WO2024042663A1 - はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 - Google Patents

はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 Download PDF

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Publication number
WO2024042663A1
WO2024042663A1 PCT/JP2022/031965 JP2022031965W WO2024042663A1 WO 2024042663 A1 WO2024042663 A1 WO 2024042663A1 JP 2022031965 W JP2022031965 W JP 2022031965W WO 2024042663 A1 WO2024042663 A1 WO 2024042663A1
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WO
WIPO (PCT)
Prior art keywords
mass
joint
solder
solder alloy
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/031965
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English (en)
French (fr)
Japanese (ja)
Inventor
貴則 嶋崎
大輔 丸山
元気 越智
正也 新井
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Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP2022551546A priority Critical patent/JP7182753B1/ja
Priority to CA3250312A priority patent/CA3250312A1/en
Priority to MX2024008241A priority patent/MX2024008241A/es
Priority to CN202280008100.1A priority patent/CN117940248A/zh
Priority to EP22947060.4A priority patent/EP4578970A4/en
Priority to KR1020237019469A priority patent/KR20250051529A/ko
Priority to PCT/JP2022/031965 priority patent/WO2024042663A1/ja
Priority to TW112121337A priority patent/TW202408714A/zh
Priority to US18/342,733 priority patent/US12569940B2/en
Publication of WO2024042663A1 publication Critical patent/WO2024042663A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces

Definitions

  • the present invention relates to a solder alloy, a joint, a joint material, a solder paste, a joint structure, and an electronic control device.
  • Solder alloys are widely known as materials for joining (soldering) materials to be joined (for example, printed wiring boards and electronic components).
  • the temperature conditions (heating temperature) during soldering are set based on the melting temperature (in this specification, it means “melting point” or “liquidus temperature”). Therefore, depending on the liquidus temperature of the solder alloy, the heating temperature may be set higher. In this case, the thermal load applied to the materials to be joined may reduce the reliability of the bonded structure (a structure in which the materials to be joined are joined together; for example, a printed circuit board). Therefore, solder alloys have been provided in which Bi is added to lower the liquidus temperature so that the heating temperature can be set low.
  • solder alloys for example, have been provided as solder alloys that contain Bi and improve ductility and brittleness.
  • Bi 32 mass% to 40 mass%
  • Sb 0.1 mass% to 1.0 mass%
  • Cu 0.1 mass% to 1.0 mass%
  • Ni 0.001 mass% to 0
  • SnBiSb-based low-temperature lead-free solder characterized by containing one or more metal elements of -2.0%, Ag0.5-0.8%, and In0.05-1% (Patent Document 3) ).
  • the bonded structure may be placed in an environment where heat cycles are repeated, and this heat cycle causes thermal fatigue failure (cracks) in the bonded portion.
  • thermal fatigue failure cracks
  • a joint formed using a solder alloy containing Bi tends to be hard and brittle, and therefore, the above-mentioned cracks are likely to occur.
  • Patent Documents 1 to 3 describe the resistance to cracks (hereinafter referred to as “heat cycle resistance” in this specification) and the resistance to external forces (hereinafter referred to as “drop impact resistance” in this specification). There is no disclosure or suggestion of a solder alloy having both of the above.
  • an object of the present invention is to solve the above-mentioned problems, and to provide a solder alloy, a bonding material, and a solder paste that contain Bi and can form a bonded portion having heat cycle resistance and drop impact resistance. That's true.
  • the solder alloy of the present invention contains Bi of 45% to 63% by mass, Sb of 0.1% to less than 0.7% by mass, and In of 0.05% to 1% by mass. The remainder is Sn and unavoidable impurities, and the liquidus temperature is 170° C. or lower.
  • the solder alloy of the present invention further includes a total of 0.001% by mass or more and 0.05% by mass or less of one or more selected from P, Ga, and Ge. I can do it.
  • the solder alloy of the present invention further contains one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total of 0.001 mass % or more and 0.05% by mass or less.
  • the bonding material of the present invention includes the solder alloy according to any one of (1) to (3) above.
  • the solder paste of the present invention contains a flux and a powder made of the solder alloy according to any one of (1) to (3) above.
  • the joint of the present invention is formed using the solder alloy according to any one of (1) to (3) above.
  • the bonding portion of the present invention is formed using the bonding material described in (4) above.
  • the joint of the present invention is formed using the solder paste described in (5) above.
  • the bonded structure of the present invention includes a first material to be bonded, a bonded portion, and a second material to be bonded, and the bonded portion includes any one of the above (6) to (8). 1, which joins the first material to be joined and the second material to be joined.
  • the electronic control device of the present invention has the bonded structure described in (9) above.
  • solder alloy, bonding material, and solder paste of the present invention can form a bonded portion that has heat cycle resistance and drop impact resistance while containing Bi.
  • solder alloy of the present embodiment contains Bi of 45% by mass or more and 63% by mass or less, Sb of 0.1% by mass or more and less than 0.7% by mass, and In of 0.05% by mass or more and 1% by mass or less. The remainder is Sn and unavoidable impurities.
  • the solder alloy of this embodiment lowers the liquidus temperature, and strengthens the joint by solid solution of Bi, Sb, and In into Sn, and , it is possible to impart reinforcement by precipitation and dispersion of fine intermetallic compounds (eg ⁇ -SnSb, InSb), and also to impart good ductility to the joint.
  • fine intermetallic compounds eg ⁇ -SnSb, InSb
  • the solder alloy of the present embodiment is suitable for use in the soldering process due to residual stress generated within the joint during solidification of the solder, and distortion generated in the printed wiring board during the manufacture of electronic control devices and electronic devices. The generation of cracks can be suppressed.
  • solder alloy of the present embodiment can suppress the occurrence of cracks and the propagation of cracks within the joint due to repeated heat cycles.
  • an instantaneous and concentrated strong external force acts on the joint. Since this external force acts on the joint from a plurality of directions (at least two types of tension, compression, shear, bending, and torsion), instantaneous and large stress and stress in response to the external force are generated within the joint. Therefore, in order to prevent the joint from being damaged by the above external force, the joint must have good strength and good ductility, that is, the yield stress, tensile stress, and breaking strain of the joint must be improved in a well-balanced manner. That is required.
  • the solder alloy of this embodiment can form a joint having a good balance of strength and ductility due to the above structure, and therefore has good resistance to the above external force, that is, good drop resistance.
  • a joint having impact resistance can be provided.
  • solder alloy of the present embodiment does not contain alloying elements such as Ni or Co that cause fine intermetallic compounds to precipitate within the joint, the solder alloy of the present embodiment can impart good strength and ductility to the joint due to the above structure. I can do it.
  • solder alloy of the present embodiment can provide good strength and ductility to the joint while lowering the liquidus temperature.
  • the Bi content falls outside the above range, there is a risk that the liquidus temperature of the solder alloy will increase significantly. Furthermore, if the Bi content exceeds 63% by mass, the ductility of the solder alloy may decrease.
  • the preferable content of Bi is 45% by mass or more and 60% by mass or less. Further, a more preferable Bi content is 50% by mass or more and 59% by mass or less. By setting the Bi content within this range, the ductility of the solder alloy can be further improved, and the heat cycle resistance and drop impact resistance of the joint can be further improved.
  • solder alloy of the present embodiment can strengthen the joint and improve ductility. It is also possible to lower the liquidus temperature of the solder alloy.
  • the Sb content is less than 0.1% by mass, there is a risk that the joint portion will not be sufficiently strengthened. Furthermore, if the Sb content is 0.7% by mass or more, coarse ⁇ -SnSb will crystallize as primary crystals, which may impede the ductility of the joint.
  • the preferable content of Sb is 0.2% by mass or more and less than 0.7% by mass. Moreover, the content of Sb is more preferably 0.3% by mass or more and 0.6% by mass or less. By setting the Sb content within this range, the ductility and strength of the solder alloy can be further improved, and the heat cycle resistance and drop impact resistance of the joint can be further improved.
  • the solder alloy of this embodiment can strengthen the joint and improve ductility. It is also possible to lower the liquidus temperature of the solder alloy.
  • the preferable content of In is 0.05% by mass or more and 0.5% by mass or less. Further, a more preferable In content is 0.05% by mass or more and 0.3% by mass or less. By setting the In content within this range, the ductility and strength of the solder alloy can be further improved, and the heat cycle resistance and drop impact resistance of the joint can be further improved.
  • the solder alloy of the present embodiment can further contain a total of 0.001% by mass or more and 0.05% by mass or less of one or more selected from P, Ga, and Ge.
  • oxidation of the solder alloy can be suppressed and the wettability of the solder alloy can be improved, thereby providing a highly reliable joint. becomes possible.
  • the total content of one or more selected from P, Ga, and Ge exceeds 0.05% by mass, there is a possibility that voids will be generated in the joint and heat cycle resistance will deteriorate.
  • the solder alloy of the present embodiment can further contain a total of 0.001% by mass or more and 0.05% by mass or less of one or more selected from Mn, Ti, Al, Cr, V, and Mo.
  • Mn, Ti, Al, Cr, V, and Mo By adding one or more selected from Mn, Ti, Al, Cr, V, and Mo to the solder alloy, the intermetallic compounds in the joint become even finer, making it possible to suppress the growth of cracks and improve the solder alloy. It is possible to achieve excellent heat cycle resistance.
  • the total content of one or more selected from Mn, Ti, Al, Cr, V, and Mo exceeds 0.05% by mass, voids may occur in the joint and heat cycle resistance may deteriorate. be.
  • solder alloy of this embodiment consists of Sn and unavoidable impurities. Note that the solder alloy of this embodiment does not contain lead other than inevitable impurities.
  • solder alloy of this embodiment satisfies the above alloy composition and content, and has a liquidus temperature of 170° C. or lower.
  • the heating temperature during soldering is set based on the melting temperature of the solder alloy, and is generally set to 20° C. or more above the melting temperature. It is said that when the heating temperature is lowered to 190° C., it is possible to significantly reduce the occurrence of deformation (warpage) in the materials to be joined, especially printed wiring boards and electronic components, due to thermal loads.
  • the liquidus temperature of the solder alloy is 170°C or lower, the solder alloy can be sufficiently melted even if soldering is performed at a heating temperature of 190°C. Therefore, in this case, thermal loads may cause deformation of printed wiring boards and electronic components, especially printed wiring boards and electronic components that have become smaller and thinner, and the deformation of the parts to be joined and the joined parts due to this deformation. It is possible to suppress the occurrence of bonding defects. Furthermore, since the generation of unmelted solder can be suppressed, a highly reliable joint can be provided.
  • the liquidus temperature of the solder alloy described above was measured in accordance with JIS Z3198-1:2014, using the Differential Scanning Calorimetry method at a heating rate of 2°C/min and a sample amount of Performed as 10 mg.
  • the bonding material of this embodiment includes the solder alloy of this embodiment, and can be used in the form of solder paste, solder ball, wire, solder preform, flux cored solder, etc., which will be described later.
  • the form of the bonding material can be appropriately selected depending on the size, type, and purpose of the materials to be bonded, the soldering method, and the like.
  • the bonding material of this embodiment can form a bonded portion having good heat cycle resistance and drop impact resistance by including the solder alloy of this embodiment.
  • solder paste of this embodiment includes a powder made of the solder alloy of this embodiment (hereinafter referred to as "alloy powder").
  • alloy powder and flux are kneaded to form a paste. It is made by
  • the flux includes, for example, a base resin, a thixotropic agent, an activator, and a solvent.
  • Examples of the base resin include rosin resin; acrylic acid, methacrylic acid, various esters of acrylic acid, various esters of methacrylic acid, crotonic acid, itaconic acid, maleic acid, maleic anhydride, esters of maleic acid, and maleic anhydride.
  • Examples include acrylic resins obtained by polymerizing at least one monomer such as acid esters, acrylonitrile, methacrylonitrile, acrylamide, methacrylamide, vinyl chloride, vinyl acetate, etc.; epoxy resins; phenol resins; and the like. These can be used alone or in combination.
  • thixotropic agents examples include hydrogenated castor oil, hydrogenated castor oil, bisamide-based thixotropic agents (saturated fatty acid bisamide, unsaturated fatty acid bisamide, aromatic bisamide, etc.), oxyfatty acids, dimethyldibenzylidene sorbitol, and the like. These can be used alone or in combination.
  • the activator examples include organic acids (monocarboxylic acids, dicarboxylic acids, and other organic acids), halogen-containing compounds, amine-based activators, and the like. These can be used alone or in combination.
  • solvent examples include alcohol-based, butyl cellosolve-based, glycol ether-based, and ester-based solvents. These can be used alone or in combination.
  • an antioxidant can be added to the flux.
  • examples of the antioxidant include hindered phenolic antioxidants, phenolic antioxidants, bisphenol antioxidants, polymer type antioxidants, and the like.
  • additives such as a matting agent and an antifoaming agent may be added to the flux.
  • the blending ratio (mass %) of the alloy powder and flux can be from 65:35 to 95:5 in terms of alloy powder:flux ratio. Further, for example, the above blending ratio can be from 85:15 to 93:7 or from 87:13 to 92:8.
  • the particle size of the alloy powder can be 1 ⁇ m or more and 40 ⁇ m or less. Further, the particle size can also be set to 5 ⁇ m or more and 35 ⁇ m or less, or 10 ⁇ m or more and 30 ⁇ m or less.
  • the solder paste of this embodiment can form a joint having good heat cycle resistance and drop impact resistance.
  • the joint part of this embodiment is formed using the solder alloy and joining material (including solder paste) of this embodiment, and joins the materials to be joined.
  • the method for forming the joint of this embodiment may be any method as long as it can be formed using the solder alloy, bonding material, and solder paste of this embodiment, and any method such as a reflow method or a flow method may be adopted. can.
  • the bonding material to be used can be appropriately selected depending on the size, type and purpose of the materials to be bonded, the forming method, etc.
  • the joined structure of this embodiment includes a first member to be joined, a joint portion, and a second member to be joined.
  • the joining part is a joining part of this embodiment, and joins the first material to be joined and the second material to be joined.
  • the combination of the first material to be joined and the second material to be joined is, for example, a substrate (the surface of which is made of ceramic, metal, alloy, or resin, and on which no electronic circuit is formed). ), printed wiring boards (boards with electronic circuits formed on them, but without electronic parts, etc.), printed circuit boards (printed wiring boards with electronic parts, etc. mounted on them), electronic parts, silicon wafers , semiconductor packages, semiconductor chips, and the like. Specific combinations include, for example, a printed wiring board and an electronic component, a printed wiring board and a semiconductor chip, a semiconductor package and a printed circuit board, a printed wiring board and a printed wiring board, and the like.
  • the bonded structure of this embodiment is produced, for example, by the following method.
  • the method of this embodiment is applied to a predetermined position of the first material to be bonded, for example, on an electronic circuit.
  • a bonding material is placed (or applied in the case of solder paste), and the second material to be bonded is placed on the bonding material.
  • these are reflowed at a predetermined heating temperature, for example, a peak temperature of 190° C., to form a joint portion for joining the first material to be joined and the second material to be joined.
  • a predetermined heating temperature for example, a peak temperature of 190° C.
  • solder preform whose surface is coated with flux is placed at a predetermined position on the first material to be bonded, and the second material to be bonded is placed on the solder preform. Place the material and heat it.
  • solder paste is applied to the surface of the BGA or a predetermined position of the first material to be joined. The second material to be joined is placed on a predetermined position of the first material to be joined, and then heated.
  • the bonded structure of this embodiment has the bonded portion of this embodiment, it can achieve good heat cycle resistance and drop impact resistance.
  • the electronic control device of this embodiment is equipped with the bonded structure of this embodiment, and is, for example, a device in which a printed circuit board in which an electronic component and a printed wiring board are bonded is placed in a housing. It controls the operation of the parts that make up electronic equipment. Since the electronic control device of this embodiment includes the bonded structure of this embodiment, it has good heat cycle resistance and drop impact resistance, and can ensure high reliability.
  • test pieces 10 as shown in FIG. 1 were prepared.
  • the test piece 10 was produced so that the central parallel part (between G1 and G2 in FIG. 1) was as follows. ⁇ Length of central parallel part (L in Figure 1): 12mm ⁇ Width of central parallel part (W in Figure 1): 2mm ⁇ Thickness of central parallel part: 4mm
  • test piece 10 was tested at room temperature using a tabletop precision universal testing machine (product name: Autograph AG-50kNX plus, manufactured by Shimadzu Corporation) at a stroke of 0.72 mm/min until it broke. I pulled it in the X direction. Then, the stroke distance when the test piece 10 broke was set as GL1, and the length L of the central parallel part of the test piece before tension was set as GL0, and the elongation rate of the test piece 10 was calculated based on the following formula.
  • tabletop precision universal testing machine product name: Autograph AG-50kNX plus, manufactured by Shimadzu Corporation
  • Elongation rate (%) (GL1-GL0)/GL0 ⁇ 100
  • Five test pieces 10 were prepared for each type of solder alloy, and the elongation rate and the average value of the elongation rate were calculated for each according to the above procedure, and evaluated based on the following criteria. The results are shown in Tables 3 and 4.
  • the average elongation rate is 25% or more and less than 30%.
  • Average elongation rate is less than 25%
  • solder paste was printed on a glass epoxy substrate using a metal mask. Then, four LGAs were placed on each glass epoxy substrate at predetermined positions on the printed solder paste. Note that the printed film thickness of the solder paste was adjusted using a metal mask. Then, the glass epoxy substrate on which the LGA is mounted is reflowed using a reflow oven (product name: TNV-M6110CR, manufactured by Tamura Seisakusho Co., Ltd.) to form the LGA, the glass epoxy substrate, and the joint portion that joins them. A test board with the following was fabricated.
  • a reflow oven product name: TNV-M6110CR, manufactured by Tamura Seisakusho Co., Ltd.
  • the preheating was from 100°C to 120°C
  • the peak temperature was 185°C
  • the time at 150°C or higher was 60 seconds
  • the cooling rate from the peak temperature to 100°C was from 1°C to 4°C/sec.
  • the oxygen concentration was set at 200 ⁇ 100 ppm.
  • the produced test substrate was subjected to a drop impact test under the following conditions using a drop impact tester (product name: HDST-150J, Shinei Technology Co., Ltd.). That is, in accordance with the JEDEC standard JESD22-B111, the test board was repeatedly allowed to freely fall from a height at which a shock waveform with an acceleration of 1,500 G and a width of 0.5 ms was applied. During the drop impact test, the electrical resistance of each joint of the test board was constantly observed, and when the resistance value exceeded 1,000 ⁇ , it was determined that the board had broken, and the number of drops until breakage was measured.
  • a drop impact tester product name: HDST-150J, Shinei Technology Co., Ltd.
  • Characteristic life is 110 times or more ⁇ : Characteristic life is 90 times or more and less than 110 times ⁇ : Characteristic life is 70 times or more and less than 90 times ⁇ : Characteristic life is less than 70 times be
  • solder paste was printed on a glass epoxy substrate using a metal mask. Then, ten chip components were placed on each glass epoxy substrate at predetermined positions on the printed solder paste. Note that the printed film thickness of the solder paste was adjusted using a metal mask. Then, the glass epoxy substrate on which the chip components are mounted is reflowed using a reflow oven (product name: TNV-M6110CR, manufactured by Tamura Seisakusho Co., Ltd.), and the chip components, the glass epoxy substrate, and the bonding bonding are performed to bond them together. A mounting board having a section was fabricated.
  • the preheating was from 100°C to 120°C
  • the peak temperature was 185°C
  • the time at 150°C or higher was 60 seconds
  • the cooling rate from the peak temperature to 100°C was from 1°C to 4°C/sec.
  • the oxygen concentration was set at 200 ⁇ 100 ppm.
  • each Test boards a to c were prepared by exposing the mounting boards to a thermal shock cycle as described below.
  • the target portion c was cut out from each test substrate a, and this was sealed using an epoxy resin (product name: HERZOG Epo low viscosity resin (base resin and curing agent), manufactured by HERZOG Japan Co., Ltd.). Then, using a wet polishing machine (product name: TegraPol-25, manufactured by Marumoto Struers Co., Ltd.), the center cross section of each chip component mounted on each test board can be seen. TM-1000, manufactured by Hitachi High-Technologies Corporation), the condition of each joint on each test board a to c was observed, and the presence or absence of a crack completely crossing the joint was confirmed. , evaluated according to the following criteria. The results are shown in Tables 3 and 4.
  • the solder alloy of this example contains predetermined amounts of Bi, Sb, In, and Sn, thereby lowering the liquidus temperature while performing (1) tensile test, (2) drop impact test, and (3) ) It is possible to form a joint that shows good results in both heat cycle tests.
  • the strain rate when a car collides with an object is said to be 10 -3 (s -1 ) to 10 3 (s -1 ).
  • the (1) tensile test a test piece with GL0 of 12 mm was pulled at a stroke of 0.72 mm/min, so converting this into a strain rate would be 10 ⁇ 3 (s ⁇ 1 ).
  • the solder alloy of this example has good resistance, that is, good strength and ductility, even when a load comparable to the strain rate when a car collides with an object is applied. It can be seen that a joint can be formed.
  • solder alloy of this example can form a highly reliable joint having excellent heat cycle resistance and drop impact resistance. Furthermore, electronic control devices and electronic devices having such a joint can exhibit high reliability.
  • solder alloy of this example can have a liquidus temperature of 170° C. or lower, it is possible to suppress bonding defects even in reflow at a peak temperature of 185° C.

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  • Engineering & Computer Science (AREA)
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  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2022/031965 2022-08-24 2022-08-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 Ceased WO2024042663A1 (ja)

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CA3250312A CA3250312A1 (en) 2022-08-24 2022-08-24 Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device
MX2024008241A MX2024008241A (es) 2022-08-24 2022-08-24 Aleacion de soldadura, porcion de junta, material de union, pasta de soldadura, estructura de junta y dispositivo de control electronico.
CN202280008100.1A CN117940248A (zh) 2022-08-24 2022-08-24 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置
EP22947060.4A EP4578970A4 (en) 2022-08-24 2022-08-24 Solder alloy, joint part, joining material, solder paste, joint structure, and electronic control device
KR1020237019469A KR20250051529A (ko) 2022-08-24 2022-08-24 땜납 합금, 접합부, 접합재, 솔더 페이스트, 접합 구조체 및 전자 제어 장치
PCT/JP2022/031965 WO2024042663A1 (ja) 2022-08-24 2022-08-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置
TW112121337A TW202408714A (zh) 2022-08-24 2023-06-08 軟焊料合金、接合部、接合材料、焊膏、接合結構體和電子控制裝置
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JP2019527145A (ja) * 2016-08-11 2019-09-26 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ＳｎＢｉＳｂ系低温鉛フリーはんだ
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JP6804126B1 (ja) 2019-04-11 2020-12-23 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部

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JP6951438B2 (ja) 2016-08-11 2021-10-20 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドＢｅｉｊｉｎｇ Ｃｏｍｐｏ Ａｄｖａｎｃｅｄ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ＳｎＢｉＳｂ系低温鉛フリーはんだ
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JP6477965B1 (ja) 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
WO2019171710A1 (ja) * 2018-03-08 2019-09-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
US20200070287A1 (en) * 2018-08-31 2020-03-05 Indium Corporation Snbi and snin solder alloys
JP6804126B1 (ja) 2019-04-11 2020-12-23 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部

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