WO2024011719A1 - 显示装置 - Google Patents
显示装置 Download PDFInfo
- Publication number
- WO2024011719A1 WO2024011719A1 PCT/CN2022/114782 CN2022114782W WO2024011719A1 WO 2024011719 A1 WO2024011719 A1 WO 2024011719A1 CN 2022114782 W CN2022114782 W CN 2022114782W WO 2024011719 A1 WO2024011719 A1 WO 2024011719A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- via hole
- width
- functional layer
- flexible circuit
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 273
- 239000002346 layers by function Substances 0.000 claims abstract description 193
- 238000005452 bending Methods 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 230000005484 gravity Effects 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims description 79
- 229910052751 metal Inorganic materials 0.000 claims description 79
- 239000003292 glue Substances 0.000 claims description 62
- 239000011241 protective layer Substances 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 42
- 239000012790 adhesive layer Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present application relates to the field of display technology, and in particular, to a display device.
- curved display devices are designed to achieve borderless display by bending the frame of the display device.
- the existing four-curved display device bends each frame downward and backward, making the four-curved display device borderless.
- the flexible circuit board since the flexible circuit board is arranged at the lower frame, when the display panel and the cover are attached, the flexible circuit board will be lifted up, causing interference in the subsequent process, resulting in damage to the flexible circuit board. , causing the flexible circuit board to fail.
- the existing four-curved display device has a technical problem that the flexible circuit board is warped, causing interference and damage to the flexible circuit board.
- Embodiments of the present application provide a display device to alleviate the technical problem of existing four-curved display devices in which the flexible circuit board is warped, causing interference and damage to the flexible circuit board.
- An embodiment of the present application provides a display device, which includes:
- the display panel includes a flat display area and at least one curved display area;
- a flexible circuit board is connected to the at least one curved display area.
- the flexible circuit board includes a first connection area connected to the display panel, a second connection area connected to the driver chip, and a second connection area located in the first connection area. and a bending area between the second connection area;
- the flexible circuit board includes a base, a first functional layer and a second functional layer, the base is disposed between the first functional layer and the second functional layer, the first functional layer and the second functional layer
- the second functional layer includes a plurality of film layers, at least three film layers in the first functional layer are formed with via holes, at least three film layers in the second functional layer are formed with via holes, and the third film layer is formed with via holes.
- the projections of the via holes on the substrate of every two layers in a functional layer and the second functional layer overlap, and the flexible circuit is formed by forming via holes in the first functional layer and the second functional layer.
- the portion of the plate located in the bending area is automatically bent by gravity.
- the first functional layer includes:
- a first metal layer disposed on one side of the substrate
- a first glue layer is provided on the side of the first metal layer away from the substrate;
- a first protective layer is provided on the side of the first adhesive layer away from the first metal layer;
- a first anti-electromagnetic layer is provided on the side of the first protective layer away from the first adhesive layer;
- the first anti-electromagnetic layer is formed with a first via hole
- the first protective layer is formed with a second via hole
- at least one of the first glue layer and the first metal layer is formed with a via hole.
- the first glue layer is formed with a third via hole
- the first metal layer is formed with a fourth via hole
- the width of the third via hole is equal to the width of the fourth via hole
- the width of the third via hole is smaller than the width of the first via hole
- the width of the third via hole is smaller than the width of the second via hole.
- the flexible circuit board includes a first insulating part and a second insulating part disposed in the bending area, the first insulating part being disposed between the second insulating part and the substrate,
- the material of the first insulating part is the same as the material of the first glue layer
- the material of the second insulating part is the same as the material of the first protective layer
- the first insulating part and the second The insulating part is disposed on a side close to the first connection area.
- the second functional layer includes:
- a second metal layer is provided on the side of the substrate away from the first functional layer
- a second glue layer is provided on the side of the second metal layer away from the substrate;
- a second protective layer is provided on the side of the second glue layer away from the second metal layer;
- a second anti-electromagnetic layer is provided on the side of the second protective layer away from the second adhesive layer;
- the second anti-electromagnetic layer is formed with a fifth via hole
- the second protective layer is formed with a sixth via hole
- at least one of the second glue layer and the second metal layer is formed with a via hole.
- the second glue layer is formed with a seventh via hole
- the width of the fifth via hole is equal to the width of the sixth via hole
- the width of the fifth via hole is equal to the width of the seventh via hole. The width of the via.
- the width of the via hole in the second functional layer is greater than or equal to the width of the via hole in the first functional layer.
- the second glue layer is formed with a seventh via hole
- the second metal layer is formed with an eighth via hole
- the width of the seventh via hole is equal to the width of the eighth via hole
- the width of the seventh via hole is smaller than the width of the fifth via hole
- the width of the seventh via hole is smaller than the width of the sixth via hole.
- the flexible circuit board includes a third insulating part and a fourth insulating part disposed in the bending area, the third insulating part being disposed between the fourth insulating part and the substrate,
- the material of the third insulating part is the same as the material of the second glue layer
- the material of the fourth insulating part is the same as the material of the second protective layer
- the third insulating part and the fourth The insulating part is disposed on a side close to the first connection area.
- At least two via holes in the first functional layer have unequal widths, each via hole in the second functional layer has an equal width, and the via holes in the second functional layer The width is equal to the maximum width of the via hole in the first functional layer.
- the width of the via hole in the second functional layer is greater than 6 mm.
- the width of the via hole in the second functional layer is less than 10 mm.
- a via hole of any film layer in the first functional layer and the second functional layer is provided in the bending area.
- the flexible circuit board further includes an ink layer, the ink layer includes a first ink layer and a second ink layer, the first ink layer is disposed in the via hole of the first functional layer, The second ink layer is disposed in the via hole of the second functional layer.
- the first functional layer includes a first metal layer, and the first ink layer is disposed in a via hole of the first metal layer.
- the thickness of the first ink layer is less than the thickness of the first metal layer.
- the second functional layer includes a second metal layer and a second glue layer.
- the second metal layer is disposed between the substrate and the second glue layer.
- the second glue layer A via hole is formed, and the second ink layer is disposed in the via hole of the second glue layer.
- the thickness of the second ink layer is less than the thickness of the second glue layer.
- the material of the second metal layer includes copper.
- the display device further includes a cover plate and a driver chip, the cover plate is disposed on a side of the display panel away from the flexible circuit board, and the driver chip is connected to the flexible circuit board.
- the present application provides a display device; the display device includes a display panel and a flexible circuit board.
- the display panel includes a flat display area and at least one curved display area.
- the flexible circuit board is connected to the display panel in at least one curved display area.
- the flexible circuit board includes a first connection area connected to the display panel, a second connection area connected to the driver chip, and a bending area located between the first connection area and the second connection area, wherein the flexible circuit board includes a base, a first functional layer and The second functional layer, the base is disposed between the first functional layer and the second functional layer, the first functional layer and the second functional layer include a plurality of film layers, and at least three film layers in the first functional layer are formed with via holes , at least three film layers in the second functional layer are formed with via holes, and the projections of the via holes of every two layers in the first functional layer and the second functional layer on the substrate overlap, by connecting the first functional layer and the second functional layer Vias are formed in the second functional layer so that the part
- At least three layers of the first functional layer are formed with via holes
- at least three layers of the second functional layer are formed with via holes
- the projections of the respective via holes on the substrate overlap.
- a via hole is formed in the functional layer so that the part of the flexible circuit board located in the bending area is automatically bent by gravity, reducing the thickness of the flexible circuit board in the bending area, increasing the width of the via hole, and reducing the thickness of the flexible circuit board in the bending area.
- the elastic modulus makes the flexible circuit board automatically fall under the action of gravity, preventing the flexible circuit board from warping and causing interference and damaging the flexible circuit board.
- FIG. 1 is a schematic diagram of a display device provided by an embodiment of the present application.
- Figure 2 is a first schematic diagram of a flexible circuit board provided by an embodiment of the present application.
- Figure 3 is a schematic diagram of an existing four-curved display device.
- Figure 4 is a second schematic diagram of a flexible circuit board provided by an embodiment of the present application.
- Embodiments of the present application address the technical problem that existing four-curved display devices have a flexible circuit board that is warped, causing interference and damage to the flexible circuit board.
- a display device and a mobile terminal are provided to alleviate the above technical problem.
- the display device 3 includes:
- the display panel 21 includes a flat display area 241 and at least one curved display area 242;
- the flexible circuit board 1 is connected to the at least one curved display area 242.
- the flexible circuit board 1 includes a first connection area 151 connected to the display panel 21, a second connection area 152 connected to the driver chip 23, and a bending area 153 located between the first connecting area 151 and the second connecting area 152;
- the flexible circuit board 1 includes a base 11, a first functional layer 12 and a second functional layer 13.
- the base is disposed between the first functional layer 12 and the second functional layer 13.
- a functional layer 12 and the second functional layer 13 include a plurality of film layers. At least three film layers in the first functional layer 12 are formed with via holes 125. At least three film layers in the second functional layer 12 are formed with via holes 125.
- the via holes 135 are formed on the first functional layer 12 and the second functional layer 13 , and the projections of the via holes on the substrate of each two layers of the first functional layer 12 and the second functional layer 13 overlap (for example, the first anti-electromagnetic layer 124 is formed with a first via hole 135 ).
- the first protective layer 123 is formed with a second via hole 125b, and the projections of the first via hole 125a and the second via hole 125b on the substrate 11 overlap;
- the second anti-electromagnetic layer 134 is formed with a fifth via hole 135c,
- the second protective layer 133 is formed with a sixth via hole 135b.
- the projections of the fifth via hole 135c and the sixth via hole 135b on the substrate 11 overlap, and the projections of the first via hole 125a and the fifth via hole 135c on the substrate 11 overlap. (the projections overlap), via holes are formed in the first functional layer 12 and the second functional layer 13 so that the portion of the flexible circuit board 1 located in the bending area 153 is automatically bent by gravity.
- Embodiments of the present application provide a display device.
- the display device at least three layers of the first functional layer are formed with via holes, and at least three layers of the second functional layer are formed with via holes, and the projection of each via hole on the substrate exists.
- Overlapping by forming via holes in the first functional layer and the second functional layer, the part of the flexible circuit board located in the bending area is automatically bent by gravity, reducing the thickness of the flexible circuit board in the bending area and increasing the via hole
- the width reduces the elastic modulus of the flexible circuit board in the bending area, causing the flexible circuit board to automatically fall under the action of gravity, preventing the flexible circuit board from warping and causing interference and damaging the flexible circuit board.
- via holes in the first functional layer and the second functional layer so that the part of the flexible circuit board located in the bending area is automatically bent by gravity means that after the flexible circuit board is bound to the display panel, due to the At least three film layers of a functional layer are formed with via holes, at least three film layers of the second functional layer are formed with via holes, and the via holes of every two layers of the first functional layer and the second functional layer are on the substrate. There is overlap in the projection, and the flexible circuit board will fall downward under the action of its own gravity, showing that the part of the flexible circuit board located in the bending area is bent, and the part located in the second connection area falls.
- the width of the via hole of any film layer in the first functional layer is greater than the preset value
- the width of the via hole of any film layer in the second functional layer is greater than the preset value
- the preset value is the value when the flexible circuit board is automatically bent by gravity.
- the width of the via hole of any film layer in the first functional layer and the width of the via hole of any film layer in the second functional layer are greater than the same preset value.
- the preset value means that the flexible circuit can The value of the board that can automatically bend due to gravity. For example, the lower the thickness of the flexible circuit board, the larger the width of the via hole of the flexible circuit board, the smaller the stress required for bending of the flexible circuit board, that is, the greater the elastic modulus of the flexible circuit board. The smaller, the easier the flexible circuit board is to bend. Therefore, the preset value is determined according to the thickness of the bending area of the flexible circuit board and the width of the via hole.
- the elastic modulus of the flexible circuit board is reduced to the point where the flexible circuit board can automatically bend under gravity, then the default value can be 6 mm.
- the width of the via hole of the first functional layer is L1 and the width of the via hole of the second functional layer is L2.
- the flexible circuit board 34 is first bonded to the display panel 36, and then the display panel 36 and the four-curved cover plate 35 are bonded.
- the flexible circuit board 34 will warp. In the subsequent process, the flexible circuit board 34 will easily interfere with the machine or fixture, resulting in The flexible circuit board is damaged and the four-curved display device is prone to failure.
- the flexible circuit board has some areas (referred to as bending areas in this application) with a smaller thickness (because at least three of the first functional layers and at least three of the second functional layers are layer with via holes), so that the flexible circuit board only has one to three layers without via holes, and by making the width of the via holes located on both sides of the substrate larger, the elastic modulus of the flexible circuit board is smaller,
- the flexible circuit board has an area that is easy to bend. During the bonding process between the cover plate and the display panel, the flexible circuit board can automatically sag due to gravity, preventing the flexible circuit board from warping and causing interference and causing damage to the flexible circuit board.
- the projections of via holes on the substrate of every two layers in the first functional layer and the second functional layer overlap that is, the projections of any two layers in the first functional layer with via holes are overlapped.
- the projections of the via holes on the substrate overlap, so that the positions where the via holes are formed on the flexible circuit board overlap.
- the thickness of the flexible circuit board in the area of the via holes is relatively smaller, and the width of the via holes of the flexible circuit board is relatively smaller, which can further Reduce the elastic modulus of the flexible circuit board in the bending area and increase the possibility of the flexible circuit board automatically falling.
- a via hole of any one of the first functional layer and the second functional layer is provided in the bending area.
- the first functional layer includes:
- the first metal layer 121 is provided on one side of the substrate 11;
- the first glue layer 122 is provided on the side of the first metal layer 121 away from the substrate 11;
- the first protective layer 123 is provided on the side of the first glue layer 122 away from the first metal layer 121;
- the first anti-electromagnetic layer 124 is provided on the side of the first protective layer 123 away from the first adhesive layer 122;
- the first anti-electromagnetic layer 124 is formed with a first via hole 125a
- the first protective layer 123 is formed with a second via hole 125b
- the first glue layer 122 and the first metal layer 121 are At least one is formed with a via hole.
- the thickness of the circuit board in the bending area and increase the width of the via holes of the flexible circuit board in the bending area, reduce the stiffness of the flexible circuit board, so that the flexible circuit board will fall due to its own gravity, avoiding damage caused by interference of the flexible circuit board .
- the first anti-electromagnetic layer is formed with a first via hole
- the first protective layer is formed with a second via hole
- the first adhesive layer is formed with a third via hole.
- the first anti-electromagnetic layer is formed with a first via hole
- the first protective layer is formed with a second via hole
- the first metal layer is formed with a third via hole.
- the first adhesive layer can not form a via hole.
- the first metal layer can be etched to form a third via hole, and then the third via hole can be filled with a flexible material, and then a first glue layer can be prepared on the first metal layer and the flexible material.
- a first protective layer and a first anti-electromagnetic layer are prepared on a glue layer, and the first protective layer and the first anti-electromagnetic layer are etched to form first via holes and second via holes.
- the first electromagnetic shielding layer 124 is formed with a first via hole 125a
- the first protective layer 123 is formed with a second via hole 125b
- the first glue layer 122 is formed with a third via hole 125c
- the first metal layer 121 is formed with a fourth via hole 125d
- the width of the third via hole 125c is equal to the width of the fourth via hole 125d (for example, in Figure 2 L3)
- the width L3 of the third via hole 125c is smaller than the width L1 of the first via hole 125a
- the width L3 of the third via hole 125c is smaller than the width L1 of the second via hole 125b.
- each of the first functional layer By forming the first via hole on the first anti-electromagnetic layer, the second via hole on the first protective layer, the third via hole on the first glue layer, and the fourth via hole on the first metal layer, each of the first functional layer
- Each film layer will form via holes, thereby reducing the thickness of the flexible circuit board located in the bending area, and making the width of the third via hole equal to the width of the fourth via hole, and the width of the third via hole is smaller than the width of the first via hole.
- the width of the third via hole is smaller than the width of the second via hole, which allows the first adhesive layer and the first protective layer to retain part of the material in the bending area, and the retained material plays an insulating and anti-corrosion role for the first
- the metal layer protects the first functional layer from damage.
- the flexible circuit board 1 includes a first insulating part 122a and a second insulating part 123a disposed in the bending area 153, and the first insulating part 122a is disposed in the bending area 153.
- the material of the first insulating part 122a is the same as the material of the first glue layer 122
- the material of the second insulating part 123a is the same as the material of the first protective layer.
- the material of the layer 123 is the same, and the first insulating part 122a and the second insulating part 123a are disposed on a side close to the first connection area 151.
- the first insulating part and the second insulating part are provided to protect the first functional layer, part of the first glue layer and the first protective layer can be left during the etching process to obtain the first insulating part and the second insulating part. Since the first metal layer is formed with a via hole, the first insulating part and the second insulating part will fall, so that the first insulating part is actually arranged on the first metal layer and the second insulating part is arranged on the first adhesive layer, but the first The insulating part is the falling part of the first glue layer, and the second insulating part is the falling part of the first protective layer, so as to reduce the process and improve the preparation efficiency.
- the second functional layer 13 includes:
- the second metal layer 131 is provided on the side of the base 11 away from the first functional layer 12;
- the second glue layer 132 is provided on the side of the second metal layer 131 away from the substrate 11;
- the second protective layer 133 is provided on the side of the second glue layer 132 away from the second metal layer 131;
- the second anti-electromagnetic layer 134 is provided on the side of the second protective layer 133 away from the second adhesive layer 132;
- the second anti-electromagnetic layer 134 is formed with a fifth via hole 135c
- the second protective layer 133 is formed with a sixth via hole 135b
- the second glue layer 132 and the second metal layer 131 are At least one is formed with a via hole.
- the second glue layer forms a fifth via hole
- the second protective layer forms a sixth via hole
- at least one of the second glue layer and the second metal layer forms a via hole, so that the thickness of the flexible circuit board in the bending area is smaller.
- the width of the via hole in the bending area is larger, which reduces the stiffness of the flexible circuit board, causing the flexible circuit board to fall due to its own gravity, preventing the flexible circuit board from being damaged due to interference.
- the second glue layer 132 is formed with a seventh via hole 135a
- the width of the fifth via hole 135c is equal to the width of the sixth via hole 135b
- the The width of the fifth via hole 135c is equal to the width of the seventh via hole 135a.
- the width of the via hole in the second functional layer is greater than or equal to the width of the via hole in the first functional layer. Since no via holes are formed in the second metal layer in the second functional layer, the width of the via holes in the second functional layer is greater than or equal to the width of the via holes in the first functional layer, further reducing the stiffness of the flexible circuit board, causing the The flexible circuit board falls due to its own gravity to prevent the flexible circuit board from being damaged due to interference.
- the second glue layer 132 is formed with a seventh via hole 135a
- the second metal layer 131 is formed with an eighth via hole 135d
- the seventh via hole 135a The width of is equal to the width of the eighth via hole 135d (both L4 in Figure 4)
- the width L4 of the seventh via hole 135a is smaller than the width L2 of the fifth via hole 135c
- the seventh via hole 135a The width L4 is smaller than the width L2 of the sixth via hole 135b.
- each of the second functional layer Each film layer will form via holes, thereby reducing the thickness of the flexible circuit board located in the bending area, and making the width of the seventh via hole equal to the width of the eighth via hole, and the width of the seventh via hole is smaller than the width of the eighth via hole.
- width, the width of the seventh via hole is smaller than the width of the eighth via hole, which allows the second adhesive layer and the second protective layer to retain part of the material in the bending area, and the retained material plays an insulating and anti-corrosion role.
- the metal layer protects the second functional layer from damage.
- the flexible circuit board 1 includes a third insulating part 132a and a fourth insulating part 133a disposed in the bending area 153.
- the third insulating part 132a is disposed in the bending area 153.
- the material of the third insulating part 132a is the same as the material of the second glue layer 132
- the material of the fourth insulating part 133a is the same as the material of the second protective layer.
- the layers 133 are made of the same material, and the third insulating part 132a and the fourth insulating part 133a are disposed on a side close to the first connection area 151.
- the third insulating part and the fourth insulating part are provided to protect the second functional layer, part of the second adhesive layer and the second protective layer can be retained during the etching process to obtain the third insulating part and the fourth insulating part. Since the second metal layer is formed with a via hole, the third insulating part and the fourth insulating part will fall, so that the third insulating part is actually arranged on the second metal layer and the fourth insulating part is arranged on the second adhesive layer, but the third The insulating part is the falling part of the second glue layer, and the fourth insulating part is the falling part of the second protective layer, so as to reduce the process and improve the preparation efficiency.
- the widths of at least two vias in the first functional layer are unequal, the widths of each via in the second functional layer are equal, and the widths of the vias in the second functional layer are equal.
- the width of the hole is equal to the maximum width of the via hole in the first functional layer.
- the width of the via holes will be made as large as possible to minimize the elastic modulus of the flexible circuit board.
- the first metal layer in the first functional layer will form over holes, so the first metal layer needs to be protected, so that the width of the via holes in the first functional layer will be inconsistent, and the second functional layer will not open holes to the second metal layer, so the second functional layer can be
- the openings are larger than the openings of the first functional layer, but considering that if the openings of the second functional layer are not opened in the first functional layer, the change in the elastic modulus of the flexible circuit board will be small, so that the second The width of the via hole in the functional layer is equal to the maximum width of the via hole in the first functional layer.
- the width of the seven via holes 135a is L2
- the width of the first via hole 125a of the first anti-electromagnetic layer 124 and the second via hole 125b of the first protective layer 123 in the first functional layer 12 is L1.
- the width of the third via hole 125c of the layer 122 and the fourth via hole 125d of the first metal layer 121 is L3.
- L3 is smaller than L1, and in order to The elastic modulus of the flexible circuit board is reduced, and excessively large via holes are prevented from affecting the normal via holes of the flexible circuit board. Therefore, L2 is made equal to the maximum width L1 of the first functional layer 12 .
- the width of the via hole in the second functional layer is greater than 6 mm, that is, the preset value can be 6 mm.
- the proportion of upturned flexible circuit boards can be reduced to 0, that is, the maximum width of the via hole in the first functional layer is equal to the width of the via hole in the second functional layer, and the via hole in the second functional layer is
- the width is greater than 6 mm, the proportion of the flexible circuit board automatically falling due to gravity is 100%, while the upward warping proportion of the flexible circuit board in the current four-curved display device is 70%.
- the flexible circuit board of this application is compared with the current flexible circuit
- the upturn ratio of the board is reduced by 70%, and the upturn ratio of the flexible circuit board of the present application is 0, which solves the problem of damage caused by interference when the flexible circuit board is upturned, and improves the yield rate of the display device.
- the width of the via hole in the second functional layer is less than 10 mm. In order to prevent the width of the via hole from affecting the packaging, space, and circuit settings of the flexible circuit board, the width of the via hole is set to less than 10 mm.
- the flexible circuit board 1 further includes an ink layer 14.
- the ink layer 14 includes a first ink layer 141 and a second ink layer 142.
- the first ink layer 141 The second ink layer 142 is disposed in the via hole 125 of the first functional layer 12
- the second ink layer 142 is disposed in the via hole 135 of the second functional layer 13 .
- the first functional layer includes a first metal layer, and the first ink layer is disposed in a via hole of the first metal layer, so that the first ink layer is disposed in a via hole of the first metal layer. In the hole, the first ink layer can protect the first metal layer from water and oxygen intrusion.
- the thickness of the first ink layer is smaller than the thickness of the first metal layer.
- the first functional layer includes:
- a first metal layer disposed on one side of the substrate
- a first glue layer is provided on the side of the first metal layer away from the substrate;
- a first protective layer is provided on the side of the first adhesive layer away from the first metal layer;
- a first anti-electromagnetic layer is provided on the side of the first protective layer away from the first adhesive layer;
- the first anti-electromagnetic layer is formed with a first via hole
- the first protective layer is formed with a second via hole
- the first glue layer is formed with a third via hole
- the first metal layer is formed with a A fourth via hole
- the width of the third via hole is equal to the width of the fourth via hole
- the width of the third via hole is smaller than the width of the first via hole
- the width of the third via hole is smaller than The width of the second via hole
- the flexible circuit board includes a first insulating part and a second insulating part disposed in the bending area
- the first insulating part is disposed between the second insulating part and the base
- the material of the first insulating part is the same as the material of the first glue layer
- the material of the second insulating part is the same as the material of the first protective layer
- the first insulating part and the first protective layer are made of the same material.
- the second insulating part is disposed on a side close to the first connection area, and the first ink layer is disposed adjacent to the first insulating part.
- the first functional layer is protected by the first insulating part, the second insulating part and the first ink layer to avoid water and oxygen intrusion or corrosion, and to prevent the electrical properties of the flexible circuit board from being affected.
- the second functional layer includes a second metal layer and a second glue layer.
- the second metal layer is disposed between the substrate and the second glue layer.
- the second glue layer is formed with a via hole.
- the second ink layer is disposed on the second In the via hole of the glue layer, the second ink layer is disposed in the via hole of the second glue layer, so that the second ink layer covers the second metal layer, so that the second ink layer can protect the second metal layer , to prevent water and oxygen intrusion from affecting the electrical properties of the flexible circuit board.
- the thickness of the second ink layer is smaller than the thickness of the second glue layer.
- the material of the first metal layer includes copper.
- the material of the second metal layer includes copper.
- the material of the first protective layer includes polyimide.
- the material of the second protective layer includes polyimide.
- the material of the substrate includes polyimide.
- the display device 3 further includes a cover plate 22 and a driver chip 23 .
- the cover plate 22 is disposed on the side of the display panel 21 away from the flexible circuit board 1 .
- the driver chip 23 is connected to the flexible circuit board 1 .
- An embodiment of the present application provides a display device; the display device includes a display panel and a flexible circuit board.
- the display panel includes a flat display area and at least one curved display area.
- the flexible circuit board is connected to the display panel in at least one curved display area.
- the flexible circuit The board includes a first connection area connected to the display panel, a second connection area connected to the driver chip, and a bending area located between the first connection area and the second connection area, wherein the flexible circuit board includes a base, a first function layer and a second functional layer, the substrate is disposed between the first functional layer and the second functional layer, the first functional layer and the second functional layer include a plurality of film layers, and at least three film layers in the first functional layer are formed with Via holes, at least three film layers in the second functional layer are formed with via holes, and the projections of the via holes of every two layers in the first functional layer and the second functional layer on the substrate overlap, through the first functional layer and forming via holes in the second functional layer so that the part of the flexible circuit board located in the bending area is automatically bent by gravity.
- At least three layers of the first functional layer are formed with via holes
- at least three layers of the second functional layer are formed with via holes
- the projections of the respective via holes on the substrate overlap.
- a via hole is formed in the functional layer so that the part of the flexible circuit board located in the bending area is automatically bent by gravity, reducing the thickness of the flexible circuit board in the bending area, increasing the width of the via hole, and reducing the thickness of the flexible circuit board in the bending area.
- the elastic modulus makes the flexible circuit board automatically fall under the action of gravity, preventing the flexible circuit board from warping and causing interference and damaging the flexible circuit board.
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Abstract
一种显示装置（3），通过使第一功能层（12）的至少三层形成过孔（125），第二功能层（13）中的至少三层形成过孔（135），且各过孔在基底（11）上的投影存在重合，通过在第一功能层（12）和第二功能层（13）中形成过孔以使得柔性电路板（1）位于弯曲区（153）的部分受到重力自动弯折，避免柔性电路板（1）上翘出现干涉损伤柔性电路板（1）。
Description
本申请涉及显示技术领域，尤其是涉及一种显示装置。
现有显示器件为了提高屏占比，会设计曲面显示器件，通过对显示器件的边框进行弯折实现无边框显示。例如现有的四曲面显示器件会通过将各边框向下向后弯折，使得四曲面显示器件实现无边框。但在显示器件的制备过程中，由于柔性电路板设置在下边框处，在进行显示面板和盖板的贴合时，会导致柔性电路板翘起，在后续制程中出现干涉，导致损伤柔性电路板，从而导致柔性电路板失效。
所以，现有四曲面显示器件存在柔性电路板翘起导致柔性电路板出现干涉受到损伤的技术问题。
本申请实施例提供一种显示装置，用以缓解现有四曲面显示器件存在柔性电路板翘起导致柔性电路板出现干涉受到损伤的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请实施例提供一种显示装置，该显示装置包括：
显示面板，包括平面显示区和至少一曲面显示区；
柔性电路板，与所述至少一曲面显示区连接，所述柔性电路板包括与所述显示面板连接的第一连接区、与驱动芯片连接的第二连接区，以及位于所述第一连接区和所述第二连接区之间的弯曲区；
其中，所述柔性电路板包括基底、第一功能层和第二功能层，所述基底设置于所述第一功能层和所述第二功能层之间，所述第一功能层和所述第二功能层包括多个膜层，所述第一功能层中的至少三个膜层形成有过孔，所述第二功能层中的至少三个膜层形成有过孔，且所述第一功能层和所述第二功能层中每两层的过孔在基底上的投影存在重合，通过在所述第一功能层和所述第二功能层中形成过孔以使得所述柔性电路板位于所述弯曲区的部分受到重力自动弯折。
在一些实施例中，所述第一功能层包括：
第一金属层，设置于所述基底一侧；
第一胶层，设置于所述第一金属层远离所述基底的一侧；
第一保护层，设置于所述第一胶层远离所述第一金属层的一侧；
第一防电磁层，设置于所述第一保护层远离所述第一胶层的一侧；
其中，所述第一防电磁层形成有第一过孔，所述第一保护层形成有第二过孔，所述第一胶层和所述第一金属层中的至少一个形成有过孔。
在一些实施例中，所述第一胶层形成有第三过孔，所述第一金属层形成有第四过孔，所述第三过孔的宽度等于所述第四过孔的宽度，所述第三过孔的宽度小于所述第一过孔的宽度，所述第三过孔的宽度小于所述第二过孔的宽度。
在一些实施例中，所述柔性电路板包括设置于所述弯曲区的第一绝缘部分和第二绝缘部分，所述第一绝缘部分设置于所述第二绝缘部分与所述基底之间，所述第一绝缘部分的材料与所述第一胶层的材料相同，所述第二绝缘部分的材料与所述第一保护层的材料相同，且所述第一绝缘部分和所述第二绝缘部分设置于靠近所述第一连接区的一侧。
在一些实施例中，所述第二功能层包括：
第二金属层，设置于所述基底远离所述第一功能层的一侧；
第二胶层，设置于所述第二金属层远离所述基底的一侧；
第二保护层，设置于所述第二胶层远离所述第二金属层的一侧；
第二防电磁层，设置于所述第二保护层远离所述第二胶层的一侧；
其中，所述第二防电磁层形成有第五过孔，所述第二保护层形成有第六过孔，所述第二胶层和所述第二金属层中的至少一个形成有过孔。
在一些实施例中，所述第二胶层形成有第七过孔，所述第五过孔的宽度等于所述第六过孔的宽度，所述第五过孔的宽度等于所述第七过孔的宽度。
在一些实施例中，所述第二功能层中的过孔的宽度大于或者等于所述第一功能层中的过孔的宽度。
在一些实施例中，所述第二胶层形成有第七过孔，所述第二金属层形成有第八过孔，所述第七过孔的宽度等于所述第八过孔的宽度，所述第七过孔的宽度小于所述第五过孔的宽度，所述第七过孔的宽度小于所述第六过孔的宽度。
在一些实施例中，所述柔性电路板包括设置于所述弯曲区的第三绝缘部分和第四绝缘部分，所述第三绝缘部分设置于所述第四绝缘部分和所述基底之间，所述第三绝缘部分的材料与所述第二胶层的材料相同，所述第四绝缘部分的材料与所述第二保护层的材料相同，且所述第三绝缘部分和所述第四绝缘部分设置于靠近所述第一连接区的一侧。
在一些实施例中，所述第一功能层中的至少两个过孔的宽度不相等，所述第二功能层中的各过孔的宽度相等，且所述第二功能层中的过孔的宽度等于所述第一功能层中的过孔的最大宽度。
在一些实施例中，所述第二功能层中的过孔的宽度大于6毫米。
在一些实施例中，所述第二功能层中的过孔的宽度小于10毫米。
在一些实施例中，所述第一功能层和所述第二功能层中的任一膜层的过孔设置于所述弯曲区。
在一些实施例中，所述柔性电路板还包括油墨层，所述油墨层包括第一油墨层和第二油墨层，所述第一油墨层设置于所述第一功能层的过孔内，所述第二油墨层设置于所述第二功能层的过孔内。
在一些实施例中，所述第一功能层包括第一金属层，所述第一油墨层设置于所述第一金属层的过孔内。
在一些实施例中，所述第一油墨层的厚度小于所述第一金属层的厚度。
在一些实施例中，所述第二功能层包括第二金属层和第二胶层，所述第二金属层设置于所述基底和所述第二胶层之间，所述第二胶层形成有过孔，所述第二油墨层设置于所述第二胶层的过孔内。
在一些实施例中，所述第二油墨层的厚度小于所述第二胶层的厚度。
在一些实施例中，所述第二金属层的材料包括铜。
在一些实施例中，所述显示装置还包括盖板和驱动芯片，所述盖板设置于所述显示面板远离所述柔性电路板的一侧，所述驱动芯片与所述柔性电路板连接。
本申请提供一种显示装置；该显示装置包括显示面板和柔性电路板，显示面板包括平面显示区和至少一曲面显示区，柔性电路板在至少一曲面显示区与显示面板连接，柔性电路板包括与显示面板连接的第一连接区、与驱动芯片连接的第二连接区，以及位于第一连接区和第二连接区之间的弯曲区，其中，柔性电路板包括基底、第一功能层和第二功能层，基底设置于第一功能层和第二功能层之间，第一功能层和第二功能层包括多个膜层，第一功能层中的至少三个膜层形成有过孔，第二功能层中的至少三个膜层形成有过孔，且第一功能层和第二功能层中每两层的过孔在基底上的投影存在重合，通过在第一功能层和第二功能层中形成过孔以使得柔性电路板位于弯曲区的部分受到重力自动弯折。本申请通过使第一功能层的至少三层形成过孔，第二功能层中的至少三层形成过孔，且各过孔在基底上的投影存在重合，通过在第一功能层和第二功能层中形成过孔以使得柔性电路板位于弯曲区的部分受到重力自动弯折，减小了弯曲区的柔性电路板的厚度，增大了过孔的宽度，减小了弯曲区柔性电路板的弹性模量，使得在重力作用下柔性电路板自动出现下坠，避免柔性电路板上翘出现干涉损伤柔性电路板。
图1为本申请实施例提供的显示装置的示意图。
图2为本申请实施例提供的柔性电路板的第一种示意图。
图3为现有四曲面显示器件的示意图。
图4为本申请实施例提供的柔性电路板的第二种示意图。
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例针对现有四曲面显示器件存在柔性电路板翘起导致柔性电路板出现干涉受到损伤的技术问题，提供一种显示装置和移动终端，用以缓解上述技术问题。
如图1、图2所示，本申请实施例提供一种显示装置，该显示装置3包括：
显示面板21，包括平面显示区241和至少一曲面显示区242；
柔性电路板1，与所述至少一曲面显示区242连接，所述柔性电路板1包括与所述显示面板21连接的第一连接区151、与驱动芯片23连接的第二连接区152，以及位于所述第一连接区151和所述第二连接区152之间的弯曲区153；
其中，所述柔性电路板1包括基底11、第一功能层12和第二功能层13，所述基底设置于所述第一功能层12和所述第二功能层13之间，所述第一功能层12和所述第二功能层13包括多个膜层，所述第一功能层12中的至少三个膜层形成有过孔125，所述第二功能层中的至少三个膜层形成有过孔135，且所述第一功能层12和所述第二功能层13中每两层的过孔在基底上的投影存在重合（例如第一防电磁层124形成有第一过孔125a，第一保护层123形成有第二过孔125b，第一过孔125a和第二过孔125b在基底11上的投影存在重合；第二防电磁层134形成有第五过孔135c，第二保护层133形成有第六过孔135b，第五过孔135c和第六过孔135b在基底11上的投影存在重合，且第一过孔125a和第五过孔135c在基底11上的投影存在重合），通过在所述第一功能层12和所述第二功能层13中形成过孔以使得所述柔性电路板1位于所述弯曲区153的部分受到重力自动弯折。
本申请实施例提供一种显示装置，该显示装置通过使第一功能层的至少三层形成过孔，第二功能层中的至少三层形成过孔，且各过孔在基底上的投影存在重合，通过在第一功能层和第二功能层中形成过孔以使得柔性电路板位于弯曲区的部分受到重力自动弯折，减小了弯曲区的柔性电路板的厚度，增大了过孔的宽度，减小了弯曲区柔性电路板的弹性模量，使得在重力作用下柔性电路板自动出现下坠，避免柔性电路板上翘出现干涉损伤柔性电路板。
需要说明的是，通过在第一功能层和第二功能层中形成过孔以使得柔性电路板位于弯曲区的部分受到重力自动弯折是指在柔性电路板与显示面板绑定后，由于第一功能层的至少三个膜层形成有过孔、第二功能层的至少三个膜层形成有过孔，且第一功能层和第二功能层中每两层的过孔在基底上的投影存在重合，柔性电路板在自身重力的作用下会向下坠，呈现为柔性电路板位于弯曲区的部分弯折，位于第二连接区的部分下坠。
在一种实施例中，所述第一功能层中任一膜层的过孔的宽度大于预设值，所述第二功能层中任一膜层的过孔的宽度大于所述预设值，所述预设值为所述柔性电路板受重力自动弯折时的数值。
需要说明的是，第一功能层中的任一膜层的过孔的宽度与第二功能层中的任意膜层的过孔的宽度大于同一预设值，预设值是指够使柔性电路板能够受重力自动弯折的数值，例如柔性电路板的厚度越低、柔性电路板的过孔的宽度越大，柔性电路板弯曲所需的应力越小，即柔性电路板的弹性模量越小，柔性电路板越容易弯曲，因此，预设值根据柔性电路板的弯曲区的厚度和过孔的宽度决定，在柔性电路板的膜层形成过孔时，例如第一功能层的过孔的宽度为6毫米时，柔性电路板的弹性模量减小至柔性电路板能够受重力自动弯折，则预设值可以为6毫米。
需要说明的是，如图2所示，第一功能层的过孔的宽度为L1、第二功能层过孔的宽度为L2。
具体的，如图3所示，当前四曲面柔性显示器件中，柔性电路板34先与显示面板36贴合，然后会将显示面板36与四曲面盖板35贴合，在显示面板36与四曲面盖板35贴合时，由于柔性电路板的弹性模量较大，导致柔性电路板34会出现翘曲，在后续制程中，柔性电路板34容易与机台或者治具等产生干涉，导致柔性电路板出现损伤，四曲面显示器件容易失效。
而在本申请实施例提供的显示装置中，由于柔性电路板存在部分区域（本申请中以弯曲区指代）厚度较小（由于第一功能层中至少三层和第二功能层中至少三层形成过孔），使得柔性电路板的存在仅有一层至三层未形成过孔的区域，且通过使得位于基底两侧的过孔的宽度较大，柔性电路板的弹性模量较小，使得柔性电路板存在容易弯曲的区域，在盖板与显示面板的贴合过程中，能够使柔性电路板因重力自动下垂，避免柔性电路板上翘出现干涉导致柔性电路板出现损伤。
在本申请实施例中，所述第一功能层和所述第二功能层中每两层的过孔在基底上的投影存在重合，即第一功能层中形成有过孔的任意两层的过孔在基底上的投影存在重合，第二功能层中形成有过孔的任意两层的过孔在基底上的投影存在重合，且所述第一功能层中形成有过孔的膜层的过孔与所述第二功能层中形成有过孔的膜层的过孔在所述基底上的投影存在重合，通过使得第一功能层的过孔在基底上的投影与第二功能层的过孔在基底上的投影重合，使得柔性电路板形成有过孔的位置重合，柔性电路板在过孔的区域的厚度相对更小，且柔性电路板的过孔的宽度相对更小，能进一步的减小弯曲区的柔性电路板的弹性模量，提高柔性电路板自动下坠的可能性。
在一种实施例中，所述第一功能层和所述第二功能层中的任一膜层的过孔设置于所述弯曲区。通过将第一功能层和第二功能层中的任一膜层的过孔设置在弯曲区，使得柔性电路板能够从弯曲区自动下坠，避免柔性电路板上翘出现干涉损伤柔性电路板，且柔性电路板与显示面板和驱动芯片连接的部分能够正常设置，避免出现弯曲导致受损。
在一种实施例中，如图2所示，所述第一功能层包括：
第一金属层121，设置于所述基底11一侧；
第一胶层122，设置于所述第一金属层121远离所述基底11的一侧；
第一保护层123，设置于所述第一胶层122远离所述第一金属层121的一侧；
第一防电磁层124，设置于所述第一保护层123远离所述第一胶层122的一侧；
其中，所述第一防电磁层124形成有第一过孔125a，所述第一保护层123形成有第二过孔125b，所述第一胶层122和所述第一金属层121中的至少一个形成有过孔。通过将第一防电磁层和第一保护层形成过孔，将第一胶层和第一保护层中的至少一个形成过孔，使得第一功能层在弯曲区的厚度较小，减小柔性电路板在弯曲区的厚度，并增大柔性电路板在弯曲区的过孔的宽度，减小柔性电路板的挺性，使柔性电路板会因自身重力下坠，避免柔性电路板出现干涉导致损伤。
具体的，所述第一防电磁层形成有第一过孔，所述第一保护层形成有第二过孔，所述第一胶层形成有第三过孔，通过使第一防电磁层、第一保护层和第一胶层形成过孔，使得柔性电路板在弯曲区的厚度较小，减小柔性电路板的挺性，使柔性电路板会因自身重力下坠，避免柔性电路板出现干涉导致损伤。
具体的，所述第一防电磁层形成有第一过孔，所述第一保护层形成有第二过孔，所述第一金属层形成有第三过孔，通过使第一防电磁层、第一保护层和第一金属层形成过孔，使得柔性电路板在弯曲区的厚度较小，减小柔性电路板的挺性，使柔性电路板会因自身重力下坠，避免柔性电路板出现干涉导致损伤。
具体的，在第一防电磁层形成第一过孔、第一保护层形成第二过孔、第一金属层形成第三过孔时，可以使第一胶层不形成过孔，具体的，可以在形成第一金属层后对第一金属层刻蚀形成第三过孔，然后在第三过孔内填充柔性材料，然后在第一金属层和柔性材料上制备第一胶层，在第一胶层上制备第一保护层和第一防电磁层，并对第一保护层和第一防电磁层刻蚀形成第一过孔和第二过孔。
针对第一功能层中的三个膜层形成过孔仍然存在柔性电路板的弯曲区的厚度较大的问题。在一种实施例中，如图2所示，所述第一防电磁层124形成有第一过孔125a、所述第一保护层123形成有第二过孔125b、所述第一胶层122形成有第三过孔125c，所述第一金属层121形成有第四过孔125d，所述第三过孔125c的宽度等于所述第四过孔125d的宽度（例如图2中均为L3），且所述第三过孔125c的宽度L3小于所述第一过孔125a的宽度L1，所述第三过孔125c的宽度L3小于所述第二过孔125b的宽度L1。通过使第一防电磁层形成第一过孔、第一保护层形成第二过孔、第一胶层形成第三过孔、第一金属层形成第四过孔，使得第一功能层中各膜层均会形成过孔，从而减小位于弯曲区的柔性电路板的厚度，且使得第三过孔的宽度等于第四过孔的宽度，且第三过孔的宽度小于第一过孔的宽度，第三过孔的宽度小于第二过孔的宽度，可以使得第一胶层和第一保护层在弯曲区留存部分材料，通过留存的材料起到绝缘和防腐蚀的作用，对第一金属层进行保护，避免第一功能层损伤。
在一种实施例中，如图2所示，所述柔性电路板1包括设置于所述弯曲区153的第一绝缘部分122a和第二绝缘部分123a，所述第一绝缘部分122a设置于所述第二绝缘部分123a与所述基底11之间，所述第一绝缘部分122a的材料与所述第一胶层122的材料相同，所述第二绝缘部分123a的材料与所述第一保护层123的材料相同，且所述第一绝缘部分122a和所述第二绝缘部分123a设置于靠近所述第一连接区151的一侧。在设置第一绝缘部分和第二绝缘部分对第一功能层进行保护时，可以使第一胶层和第一保护层在刻蚀过程中留存一部分，得到第一绝缘部分和第二绝缘部分，由于第一金属层形成有过孔，第一绝缘部分和第二绝缘部分会下落，使得实际上第一绝缘部分设置在第一金属层、第二绝缘部分设置在第一胶层，但第一绝缘部分为第一胶层下落部分、第二绝缘部分为第一保护层下落部分，以减少工艺，提高制备效率。
针对当前显示器件的第二功能层的过孔的宽度较小导致柔性电路板的挺性较大，出现柔性电路板上翘受损的问题。在一种实施例中，如图2所示，所述第二功能层13包括：
第二金属层131，设置于所述基底11远离所述第一功能层12的一侧；
第二胶层132，设置于所述第二金属层131远离所述基底11的一侧；
第二保护层133，设置于所述第二胶层132远离所述第二金属层131的一侧；
第二防电磁层134，设置于所述第二保护层133远离所述第二胶层132的一侧；
其中，所述第二防电磁层134形成有第五过孔135c，所述第二保护层133形成有第六过孔135b，所述第二胶层132和所述第二金属层131中的至少一个形成有过孔。通过使第二胶层形成第五过孔，第二保护层形成第六过孔，第二胶层和第二金属层中的至少一个形成过孔，使得柔性电路板在弯曲区的厚度较小，且在弯曲区的过孔的宽度较大，使得柔性电路板的挺性减小，使柔性电路板会因自身重力下坠，避免柔性电路板出现干涉导致损伤。
在一种实施例中，如图2所示，所述第二胶层132形成有第七过孔135a，所述第五过孔135c的宽度等于所述第六过孔135b的宽度，所述第五过孔135c的宽度等于所述第七过孔135a的宽度。通过使第二胶层、第二保护层和第二防电磁层的过孔的宽度相等，使得第二功能层中的各层的过孔的宽度较大，从而增大位于弯曲区的柔性电路板的过孔的宽度，减小柔性电路板的挺性，使柔性电路板会因自身重力下坠，避免柔性电路板出现干涉导致损伤。
在一种实施例中，所述第二功能层中的过孔的宽度大于或者等于所述第一功能层中过孔的宽度。由于第二功能层中第二金属层未形成过孔，使第二功能层中的过孔的宽度大于或者等于第一功能层中过孔的宽度，进一步减小柔性电路板的挺性，使柔性电路板因自身重力下坠，避免柔性电路板出现干涉导致损伤。
针对第二功能层中的三个膜层形成过孔仍然存在柔性电路板的弯曲区的厚度较大的问题。在一种实施例中，如图4所示，所述第二胶层132形成有第七过孔135a，所述第二金属层131形成有第八过孔135d，所述第七过孔135a的宽度等于所述第八过孔135d的宽度（图4中均为L4），所述第七过孔135a的宽度L4小于所述第五过孔135c的宽度L2，所述第七过孔135a的宽度L4小于所述第六过孔135b的宽度L2。通过使第二防电磁层形成第五过孔、第二保护层形成第六过孔、第二胶层形成第七过孔、第二金属层形成第八过孔，使得第二功能层中各膜层均会形成过孔，从而减小位于弯曲区的柔性电路板的厚度，且使得第七过孔的宽度等于第八过孔的宽度，且第七过孔的宽度小于第八过孔的宽度，第七过孔的宽度小于第八过孔的宽度，可以使得第二胶层和第二保护层在弯曲区留存部分材料，通过留存的材料起到绝缘和防腐蚀的作用，对第二金属层进行保护，避免第二功能层损伤。
在一种实施例中，如图4所示，所述柔性电路板1包括设置于所述弯曲区153的第三绝缘部分132a和第四绝缘部分133a，所述第三绝缘部分132a设置于所述第四绝缘部分133a和所述基底11之间，所述第三绝缘部分132a的材料与所述第二胶层132的材料相同，所述第四绝缘部分133a的材料与所述第二保护层133的材料相同，且所述第三绝缘部分132a和所述第四绝缘部分133a设置于靠近所述第一连接区151的一侧。在设置第三绝缘部分和第四绝缘部分对第二功能层进行保护时，可以使第二胶层和第二保护层在刻蚀过程中留存一部分，得到第三绝缘部分和第四绝缘部分，由于第二金属层形成有过孔，第三绝缘部分和第四绝缘部分会下落，使得实际上第三绝缘部分设置在第二金属层、第四绝缘部分设置在第二胶层，但第三绝缘部分为第二胶层下落部分、第四绝缘部分为第二保护层下落部分，以减少工艺，提高制备效率。
在一种实施例中，所述第一功能层中的至少两个过孔的宽度不相等，所述第二功能层中的各过孔的宽度相等，且所述第二功能层中的过孔的宽度等于所述第一功能层中的过孔的最大宽度。通过使得第二功能层的过孔的宽度大于第一功能层的宽度，使得位于弯曲区的柔性电路板的过孔的宽度较大，从而可以减小柔性电路板的挺性，使柔性电路板会因自身重力下坠，避免柔性电路板出现干涉导致损伤。使得第一功能层的部分膜层留存一部分，对第一功能层进行保护，避免第一功能层出现损伤。
具体的，在柔性电路板上设置过孔时，会尽量使得过孔的宽度较大，以尽量减小柔性电路板的弹性模量，但由于第一功能层中的第一金属层会形成过孔，因此需要对第一金属层进行保护，使得第一功能层中的过孔的宽度会存在不一致，而第二功能层不会对第二金属层开孔，因此，可以使第二功能层的开孔大于第一功能层的开孔，但考虑到如果第二功能层的开孔处第一功能层未开孔，对柔性电路板的弹性模量的改变较小，因此，使得第二功能层的过孔的宽度等于所述第一功能层中的过孔的最大宽度。
具体的，如图2所示，可以看到第二功能层13中第二防电磁层134的第五过孔135c、第二保护层133的第六过孔135b、第二胶层132的第七过孔135a的宽度均为L2，而第一功能层12中的第一防电磁层124的第一过孔125a和第一保护层123的第二过孔125b的宽度为L1，第一胶层122的第三过孔125c和第一金属层121的第四过孔125d的宽度为L3，由于第一金属层和第一胶层在弯曲区设有绝缘材料，因此L3小于L1，而为了减小柔性电路板的弹性模量，且避免过孔过大影响柔性电路板的正常过孔，因此，使得L2等于第一功能层12的最大宽度L1。
具体的，第二功能层中的过孔的宽度大于6毫米，即使得预设值可以为6毫米，通过使第一功能层和第二功能层中的过孔的宽度大于6毫米，在制备显示器件时，可以使得柔性电路板出现上翘的比例降为0，即在第一功能层的过孔的最大宽度等于第二功能层的过孔的宽度，且第二功能层的过孔的宽度大于6毫米时，柔性电路板受重力自动下坠的比例为100%，而当前四曲面显示器件中柔性电路板的上翘比例为70%，即本申请的柔性电路板相较于当前柔性电路板的上翘比例下降70%，且本申请的柔性电路板的上翘比例为0，解决了柔性电路板上翘出现干涉导致损伤的问题，提高了显示器件的良率。
在一种实施例中，第二功能层的过孔的宽度小于10毫米，为了避免过孔的宽度影响柔性电路板的封装、空间、电路设置，过孔的宽度设置为小于10毫米。
针对柔性电路板形成过孔会导致水氧入侵的问题。在一种实施例中，如图2所示，所述柔性电路板1还包括油墨层14，所述油墨层14包括第一油墨层141和第二油墨层142，所述第一油墨层141设置于所述第一功能层12的过孔125内，所述第二油墨层142设置于所述第二功能层13的过孔135内。通过在第一功能层和第二功能层的过孔内分别设置第一油墨层和第二油墨层，使得第一油墨层和第二油墨层可以对水氧进行阻隔，避免水氧入侵影响柔性电路板的电性。
具体的，所述第一功能层包括第一金属层，所述第一油墨层设置于所述第一金属层的过孔内，通过使得第一油墨层设置于所述第一金属层的过孔内，使得第一油墨层可以保护第一金属层，避免水氧入侵。
具体的，第一油墨层的厚度小于第一金属层的厚度，通过使得第一油墨层的厚度小于第一金属层的厚度，避免第一油墨层的厚度过大影响柔性电路板的挺性，使得柔性电路板可以受自身重力下坠，避免柔性电路板出现干涉导致损伤。
在一种实施例中，所述第一功能层包括：
第一金属层，设置于所述基底一侧；
第一胶层，设置于所述第一金属层远离所述基底的一侧；
第一保护层，设置于所述第一胶层远离所述第一金属层的一侧；
第一防电磁层，设置于所述第一保护层远离所述第一胶层的一侧；
其中，所述第一防电磁层形成有第一过孔，所述第一保护层形成有第二过孔，所述第一胶层形成有第三过孔，所述第一金属层形成有第四过孔，所述第三过孔的宽度等于所述第四过孔的宽度，所述第三过孔的宽度小于所述第一过孔的宽度，所述第三过孔的宽度小于所述第二过孔的宽度，所述柔性电路板包括设置于所述弯曲区的第一绝缘部分和第二绝缘部分，所述第一绝缘部分设置于所述第二绝缘部分与所述基底之间，所述第一绝缘部分的材料与所述第一胶层的材料相同，所述第二绝缘部分的材料与所述第一保护层的材料相同，且所述第一绝缘部分和所述第二绝缘部分设置于靠近所述第一连接区的一侧，所述第一油墨层与所述第一绝缘部分相邻设置。通过第一绝缘部分、第二绝缘部分和第一油墨层对第一功能层进行保护，避免水氧入侵，或者出现腐蚀，避免柔性电路板的电性受到影响。
具体的，第二功能层包括第二金属层和第二胶层，第二金属层设置于基底和第二胶层之间，第二胶层形成有过孔，第二油墨层设置于第二胶层的过孔内，通过使得第二油墨层设置于所述第二胶层的过孔内，使得第二油墨层覆盖在第二金属层上，使得第二油墨层可以保护第二金属层，避免水氧入侵影响柔性电路板的电性。
具体的，第二油墨层的厚度小于第二胶层的厚度，通过使得第二油墨层的厚度小于第二胶层的厚度，避免第二油墨层的厚度过大影响柔性电路板的挺性，使得柔性电路板可以受自身重力下坠，避免柔性电路板出现干涉导致损伤。
在一种实施例中，所述第一金属层的材料包括铜。
在一种实施例中，所述第二金属层的材料包括铜。
在一种实施例中，第一保护层的材料包括聚酰亚胺。
在一种实施例中，第二保护层的材料包括聚酰亚胺。
在一种实施例中，基底的材料包括聚酰亚胺。
在一种实施例中，如图1所示，显示装置3还包括盖板22和驱动芯片23，所述盖板22设置于所述显示面板21远离所述柔性电路板1的一侧，所述驱动芯片23与所述柔性电路板1连接。
根据上述实施例可知：
本申请实施例提供一种显示装置；该显示装置包括显示面板和柔性电路板，显示面板包括平面显示区和至少一曲面显示区，柔性电路板在至少一曲面显示区与显示面板连接，柔性电路板包括与显示面板连接的第一连接区、与驱动芯片连接的第二连接区，以及位于第一连接区和第二连接区之间的弯曲区，其中，柔性电路板包括基底、第一功能层和第二功能层，基底设置于第一功能层和第二功能层之间，第一功能层和第二功能层包括多个膜层，第一功能层中的至少三个膜层形成有过孔，第二功能层中的至少三个膜层形成有过孔，且第一功能层和第二功能层中每两层的过孔在基底上的投影存在重合，通过在第一功能层和第二功能层中形成过孔以使得柔性电路板位于弯曲区的部分受到重力自动弯折。本申请通过使第一功能层的至少三层形成过孔，第二功能层中的至少三层形成过孔，且各过孔在基底上的投影存在重合，通过在第一功能层和第二功能层中形成过孔以使得柔性电路板位于弯曲区的部分受到重力自动弯折，减小了弯曲区的柔性电路板的厚度，增大了过孔的宽度，减小了弯曲区柔性电路板的弹性模量，使得在重力作用下柔性电路板自动出现下坠，避免柔性电路板上翘出现干涉损伤柔性电路板。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。
Claims (20)
- 一种显示装置，其包括：显示面板，包括平面显示区和至少一曲面显示区；柔性电路板，与所述至少一曲面显示区连接，所述柔性电路板包括与所述显示面板连接的第一连接区、与驱动芯片连接的第二连接区，以及位于所述第一连接区和所述第二连接区之间的弯曲区；其中，所述柔性电路板包括基底、第一功能层和第二功能层，所述基底设置于所述第一功能层和所述第二功能层之间，所述第一功能层和所述第二功能层包括多个膜层，所述第一功能层中的至少三个膜层形成有过孔，所述第二功能层中的至少三个膜层形成有过孔，且所述第一功能层和所述第二功能层中每两层的过孔在基底上的投影存在重合，通过在所述第一功能层和所述第二功能层中形成过孔以使得所述柔性电路板位于所述弯曲区的部分受到重力自动弯折。
- 如权利要求1所述的显示装置，其中，所述第一功能层包括：第一金属层，设置于所述基底一侧；第一胶层，设置于所述第一金属层远离所述基底的一侧；第一保护层，设置于所述第一胶层远离所述第一金属层的一侧；第一防电磁层，设置于所述第一保护层远离所述第一胶层的一侧；其中，所述第一防电磁层形成有第一过孔，所述第一保护层形成有第二过孔，所述第一胶层和所述第一金属层中的至少一个形成有过孔。
- 如权利要求2所述的显示装置，其中，所述第一胶层形成有第三过孔，所述第一金属层形成有第四过孔，所述第三过孔的宽度等于所述第四过孔的宽度，所述第三过孔的宽度小于所述第一过孔的宽度，所述第三过孔的宽度小于所述第二过孔的宽度。
- 如权利要求3所述的显示装置，其中，所述柔性电路板包括设置于所述弯曲区的第一绝缘部分和第二绝缘部分，所述第一绝缘部分设置于所述第二绝缘部分与所述基底之间，所述第一绝缘部分的材料与所述第一胶层的材料相同，所述第二绝缘部分的材料与所述第一保护层的材料相同，且所述第一绝缘部分和所述第二绝缘部分设置于靠近所述第一连接区的一侧。
- 如权利要求1所述的显示装置，其中，所述第二功能层包括：第二金属层，设置于所述基底远离所述第一功能层的一侧；第二胶层，设置于所述第二金属层远离所述基底的一侧；第二保护层，设置于所述第二胶层远离所述第二金属层的一侧；第二防电磁层，设置于所述第二保护层远离所述第二胶层的一侧；其中，所述第二防电磁层形成有第五过孔，所述第二保护层形成有第六过孔，所述第二胶层和所述第二金属层中的至少一个形成有过孔。
- 如权利要求5所述的显示装置，其中，所述第二胶层形成有第七过孔，所述第五过孔的宽度等于所述第六过孔的宽度，所述第五过孔的宽度等于所述第七过孔的宽度。
- 如权利要求6所述的显示装置，其中，所述第二功能层中的过孔的宽度大于或者等于所述第一功能层中的过孔的宽度。
- 如权利要求5所述的显示装置，其中，所述第二胶层形成有第七过孔，所述第二金属层形成有第八过孔，所述第七过孔的宽度等于所述第八过孔的宽度，所述第七过孔的宽度小于所述第五过孔的宽度，所述第七过孔的宽度小于所述第六过孔的宽度。
- 如权利要求8所述的显示装置，其中，所述柔性电路板包括设置于所述弯曲区的第三绝缘部分和第四绝缘部分，所述第三绝缘部分设置于所述第四绝缘部分和所述基底之间，所述第三绝缘部分的材料与所述第二胶层的材料相同，所述第四绝缘部分的材料与所述第二保护层的材料相同，且所述第三绝缘部分和所述第四绝缘部分设置于靠近所述第一连接区的一侧。
- 如权利要求1所述的显示装置，其中，所述第一功能层中的至少两个过孔的宽度不相等，所述第二功能层中的各过孔的宽度相等，且所述第二功能层中的过孔的宽度等于所述第一功能层中的过孔的最大宽度。
- 如权利要求10所述的显示装置，其中，所述第二功能层中的过孔的宽度大于6毫米。
- 如权利要求10所述的显示装置，其中，所述第二功能层中的过孔的宽度小于10毫米。
- 如权利要求1所述的显示装置，其中，所述第一功能层和所述第二功能层中的任一膜层的过孔设置于所述弯曲区。
- 如权利要求1所述的显示装置，其中，所述柔性电路板还包括油墨层，所述油墨层包括第一油墨层和第二油墨层，所述第一油墨层设置于所述第一功能层的过孔内，所述第二油墨层设置于所述第二功能层的过孔内。
- 如权利要求14所述的显示装置，其中，所述第一功能层包括第一金属层，所述第一油墨层设置于所述第一金属层的过孔内。
- 如权利要求15所述的显示装置，其中，所述第一油墨层的厚度小于所述第一金属层的厚度。
- 如权利要求14所述的显示装置，其中，所述第二功能层包括第二金属层和第二胶层，所述第二金属层设置于所述基底和所述第二胶层之间，所述第二胶层形成有过孔，所述第二油墨层设置于所述第二胶层的过孔内。
- 如权利要求17所述的显示装置，其中，所述第二油墨层的厚度小于所述第二胶层的厚度。
- 如权利要求17所述的显示装置，其中，所述第二金属层的材料包括铜。
- 如权利要求1所述的显示装置，其中，所述显示装置还包括盖板和驱动芯片，所述盖板设置于所述显示面板远离所述柔性电路板的一侧，所述驱动芯片与所述柔性电路板连接。
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