所述升降模块用于驱动所述传输臂(410)上升和下降，所述直线模块用于驱动所述传输臂(410)在所述冷却板(210)和所述加热板(300)之间传输基板。
  2. 根据权利要求1所述的热处理装置，其特征在于，所述直线模块包括第二驱动单元(440)和第二导轨(490)，所述第二驱动单元(440)用于驱动所述升降模块和所述传输臂(410)在所述第二导轨(490)上滑动。
  3. 根据权利要求2所述的热处理装置，其特征在于，所述直线模块还包括第一移动件(430)，所述升降模块设置在所述第一移动件(430)上，所述第一移动件(430)活动安装在所述第二导轨(490)上，所述第二驱动单元(440)驱动所述第一移动件(430)在所述第二导轨(490)上滑动。
  4. 根据权利要求3所述的热处理装置，其特征在于，所述传输单元(400)包括一支撑件(412a)，所述支撑件(412a)的一侧设置在传输臂(410)上；
    所述升降模块包括第一驱动单元(450)，所述第一驱动单元(450)包括第二滑动件和驱动件，所述支撑件(412a)的另一侧设置在所述第二滑动件上，所述驱动件驱动所述第二滑动件上下滑动从而带动所述传输臂(410)上升和下降。
  5. 根据权利要求4所述的热处理装置，其特征在于，所述直线模块还包括第二移动件(431)和辅助导轨(420)，所述升降模块还包括第一滑动件(481)和第一导轨(480)，第一滑动件(481)滑动设置在第一导轨(480)上，所述第一导轨(480)设置在所述第二移动件(431)上，所述传输单元(400)还包括另一支撑件(412b)，所述另一支撑件(412b)的两侧分别设置在所述传输 臂(410)和第一滑动件(481)上；
    所述辅助导轨(420)与所述第二导轨(490)间隔设置，所述第二移动件(431)活动设置在所述辅助导轨(420)上，所述第二驱动单元(440)驱动所述第二移动件(431)在所述辅助导轨(420)上、所述第一移动件(430)在所述第二导轨(490)上同时滑动。
  6. 根据权利要求1所述的热处理装置，其特征在于，所述传输臂(410)上设有至少两个凸起(411)；
    所述冷却板(210)沿着外圆周边缘设有至少两个凹槽(220)，所述传输臂(410)放置或承托基板的过程中所述凸起(411)容纳在所述凹槽(220)内，所述凸起(411)上设有支撑销(413)，所述支撑销(413)用于支撑基板。
  7. 根据权利要求6所述的热处理装置，其特征在于，所述支撑销(413)上设有阻挡部(414)，所述阻挡部(414)与基板的外边缘接触用于防止基板从所述支撑销(413)上偏离出去。
  8. 根据权利要求3所述的热处理装置，其特征在于，所述直线模块包括有连接件(432)、两条平行排列的所述第二导轨(490)、两个所述第一移动件(430)，所述传输单元(400)包括两个支撑件(412)，两个支撑件(412)的一侧设置在传输臂(410)上，所述升降模块包括第一驱动单元(450)、两个第一滑动件(481)和两个第一导轨(480)；
    所述连接件(432)的两端分别设置在两个所述第一移动件(430)，两个所述第一移动件(430)分别活动安装在各自的所述第二导轨(490)上，所述第二驱动单元(440)驱动所述两个第一移动件(430)直线运动；
    所述第一驱动单元(450)设置在所述连接件(432)上，两个所述第一导轨(480)分别设置在所述连接件(432)的两端，所述支撑件(412)通过所述第一滑动件(481)滑动安装在对应的所述第一导轨(480)上。
  9. 根据权利要求1所述的热处理装置，其特征在于，所述传输臂(410)包括一对长条状的支撑部(415)，所述支撑部(415)设置在所述冷却板(210)下方，每个所述支撑部(415)包括至少两个支撑销(413)，所述支撑销(413)用于支撑基板，所述冷却板(210)包括两条用于容纳所述支撑销(413)的狭缝。
  10. 根据权利要求6所述的热处理装置，其特征在于，所述传输臂(410)包括一对弧形支撑部(415)，每个所述支撑部(415)包括从所述支撑部(415)内侧突出的至少两个所述凸起(411)。
  11. 根据权利要求1所述的热处理装置，其特征在于，进一步包括上板(130)，所述上板(130)设置在所述冷却板(210)下方且覆盖所述升降模块和所述直线模块。
  12. 根据权利要求1所述的热处理装置，其特征在于，进一步包括壳体，所述冷却单元(200)、加热单元(300)和传输单元(400)设置在所述壳体内，所述壳体具有至少一个导向槽(120)，所述传输单元(400)沿着所述导向槽(120)移送基板。
  13. 根据权利要求3所述的热处理装置，其特征在于，所述传输臂(410)为C型结构，所述C型结构包括对称的两部分，所述直线模块和所述升降模块集中设置在其中一部分的下方，所述升降模块设置在所述第二导轨(490)远离所述第二驱动单元(440)的一侧。
  14. 根据权利要求13所述的热处理装置，其特征在于，所述升降模块包括第一驱动单元(450)、两个第一滑动件(481)和两条第一导轨(480)，传输臂(410)设置在第一滑动件(481)上，所述第一驱动单元(450)驱动所述第一滑动件(481)沿所述第一导轨(480)升降。
PCT/CN2023/109218 2022-09-29 2023-07-26 一种热处理装置 WO2024066706A1 (zh)

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